2010

SMARTPHONE PARTS
PARTS LIST & IDENTIFICATION
There is only one Smartphone that has been released with Gingerbread which is
Nexus S. ”Nexus S” is exclusive for Google and is released by Samsung.

TASHFAIN A. AWAN
ELANCE : MECHTECH
12/28/2010
SMARTPHONE PARTS December 28, 2010

Thanks lot for considering me for this job. I would like to pursue this job as a case study as we have only
one Smartphone (NEXUS S) that is using Gingerbread in the market right now.

TASHFAIN AMIR
SMARTPHONE PARTS December 28, 2010

CASE STUDY: NEXUS S

ABSTRACT:

Nexus S is the first phone to run Gingerbread, the fastest version of Android yet. Gingerbread builds on
some of the most popular Android features like multi-tasking and Wi-Fi hotspot and adds a refreshed
user interface, an improved keyboard, near field communication (NFC) support, and more.

A 1 GHz Hummingbird processor paired with 16GB of internal memory makes Nexus S one of the fastest
phones on the market. Menus open faster, tabs are more responsive, and web pages load quicker with
virtually no lag time. Switch between apps effortlessly with true multitasking on Android.

Nexus S has a dedicated Graphics Processing Unit (GPU). Playing mobile games, browsing the web, and
watching videos are fast, fluid, and smooth. It's like having a pocket-sized multimedia and game console.

Operating System: Android 2.3 (Gingerbread)

Smart Phone: Nexus S

Manufacturer: SAMSUNG

Connectivity

Quad-band GSM: 850, 900, 1800, 1900

Tri-band HSPA: 900, 2100, 1700
HSPA type: HSDPA (7.2Mbps) HSUPA (5.76Mbps)
Wi-Fi 802.11 n/b/g
Bluetooth 2.1+EDR
Near Field Communication (NFC)
Assisted GPS (A-GPS)
MicroUSB 2.0

Display

4.0" WVGA (480x800)

Contour Display with curved glass screen
Super AMOLED
235 ppi
Capacitive touch sensor
Anti-fingerprint display coating
SMARTPHONE PARTS December 28, 2010

Size and weight

63mm x 123.9mm x 10.88mm

129g

Hardware

Haptic feedback vibration

Three-axis gyroscope
Accelerometer
Digital compass
Proximity sensor
Light sensor

Battery

Talk time up to 6.7 hours on 3G

(14 hours on 2G)
Standby time up to 17.8 days on 3G
(29.7 days on 2G)
1500 mAH Lithum Ion

Processor and memory

1GHz Cortex A8 (Hummingbird) processor

16GB iNAND flash memory

Cameras and multimedia

Back-facing: 5 megapixels (2560x1920)

720 x 480 video resolution
H.264, H.263 MPEG4 video recording
Auto focus
Flash
Front-facing: VGA (640x480)
3.5mm, 4-conductor headset jack
(stereo audio plus microphone)
Earpiece and microphone
Software noise-cancellation
SMARTPHONE PARTS December 28, 2010

Google Nexus S motherboard

The red part, Skyworks dual-band
GSM, GPRS and EDGE front-end
transmitter module

Orange part, SanDisk SDIN4C2

MLC NAND flashes memory
modules, the capacity of 16GB.

Cortex A8 processor architecture

part of the Hummingbird, yellow
marked

Infineon baseband processor 8824

XG616 X-Gold adopts a light blue
label,

Wolfson Microelectronics WM8994

ultra low power audio codec is part
of a dark blue label.
SMARTPHONE PARTS December 28, 2010

Part: Cortex-A8 Processor

Manufacturer: ARM Holdings

Series: Cortex A Family

Code: Cortex A8

Technology: ARMv7

Description:

The ARM Cortex™-A8 processor is based on the ARMv7 architecture and has the ability to scale in speed
from 600MHz to greater than 1GHz. The Cortex-A8 processor can meet the requirements for power-
optimized mobile devices needing operation in less than 300mW; and performance-optimized consumer
applications requiring 2000 Dhrystone MIPS.

Overview

The Cortex-A8 high-performance processor is proven in end devices today. From high-end feature
phones to notebooks, DTVs, printers and automotive-infotainment, the Cortex-A8 processor offers a
proven high-performance solution with millions of units shipped annually.

The processor is particularly suited to high-performance applications.

Frequency from 600MHz to 1GHz and above

High-performance, Superscalar microarchitecture
NEON™ technology for multi-media and SIMD processing
Binary compatibility with ARM926, ARM1136, and ARM1176 Processors

Performance:

65nm LP process 65nm G+ process

Optimized Synthesized Optimized Synthesized
Frequency (MHz) 600 500 1 GHz 750
Frequency conditions At SS,1.08v 125C At SS,0.9v 125C
Area with L1 Cache (mm2) <4 <4 <4 <4
Cache Size (I/D) 32K/32K 32K/32K 32K/32K 32K/32K
For all specifications go to,

http://www.arm.com/products/processors/cortex-a/cortex-a8.php
SMARTPHONE PARTS December 28, 2010

Part: Wi – Fi Chip

Family: BCM4329

Support: Wi-Fi + Bluetooth + FM products

Manufacturer: Broadcom

BCM4329 - Low-Power 802.11n with Bluetooth® 2.1 + EDR and FM (Tx and Rx)

The Broadcom BCM4329 integrates a complete IEEE 802.11 a/b/g/n system (MAC/baseband/radio) with
Bluetooth® 2.1 + EDR (Enhanced Data Rate), and FM radio receiver and transmitter. By combining
several proven wireless technologies onto a single silicon die, the BCM4329 enables mobile devices to
support today's toughest media applications -- without impacting device size or battery life.

The BCM4329 eliminates the barriers of adding the latest wireless connectivity features to small,
battery-operated devices. In addition to bringing greater Wi-Fi throughput and coverage to mobile
consumer electronics, the BCM4329 is Broadcom's smallest and lowest cost dual-band 802.11n solution.
It features integrated 2.4 GHz and 5 GHz WLAN CMOS power amplifiers, which reduce BoM costs while
maintaining superior performance. The BCM4329 also utilizes advanced design techniques and process
technologies to reduce active and idle power consumption and extend battery life.

FEATURES:

Broadcom's most integrated 65 nm single-chip combo device with single-band (2.4 GHz)
802.11b/g/n or dual-band (2.4 GHz and 5 GHz) 802.11a/b/g/n, plus Bluetooth 2.1 + EDR and FM
receiver and transmitter features
Offers one of the industry's most advanced Bluetooth/Wi-Fi coexistence technologies to ensure
the best possible user experience
Full featured, on-chip Power Management Unit supporting direct battery (2.3V to 5.5V)
connection
Bluetooth Core Specification Version 2.1 + EDR compliant with provisions supporting future
specifications and Bluetooth Class 1 or Class 2 transmitter operation
Supports 802.11n performance and range features, such as Space Time Block Coding (STBC),
Short Gual Interval (SGI), A-MPDU aggregation, Block Ack, Greenfield, RIFS
SMARTPHONE PARTS December 28, 2010

GENERAL DISCUSSION

Broadcom® BCM4329 Continues to Raise the Bar for Mobile Connectivity by Delivering Cost Effective
Combo Solutions with More Features and Lower Power Consumption

Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless
communications, today announced the availability of its newest wireless combination chip that enables
mobile phones to support more media and data applications without impacting size or battery life. By
integrating Broadcom's industry leading 802.11n Wi-Fi®, Bluetooth® and FM technologies on a single
silicon die, the new combo solution offers far more functionality than any other single-chip wireless
solution on the market. The highly integrated Broadcom® chip also provides significant cost, size, power
and performance advantages over discrete semiconductor implementations, making it ideal for
handheld electronics.

Combination chips have gained tremendous traction as more manufacturers add multiple wireless
features to mobile phones and other handheld devices, and will account for nearly one-third of all
wireless connectivity solutions shipped in 2012*. To serve this growing market, Broadcom recently
announced its plans to introduce a new combination chip every 60 days over the coming months. A
variety of products based on the Broadcom BCM4325, the industry's first Wi-Fi/Bluetooth/FM chip, are
already on store shelves, and devices based on the Broadcom BCM2049 Bluetooth/FM chip are currently
nearing production. Now the newest member of this award-winning combo family, the BCM4329, adds
the most advanced Wi-Fi technology and FM transmit capabilities to enable even more powerful
applications in smaller devices.

As mobile phones become more media-centric - with cameras, full-featured browsers and enhanced
audio capabilities - many consumers want to share photos, videos, music and data between their
portable devices and other electronics such as TVs, PCs, printers, remote speakers, headsets and car
stereos. These applications can benefit from the new 802.11n standard, which offers higher throughput,
more robust connections and much greater coverage than previous Wi-Fi technologies.

Broadcom continues to raise the bar for mobile connectivity by delivering one of the industry's first
solutions to offer 802.11n for mobile devices. It provides up to 50 Megabits per second (Mbps) of actual
wireless throughput, allowing large file transfers to happen more quickly while consuming less total
power. In addition, the BCM4329 employs space time block coding (STBC), an 802.11n feature that
enables a mobile device to maintain a connection with an access point anywhere within an expanded
coverage area.

The BCM4329 includes both FM transmit and receive capabilities. FM transmit enables consumers to
stream music directly from a personal media players (PMPs) or mobile phone to car stereos or home
theater systems without having to purchase special adapters or use bulky cables. FM receive is already a
popular feature that enables consumers to obtain real-time traffic information as well as listen to music,
news and sports broadcasts on their mobile phones.

The BCM4329 also integrates Bluetooth, which is already a ubiquitous feature in mobile phones and
PMPs, enabling hands-free communications with wireless headsets, cordless data synchronization and
SMARTPHONE PARTS December 28, 2010

stereo music streaming to headphones and speakers. Since Bluetooth and Wi-Fi operate in the same 2.4
GHz band, both the Broadcom BCM4325 and BCM4329 combination chips use innovative co-existence
algorithms and a shared antenna system to minimize interference and provide even better performance
than products that use separate Bluetooth and Wi-Fi solutions.

"Handset manufacturers are excited about the opportunities that 802.11n brings, but they are looking
for single antenna solutions that meet stringent size and power requirements," said Chris Bergey,
Director of Broadcom's Embedded WLAN line of business. "The BCM4329 is another example of how
Broadcom is driving the industry towards combination solutions, not by delivering a one-size-fits-all
technology, but by integrating the right mix of technologies for the right applications."

Technical Information

Since handheld devices lack the space, battery power and processing power to support 802.11n
implementations with multiple antennas, the BCM4329 uses single-stream 802.11n to transmit and
receive data. This significantly reduces the system's footprint and power consumption when compared
to multi-stream solutions. Despite the use of a single antenna, the BCM4329 provides faster and more
reliable wireless connections than current 802.11g products.

In addition to its performance advantages, the BCM4329 is the industry's smallest and lowest cost dual-
band 802.11n solution. Dual-band capabilities allow Wi-Fi users to leverage the less crowded 5 GHz
spectrum for media applications that require faster guaranteed bandwidth. To eliminate the cost and
size barriers of adding dual-band functionality to mobile devices, the BCM4329 integrates 2.4 GHz and 5
GHz CMOS power amplifiers, which can reduce bill-of-material (BOM) costs by up to 75 cents while
providing the same or better performance than solutions using external power amplifiers. Broadcom's
extreme integration also reduces power consumption and makes BCM4329 designs fifteen percent
smaller than those based on its predecessor, enabling modules that are less than 75 mm2 to
accommodate the board space requirements of handheld devices.

Availability and Pricing

The BCM4329 combination chip is now sampling to early access customers and is scheduled for
significant production quantities in 2009. Pricing is available upon request.

About Broadcom

Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired
and wireless communications. Broadcom products enable the delivery of voice, video, data and
multimedia to and throughout the home, the office and the mobile environment. We provide the
industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to
manufacturers of computing and networking equipment, digital entertainment and broadband access
products, and mobile devices. These solutions support our core mission: Connecting everything®.
SMARTPHONE PARTS December 28, 2010

Broadcom is one of the world's largest fabless semiconductor companies, with 2007 revenue of $3.78
billion, and holds over 3,000 U.S. and over 1,300 foreign patents, more than 7,500 additional pending
patent applications, and one of the broadest intellectual property portfolios addressing both wired and
wireless transmission of voice, video, data and multimedia.

Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia
and Europe. Broadcom may be contacted at +1.949.926.5000 or at www.broadcom.com.

Broadcom Trade Press Contact

Henry Rael
Public Relations Manager
949-926-5734
hrael@broadcom.com

Broadcom Investor Relations Contact

T. Peter Andrew
Vice President, Corporate Communications
949-926-5663
andrewtp@broadcom.com

SOURCE Broadcom Corporation; BRCM Mobile & Wireless

http://www.broadcom.com
SMARTPHONE PARTS December 28, 2010

Part: Cellular system on chip

Code #: X-GOLDTM616

Family: BCM4329

Manufacturer: The Infineon

High Performance Modem Solution for Smart Phones

The Infineon X-GOLDTM616 is a cellular system on chip comprising of the 2G/3G digital and analogue
baseband plus the power management function all monolithically integrated in 65nm CMOS technology.
It is Infineon’s 3rd generation 3G baseband solutions and is taking the next step in bringing enhanced
modem features such as HSDPA and HSUPA to the mass market. This modem solution is designed for an
optimized smart phone system setup together with an application processor. In addition it addresses the
market segments for cost optimized cellular modem solutions like PC modems, data cards, M2M
modules and cellular automotive solutions. The X-GOLDTM616 provides the complete modem
functionality offering HSDPA cat 8 (7.2Mbps), HSUPA cat 6 (5.7Mbps), EDGE multi slot class 33 and
includes the latest OMTP security standards. The processing of the 2G/3G cellular protocol stack is
handled by an ARM® 1176 embedded microcontroller. The physical layer and the voice processing is
handled by a dedicated hardware accelerator and DSP sub system. The X-GOLDTM616 enables the
XMMTM6160 platform solution; a reference design with the complete RF engine, the integrated release
6 protocol stack and modem interface SW for the inter processor communication via various HW
interfaces. The integration of all baseband and PMIC functions and the combination with Infineon’s
SMARTiTMUE RF engine heralds lowest PCB footprint, below 700mm2 for triple band 3G and quad band
EDGE and offers optimized stand-by and talk times. The solution is validated with an Inter Operability
Test Program at infrastructure vendors and operators, to significantly reduce the time to market for
customer’s end product.

Main Features

1. Modem
a. HSUPA 5.7Mbps
b. HSDPA 7.2Mbps
c. WCDMA: 386kbps DL/UL
d. EDGE: MSC33
e. Speech: NB-ARM, WB-AMR
f. SAIC
2. CPU
a. ARM1176
SMARTPHONE PARTS December 28, 2010

3. Memory
a. LPDDR1-SDRAM
b. NOR, NAND Flash
c. Shared-SDRAM, Dual-Ported-SDRAM

NOTE: For other parts, their catalogs were available so I have downloaded them for review.

RESOURCES:

http://www.ifixit.com

www.finalcn.com/

http://intlo.com/nexus-s/#

http://www.arm.com

www.infineon.com/

www.sandisk.com/

www.skyworksinc.com/

www.wolfsonmicro.com/

www.broadcom.com/

http://www.atmel.com