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DATA SHEET
book, halfpage
M3D109
Philips Semiconductors
Product specication
PNP medium power transistor in a SOT89 plastic package. NPN complements: BCX54, BCX55 and BCX56.
3
MARKING TYPE NUMBER BCX51 BCX51-10 BCX51-16 BCX52 BCX52-10 MARKING CODE AA AC AD AE AG TYPE NUMBER BCX52-16 BCX53 BCX53-10 BCX53-16 MARKING CODE AM AH AK AL
1 Bottom view 2 3
MAM297
1999 Apr 19
Philips Semiconductors
Product specication
MIN. 65 65
UNIT
mA W C C C
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm2. For other mounting conditions, see Thermal considerations for SOT89 in the General Part of associated Handbook. THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s Note 1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm2. For other mounting conditions, see Thermal considerations for SOT89 in the General Part of associated Handbook. PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 VALUE 94 14 UNIT K/W K/W
1999 Apr 19
Philips Semiconductors
Product specication
MIN. 40 63 25 63 100
TYP. MAX. UNIT 50 100 10 100 250 160 250 500 1 mV V MHz nA A nA
IE = 0; VCB = 30 V; Tj = 125 C IC = 0; VEB = 5 V VCE = 2 V; see Fig.2 IC = 5 mA IC = 150 mA IC = 500 mA DC current gain BCX51-10; BCX52-10; BCX53-10 BCX51-16; BCX52-16; BCX53-16 VCEsat VBE fT collector-emitter saturation voltage base-emitter voltage transition frequency IC = 500 mA; IB = 50 mA IC = 500 mA; VCE = 2 V IC = 150 mA; VCE = 2 V; see Fig.2
160
MBH730
hFE 120
VCE = 2 V
80
40
0 101
10
102
103
IC (mA)
104
1999 Apr 19
Philips Semiconductors
Product specication
Plastic surface mounted package; collector pad for good heat transfer; 3 leads
SOT89
b3
E HE
2
b2
3
c
w M
b1 e1 e
2 scale
4 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.6 1.4 b1 0.48 0.35 b2 0.53 0.40 b3 1.8 1.4 c 0.44 0.37 D 4.6 4.4 E 2.6 2.4 e 3.0 e1 1.5 HE 4.25 3.75 L min. 0.8 w 0.13
EUROPEAN PROJECTION
1999 Apr 19
Philips Semiconductors
Product specication
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1999 Apr 19
Philips Semiconductors
Product specication
1999 Apr 19
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
115002/00/03/pp8