02 Hardware Description

Technical Manual Hardware Description
M900/M1800 MSC/SSP/IP Table of Contents
Table of Contents
Chapter 1 Overall Hardware Structure ........................................................................................ 1-1
Chapter 2 Rack .............................................................................................................................. 2-1

2.1 Physical Features .............................................................................................................. 2-1
2.1.1 Design Features ...................................................................................................... 2-1
2.1.2 Material and Color ................................................................................................... 2-1
2.1.3 Dimensions and Weight .......................................................................................... 2-1
2.1.4 Other Features ........................................................................................................ 2-2
2.1.5 Rack Installation ...................................................................................................... 2-2
2.2 Functional Configurations .................................................................................................. 2-2
2.2.1 AM/CM Rack ........................................................................................................... 2-2
2.2.2 SM Rack.................................................................................................................. 2-4
2.2.3 BAU Rack................................................................................................................ 2-5
Chapter 3 Frames .......................................................................................................................... 3-1
Chapter 4 Boards........................................................................................................................... 4-1

4.1 Functions and Features ..................................................................................................... 4-1
4.2 Board Structure.................................................................................................................. 4-1
Chapter 5 Functional Units........................................................................................................... 5-1

5.1 Control System .................................................................................................................. 5-3
5.2 Switching Network ............................................................................................................. 5-6
5.3 Digital Trunk System.......................................................................................................... 5-7
5.3.1 GDTM...................................................................................................................... 5-8
5.3.2 GECR ...................................................................................................................... 5-9
5.4 Signalling System ............................................................................................................ 5-10
5.5 Clock Synchronization System ........................................................................................ 5-11
5.6 Alarm System................................................................................................................... 5-13
5.7 Back Administration Module (BAM) ................................................................................. 5-14
5.8 Bill Administration Unit (BAU) .......................................................................................... 5-16
5.9 Visitor Location Register (VLR) ....................................................................................... 5-19
5.10 Shared Resources ......................................................................................................... 5-21
5.10.1 IWF...................................................................................................................... 5-21
5.10.2 SRF ..................................................................................................................... 5-22
5.10.3 Signal Tone Generation Circuit ........................................................................... 5-24
Huawei Technologies Proprietary
i
M900/M1800 MSC/SSP/IP Chapter 1 Overall Hardware Structure
Chapter 1 Overall Hardware Structure
The hardware system of the M900/M1800 MSC/SSP/IP has a 4-level hierarchical

structure, as shown in Figure 1-1. The lowest level comprises several circuit boards.
Various circuit boards are combined together to form frame units. Each frame unit
accomplishes specific functions. Frame units with various functions are combined
together to form a module and respective modules can implement specific functions
independently. Different modules are combined together to form the MSC.
MSC
Modules
Functional frames
Circuit boards
Figure 1-1 Hierarchical structure of M900/M1800 MSC/SSP/IP
The modular design makes the installation and expansion of MSC convenient &
flexible i.e., new functions and technologies can be introduced by just
adding/removing respective functional frames.
Application of Very Large Scale Integrated (VLSI) circuit gives a compact and highly
reliable system with low power consumption. Hardware design is simplified due to the
application of microprocessors and programmable logic chips. The addition of
corresponding hardware and software can enhance functions.
According to hardware entities, M900/M1800 MSC/SSP/IP can be subdivided into the

Administration Module/Communication module (AM/CM), Switching Module (SM),
Visitor Location Register (VLR) and Bill Administration Unit (BAU).
M900/M1800 MSC/SSP/IP adopts the distributed modular structure based on AM/CM

as shown in Figure 1-2.
1-1
M900/M1800 MSC/SSP/IP Chapter 1 Overall Hardware Structure
MSC/SSP/IP
SM
E1 Optical fiber
BSC
E1 Optical fiber
HLR SM
TMSC AM/CM
GMSC
Optical fiber
SCP E1
PSTN SM
HDLC
LAN
BAM LAN/WAN OMC
VLR BAU
LAN/WAN
Billing center
Figure 1-2 Modular structure of the M900/M1800 MSC/SSP/IP
AM/CM is the switching center for speech and signalling in MSC. It provides
interconnection between SMs.
SM performs most of the call handling, signalling processing and circuit maintenance
functions.
BAU handles bill saving, interconnects with the billing center and supports bill
browsing.
VLR is a real-time database. It is in charge of storing and managing the corresponding

data of MS (Mobile Station) currently registered in the MSC/VLR. The VLR also
provides security management to related subscribers.
1-2
M900/M1800 MSC/SSP/IP Chapter 2 Rack
Chapter 2 Rack
M900/M1800 MSC/SSP/IP racks include AM/CM rack, SM rack, BAU rack and PDF
(Power Distribution Frame) rack. BAU rack adopts the B-type server rack structure,
while the other three racks adopt the assembled rack structure.
2.1 Physical Features
2.1.1 Design Features
Side panels of assembled racks and B-type server racks adopt the suspended
quick-assembly structure. Front and back doors are provided with the latch
installation locking structure that enables easy assembling and disassembling. The
rack is designed with upper and lower outlet holes to enable upper or lower access
according to practical scenarios.
2.1.2 Material and Color
The rack material is the cold steel board. The fireproof performance of internal
materials is in compliance with the UL standard 94.V0.
The rack surface color is Huawei white. The rack part is plated with colored zinc.
2.1.3 Dimensions and Weight
I. Assembled rack
Rack dimensions: Width: 800mm (without side panel)
Depth: 550mm
Height: 2100mm (with top cover), 1946.5mm (without top cover)
Side panel dimensions: Height: 2100mm
Width: 550mm
Depth: 40mm
Weight: 224kg (empty rack), 310kg (fully configured)
2-1
II. B-type server rack
Rack dimensions: Width: 600mm (without side panel)
Depth: 800mm
Height: 2100mm (with top cover), 1946.5mm (without top cover)
Side panel dimensions: Height: 2100mm
Width: 800mm
Depth: 40mm
Weight: 193kg (empty rack), 440kg (fully configured)
2.1.4 Other Features
Special care is taken for the design of rack aspects, such as shielding, wiring, dust
prevention and radiation. An assembled rack has three fans at the top and three fans
at the bottom to form a closed single air duct for forced draught. B-type server rack
adopts the natural radiating mode, i.e. wind enters from the front door & the rack
bottom and exits from the back door & the rack top.
2.1.5 Rack Installation
The assembled rack and the B-type server rack can be installed on cement floor or on
the anti-static floor. Complete accessory code and operation guide are available for
the rack support during installation. Special mounting holes for earthquake-proof
reinforcements and supports are provided in each assembled rack and B-type server
rack.
Each assembled rack has mounting holes for fastening bolts to provide simple and
easy combination of racks.
2.2 Functional Configurations
2.2.1 AM/CM Rack
The standard configuration of AM/CM rack is shown in Figure 2-1.
2-2
(1)
(2)
(3)
(4)
(5)
(1) Clock frame (2) Main control frame (3) Interface frame (4) VLR frame
(5) BAM frame
Figure 2-1 AM/CM rack configuration
From top to bottom, the frames are:

z Clock frame: Its standard configuration is GCKS×2 boards. It provides 32MHz,
2MHz and 8kHz clocks.
z Main control frame: Its standard configuration includes
GSNT×2+GMCC×12+GALM boards. This frame manages the module
communication and signalling switching. It also performs the alarm and
maintenance functions.
2-3
z Interface frame (DT frame): Its standard configuration includes

GCTN×2+GFBI×32. It performs the inter-module speech channel switching and
provides clock for the switching module.
z VLR frame: Two VLRs work in the active/standby mode.
z BAM frame: It contains an industrial PC, loaded with special software.
2.2.2 SM Rack
The standard SM rack configuration is shown in Figure 2-2.
(1)
(2)
(3)
(4)
(5)
(1) Trunk frame (2) Trunk frame (3) Number receiving frame (4) Main control frame
(5) Empty frame
Figure 2-2 SM rack configuration
2-4
From top to bottom, the frames are:

z Trunk frame: Its standard configuration includes GDTM (or GECR) ×16 boards.
The digital trunk equipment provides standard E1 interfaces used in connecting
with other MSCs, HLRs and STPs.
z Number receiving frame: Its standard configuration includes
GSPT×2+GDRV×16 boards. It broadcasts the prompt tone and receives
numbers in the subscriber-network interaction process of IN service.
z Main control frame: Its standard configuration includes
GMPU×2+GNET×2+GMEM×2+GNOD×11+GSIG×2+GEMA+GLAP (or MFC)
×8+GMC2×2+GOPT×2+GALM+TCI boards. It manages the module
communication and traffic switching. It also performs the alarm and maintenance
functions.
In addition, the IWF (Interworking Function) frame can be configured as required.
When fully configured, the IWF frame can hold 16 IWF boards, each of which provides
4 channels of data.
2.2.3 BAU Rack
The physical configuration of the standard BAU rack is shown in Figure 2-3.
2-5
⑻
POWER POWER
ON SYN ON SYN
INVERTER INVERTER
FAULT FAULT
BATL/H FAULT BATL/H
OFF BATL/H OFF
ALARM
ON
⑼
OFF
(1) Power distribution box (2) Monitor (3) LAN switch (4) Shifter
(5) Keyboard (6) Server 1 (7) Server 2 (8) Controller
(9) Converter
Figure 2-3 BAU rack configuration
2-6
M900/M1800 MSC/SSP/IP Chapter 3 Frames
Chapter 3 Frames
As discussed earlier, various circuit boards are combined to form a frame, which is
relatively an independent unit, e.g. Main Control frame, Trunk frame, Clock frame,
VLR frame, IWF frame, DTMF receiver frame, EC frame, TC frame and BAM frame.
All frames have the same dimensions except the Control frame whose height is twice
as the rest. Each frame has 26 slots.
The physical/mechanical structure of the frame includes circuit boards, backplane,

front & back beams, sideboards and slides. Physical structure of clock frame is shown
as an example in Figure 3-1.
⑵
⑽
⑶
⑻
⑸
⑺
(1) Left side plate (2) Upper front beam (3) Board name strip (4) Lower front beam
(5) Plug-in board (6) Dummy panel (7) Guide rail (8) Right side plate
(9) Upper back beam (10) Guide rail
Figure 3-1 Frame illustration
3-1
M900/M1800 MSC/SSP/IP Chapter 4 Boards
Chapter 4 Boards
4.1 Functions and Features
Boards in the M900/M1800 MSC/SSP/IP system have the following general features:
z Each board consists of advanced integrated circuits, such as ASIC, EPLD and
FPGA. It features high integrity, fine technique and high reliability.
z Boards are designed by strictly following unified hardware design regulations,
which inherit the existing circuit design.
z Supports the ‘hot plug/unplug’ function.
z Boards have built-in Watchdog that can automatically reset boards in case of
severe problems.
z Supports the online software loading of board.
z Provides the serial port printing function and the resetting switch.
4.2 Board Structure
Dimensions of boards in the M900/M1800 MSC/SSP/IP system are unified. Except

the switching network board (GCTN and GNET), all boards have the same
dimensions of 280mm(L) × 233.35mm(W) ×2.0mm (PCB thickness).
The board structure is shown in Figure 4-1.
4-1
(1) Indicator (2) Pull-down panel (3) Elastic locking hook (4) Handle bar
(5) Board name (6) Plug
Figure 4-1 Board structure
Most functional boards consist of PCB boards, each of which occupies only one/two
slots of a shelf.
In some boards, the pull-down panel can be opened to display the parts on the PCB
board, such as the reset button, DIP switches and serial port. The maintenance staff
can implement operations on the board without pulling out the board.
The board panel is shown in Figure 4-2.
4-2
RUN
FAIL
(1)
(2)
(3)
1 2 3 4
ON
(1) Serial port (2) DIP switches (3) Reset button

Figure 4-2 Pull-down panel of the board
4-3
M900/M1800 MSC/SSP/IP Chapter 5 Functional Units
Chapter 5 Functional Units
According to the functional structure, M900/M1800 MSC/SSP/IP mainly comprises

Control System, Switching Network, Digital Trunk System, Clock Synchronization
System, Alarm System, Back Administration Module (BAM), Bill Administration Unit
(BAU), shared resources, Monitoring System and VLR.
The functional structure of the M900/M1800 MSC/SSP/IP is shown in Figure 5-1.
BSC AIE IWF
HLR SRF
MSC GDTM
Switching network
STP GSIG
Shared resources
PSTN ECR
GNE
T
ISDN PRA
Digital trunk system LPN7
MFC
Billing Clock sys. LPRA

BAU VLR
Center Signalling system
BAM GMEM GNOD
Alarm sys.
GMPU GMPU
Monitoring GMCC GMPU
Control system
Figure 5-1 Functional structure of the MSC/SSP/IP
The Control System works on the principle of distributed processing and centralized
control. It comprises the processor, intra-module communication, inter-module
communication, signalling switching and signalling processing circuitry.
The central switching network board (GCTN) and the intra-module switching network
board (GNET) form a large capacity T-T-T switching network to complete the speech
information switching function. GCTN is a 16k×16k T-network. 4k×4k single-T
switching board (GSNT) accomplishes the intra module communication.
M900/M1800 MSC/SSP/IP’s Digital Trunk System offers:

z Standard open A-interface to BSS equipment of other vendors.
z Standard E1 interface to other MSCs.
z Standard signalling link to HLR.
5-1
z Standard signalling link to STP equipment.

z Standard signalling link to gsmSCF (GSM Service Control Function).
z Standard E1 interface to SGSN
z MSC/SSP/IP provides standard E1 interface to connect with PSTN through the
built-in echo canceller.
The signalling system handles the access and processing of SS7, R2 & DSS1
signalling.
The Clock Synchronization System mainly comprises the clock frame and is used to
provide stable clock source to the system.
The Alarm System of the MSC/SSP/IP adopts the distributed collection and
centralized processing technique. Various types of alarm information are sent to the
alarm box, alarm indicators & OMC alarm console accordingly and corresponding
audio & visual alarms are generated.
BAM is a communication bridge between MSC and OMC. It enables operations and
maintenance on MSC via OMC. BAM communicates with the Control System via
HDLC links and also communicates with OMC directly or indirectly via the Network
Adapter.
BAU receives bills sent from the GMPU and saves them as files under the directory
open to the Billing Center. The collector of the Billing Center collects the data from this
directory and then deletes the files. The Client can view or query the charging files via
the BAU. BAU is connected with the collector of the Billing Center via LAN or WAN.
VLR is a real-time database. It is in charge of storing and managing the corresponding

data of mobile subscribers currently registered in the MSC/SSP/IP. VLR also provides
security management to related subscribers.
The shared resources mainly include the Interworking Function (IWF) unit, Special
Resources Function (SRF) unit and GSIG. These are invoked by GMPU as the
resource modules to perform some special functions.
The monitoring system provides two monitoring schemes, i.e. SOSM and SPBX to
implement call monitoring.
5-2
5.1 Control System
The M900/M1800 MSC/SSP/IP adopts distributed processing and centralized control

system. The internal control structure of multi-SM configuration is shown in Figure
5-2.
AM/CM
GMCCM
GMCCM
16 digit parallel bus
GMCCS GMCCS GMCCS GMCCS GMCCS

GMCCS GMCCS GMCCS GMCCS GMCCS
SNT
GSNT
GSNT
GFBI
GFBI GFBI
GFBI
Optical fiber
SM GOPT SM GOPT
GOPT GOPT
LAPN7/ GMC2 LAPN7/ GMC2

LAPD
GLAP GMC2 LAPD
GLAP GMC2
GNET
GNET GNET
GNET
GMPU GMPU
GMPU GMPU
GNOD
GNOD GNOD
GNOD
Figure 5-2 M900/M1800 MSC/SSP/IP control system
I. System structure
The Control System comprises the processor, inter-module communication,

intra-module communication, signalling switching and signalling processing circuitry.
5-3
GMCCM is the main processing board of AM/CM and GMPU is the main processing
board of SM.
The inter-module communication circuit comprises mainly GMCCS in AM/CM and

GMC2 in SM.
The intra-module communication function of AM/CM is implemented by GMCCS.

Mainly, GNOD board implements the intra-module communication function of SM.
GNOD board contains four independent main nodes. Each main node communicates
with the GMPU board and the slave node under the control of CPU. The GMPU board
and GNOD communicate through mailbox. At the same time, the main node
communicates with the slave node via serial port. It transparently transfers the
high-level commands of the GMPU board and accepts the response of the slave node.
It also queries and collects the status of slave nodes.
The signalling switching circuit is mainly used to control the switching of signalling,
which refers to various control and status information. In AM/CM, the GSNT board
implements the function of signalling switching between different boards. GNET board
is responsible for signalling switching in SM.
The signal processing circuit mainly refers to the processing board of SS7 signalling
and GLAP performs this function in SM.
II. Inter-module communication
GMCCM is the main controlling board of AM/CM and GMPU is of SM. These boards
communicate through data channels, which are established by GMCCS (AM/CM) and
GMC2 (SM), as shown in Figure 5-3.
The information communicated between these modules includes data management,

call handling information, maintenance test information and traffic statistics
information.
5-4
AM/CM
GMCCM
Data bus
GMCCS GMCCS GMCCS GMCCS
GMC2 GMC2 GMC2 GMC2 GMC2 GMC2
GMPU GMPU GMPU
SM SM SM
Figure 5-3 Principle of inter-module communication
The above figure shows that GMC2 is the single-channel HDLC communication board
and is in charge of inter-module communication in SM. GMCCS is the multi-channel
HDLC communication board for the inter-module communication in AM/CM.
Both GMCCS and GMC2 work in load-sharing mode. Each SM contains two GMC2
boards that communicate with two GMCCS boards respectively. The two GMCCS
boards work in the load-sharing mode, that is, if the two GMC2 links in SM are normal,
each link carries half of the system load. In case of any failure or abnormality in one
link, the other will take over the full load, as shown in Figure 5-4.
5-5
GMCCM
Bus
AM/CM
GMCCS GMCCS GMCCS

AM/CM
HDLC HDLC HDLC HDLC
GMC2 GMC2
GMC2 GMC2
Dual port Dual port
Dual port Dual port
GMPU GMPU GMPU GMPU

SM SM SM SM
(a) Communication between two SMs that are
connected to one MCCS board (b) Communication between twoSMs that are
connected to different MCCS boards
Optical fiber
GMPU GMC2 GOPT GFBI GMCCS GMCCM
SM AM/CM
(c) Communication between SM and AM/CM
Figure 5-4 Inter-module communication
The communications between GMPU & GMC2 in SM, between GMCCM & GMCCS in
AM/CM and between GMCCSs are all implemented through mailbox. The
communication between GMC2 and GMCCS is implemented through HDLC links.
AM/CM & SM are interconnected through optical fibers, which also provide the
communication path for GMC2 and GMCCS boards via optical interface (GFBI and
GOPT), as shown in Figure 5-4 (c).
The physical layer of the inter-module communication is mainly implemented via

optical fibers and HSCX (High-level Serial Communication Controller with extended
feature and functionality). The link layer is in conformity with X.25 LAPB. The transfer
layer is implemented by GMCCS. The transmission and application layers are
implemented via the GMCCM board and software.
5.2 Switching Network
The central T network board (GCTN) and the intra-module switching network board
(GNET) form a large capacity T-T-T switching network. GCTN is a 16k×16k T
5-6
switching network. The intra-module switching network is a 4k×4k single T switching

network. The structure of the switching network is shown in Figure 5-5.
AM/CM
GCTN
GFBI GFBI
SM SM
GOPT GOPT
GNET GNET
GDTM GECR GDTM GECR
BSC PSTN BSC PSTN
Figure 5-5 Structure of the switching network
GCTN board is the central switching network board of the MSC/SSP/IP. It implements
the middle “T” function of the “T-T-T” switching. GCTN board adopts the cross timeslot
division of streamline working mode to enable the non-blocking switching of the
16k×16k time slots. It drives the 32 MHz, the frame synchronization 8kHz & the code
element synchronization 4MHz signals from the clock frame and sends them to the
GFBI board. It also adjusts the time delay of HW, 32MHz and 4MHz signals sent from
the GFBI board. It can exchange O&M information between GMCCM & GMCCS via
HDLC channel and at the same time, handles calls.
5.3 Digital Trunk System
Digital trunk equipment is the interface equipment between MSC/SSP/IP & other
external systems, such as MSC, HLR, STP, BSC, SCP, PSTN and SMC. It provides
standard E1 interface and is mainly used to perform code translation.
5-7
The position of the digital trunk equipment in the system is shown in Figure 5-6.
MSC/SSP/IP
BSC AIE
HLR
MSC
GDTM
STP
Switching network
SCP GNE
T
PSTN GECR
ISDN PRA
Digital trunk system
GNOD
GMPU GMPU
GMCC GMPU
Control system
Figure 5-6 Position of the digital trunk equipment in MSC/SSP/IP
In M900/M1800 MSC/SSP/IP, the digital trunk equipment adopts the PCM30/32

CEPT mode to receive & transmit the primary digital signals between MSC/SSP/IP
and other external equipment. The digital trunk board (such as GDTM, GECR or PRA
boards) implements the functions of digital trunk equipment.
5.3.1 GDTM
A GDTM (Digital Trunk Module) is used when MSC/SSP/IP connects with other GSM
network equipment including BSC, HLR, EIR, STP, SCP, GGSN, SGSN, SMC and
another MSC.
I. Basic functions
The digital trunk equipment has the following basic functions, such as code translation,
re-timing and control function.
5-8
Digital Trunk Module accomplishes the code conversion between High Density
Bipolar of order 3 (HDB3) coding used in external trunks and Non Return to Zero
(NRZ) coding used internally.
The digital trunk equipment can generate a clock signal internally to be synchronous
with the signal frequency on the trunk. This signal is used to extract information from
the trunk channel. The digital trunk equipment can co-ordinate different external and
internal clock signals to eliminate the frequency difference of the internal and external
clocks.
It also enables frame synchronization monitoring and self-loop test.
II. Digital trunk configuration
According to the equipment connected, digital trunk equipment shall be configured as

different types. While configuring digital trunk equipment, same hardware is used but
different software is loaded in order to provide different interface functions.
When MSC/SSP/IP is connected with network entities, such as HLR, EIR, STP, SCP,
GGSN, SGSN, SMC and another MSC, the digital trunk equipment should be
configured as “TUP”.
When MSC/SSP/IP is connected with BSC, the digital trunk equipment should be
configured as “AIE”.
Through the PRA board, MSC/SSP/IP can connect with ISDN PBX. It provides 30B+D
channels and fulfills telephony, MODEM transmission & facsimile services. In this
case, the digital trunk equipment should be configured as “PRA”.
5.3.2 GECR
A GECR (Echo Canceller for R2 signalling) board is used when MSC/SSP/IP

connects with PLMN network entities using R2 signalling. It has echo cancellation
function.
The EC is required at the MSC-PSTN interface to reduce the effect of GSM delay
when the mobile is connected to the PSTN circuit. Echoes can be generated due to
the impedance mismatch in two-wire to four-wire hybrid transformer, or the poor
separation of transmission and reception of the telephone set as shown in Figure 5-7.
When the path time delay of the echo is more than 30ms, the speaker will hear the
echoing voice, which influences the communication quality or even interrupts the
normal communications. For GSM system, due to the following reasons, echoes with
64ms time delay will be generated when the MS (Mobile Station) is connected with the
PSTN subscribers.
z Time delay in information transmission over radio links.
5-9
z Time delay caused by the equalization against multi-path delay by the BSS or
MS.
z Time delay due to code translation by TRAU (Transcoder & Rate Adapter Unit)
Therefore, GSM system must be equipped with EC.
4 wire 2 wire Near end
Transmit
Acoustic echo
Far end H
Electric echo Telephone

Receive
Figure 5-7 Generation of echoes
The M900/M1800 MSC/SSP/IP adopts embedded EC and provides standard E1

interface to PSTN. The position of EC in the system is shown in Figure 5-8.
MSC/SSP/IP
E1 2-wire
BSS GECR PSTN
MS Telephone
Figure 5-8 Position of EC in the system
5.4 Signalling System
M900/M1800 MSC/SSP/IP supports three signalling systems: SS7, R2 and DSS1.
A signalling system can be divided into two parts according to hardware functions:
signalling access part and signalling processing part. The signalling access part
mainly comprises the digital trunk system (AIE, GDTM, GECR and PRA boards) and
the switching network (GNET and GSNT boards), while the signalling processing part
mainly includes the signalling processing units (LPN7, MFC and LPRA boards) and
the control system (GMPU and GMCC boards), as shown in Figure 5-9. For details,
refer to Signalling System of this manual.
5-10
BSC AIE
HLR
Switching network
MSC GDTM
STP GNE LPN7
T
PSTN GECR MFC
ISDN PRA LPRA

Digital trunk system Signalling system
GNOD
GMPU GMPU
GMCC GMPU
Control system
Figure 5-9 Structure of the signalling system
5.5 Clock Synchronization System
The clock synchronization system of MSC/SSP/IP phase-locks the clock reference

sources of the upper-level PSTN, BITS or GPS to provide AM/CM and SM modules
with stable clock sources. Functions of the clock synchronization system are
implemented mainly by GCKS in the clock frame of AM/CM.
I. System features
The clock synchronization system of the M900/M1800 MSC/SSP/IP has the following
features:
z The MSC/SSP/IP clock synchronization system adopts digital phase-locked loop
and reliable software phase lock mode, which enables the clock of the whole
system to follow reliably, the clock of PSTN, BITS or GPS.
z MSC/SSP/IP adopts the Stratum 2 Class-A clock, and the indices of the clock
are fully compliant with the specifications.
z The clock system provides a complete display, alarm, maintenance and
operation system. The operator, directly via the OMC, may set internal
parameters of the clock.
5-11
II. System structure
The structure of the MSC/SSP/IP clock synchronization system is shown in Figure

5-10.
Ref erence source AM/C M
PSTN G
G
BITS C GSNT
C
GPS K
K
GECR S
Up lev el GMSC S
GMCC GALM
GCTN
GFBI
SM1 GOPT SM2 GOPT SM2 GOPT
……
GNET GNET GNET
G G G G P G G G G P G G G G P
M M D E R M M D E R M M D E R
P C T C A P C T C A P C T C A
U 2 M R U 2 M R U 2 M R
Figure 5-10 Structure of the clock synchronization system
The MSC/SSP/IP clock synchronization system receives the phase-locked clock

provided by GECR, BITS or GPS. It extracts the clock and synthesizes it into the
needed clock synchronization signals and sends these signals to GCTN & GSNT
switching networks. GCTN and GSNT in turn, send the clock to other parts of the
AM/CM. The GOPT board of SM extracts the clock from the optical signals, generates
the required clock synchronization signals and sends them to the GNET board. The
GNET board in turn, sends the clock synchronization signals to other parts of SM.
III. Control mode
The main hardware of the clock synchronization system is the clock frame, which
contains two GCKS in hot backup mode. GMCCM performs operation and
maintenance over GCKS boards via serial ports.
5-12
In case of remote operations (e.g. operation & maintenance) through OMC, OMC
communicates with the MSC via BAM and the GMCCM communicates with the GCKS
board via the RS422 serial port.
5.6 Alarm System
The alarm system of M900/M1800 MSC/SSP/IP works on the principle of distributed

collection and centralized processing. The alarm information is collected on the alarm
communication board and is processed according to the alarm types. This information
is then sent to the alarm box and the OMC alarm console.
The whole alarm system is composed of the alarm box, OMC alarm console and
alarm communication board. The structure of the alarm system is shown in Figure
5-11.
Alarm box
GALM
Secondary power alarm collector
BAM OMC alarm subsystem
GMCCM GMCCS
AM/CM
SM
GMC2
GMPU
Room environment alarm collection
GALM
Secondary power alarm collector
Figure 5-11 M900/M1800 MSC/SSP/IP alarm system
GMPU of SM & the GMCCM of AM/CM handle the software & hardware faults on
boards and classify these alarms into different levels. The alarms are accordingly sent
to the OMC alarm console & alarm box and corresponding audio & visual alarms are
generated.
5-13
The alarm communication board (GALM) provides hardware interfaces for equipment
room environment alarms, which enable the collection of alarms of temperature,
humidity, fire, etc., as well as the collection of secondary power alarms from the racks.
5.7 Back Administration Module (BAM)
BAM is the bridge for communications between the MSC/SSP/IP and the OMC
system. The user can conveniently and flexibly implement maintenance & operations
on the switch via BAM.
BAM transfers the maintenance & operation commands from terminals to the
foreground and directs the MSC responses to the corresponding terminals.
Meanwhile, it enables the storage and transfer of charging information, alarm
information and traffic measurement data. It stores important data on the hard disk,
MO disk, magnetic tape or network server according to the requirements.
In normal cases, when the communication between BAM and MSC are not
interrupted, all the functions of the terminal software can be fulfilled. In case the
software is working abnormally or the system is down, BAM can automatically reset
and restart within the set time. Through the network adapter, BAM can be connected
with multiple WSs, and the same operations can be executed on the WS, to enable
multi-point remote maintenance.
BAM is connected with the Front Administration Module (FAM) via a 2Mb/s HDLC link.
The terminal system is connected with BAM via the network as shown in Figure 5-12.
Peripheral PI NI Terminal network system
MCP
BAM
HDLC
FAM
CM
SM SM
Figure 5-12 Principle of BAM
5-14
BAM is an industrial computer running on the Windows operating system. It is placed

in the AM/CM cabinet and occupies a standard frame. BAM comprises three major
parts:
I. PI (Peripheral Interface)
PI can be connected with various external devices, including two MO disk drives, hard
disk array, printer and tape drives, for the purpose of storage, transfer and hard copy
of data.
II. NI (Terminal Network Interface)
NI is adopted to form the terminal systems (maintenance, testing, traffic statistics,

special service and data setting) into a LAN, which can be connected with network
servers and provide 10M~100M transmission channels, to enable data sharing in a
larger range by extending the network via network bridge/routers.
III. MCP (Module Communication PC card)
Each MCP card provides two 2Mb/s HDLC channels to FAM to serve as the
information channel between FAM and BAM. The logic of the BAM system is shown in
Figure 5-13.
CD-ROM Hard disk Flop. disk COM Video

MO
display
BAM
Video
PI SCSI card WDT
blaster
ISA/PCI BUS
CPU
MEM
Main board
NI MCP card MODEM
OMC Server WS AMC PSTN
Figure 5-13 BAM logic map
BAM communicates with the control system through HDLC link and connects to OMC
via LAN or WAN as per the network requirements.
When the MSC/SSP/IP and the OMC are co-located, BAM and OMC can be
connected through LAN. When MSC/SSP/IP and OMC are far apart, they are
connected via WAN. The position of BAM in the system is shown in Figure 5-14.
5-15
RAS router
BAM BAM Dial-up network

PSTN
LAN
Router
OMC server WS WS
TS multplexer/demultiplexer
…...
E1 X.25 DDN
BAM
TS multplexer/demultiplexer
LAN
Router
WS
Figure 5-14 Position of BAM in the system
5.8 Bill Administration Unit (BAU)
The BAU (Bill Administration Unit) receives the bills from the MSC, converts them into
a special file format and saves them in a special directory from which the bill collector
in the billing center can get the bills. Besides, it sends the charging files to the OMC
SERVER, for the client to browse and query.
The SM sends the bills to the BAU for processing. BAU verifies the individual bill serial
numbers from different modules, to ensure no bill loss or repetition and saves these
verified bills. It then converts their format and stores them in a designated directory,
for the reference of the billing center. The bill collector obtains these bills through the
FTP or FTAM. After the bills in the BAU are taken away and the bill collector confirms
the same, they are deleted. However, the BAU still keeps a backup directory of them
and communicates with the OMC bill server through the TCP/IP protocol, to facilitate
future browsing of these bills.
The position of BAU in the system and its connections are shown in Figure 5-15.
5-16
MSC MSC
BAU0 BAU1 BAU0 BAU1
HUB HUB
DDN / E1 / X.25
IP Router
IP Router
LAN
HUB
Figure 5-15 Position of BAU in the system and its connections
I. System hardware
BAUs ensure the reliability of the system with the active/standby structure.
Each BAU is equipped with multiple, large-capacity pluggable hard disks in hot
backup mode. It supports the hard disk with the redundancy technology and any failed
hard disk can be recovered without interrupting the system running. To guarantee the
security of the operation and the file system, a hard disk is divided into two logical
arrays and the charging data is saved on both these logical hard disks to prevent any
deletion by mistake. The bill collector can use the FTP or FTAM protocol to access the
active/standby BAUs.
The BAU is connected to the billing center through Ethernet. Multiple remote MSCs
can be connected to the bill server through WAN.
The charging system comprises the bill server and maintenance terminals. The bill
server runs on Windows NT and the maintenance terminals can run on any platform
supporting Java. Maintenance function can also be executed on server. The system
structure is shown in Figure 5-16.
5-17
AM/CM
SM1 SM2 SM16
GMPU GMPU GMPU

GMPU
(Standby) GMPU
(Standby) GMPU
(Standby)
(Active) (Active) (Active)
BUS BUS BUS
GMEM GMEM GMEM GMEM GMEM GMEM

(Active) (Standby) (Active) (Standby) (Active) (Standby)
LAN (Active)
LAN (Standby)
HUB
Serial port heartbeat path
Private LAN heartbeat path
BAU (active) BAU (standby) Billing center
Figure 5-16 BAU system structure
The two servers are connected through different network ports with the MSC and the
billing center. In Figure 5-16, all the ports are 10M/100M Ethernet interfaces with no
X.25 interface and they can be connected to the WAN via router or E1 multiplexer.
There are two heartbeat paths: one is connected through the serial ports and the
other through a private network. They are used to transmit the timed handshaking
information between the active server & the standby server and to monitor the running
of these two servers so that a stable system running is ensured.
II. System performance and features
The performance and features of the BAU are listed below:
The MSC provides the interfaces to the billing center through BAU. The two BAUs are
working in active/standby mode. Each BAU has its own interface with the billing
center and the billing center collects the charging files from the two BAUs
5-18
simultaneously. The MSC ensures the availability of at least one BAU always. BAU
can support the FTP and FTAM protocols.
BAU is equipped with arrays of disks and a CD-R drive, for the backup and storage of
a large volume of bills.
The generation of MSC charging files is subject to the parameters, generation time
and file size. A new charging file is generated either after a certain time, or when the
file size reaches a preset value and both these parameters can be set/adjusted.
Two types of charging files can be generated, hot billing files and ordinary bill files.
5.9 Visitor Location Register (VLR)
In M900/M1800 digital cellular mobile switching system, VLR and MSC are merged
into an entity named MSC/VLR.
The VLR database is located in AM/CM and its signalling processing is implemented
by GMPU of MSC. MSC adopts the fully distributed modular design and VLR
database adopts a centralized scheme.
To ensure good system reliability, hot backup is supported for all the VLR database
parts. The SMs communicate with the VLR database server via Ethernet interfaces
provided by the active/standby database interface boards (GMEM). Meanwhile, the
handshaking message protocol between the active and standby VLRs is done
through the private network.
The position of VLR in M900/M1800 MSC/SSP/IP is shown in Figure 5-17.
5-19
AM/CM
SM1 SM2 SM16
GMPU
GMPU
GMPU
GMPU ........ GMPU
GMPU
Standby)
(Active) (Standby)
(Active) (Stand by)
(Active)
BUS BUS BUS
GMEM GMEM GMEM GMEM GMEM GMEM

(Active) (Standby) (Active) (Stand by) (Active) (Standby)
LAN(Active)
LAN(Standby)
VLR Private LAN VLR

(Active) (Stand by)
Figure 5-17 VLR position
The VLR provides the following basic functions:

z Subscriber data storage: The subscriber data refers to the IMSI number,
MSISDN number, location area, HLR address, user type and user state. Besides,
the authentication and encryption data are also stored.
z Subscriber data retrieval: When a call is being set up, according to the MSC
requests, the VLR provides the subscriber information for the MSC, including
IMSI, TMSI and MSRN.
z IMSI attach/detach: It supports the IMSI attach/detach function.
z Location registration: When a mobile subscriber appears in a new location, or a
location update message is received from the MS, VLR will initiate the location
update to the HLR and retrieve the relevant subscriber information from the HLR
or the previous VLR.
z Authentication: VLR supports HLR to retrieve the authentication triplet
(RAND/SRES/Kc) from the AUC and stores them, or requests the authentication
parameters from the previous VLR during location registration. In addition, the
VLR supports the MS authentication at the request of the MSC.
5-20
z MSRN allocation: It supports the MSRN allocation on a per call basis. While
allocating the MSRN, it starts the 90s release timer to ensure the timely release
of MSRN in case of failure.
z Handover number (HON) allocation: When handover is performed between two
MSCs, the VLR provides the HON for the MSC and releases the HON after the
call is set up.
z TMSI allocation: It keeps the identity of mobile subscribers confidential.
Whenever the location is updated, it may reallocate the TMSI number.
z Regional subscription restriction: When the user location is to be updated, it
decides if the location update is allowed in the area according to the zone code
list of the user.
z Purge MS: When the MS does not connect or respond to the network within a
specified time, VLR will delete the relevant subscriber data and notify the HLR
about this.
z VLR data restoration: Upon restarting, VLR deletes all the IMSI record and TMSI
number of the affected users. When the VLR receives the MSRN allocation and
location update requests, it starts the data restoration process.
z The M900/M1800 VLR has the following features:
z It can store and manage 300,000 mobile subscribers. The reference load is: call
handling 1.5 times/per user/per hour, mobility management 8.5 times/per
user/per hour.
z Information retrieval delay≤1000 ms, Information registration delay≤2000 ms.
z The system parameters can be flexibly configured, e.g. number of subscribers in
the system, through the OMC according to the user requirements.
z All the parts, such as GMEM board, network concentrator and database server,
are configured in the hot standby mode to ensure the high reliability of the
system.
5.10 Shared Resources
5.10.1 IWF
The IWF (Interworking Function) unit is necessary for interconnections between GSM
network and other networks, such as PSTN, ISDN and PSPDN. It supports data
services and fax service in the GSM system. It implements the functions of rate
adaptation, radio link protocols (RLP/L2R), fax adaptation etc., provides 3.1kHz
interface availability and supports transparent & non-transparent services. Figure
5-18 shows its position in the MSC/SSP/IP system.
5-21
PSTN
PSTN
MSC/SSP/IP
MSC/VLR
Fax
传真机
BSS
BSS IWF
IWF Internet
Internet
MS
手机 Computer
计算机
ISDN
ISDN
Portable
便携机 computer
ISDN telephone
ISDN话机
Figure 5-18 Position of IWF in the MSC/SSP/IP system
5.10.2 SRF
The SRF (Special Resource Function) equipment is used in the Mobile Intelligent
Network and its functions include generation of signal tones, sending of the
pre-recorded announcement (fixed or variable), collection of digits and synthesis of
voices. These functions are implemented by the dual-tone number transceiver frame.
SRF is generally configured in an SM to act on this SM, or it acts on other SMs
containing no SRF, through data configuration.
There are two boards in the dual-tone number transceiver frame: GSPT and GDRV.
The structure of SRF is shown in Figure 5-19.
5-22
BSC AIE GDRV
Switching network
GDRV
GNE GSPT
PSTN GECR T
GSPT SRF
GNOD GNOD
GMPU GMPU
GMCC GMPU Control system
Figure 5-19 Structure of SRF
I. Intelligent speech board GSPT
A GSPT board is used to broadcast different prompt tones and waiting tones. The
EPROM on the board can store 2.2-hour (62Mb) prompt/waiting tones. There is no
limit to the prompt tone length and through the T-net switching on the board, GSPT
can simultaneously provide 128 tone-broadcasting channels. In addition, it provides
HW drive for GDRV board in the frame.
The memory unit EPROM is used to store various prompt tones. When a prompt tone
is required, the GMPU issues commands through the serial port to GSPT board.
GSPT board controls the T-net to switch the prompt tone to the designated time slot
and sends it to other boards within the same frame. The HW signals from other
boards in the same frame are also driven by GSPT board and changed into different
signals before being sent to the main control frame.
II. DTMF number receiver and drive board GDRV
The GDRV and the GSPT boards are configured in the same frame to jointly
broadcast the prompt tone and receive numbers in the user-network interaction
process of IN service. Their main functions are:
z NOD and HW signal level conversion.
5-23
z Provides 16 DTMF number receivers.

The GDRV board uses the Digital Signal Processor (DSP) to provide the DTMF
transceiving function. When the DTMF number receiving is necessary, the GMPU
issues commands through the main node to the single chip processor on the GDRV.
The GMPU controls the switching network to switch the relevant time slot to the serial
port of the DSP. When the DSP detects the number, it reports the number to the single
chip processor, which reports the number through the serial port to the GMPU. If
DTMF signals are to be sent, the single chip processor instructs the DSP through the
control logic to dial the number, which is then switched to the HW.
5.10.3 Signal Tone Generation Circuit
In the connection process, MSC/SSP/IP should provide signal tones to subscribers,

including new service prompt, time report and weather broadcast. Digital tone signal
generation circuits generate the digital signals needed for the above-described tones.
The digital tone signal generation circuit function is implemented by the GSIG board.
Its position in the system is shown in Figure 5-20.
BSC AIE
Switching network
HW
GSIG
GNE HW GSIG
PSTN GECR T
GNOD
GMPU GMPU
GMCC GMPU Control system
Figure 5-20 Position of GSIG
The GSIG circuit is controlled by the GMPU board. Its working status and playback
contents are issued via commands or tables. Incoming and outgoing speech signals
go through the GNET board via 2.048Mbit/s HW.
5-24
GSIG can be connected with two PCM HW to provide at any time 64 announcements
which have been saved in the memory. Any HW channel can be used to record in any
TS (Time Slot).
Signal tone generation circuits are of two sets in each module, A and B, which work as
mutual backups. The circuits are the same in their hardware structure and can be
interchanged with each other.
5-25

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Technical Manual Hardware Description

M900/M1800 MSC/SSP/IP Table of Contents

Chapter 1 Overall Hardware Structure ........................................................................................ 1-1

Chapter 2 Rack .............................................................................................................................. 2-1

Chapter 3 Frames .......................................................................................................................... 3-1

Chapter 4 Boards........................................................................................................................... 4-1

Chapter 5 Functional Units........................................................................................................... 5-1

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Chapter 1 Overall Hardware Structure

The hardware system of the M900/M1800 MSC/SSP/IP has a 4-level hierarchical

Figure 1-1 Hierarchical structure of M900/M1800 MSC/SSP/IP

According to hardware entities, M900/M1800 MSC/SSP/IP can be subdivided into the

M900/M1800 MSC/SSP/IP adopts the distributed modular structure based on AM/CM

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Figure 1-2 Modular structure of the M900/M1800 MSC/SSP/IP

VLR is a real-time database. It is in charge of storing and managing the corresponding

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2.1 Physical Features

2.1.1 Design Features

2.1.2 Material and Color

2.1.3 Dimensions and Weight

Rack dimensions: Width: 800mm (without side panel)

Height: 2100mm (with top cover), 1946.5mm (without top cover)

Side panel dimensions: Height: 2100mm

Weight: 224kg (empty rack), 310kg (fully configured)

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II. B-type server rack

Rack dimensions: Width: 600mm (without side panel)

Height: 2100mm (with top cover), 1946.5mm (without top cover)

Side panel dimensions: Height: 2100mm

Weight: 193kg (empty rack), 440kg (fully configured)

2.1.4 Other Features

2.1.5 Rack Installation

2.2 Functional Configurations

2.2.1 AM/CM Rack

The standard configuration of AM/CM rack is shown in Figure 2-1.

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From top to bottom, the frames are:

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z Interface frame (DT frame): Its standard configuration includes

The standard SM rack configuration is shown in Figure 2-2.

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From top to bottom, the frames are:

2.2.3 BAU Rack

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The physical/mechanical structure of the frame includes circuit boards, backplane,

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4.1 Functions and Features

4.2 Board Structure

Dimensions of boards in the M900/M1800 MSC/SSP/IP system are unified. Except

The board structure is shown in Figure 4-1.

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The board panel is shown in Figure 4-2.

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(1) Serial port (2) DIP switches (3) Reset button

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Chapter 5 Functional Units

According to the functional structure, M900/M1800 MSC/SSP/IP mainly comprises

The functional structure of the M900/M1800 MSC/SSP/IP is shown in Figure 5-1.

BSC AIE IWF

Digital trunk system LPN7

Billing Clock sys. LPRA