En Cu515 Tu515 SVC Eng 1106

Service Manual
Internal Use Only
Service Manual CU515/TU515
Model : CU515/TU515
Date: November, 2007 / Issue 1.0
Table Of Contents
1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5 1.2 Regulatory Information............................ 5 4.10 Camera Troubleshooting ...................102 4.11 Keypad Backlight Troubleshooting ....104 4.12 Folder ON/OFF Troubleshooting .......105 4.13 Main LCD Troubleshooting ................106 4.14 Receiver Path ....................................107 4.15 Headset path......................................109 4.16 Speaker phone path...........................111 4.17 Main microphone ...............................113 4.18 Headset microphone..........................115 4.19 Vibrator ..............................................117
2. PERFORMANCE...............................7
2.1 System Specification................................7 2.2 Using Condition (Accessory)....................7 2.3 Radio Performance ..................................8 2.4 Current Consumption.............................11 2.5 Operation Time ......................................11 2.6 RSSI Bar ................................................11 2.7 Battery Bar .............................................12 2.8 BACKUP BATTERY...............................12 2.9 Sound Level ...........................................12
5. DOWNLOAD..................................118
5.1 Introduction ..........................................118 5.2 Downloading Procedure.......................118 5.3 Troubleshooting Download Errors .......133 5.4 Caution.................................................141
3. TECHNICAL BRIEF ........................13

3.1 General Description ...............................13 3.2 GSM Mode.............................................15 3.3 UMTS Mode...........................................19 3.4 LO Phase-locked Loop ..........................22 3.5 Off-chip RF Components .......................24 3.6 Digital Baseband(DBB/MSM6260).........32 3.7 Block Diagram(MSM6260).....................34 3.8 Subsystem(MSM6260) ..........................35 3.9 Power Block ...........................................43 3.10 External memory interface ...................48 3.11 H/W Sub System..................................49 3.12 Main Features ......................................65
6. BLOCK DIAGRAM ........................142

6.1 GSM & UMTS RF Block.......................142 6.2 Interface Diagram ................................143
7. Circuit Diagram ............................145 8. BGM Pin Map................................153 9. PCB LAYOUT ................................167 10. Calibration & RF Auto Test Program (Hot Kimchi)................159
10.1 Configuration of HOT KIMCHI ...........159 10.2 How to use HOT KIMCHI...................160
4. TROUBLE SHOOTING ...................69

4.1 RF Component.......................................69 4.2 Checking VCXO Block ...........................72 4.3 Checking Ant. SW Module Block ...........74 4.4 Checking UMTS Block ...........................76 4.5 Checking GSM Block .............................83 4.6 Power ON Troubleshooting....................92 4.7 Charger Troubleshooting .......................95 4.8 USB Troubleshooting.............................98 4.9 SIM Detect Troubleshooting ................100
11. EXPLODED VIEW & REPLACEMENT PART LIST ..... 163

11.1 EXPLODED VIEW ............................ 163 11.2 Replacement Parts <Mechanic component>.................... 165 <Main component> ........................... 169 11.3 Accessory ......................................... 186
Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
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1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your companys employees, agents, subcontractors, or person working on your companys behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that resultfrom such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling: sign.
Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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2. PERFORMANCE
2. PERFORMANCE
2.1 System Specification
Item 1.Type 2.Size 3.Weight 4.Battery 5.LCD Type 6.Accessory 1)Travel Adaptor 2)Ear-Mic Adaptor 3)Data Cable 1) Input : AC 100~240V , Output : 5.1V, 700mA 2) ELA 3) USB data cable (option) Type / Spec. TFT Main_LCD & Mono Sub LCD Folder 96 x 49.5 x 18.3 mm 100.5g, (With 1,000mA Battery) Standard :1,000 mAh (Li-ion) TFT Main LCD(2, 176 x 220), Mono Sub LCD(1.3 128 X160)
2.2 Using Condition (Accessory)

1) Maximum Using Condition (Using Environment)
Item Available AC Input Power Available DC Input Power Storage Temperature Specification AC : 240 V Max DC : 12 V Max - 20 ~ + 70 C
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2. PERFORMANCE
2) General Using Condition

Item Output Power Battery Power Input Power Current Consumption Operation Temperature -20 60 AC Power 3.2 100 3.7 110 4.2 240 Vdc Vac W C Spec. DC Power Min Typ. Max 12 Unit Vdc
2.3 Radio Performance

1) Transmitter-GSM Mode
Item Phase Error Frequency Error EMC(Radiated Spurious Emission Disturbance) Transmitter Output power and Burst Timing Burst Timing Spectrum due to modulation out to less than 1800kHz offset Specification Rms : 5 Peak : 20 GSM : 0.1 ppm DCS/PCS : 0.1 ppm GSM/DCS : < -28dBm GSM : 5dBm - 33dBm 3dB DCS/PCS : 0dBm - 30dBm 3dB <3.69us 200kHz : -36dBm 600kHz : -51dBm/-56dBm GSM : 1800-3000kHz :< -63dBc(-46dBm) 3000kHz-6000kHz : <-65dBc(-46dBm) 6000kHz < : < -71dBc(-46dBm) DCS : 1800-3000kHz :< -65dBc(-51dBm) 6000kHz < : < -73dBc(-51dBm) 400kHz : -19dBm/-22dBm(5/0), -23dBm 600kHz : -21dBm/-24dBm(5/0), -26dBm Class II(RBER) : -105dBm(2.439%) 0.012(-15 - -40dBm) 800kHz, 1600kHz : -98dBm/-96dBm (2.439%) -98dBm/-96dBm (2.439%) 0.5T
Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band
Spectrum due to switching transient Reference Sensitivity - TCH/FS Usable receiver input level range Intermodulation rejection - Speech channels AM Suppression -GSM : -31dBm - DCS : -29dBm Timing Advance
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2. PERFORMANCE
2)Transmitter - WCDMA Mode

Item Transmit Frequency Maximum Output Power Frequency Error Open Loop Power Control Minimum Transmit Power Occupied Bandwidth Adjacent Channel Leakage Power Ratio (ACLR) Specification WCDMA850 : 824 MHz ~ 849 MHz WCDMA1900 : 1850 ~1910 MHz +24 dBm / 3.84 MHz, +1 / -3 dB within 0.1 PPM Normal Conditions : within 9 dB, Extreme Conditions : within 12 dB < -50 dBm /3.84 MHz < 5 MHz at 3.84 Mcps (99% of power) > 33 dB @ 5 MHz, > 43 dB @ 10 MHz < -36 dBm / 1 kHz RW @ 9 kHz < 150 kHz < -36 dBm / 10 kHz RW @ 150 KHz f < 30 MHz < -36 dBm / 100 kHz RW @ 30 MHz f < 1 GHz Spurious Emissions |f-fc| > 12.5 MHz < -30 dBm / 1 MHz RW @ 1 GHz f < 12.75 GHz < -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz < -67 dBm / 100 kHz RW @ 925 MHz f 935 MHz < -79 dBm / 100 kHz RW @ 935 MHz < f 960 GHz < -71 dBm / 100 kHz RW @ 1805 MHz f 1880 MHz Transmit Intermodulation Error Vector Magnitude Peak Code Domain Error < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz when Interference CW Signal Level = -40 dBc < 17.5 %, when Pout -20 dBm < -15 dB at Pout -20 dBm
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2. PERFORMANCE
3)Receiver - WCDMA Mode

Item Receive Frequency Reference Sensitivity Level Maximum Input Level Adjacent Channel Selectivity (ACS) Specification WCDMA850 : 849 MHz ~ 894 MHz WCDMA1900 : 1930 ~1990 MHz BER < 0.001 when or = -106.7 dBm / 3.84 MHz BER < 0.001 when or = -25 dBm / 3.84 MHz ACS > 33 dB where BER < 0.001 when or = -92.7 dBm / 3.84 MHz & Ioac = -52 dBm / 3.84 MHz @ 5 MHz BER < 0.001 when or = -103.7 dBm / 3.84 MHz Blocking Characteristic & Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = 10 MHz or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = 15 MHz Spurious Response BER < 0.001 when or = -103.7 dBm / 3.84 MHz & Iblocking = -44 dBm BER < 0.001 when or= -103.7 dBm / 3.84 MHz Intermodulation & Iouw1 = -46 dBm @ Fuw1(offset) = 10 MHz & Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = 20 MHz Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz f < 1 GHz < -47 dBm / 1 MHz BW @ 1 GHz f 12.75 GHz
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2. PERFORMANCE
2.4 Current Consumption

WCDMA Only Sleep Mode Standby Talk Mode NO SVC Mode Power Off (Backup Battery Charging) 1.5mA(sleep current) 4mA(DRX=1.28sec) VC 13dBm (low power mode) : 300 mA TBD 300A 500A GSM Only 1.5mA(sleep current) 4mA(MF=5) 310 (Tx Lvl:5) TBD 300A 500A
2.5 Operation Time

Stand by WCDMA Only GSM Only 333 hours = 3mA (1000mAh battery, DRX cycle = 1.28) 333 hours = 3mA (1000mAh battery, Paging frame class5) Voice Call 180 mins = 300mA (1000mAh battery, TX = 13dBm) 190 mins = 310mA (1000mAh battery, TX = Level 5) / / VT
2.6 RSSI Bar

Level Change 1) BAR 5 2) BAR 5 4 3) BAR 4 3 4) BAR 3 2 5) BAR 2 1 6) BAR 1 0 WCDMA -90 2 dBm -90 2 dBm -95 2 dBm -100 2 dBm -103 2 dBm -106 2 dBm GSM -87 2 dBm -87 2 dBm -92 2 dBm -97 2 dBm -102 2 dBm -107 2 dBm
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2. PERFORMANCE
2.7 Battery Bar

Indication Bar3 Bar 3 2 Bar 2 1 Bar 1 Empty Low Voltage, Warning message+ Blinking Power Off Standby 3.76 0.05V 3.76 0.05V 3.687 0.05V 3.617 0.05V 3.493 0.05V (Stand-by) / 3.617 0.05V (Talk) [Interval : 3min(Stand-by) / 1min(Talk)] 3.28 0.05V
2.8 BACKUP BATTERY : Over 50 hours (When Normal POWER OFF/EMERGENCY OFF) 2.9 Sound Level
Key Tone 1) Standby : a) Speaker : 70~120dBspl (When 30cm distance, Maximum Tone) b) Headset : 70~100dBspl c) Warning Tone : 70~120dBspl (When 30cm distance, Maximum Tone) 2) Talk : a) Speaker : 70 ~ 100dBspl b) Headset : 70 ~ 100dBspl (Key Tone(In Calling) 100dBspl under) c) Warning Tone : 70~100dBspl (When 30cm distance, Maximum Tone)
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 General Description
The CU515 supports UMTS-850, UMTS-1900, GSM-850, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne 1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.
Fig 1.1 Block diagram of RF part
A generic, high-level functional block diagram of CU515 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module) (plustwo duplexers for UMTS high-band and low-band operations).
QUALCOMMs branded chipset that implements a Zero-IF radio architecture.
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3. TECHNICAL BRIEF
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The high-band UMTS receive path and low-band path are accommodated in the RFR6275 IC. The RFIC.s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC (at ADC1). For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge from the RTR6275 transceiver. In the GSM receive path, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing. The RFR6275 GSM/UMTS IC receiver baseband outputs share the same interface to the MSM IC input ADC as the RTR6275 IC baseband outputs. The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology: 1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a constant envelope phase signal at RF; 2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the MSM CU515 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators. The devices general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.
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3. TECHNICAL BRIEF
3.2 GSM Mode

3.2.1 GSM Receiver
The Dual-mode CU515s receiver functions are split between the three RFICs as follows: UMTS-850,1900 operation uses the RFR6275 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q). GSM-850, GSM-900, DCS-1800, and PCS-1900 modes both use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters. RF Front end consists of antenna, antenna switch module(DGM099M01) which includes four RX saw filters(GSM850, GSM900, GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In CU515, a common antenna connects to one of eight paths: 1) UMTS-850 Rx/Tx, 2) UMTS-1900 Rx/Tx, 3) GSM-850 Rx, 4) GSM-900 Rx, 5) GSM-850 GSM-900 Tx, (Low Band Txs share the same path) 6) DCS-1800 Rx, and 7) DCS1800,PCS-1900 Tx(High Band Txs share the same path), 8) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. GSM850/GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.
ANTENNA SWITCH MODULE LOGIC

DGM099M01
ANT_SEL0 GSM900/GSM850 TX DCS/PCS TX GSM 850 RX GSM 900 RX DCS RX PCS RX UMTS 850 UMTS 1900 HIGH LOW LOW HIGH HIGH LOW LOW LOW
ANT_SEL1 LOW HIGH LOW LOW HIGH HIGH HIGH LOW
ANT_SEL2 HIGH HIGH LOW LOW LOW LOW HIGH HIGH
Table 1.1 Antenna Switch Module Control logic
The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software-please see applicable AMSS Software documentation for details.
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3. TECHNICAL BRIEF
The GSM850, GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). GSM850, GSM900, DCS, and PCS receiver inputs are similar to the RFR6275 UMTS Rx input in that they also use differential configurations to improve common-mode rejection and second-order nonlinearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins Since GSM850, GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers - this is accomplished in the switch module. The GSM850, GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters and matching networks that transform single-ended 50-sources to differential impedances optimized for gain and noise figure. Similar to the RFR, the RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6275 input stages include MSM-controlled gain The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6260 IC for further processing (an interface shared with the RFR6275 UMTS receiver outputs.
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3. TECHNICAL BRIEF
RTR6275 RX feature
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3. TECHNICAL BRIEF
3.2.2 GSM Transmitter out put

The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applictions and PCB characteristics based on pass-band symmetry about the band center frequency, the suggested starting value is shown in Figure1.2.
Figure 1.2.2-1 GSM Transmitter matching The RTR6275 IC is able to support GSM 850/1900 and GSM 1800/1900 mode transmitting. This design guideline shows a quad-band GSM application. Both high-band and low band outputs are followed by resistive pads to ensure that the load Presented to the outputs remains close to 50ohm. The low-band GSM. Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the GSM Rx band.
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3. TECHNICAL BRIEF
3.3 UMTS Mode

3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RFR6275 device. UMTS LNA circuits(one for low-band UMTS and one for high-band UMTS path) separated from all other receive functions contained within the RFR6275 reveiver IC to improve mixer LO to RF isolation- a critical parameter in the ZIF architecture. Isolation is further improved using high-reverse isolation circuits in the LNA designs. The LNA gains are stepped via API control. The IC operating mode and LNA bias currents are automatically adjusted via software to minimize DC power consumption.
Figure 1.3.1-1 RFR6275 IC functional block diagram
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3. TECHNICAL BRIEF
Separate GPS and UMTS down-converters exist within the RFR6275 to allow GPS signals to be processed independently of UMTS signals. The inputs use differential configurations to improve second-order intermodulation and common-mode rejection performance. The differential input gain stage implements MSM IC-controlled gain adjustments to extend receiver dynamic range. The outputs of the differential amplifiers drive the RF port of the quadrature RF-tobaseband downconverters. The down-converters are routed to low-pass filters (one I and one Q) whose pass-band and stop-band characteristics supplement MSM device processing. These filter circuits allow for DC offset correction and the differential I/Q outputs are buffered to interface with the MSM IC. . Numerous secondary functions also are integrated on-chip: the Rx LO generation and distribution circuits and various interface, control, and status circuits. An on-chip UMTS VCO is phase locked to the external VC-TCXO signal and processed, by the LO generation and distribution circuits, to create the UMTS Rx LO signals for the quadrature down-converter. A second on-chip GPS VCO is also phaselocked to the VC-TCXO signal to generate the LO signals for the GPS down-converter. The LO signals, applied to their respective mixer, are at frequencies different to that of the VCOs, which is an important consideration for ZIF processing. The QUALCOMM MSM device provides status and control signaling, employing power reduction features (such as selective circuit power-down, gain control, and bias control) to extend handset standby time.
3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. mixers. The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-interface. The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator. UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine different frequency converters. the UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC design achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design guideline shows only UMTS 2100/1900 and UMTS 850 applications.
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3. TECHNICAL BRIEF
RTR6275 IC functional block diagram
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3. TECHNICAL BRIEF
3.4 LO Phase-locked Loop

All LO functions are fully integrated on-chip and do not require user any adjustment. QUALCOMM has established and implemented frequency plans and LO generation schemes that support the radioOne Platform B-series chipset. Only one area requires handset designer attention: the loop filters relating to each PLL. These are addressed in this chapter. All the UMTS Rx, GSM Rx, and GPS PLL circuits are included within the RFICs: reference dividers, phase detectors, charge pumps, feedback dividers, and digital logic. There are four integrated VCOs and PLLs within the Platform B (RFCMOS) chipset as shown in Figure 5-1 and Figure 5-2: Figure 5-1 1. PLL1, within the RTR6275 IC, produces the LO for up- and down-conversion of GSM Tx/Rx, and UMTS Tx. 2. PLL2, within RTR6275 IC, produces the Rx LO for one of the (high band) UMTS receive Paths. Figure 5-2 3. PLL3, within the RFR6275 IC, produces the Rx LO for the remaining UMTS receive paths. 4. PLL4, within the RFR6275 IC, produces the Rx LO for the GPS receive path. Within the RFICs, a buffered 19.2 MHz TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase- and frequency-locked. Thereference is divided by the R-Counters to create a fixed frequency input to the phase detector, FR. The other phase detector input (FV) varies as the loop acquires lock, and is generated by dividing the VCO frequency using the feedback path N-Counter. The closed loop will force FV to equal FR when locked. If the loop is not locked, the error between FV and FR will create an error signal at the output of the charge pump. This error signal is filtered by the loop filter components and applied to the VCO, tuning the output frequency so that the error is decreased. Ultimately, the loop forces the error to approach zero and the PLL is phase- and frequency-locked.
Figure 5-1
Figure 5-2
RFR6275 PLLs functional block diagram
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3. TECHNICAL BRIEF
3.4.1 UMTS Rx PLL (PLL3)

QUALCOMM provides a baseline PLL3 design for UMTS Rx. Loop filter component reference designators are shown in Figure 5-2. Table_ Baseline PLL3 design for UMTS Rx
Notes: 1. The performance values listed in this table are based on simulation results and are provided as a starting point for handset designers. Synthesizer performance is still being evaluated and optimized during this document release. Loop parameter, settling time, and filter component values are all expected to change when the optimization effort is completed. Future revisions will include expected performance based on measured data. 2. For CU515 C1_2.2nF C2_150pF R1_10k 3. Loop parameter acronyms are: Kvco VCO tuning sensitivity CP_I Charge pump current (controlled by API software) PM Phase margin L_BW Loop bandwidth 4. The listed VCO tuning sensitivity is based on QUALCOMM internal Rx VCO. 5. The listed settling times are for switching between channels at opposite ends of the active band and settling to within 250 Hz of the final frequency. 6. Test and evaluation efforts were ongoing at the time of this document release. Check future versions for design recommendations based on our test results.
3.4.2 Transceiver PLL (PLL1)

The PLL1 within the RTR6275 IC creates the Rx LO for all the GSM receive bands and GSM transmit bands as well as the UMTS transmit bands. The PLL1 of RTR6275 IC (with on-chip VCO) creates the transceiver LO that supports the quad-band GSM receivers and the GSM transmitters as well as the tri-band UMTS transmit outputs. All LO functional blocks are integrated into the RTR6275 IC except for some loop filter capacitors (Figure 5-1). On-chip circuits include reference divider, phase detector, charge pump, VCO, feedback divider, and digital logic status. The off-chip loop filter capacitors allow minimal optimization of PLL performance characteristics (stability, transitory response, settling time, and phase noise) for different applications.
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3. TECHNICAL BRIEF
3.5 Off-chip RF Components

3.5.1 Antenna switch module
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3. TECHNICAL BRIEF
3.5.2 UMTS duplexer

A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include; Insertion loss . this component is also in the receive and transmit paths ; In the CU515 typical losses : UMTS1900_ Tx = 2.1 dB, UMTS1900_ Rx = 2.8 dB and UMTS850_ Tx =1.9 dB, UMTS850_ Rx = 2.7 dB Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance: Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 45 dB. Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum duplexer Tx-band isolation value is about 55 dB. Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled. Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1). Power handling . high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.
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3. TECHNICAL BRIEF
3.5.3 UMTS Power Amplifier

UMTS850/UMTS1900 Power Amplifier module. The AWT6321 addresses the demand for increased integration in dual-band handsets for North American CDMA network deployments. The small footprint 3 mm x 5 mm x 1 mm surface mount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands, while achieving a 25% PCB space savings compared with solutions requiring two single-band PAs. The package pinout was chosen to enable handset manufacturers to easily route VCC to both power amplifiers and simplify control with a common VMODE pin. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. The AWT6321 is part of ANADIGICS High- Efficiency-at-LowPower (HELP TM) family of CDMA power amplifiers, which deliver low quiescent currents and significantly greater efficiency without a costly external DAC or DC-DC converter.
Block Diagram
- 26 -
3. TECHNICAL BRIEF
Electrical specifications-Cellular Band
- 27 -
3. TECHNICAL BRIEF
Electrical specifications - PCS Band
- 28 -
3. TECHNICAL BRIEF
3.5.4 Thermistor
This thermistor senses temperature variations around UMTS PA to adjust PA gain deviation for assure compliance with the applicable transmit power control standards. Negative temperature compensation thermistor is used in the CU515.
3.5.5 GSM/GPRS/EDGE Power amplifier

Product Description The TQM7M5003 is a small (7x7mm), GSM/EDGE PAM for handset applications. This module has been optimized for excellent EDGE efficiency, ACPR and EVM in an open loop polar modulation environment at EDGE class E2+ operation while maintaining high GSM/GPRS efficiency. The TQM7M5003 is fan-out compatible with TriQuints other power amplifier modules.
GSM PA functional block diagram
Operating Parameter
- 29 -
3. TECHNICAL BRIEF
3.5.6 UMTS Rx RF filter

Filter1 869 ~ 894MHz Filter2 1805 ~1880MHz An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include: Out-of-band rejection or attenuation levels, usually specified to meet these conditions: Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency. Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage. Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input. Phase and amplitude balance - the ZIF architecture requires well-balanced differential inputs to the RFR6202 IC. This is accomplished by the RF filter which takes a single-ended output from the RFL6202 IC and provides differential outputs having nominal 180 phase separation. Phase and/or amplitude imbalance causes degraded common-mode rejection and second-order nonlinearity, so their requirements are specified jointly. 3 degrees and 1 dB -12 to + 3 degrees and 0.7 dB Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections.
3.5.7 VCTCXO
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6260 IC. The oscillator frequency is controlled by the MSM6260s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control. The filtered PDM signal results in an analog control signal into the VCTCXO tuning port whose voltage is directly proportional to the density of the digital bit stream. The MSM device varies the pulse density to change the analog control voltage that sets the oscillator frequency - all within a feedback control loop that minimizes handset frequency drift relative to the network.
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3. TECHNICAL BRIEF
3.5.8 Bluetooth
The MSM6260 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.5.12-1 shows the bluetooth system architecture in the CU515.
Figure1.5.12-1 Bluetooth system architecture
- 31 -
3. TECHNICAL BRIEF
3. BB Technical Description
3.6 Digital Baseband(DBB/MSM6260)
3.6.1 General Description
A. Features(MSM6260)
Support for multimode operation - HSDPA, tri-band WCDMA (UMTS), quad GSM/GPRS/EDGE, and GPS. Support for HSDPA downlink up to 3.6 Mbps Support for WCDMA (UMTS) uplink data rate up to 384 kbps High-performance ARM926EJ-S running at up to 270 MHz for 3.6 Mbps HSDPA ARM Jazelle Java hardware acceleration for faster Java-based games and other applets QDSP4000 high-performance DSP cores Integrated gpsOne position location technology functionality Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals Qcamera with 30 fps QCIF viewfinder resolution, and support for 3 MP camera sensors Direct interface to digital camera module with video front end (VFE) image processing True 3D graphics for advanced wireless gaming SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI integrity. Support for Qfuse. Audio on par with portable music players Vocoder support (AMR, FR, EFR, HR) Advanced 14 x 14 mm, 0.5-mm pitch, 409-pin lead-free CSP packaging technology SD/SDIO hardware support
- 32 -
3. TECHNICAL BRIEF
GSM Tx/Rx 1800/19 00 850/9 00
GSM TX_SAW PAM 900

GSM 850 Rx GSM 900 Rx GSM 1800 Rx
1.3M
Receiver GSM-VCO MIC
FEM (SWPlexer + GSM_RX_SAW)
SPDT
TPA2 005
I/ Q
SPE AKE R
GSM 1900 Rx
RTR6275
WCDMA Tx/Rx 85 0Coupler
Stereo Headset
TFLA SH
TX_SAW
MSM6260 WCDMA PAM

190 0 Coupler
W-VCO
LCD (2 QCIF)
S S BI
Duplexer
TX_SAW
Duplexer
190 RX_SAW 0 85RX_SAW 0
HDET
NAND 1G SDRAM 512M
LNA RFR6275 LNA W-VCO BI

S S S S BI
Power
USIM PM665 0
USB +5V
Bluetooth
Figure. Simplified Block Diagram
- 33 -
3. TECHNICAL BRIEF
3.7 Block Diagram(MSM6260)
SDRAM 512M
NAND Flash 1G
LCD
(2.2inch)
EBI 1 CAMERA PROCESSING (Default 8bit Interface) GRAPHICS Open GL ES 3D, 2D VIDEO MPEG-4 H.263, H.264 QDSP 4000
EBI 2
DUAL MEMORY BUS
GSM/GPRS/EDGE processor UMTS, WCDMA, HSDPA processor BT 1.2 processor
Camera 1.3M
MSM6260
Modem QDSP 4000
PLL ARM 926ejs With Jazelle
GPIO AUDIO Keypad I/F MP3, AAC, EVRC, QCELP AMR, CMX, MIDI UART1 JTAG USB UART2 / RUIM1 UART3 / PMIC SBI CONNECTIVITY RF SBI Rx ADC Tx DAC
I/O Conn
KEY PAD
PM6650
USIM
Figure. Simplified Block Diagram of MSM6260
USB
- 34 -
3. TECHNICAL BRIEF
3.8 Subsystem(MSM6260)
3.8.1 ARM Microprocessor Subsystem
The MSM6260 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6275, RFR6275 and PM6650 devices.
3.8.2 WCDMA R99 features

The MSM6260 device supports the W-CDMA FDD release 99, including the following features: All modes and data rates for W-CDMA frequency division duplex (FDD), with the following restrictions: The downlink supports the following specifications: - Up to four physical channels, including the broadcast channel (BCH), if present - Up to three dedicated physical channels (DPCHs) - Spreading factor (SF) range support from 4 to 256 - The following transmit diversity modes are supported: Space time transmit diversity (STTD) Time-switched transmit diversity (TSTD) Closed-loop feedback transmit diversity (CLTD) The uplink supports the following specifications: The uplink provides the following UE support: - One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary - A maximum data rate of 384 kbps Full SF range support from 4 to 256 SMS (CS and PS) PS data rate - 384 kbps DL / 384 kbps UL CS data rate - 64 kbps DL / 64 kbps UL AMR (all rates)
- 35 -
3. TECHNICAL BRIEF
3.8.3 GSM features

The following GSM modes and data rates are supported by the MSM6260 device hardware. Support modes conform to release '99 specifications of the sub-feature. Voice features FR EFR AMR HR A5/1, A5/2, and A5/3 ciphering Circuit-switched data features 9.6k 14.4k Fax Transparent and non-transparent modes for CS data and fax No sub-rates are supported
3.8.4 GPRS features

Packet switched data (GPRS) DTM (Simple Class A) operation Multi-slot class 12 data services CS schemes: CS1, CS2, CS3, and CS4 GEA1, GEA2, and GEA3 ciphering Maximum of four Rx timeslots per frame
3.8.5 EDGE features

EDGE E2 power class for 8 PSK DTM (simple Class A), multi-slot class 12 Downlink coding schemes - CS 1-4, MCS 1-9 Uplink coding schemes - CS 1-4, MCS 1-9 BEP reporting SRB loopback and test mode B 8-bit, 11-bit RACH PBCCH support 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF
- 36 -
3. TECHNICAL BRIEF
3.8.6 MSM6260 device audio processing features

Integrated wideband stereo CODEC 16-bit DAC with typical 88 dB dynamic range Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path VR- Voice mail + voice memo Acoustic echo cancellation Audio AGC Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8 (G2) Internal vocoder supporting AMR, FR, EFR, and HR
3.8.7 MSM6260 microprocessor subsystem

Industry standard ARM926EJ-S embedded microprocessor subsystem 16 kB instruction and 16 kB data cache Instruction set compatible with ARM7TDMI ARM version 5TEJ instructions Higher performance 5 stage pipeline, Harvard cached architecture Higher internal CPU clock rate with on-chip cache Java hardware acceleration Enhanced memory support 75 MHz and 90 MHz bus clock for SDRAM 32-bit SDRAM Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2) such as LCD panels 1.8 V or 2.6 V memory interface support (excluding EBI1) NAND FLASH memory interface - 8/16-bit data I/O width NAND flash support - 1- or 4-bit ECC - 512-byte/2KB page-size support - 2 chip selects supported for NAND Flash - Boot from NAND - Low-power SDRAM (LP-SDRAM) interface Internal watchdog and sleep timers
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3. TECHNICAL BRIEF
3.8.8 Supported interface features

USB On-the-Go core supports both slave and host functionality Three universal asynchronous receiver transmitter (UART) serial ports USIM controller (via UART) Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards Parallel LCD interface General-purpose I/O pins External keypad interface
3.8.9 Supported multimedia features

Provide additional general purpose MIPS by using: Two QDSP4000s Dedicated hardware accelerators and compression engines Improve Java, BREW, and game performance Integrated Java and 2D/3D graphics accelerator with Sprite engine Enable various accessories via USB host connectivity. Integrated USB host controller functionality Enable compelling visual and audio applications.
Qcamera
High-quality digital camera processing, supporting CCD or CMOS image sensors up to 3 MP 30 fps QCIF viewfinder
Qtv
Audio and video decoder that supports VOD, MOD and Broadcast multimedia services. Audio CODECs supported: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, RealAudio v8 Integrated stereo wideband Codec for music/digital clips CMX Video Codecs supported: MPEG-4, H.263, H.264, Windows Media v9 and RealNetworks v10
Video telephony services: Qvideophone

A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps Video CODECs supported: MPEG-4 and H.263 Audio CODECs supported: AMR-NB
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3. TECHNICAL BRIEF
Qcamcorder
Real time mobile video encoder Video CODECs supported: MPEG-4, H.263 Audio CODECs supported: AMR-NB Recording performance: 15 fps @ QCIF, 192 kbps Video telephony at 15 frames per second(fps), QCIF resolution video encode at 15 fps at QCIF for camcorder capability Video decode at 15 fps at QCIF resolution, streaming or offline
gpsOne
Integrated gpsOne processing Standalone gpsOne mode in which the handset acts as a GPS receiver
CMX (MIDI and still image, animation, text, LED/vibrate support)

72 simultaneous polyphonic tones 44 kHz sampling rate 512 kB wave table Support of universal file formats Standard MIDI Format (SMF) SP-MIDI SMAF Audio playback (MA-2, MA-3, MA-5) XMF/DLS MFil (requires Docomo license) PNG decoder Pitch bend range support LED/vibrate support Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2) MLZ decoder Integrated PNG/SAF A.T.
- 39 -
3. TECHNICAL BRIEF
Table 1-1 Summary of MSM6260 device features
- 40 -
3. TECHNICAL BRIEF
3.8.10 Serial Bus Interface(SBI)

The MSM6260 devices SSBI is designed specifically to be a quick, low pin count control protocol for QUALCOMMs RTR6275, RFR6275 and PM6650 ASICs. Using the SSBI, the RTR6275, RFR6275, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SSBI also controls DC baseband offset errors.
3.8.11 Wideband CODEC

The MSM6260 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the microphone and earphone amplifiers into the MSM6260 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set interally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.
3.8.12 Vocoder Subsystem

The MSM6260 devices QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6260 devices integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.
3.8.13 ARM Microprocessor subsystem

The MSM6260 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RFR6275, RTR6275, and PM6650 devices.
3.8.14 Mode Select and JTAG Interfaces

The mode pins to the MSM6260 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6260 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.
- 41 -
3. TECHNICAL BRIEF
3.8.15 General-Purpose Input/Output Interface

The MSM6260 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.
3.8.16 UART
The MSM6260 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins. UART1 for data UART2 (can be used for USIM interface) UART3 for data
3.8.17 USB
The MSM6260 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host.
- 42 -
3. TECHNICAL BRIEF
3.9 Power Block

3.9.1 General
MSM6280, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6280, MSM memory, RF block, Bluetooth, Micro SD, USIM and TCXO. Major power components are : PM6650(U401) : Phone power supply AAT3157ITP(U401) : LCD Backlight charge pump PM6650(U401) : LCD LDO PM6650(U401) : Camera dual LDO
3.9.2 PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.
- 43 -
3. TECHNICAL BRIEF
Figure. PM6650 Functional Block Diagram
- 44 -
3. TECHNICAL BRIEF
3.9.3 Charging control

A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.
3.76 0.05V
3.76 0.05V
3.687 0.05V
3.617 0.05V
CU515 Battery Bar Display(Stand By Condition)
- 45 -
3. TECHNICAL BRIEF
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V). The charging current is set to 80mA. Parameter Trickle Current Min 60 Typ 80 Max 100 Unit mA
- 46 -
3. TECHNICAL BRIEF
Constant Current Charging

The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.
Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current (110mA) Charging Method : CC & CV (Constant Current & Constant Voltage) Maximum Charging Voltage : 4.2V Maximum Charging Current : 600mA Nominal Battery Capacity : 1000 mAh Charger Voltage : 5.1V Charging time : Max 3h (Except time trickle charging) Full charge indication current (icon stop current) : 110mA Low battery POP UP : Idle - 3.493V, Dedicated(GSM/WCDMA) - 3.617V Low battery alarm interval : Idle - 3 min, Dedicated - 1min Cut-off voltage : 3.28V
- 47 -
3. TECHNICAL BRIEF
3.10 External memory interface

A. MSM6260 The MSM6260 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, etc. EBI1 Features - 16 bit static and dynamic memory interface - 32 bit dynamic memory interface - 24 bits of address for static memory devices which can support up to 32MBytes on each chip select - Synchronous burst memories supported (burst NOR, burst PSRAM) - Synchronous DRAM memories supported - Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses - Pseudo SRAM (PSRAM) memory support EBI2 Features - Support for asynchronous FLASH and SRAM(16bit & 8bit) - Interface support for byte addressable 16bit devices(UB_N & LB_N signals) - 2Mbytes of memory per chip select - Support for 8 bit/16bit wide NAND flash - Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit) 1Gb NAND(16bit) flash memory + 512Mb SDRAM (32bit) 1-CS(Chip Select) are used
Interface Spec Device FLASH SDRAM Part Name TY9000A800K0GG TY9000A800K0GG Maker Toshiba Toshiba Read Access Time 50 ns 15 ns Write Access Time 50 ns 15 ns
Table#1. External memory interface for CU515
- 48 -
3. TECHNICAL BRIEF
3.11 H/W Sub System

3.11.1 RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)
MSM6260 controls RF part(RTR6275) using these signals. SBST : SSBI I/F signals for control Sub-chipset PA_ON1, PA_ON2 : Power AMP on RF part RX0_I/Q_M/P,TX_I/Q_M/P: I/Q for T/Rx of RF TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
WDOG_STB_SBCK1_GPIO0 SBDT1_GPIO1 PA_ON1_GPIO2 GRFC9_GPIO12 CAMCLK_PO_GP_MN_GPIO13 GPIO28 USB_RX_DATA_GPIO29 XMEM2_CS_N2_GPIO35 XMEM2_CS_N3_GPIO36 LCD_EN_GPIO37 GPIO43 SYNTH2_GPIO65 GPIO66 XMEM1_CS_N1_GPIO76 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93
H25 F26 H11 D5 J21 A6 N19 W15 AA15 AE13 H9 B6 F8 AA1 Y6 L25 H6 F18 H18 H13
PA_ON1 W850 PAM CAM_MCLK LCD_IF_MODE PA_ON2 W1900 PAM MICROSD_DETECT CAM_PWDN
LCD_RESET_N
VGA_CAM_RESET FOLDER_DETECT
TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0
TX_AGC_ADJ
TP200
TCXO_EN
C240
R208
2K
TRK_LO_ADJ
Close to MSM
B12 A13 B13 F12 W23 V23 V25 W25 AA25 Y25 AB25 AC25 D17
TX_QM TX_QP TX_IM TX_IP DAC_REF
RX_QM RX_QP RX_IM RX_IP
GP_PDM2_PA_RANGE1 H17 GP_PDM1_PA_RANGE0 TRST_N TCK TMS TDI TDO RTCK AUX_PCM_CLK_GRFC14_GPIO80 AUX_PCM_DIN_GRFC13_GPIO14 AUX_PCM_DOUT_GRFC12_GPIO103 AUX_PCM_SYNC_GRFC11_GPIO102 TX_ON_GRFC10 GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3
H15 D16 F15 D15 A17 H16 K19 N21 G4 J8 H12 B4 T23 T19 D11 H10 F10 D9 A8 B8
PA_R0 JTAG_TRST_N JTAG_TCK JTAG_TMS JTAG_TDI JTAG_TDO JTAG_RTCK SPK_AMP_EN
TX_ON ANT_SEL2 ANT_SEL1 ANT_SEL0 GSM_SAW_SW_MODE
GSM_PA_BAND GSM_PA_EN
Figure. Schematic of RF Interface of MSM6260
33nF
A12
- 49 -
3. TECHNICAL BRIEF
B. RFR6275(WCDMA_Rx)
SBDT: SSBI I/F signals for control Sub-chipset RX0_I/Q_M/P : I/Q for Rx of RF
C. the others
TRK_LO_ADJ : TCXO(19.2M) Control PA_ON1 : WCDMA(850) TX Power Amp Enable PA_ON2: WCDMA(1900) TX Power Amp Enable ANT_SEL[0-3] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp GSM_PA_RAMP : Power Amp Gain Control of APC_IC GSM_PA_EN : Power Amp Gain Control Enable of APC_IC GSM_SAW_SW_MODE: GSM SAW Filter Switch
- 50 -
3. TECHNICAL BRIEF
3.11.2 MSM Sub System

3.11.2.1 USIM Interface
SIM interface scheme is shown in Figure. And, there control signals are followed USIM_CLK : USIM Clock USIM_Reset : USIM Reset USIM_Data : USIM Data T/Rx
VREG_UIM 2.85V USIM CLK
MSM6260
USIM CLK USIM Reset USIM Data
PM6650
USIM Reset USIM Data
USIM
Figure. SIM Interface
3.11.2.2 UART Interface

UART signals are connected to MSM GPIO through IO connector with 115200 bps speed. GPIO_Map GPIO_96 GPIO_95 Name UART_RXD UART_TXD Note Data_Rx Data_Tx Table. UART Interface
- 51 -
3. TECHNICAL BRIEF
3.11.2.3 USB
The MSM6260 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6260 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6260.
Name USB_DAT USB_SE0 USB_OE_N USB_VBUS USB_D+ USB_D-
Note Data to/from MSM Data to/from MSM Out-Put Enable of Transceiver USB_Power From Host(PC) USB Data+ to Host USB Data- to Host
Table. USB Signal Interface
M21 UART3_DP_RX_DATA_GPIO85 M19
H14 MMC_CMD_GPIO30 L14
MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31
UART3_DP_TX_DATA_GPIO84 GPIO40 GPIO42
UART3_CTS_N_GPIO86
USB_DAT_VP USB_SE0_VM USB_OE_TP_N
USB_OE_N USB_CNT_N USB_VBUS USB_DAT USB_D+ USB_SE0 USB_D47K C427 4.7u 1608
14 15 16 17 18 19 20 21
USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P USB_SE0 USB_D_M LCD_DRV_N GP1_DRV_N(MPP7)
D6
D7
N26
N23
N25
L23
VGA_CAM_PWDN
TP201
M16
PM_INT_N PS_HOLD
MICROSD_CMD MICROSD_DATA(0) MICROSD_CLK
USB_DAT USB_SE0 USB_OE_N
R412
Figure. Schematic of USB block(MSM6260Side & PM6650 Side)
- 52 -
22
3. TECHNICAL BRIEF
3.11.3 HKADC(House Keeping ADC)

The MSM6260 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6260 device has six analog input pins which are multiplexed to the input of the internal HKADC.
Figure. MSM6260HKADC Block diagram
Channel HKADC0 HKADC1 HKADC2 HKADC3 HKADC4 HKADC5
Signal AMUX_OUT VBATT_SENSE No use TTY_ADC_DET PCB_Rev_ADC VBATT_TEMP
Note RF PAM Temperature Check Battery voltage level
Ear jack Detection for TTY PCB Version Check Battery Temperature Check
Table. HKADC channel table
- 53 -
3. TECHNICAL BRIEF
3.11.4 Key Pad

There are 24 buttons, 4 side keys in Figure. Shows the Keypad circuit. END Key is connected PM_ON_SW_N to PMIC(PM6650).
COL(0) ROW0 ROW(1) ROW(2) ROW(3) ROW(4) 1 4 7 * 2 5 8 0 COL(1) COL(2) Multi 3 6 9 # COL(3) CLR Left OK SEND Down COL(4) MENU Up Right SEARCH BACK COL(5) Side(up) Side(down) PTT
Table. Key Matrix Mapping Table
VREG_MSMP_2.7V
2 4 6 8
100K
KEY
RA600 1 3 5 7 100K
R602
HOT600
HOT3
CLR
CLR
MENU
MENU
KEY_ROW(0)
600
1 KEY_ROW(1)
601
2
602
3
LEFT
LEFT
UP
UP
603
4 KEY_ROW(2)
604
5
605
6
OK
OK
RIGHT
RIGHT
606
7 KEY_ROW(3)
607
8
608
9
SND
SND
SEARCH
SEARCH
HOT601
KEY_COL(0) KEY_ROW(4) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4) HOT4
609
0
HOT602
HOT5
DN
DN
BACK
BACK
Figure. Keypad Circuit
- 54 -
3. TECHNICAL BRIEF
ON_SW
END
PM_ON_SW_N D600 RB521S-30 VA600 EVLC18S02015 END
SPK_EN
CN601 1 2 3 VA602 KEY_ROW(4) KEY_COL(5) EVLC18S02015
CN600 1 2 3 4 5
VOL
KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_COL(5) VA601 EVLC18S02015
Figure. Keypad Circuit (On switch, Side KEY 4EA )
3.11.5 Camera Interface

CU515 Installed a 1.3M Pixel SXGA Camera. Below figure shows the camera board to board connector and camera I/F signal.
CN103
CAM_DATA(7) CAM_DATA(6) CAM_DATA(5) CAM_DATA(4) CAM_DATA(3) CAM_DATA(2) CAM_DATA(1) CAM_DATA(0) CAM_PCLK CAM_RESET CAM_PWDN
G1 1 2 3 4 5 6 7 8 9 10 11 12 G3 G2 24 23 22 21 20 19 18 17 16 15 14 13 G4
I2C_SCL I2C_SDA CAM_VSYNC CAM_HSYNC CAM_MCLK VREG_CAM_AVDD VREG_MSMP_2.7V VREG_CAM_1.5V
AXT324164
FPCB_TO_CAMERA CONNECTOR
Figure. VGA Camera and Slide FPCB Board to Board Connector
- 55 -
3. TECHNICAL BRIEF
The Camera module is connected to LCD FPCB with 24pin Board to Board connector. Its interface is dedicated camera interface port in MSM6260. The camera port supply 24MHz master clock to camera module and receive 48MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6260. No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Name GND CAM_DATA(7) CAM_DATA(6) CAM_DATA(5) CAM_DATA(4) CAM_DATA(3) CAM_DATA(2) CAM_DATA(1) CAM_DATA(0) CAM_PCLK CAM_RESET CAM_PWDN GND VREG_CAM_1.5V VREG_MSMP_2.7V VREG_CAM_AVDD GND CAM_MCLK CAM_HSYNC CAM_VSYNC GND I2C_SDA I2C_CLK GND Port GND O O O O O O O O O I I GND I I I GND I O O GND I I GND Note GND Camera data Camera data Camera data Camera data Camera data Camera data Camera data Camera data Camera pixel clock Camera reset Camera power down(Enable) GND Camera core power Camera I/O power Camera Analog power GND Main clock Horizontal Sync Vertical Synch GND I2C data I2C clock GND
Table. Interface between Camera Module and LCD FPCB (in camera module)
- 56 -
3. TECHNICAL BRIEF
3.11.6 Folder ON/OFF Operation

There is a magnet to detect the Folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin OUT of U600 goes to 0V. Otherwise, 2.7V. This folder signal is delivered to MSM6260 GPIO92.
FOLDER_DETECT
R600 C600 62 100K VREG_MSMP_2.7V
U600
VDD G1 OUT G2
0.1u
R601
A3212EELLT-T
FOLDER_DETECT C601 10p
Figure. Schematic of Folder ON/OFF detection circuit
- 57 -
3. TECHNICAL BRIEF
3.11.7 Keypad Light

There are 16 White LEDs in Main board backlight circuit, which are driven by KPD_DRV_N line from PM6650. There are 7 Orange LEDs in Touch FPCB, which are driven by KEY_LED_DRV_N line from PM6650.
KEY_BACK_LIGHT LED(16EA)
LD600 +VPWR 100ohm LD601 R604 100ohm LD604 R607 100ohm LD607 R610 100ohm LD608 LD605 LD602 R605 100ohm R608 100ohm R611 100ohm LD606 LD610 R613 100ohm LD611 R614 100ohm 100ohm LD609 LD612 R615 100ohm KYBD_BACKLIGHT LD613 R616 100ohm R612 100ohm LD615 LD603 R606 100ohm LD614 R617 100ohm R618 100ohm R609 R603
VA613 EVL14S02200
Figure. Keypad Backlight Circuit
- 58 -
3. TECHNICAL BRIEF
3.11.8 LCD Module (NM200CM2A : TOVIS)

- The NM220CT2 model is a Color TFT Main and MONO Sub LCD supplied by TOVIS. This main Module has a 2.0 inch diagonally measured active display area with 176(RGB)X220 resolution and sub Module has a 0.98 inch diagonally measured active display area with 96X64 resolution. In case of Main LCD, each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes. * Features - Display mode(Main LCD) : Normally White, Transmissive TN mode 65K colors - Display mode(Sub LCD) : Normally Black, Mono Transmissive TN mode 256 colors - LCD Driver IC: LGDP4523(Main LCD,LGE), S6B0724(Sub LCD, Samsung) - Driving Method : A-Si TFT Active Matrix - 16 bit CPU interface Parallel - 16 bit / 18 bit CPU interface Parallel
LGDP4523( Source & Gate 1 Chip )
User Conn.
VCC VCI DB0~DB15 MAIN_IF RESET* WR* M-CS* S_CS* RS RD*
Interface PCB
Main FPC
DATA & CTRL
Main LCD 262K Color 176 RGB 220

(0.18 X 0.18 mm Dots)
VSYNCO
Sub FPC
RCVP RCVN MOT_PWR_ +VPWR SPKP SPKN
Receiver MOTOR SPK
Receiver PAD MOTOR PAD SPK PAD
BLU
Sub LCD Mono STN 96 64

(0.21 X 0.23 mm Dots)
S6B0724
VMLED MLED1 MLED2 MLED3
LED Power
LED PAD
Parallel Type 3-LED
Figure. LCD Module Block Diagram
- 59 -
3. TECHNICAL BRIEF
3.11.9 Display & LCD FPC Interface

LCD module is connected to LCD FPCB with 40 pins B TO B connector. The LCD module is controlled by 16-bit EBI2 in MSM6260
FPCB_TO_LCD CONNECTOR
CN102
G1 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 G2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 MOTOR_PWR20 +VPWR
EBI2_OE_N LCD_MAKER_ID LCD_IF_MODE LCD_ADS VREG_MSMP_2.7V EBI2_DATA(15) EBI2_DATA(14) EBI2_DATA(13) EBI2_DATA(12) EBI2_DATA(11) EBI2_DATA(10) EBI2_DATA(9) EBI2_DATA(8) RCVRCV+
SPKSPK+
VSYNCOUT EBI2_WE_N LCD_CS_N LCD_RESET_N SUB_LCD_CS_N EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) WLED_PWR WLED_1 WLED_2 WLED_3
AXK8L40125G
- 60 -
3. TECHNICAL BRIEF
3.11.9.1 Audio Signal Processing & Interface

Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6260). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the signal from DBB chip (MSM6260) and outputs it to receiver (or speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (AUXOP, AUXON) are differential outputs. Earphone2 (EAR2/EAR3) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.
Figure. Audio Interface Detailed Diagram(MSM6260)
- 61 -
3. TECHNICAL BRIEF
MSM6260 CODEC pins

EAR_MIC2N EAR_MIC2P MIC1N MIC1P C206 C207 LINE_N LINE_P HPH_R HPH_L RCVRCV+ MICBIAS
AC18
AC17
AA17
AA18
AA19 AC22
AC21
AC19
AC20
0.1u 0.1u
C205 0.1u 10%
LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P COMP
AA20
AE18
AE19
AF20 AE20
AF18
AF19
AF21
AF22
W17
T15
SDCC_DAT1_GPIO99
F25 M25
TTY DETECT
EAR_MIC2P MICBIAS HH-1M1005-601JT C500 15p EAR_MIC2P
FB500 R500 10u
2.2K
TTY_ADC_DET
C501
MIC
C301 MICBIAS
C300 10u
MIC300
PWR
OUT
5 4 3 G2 2 G1 1
G3
47p
C302 C303 39p 10p
0.1u 0.1u
MIC1N MIC1P
SP0204LE5-PB
Close to MSM!
C304
Figure . Audio part schematics
C305
- 62 -
3. TECHNICAL BRIEF
Speaker AMP
TPA2005D1ZQYR
C314 LINE_N C317 LINE_P 0.01u 0.01u 62K R303 62K R304 D1 INB4 VDD1 C4 VDD2 B1 NC +VPWR
C1
IN+
U300
VOVO+
GND2 GND3 GND4 GND5 GND6 GND7
SPK+
FB300 HH-1M1005-601JT FB301 HH-1M1005-601JT
1u
A4 D4
1 2
C320 C321 1000p 1000p
SPK_AMP_EN
R305
A1
100K
_SD
GND1
Figure . Audio part schematics
C318 10u
C319
A2 A3 B3 C2 C3 D2 D3
ENEY0003801 24-8000-002-000-829
- 63 -
3. TECHNICAL BRIEF
3.11.9.2 Audio Mode

There are three audio modes (Voice call, speaker phone, MIDI/MP3).
MODE
Device Receiver Mode
Description Receiver Voice Call Speaker Phone Headset Voice Call Speaker Phone Speaker MIDI Bell Headset MIDI Bell Speaker MP3 Headset MP3 Receiver Voice Call Speaker Phone Headset Voice Call MP3
Voice Call
Loud Mode Headset
Speaker phone
Loud Mode Loud Mode
MIDI Headset MP3 Loud Mode Headset Receiver Mode PTT Loud Mode Headset A2DP Blue tooth
Table. Audio Mode
- 64 -
3. TECHNICAL BRIEF
3.12 Main Features

3.12.1 LG-CU515 Main features
- Dual Clamshell Type - WCDMA(850, 1900) + EDGE Quad(Class10) - Color LCD(Main:65K TFT, 2.0, Sub : MSTN) - 1.3M Camera - 17 phi speaker - Stereo Headset - Speaker phone(in GSM and WCDMA) - PTT with Voice Buffering (Kodiak v5.2) - HAC (Hearing Aid Compatibility) Support - 72 Poly Sound - MP3/AAC decoder and play - MPEG4 encoder/decoder and play/save - JPEG en/decoder - Supports Bluetooth, USB - Support Micro SD Card - 1,000 mAh (Li-Ion)
- 65 -
3. TECHNICAL BRIEF
3.12.1.2 CU515 Main Component
Bluetooth
Logic /Audio
RF
Main board, Bottom Main board, Top
Folder part
- 66 -
3. TECHNICAL BRIEF
RF
U106
U105
U601
FL101 FL102 FL104 FL100 SW100 U101
Reference SW100 FL100 U101 U101
Description Ant. Switch module SP8T GSM PAM GSM SAW
Reference U106 FL102 FL104 U105 U601
Description RFR6275 W850 Duplex W1900 Duplex WCDMA PAM RTR6275
- 67 -
3. TECHNICAL BRIEF
Audio/logic
U400 CN500 ANT104 U300 U301 M100 CN502 U200
U401
X400 CN503 X100 MIC300
Reference X100 U200 X400 U301 M100 ANT104
Description TCXO MSM6260 OSC Memory BT module BT ANT
Reference U401 U300 CN503 CN501 U400 MIC300
Description PMIC Speaker AMP USIM connector IO connector Charge pump MIC
- 68 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
- 69 -
4. TROUBLE SHOOTING
Block Diagram Block Common
Ref. Name U200 X400 U401 U300 FL100 U301 SW100 X100
TG-5001LH-19.2MHz MSM6260 FC-255(9PF,20PPM) PM6650-3P TPA2005D1ZQYR D2024 TY9000A800JOGG RF-800 TG-5001LH-19.2MHz LBRQ-2B43A AMAA903015LG12 RFR6275 RTR6275CHARTERED B7847 B7838 B7637 ACMD-7402-TR1G RF5144 MQW541A1G44 B9314 AWT6321R LMSM32AA-533
Function Main Control Sleep Clock Power Control Speaker AMP Switch Memory Test Connector VCTCXO Bluetooth RF Transceiver Antenna UMTS Receiver IC UMTS/GSM Transceiver UMTS1900 RX SAW filter UMTS850 RX SAW filter UMTS 850 Duplexer UMTS 1900 Duplexer UMTS dual PA UMTS VCO UMTS 1900/850 TX DUAL SAW Filter TX Dual PAM GSM850/900 TX SAW Filter
Comment Main Chipset 32.768 kHz Power Supply AMP Band select 1G/512M Calibration, etc 19.2MHz Bluetooth TRX Bluetooth antenna RX TRX RX RX TRX TRX TX RX TX TX TX
Bluetooth
M100 ANT104
UMTS
U106 U601 FL106 FL105 FL102 FL104 U105 X100 FL103
GSM
U105 FL101
- 70 -
4. TROUBLE SHOOTING
4.1.1 SIGNAL PATH_UMTS RF
$ & $ # ^ @ % ! ! @ # $ % ^ & * (
( *
4.1.2 SIGNAL PATH_GSM RF
( $% #@ ! @ # $ % ^ & * (
& ! ^
- 71 -
4. TROUBLE SHOOTING
4.2 Checking VCXO Block

The reference frequency (19.2MHz) from X100 (TCXO) is used in UMTS TX part, GSM part and BB part.
Check 1. Crystal part
If you already check this crystal part, you can skip check 1.
VREG_TCXO_2.85V
X100
C49 C50
TP1
4 3
VCC VCONT OUT
19.2MHz 1 2
TCXO
100ohm R123 TRK_LO_ADJ C53 0.01u
GND
1u
0.1u
TG-5010LH_19_2M_75A
VREG_BT_2.85V
TP4
C55 TCXO_PM C58 RTR6275_TCXO C60 RFR6275_TCXO 1000p 1000p 100p
TP2
TP3
R124 100K
C61
VCC
1000p 4 R126 51 TCXO_BT
C63
1000p
U103
TC7SH04FS
2
GND
TP2
TP1
TP4 TP3
Test Point (Crystal Part)
- 72 -
4. TROUBLE SHOOTING
- 73 -
4. TROUBLE SHOOTING
4.3 Checking Ant. SW Module Block
ANT_SEL0
ANT_SEL1
ANT_SEL2
ANT102 L102 1.5p
R100 3.3nH L104 10nH
SW100
ANT G2 G1 RF
C1 56nH L103
56p
RF-800
9 1 PCN_PCS_TX 11 GSM850_EGSM_TX L107 L108 3.9nH 1.5p C4 51 R103 20 WCDMA2100 21 WCDMA850 22 WCDMA1900 4 CTRL1 5 CTRL2 6 CTRL3 C8 56p C14 0.5p
ANT
WCDMA_850
1.2nH
FL100
PCN_RX1 PCN_RX2 PCS_RX1 PCS_RX2 EGSM_RX1 EGSM_RX2 GSM850_RX1 GSM850_RX2 VDD
2 13 14 15 16 17 18 19 7 L110 15nH VREG_RF_SMPS C10 33p C11 0.1u
R104
1.5nH
24 23 10 8 3 2
WCDMA_1900
DGM099M01
TP1
56p 1K 1K 1K R107 R108 R109 20 21 22 C18
ANT_SEL0 ANT_SEL1 ANT_SEL2
C19 0.5p
Schematic of the Antenna Switch Block
- 74 -
4. TROUBLE SHOOTING
Logic Table of the Antenna Switch
Checking Switch Block power source
- 75 -
4. TROUBLE SHOOTING
4.4 Checking UMTS Block

4.4.1 Checking TX POWER of UMTS 1900MHz
TP4
TP1
TP2 TP3
Test Point (RF TX POWER of UMTS1900)
For testing, Max power of UMTS1900MHz is needed.
- 76 -
4. TROUBLE SHOOTING
- 77 -
4. TROUBLE SHOOTING
4.4.2 Checking TX POWER of UMTS 850MHz
TP4
TP1
TP2
TP3
Test Point of RF TX POWER of UMTS 850
For testing, Max power of UMT850MHz is needed.
- 78 -
4. TROUBLE SHOOTING
- 79 -
4. TROUBLE SHOOTING
4.4.3 Checking UMTS PAM Control Block

PAM control signal
1. PWR_DET : UMTS Tx Power Detected value (Check R125) 2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control 3. VREG_RF_SMPS : UMTS PAM enable (about 2.85V) 4. VREG_W_PA : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V)
VPWR1
R125
UMTS 850 Coupler
UMTS 1900 Coupler
VREG_RF_SMPS
4.4.4 Checking RF Rx Level

ANT102 L102 1.5p R100 3.3nH L104 10nH
SW100
ANT G2 G1 RF
C1 56nH L103
56p
RF-800
TP1
L107 L108 3.9nH 1.5p C4 51
9 1 PCN_PCS_TX 11 GSM850_EGSM_TX R103 20 WCDMA2100 21 WCDMA850 22 WCDMA1900 4 CTRL1 5 CTRL2 6 CTRL3 C8 56p C14 0.5p
ANT
WCDMA_850
1.2nH
FL100
R104
1.5nH
TP2
- 80 -
24 23 10 8 3 2
WCDMA_1900
TP2
DGM099M01
4. TROUBLE SHOOTING
WCDMA
FL102 WCDMA_850
C51 ANT TX RX GND1 GND2 GND3 GND6 GND5 GND4 C54 39p L120 15nH C57 0.5p 56p 12nH RX_WCDMA_850 L121 6.8p C52
CP0402A0836BNTR
OUT
50OHM
B7637
IN 20dB R125 8.5dB R127 110 56 110 PWR_DET 3 COUP
U102
TP3
WCDMA_1900
TP3
ACMD-7402-TR1G
FL104
ANT C66 TX 33p
U104 CP0402A0836BNTR
0.5p 1 2 OUT IN
L124 NA C68 1nH
RX
G7 G6 G5 G4 G3 G2 G1
50OHM
L128 82p C71 0.5p
5.6nH
RX_WCDMA_1900
22dB R129 51
TP4
FL105 B7838
L131 8.2nH 1.5K 33nH
2 3
C69
COUP
C67
R128
L129
1.2nH RX_WCDMA_850
14 LB_LNA_IN 10 LB_LNA_OUT 5 LB_INP 4 LB_INM
17 RX_QP 18 RX_QM 19 RX_IP 20 RX_IM 27 GRX_QP 28 GRX_QM 29 GRX_IP 30 GRX_IM TCXO 45
C73 33p
G1 O1 IN G2 O2
C74
4p
15nH L132
R130
C76 L133
4p
15nH L135
RX_WCDMA_1900
15 HB_LNA_IN 9 HB_LNA_OUT 7 HB_INP 6 HB_INM
82p
0.1u
VREG_W
L136
1.2nH
C81 100p
C85
C86
32 GPS_PLNA_IN 35 GPS_PLNA_OUT 37 GPS_INP 38 GPS_INM
41 GPS_CP_OUT 47 UMTS_CP_OUT 12 NC1 43 NC2 44 NC3 VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10 VDDA11 VDDA12 VDDA13 VDDA14 1 3 8 11 16 21 26 31 36 39 40 42 46 48
U106
R132
11.8K (1%) 5.62K (1%)
2 13 33
R_BIAS R_BIAS_UMTS R_BIAS_GPS
FL106
L140 L141 3.9nH C609 1.5p 2.7nH
2 3
L137
33p
R133
C94
8.2p
B7847
G1 O1 IN G2 O2
C93 1.8p
L139 39nH
SSBDT_RFR C99 1.8p L142 39nH
R135 330
23 SSBI 34 BLANK 24 GND 49 GND_SLUG
L143
33p VREG_MSMP_2.7V 51 R137 C107 100p 22 VDDM1 25 VDDM2
RFR6275
TP4
Vbias
Vbias
- 81 -
4. TROUBLE SHOOTING
TP* : UMTS 850 RX PATH TP* : UMTS 1900 RX PATH
- 82 -
4. TROUBLE SHOOTING
4.5 Checking GSM Block
3 1 2
- 83 -
4. TROUBLE SHOOTING
4.5.1 Checking Ant. SW Module

Refer to chapter 3.3
Schematic of RF Tx level
ANT102 L102 1.5p R100 3.3nH L104 10nH
SW100
ANT G2 G1 RF
C1 56nH L103
56p
RF-800
9 1 PCN_PCS_TX 11 GSM850_EGSM_TX L107 L108 3.9nH 1.5p C4 51 R103 20 WCDMA2100 21 WCDMA850 22 WCDMA1900 4 CTRL1 5 CTRL2 6 CTRL3 C8 56p C14 0.5p
ANT
WCDMA_850
1.2nH
FL100
R104
1.5nH
ANTENNA SWITCH MODULE LOGIC ANT_SEL0 GSM900/GSM850 TX DCS/PCS TX GSM 850 RX GSM 900 RX DCS RX PCS RX UMTS 850 UMTS 1900 HIGH LOW LOW HIGH HIGH LOW LOW LOW ANT_SEL1 LOW HIGH LOW LOW HIGH HIGH HIGH LOW ANT_SEL2 HIGH HIGH LOW LOW LOW LOW HIGH HIGH
24 23 10 8 3 2
WCDMA_1900
DGM099M01
- 84 -
4. TROUBLE SHOOTING
Checking RF Tx level
- 85 -
4. TROUBLE SHOOTING
4.5.2 Checking PAM Block

TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V TP2. GSM_PA_BAND : Power Amp Band Selection Control (GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V) TP3. GSM_PA_EN : Power Amp Enable (Power ON : higher than 1.25V , Power OFF : lower than 0.4V) TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V
TP1
TP4 TP3 (Pin No.3) TP2 (Pin No.2)
- 86 -
4. TROUBLE SHOOTING
0.5p
TP4
L118 3.3nH 22u C30 +VPWR
TP3
14 1 2 3 4 5 6 7 R119 GSM_PA_BAND
C28 100p
GND6 GND5 VCC GND4 GND3 GND8 GND7 GSM_OUT GND2
DCS_PCS_IN BS TX_EN
R113 62 9.23dB 100 R116
22p
DCS_PCS_TX
C36
13
12 11
GSM_PA_EN
10
U101 TQM7M5003
VBATT GND1 VRAMP GSM_IN
9 8
TP2
5 GSM_PA_RAMP 39p 2.2K
R115
100
FL101
RFOUT
GND5 GND4 GND3 GND2 GND1
RFIN VC
1 7
17
16
15
DCS_PCS_OUT C44
8 6 4 3 2
LMSM32AA-533
200 C45 68p
TP1
Schematic of GSM PAM Block
- 87 -
4. TROUBLE SHOOTING
4.5.3 Checking RF Rx Block

TP1. GSM850 Rx Input TP2. GSM900 Rx Input TP3. PCS Rx Input TP4. DCS Rx Input
TP1
TP3
TP4 TP2
GSM850/GSM900/DCS/PCS Rx Block
L100
5.1nH
L101 NA L105 5.1nH
L106
4.3nH L109 NA
TP4
L111 4.3nH
WCDMA_1900_TX_OUT DCS_PCS_TX L112 22nH GSM_TX WCDMA_850_TX_OUT L113 NA L114 22nH DAC_REF C17 12p TX_ON TX_AGC_ADJ
C5 C6 C9 C12
6p 6p 5p 12p
U601
46 44 43 42 DA_HB1_OUT DA_HB2_OUT DA_LB1_OUT DA_LB2_OUT
TP3
24 RF_ON 56 VCNTRL 54 DAC_REF 14 R105 12K (1%) SBDT
L115
27nH L116 47nH SSBDT_RTR R106 680 (1%)
TP1
L117 27nH
3 R_BIAS1 27 R_BIAS2 30 31 32 33 38 39 36 37 GCELL_INN GCELL_INP EGSM_INP EGSM_INN DCS_INP DCS_INN GPCS_INP GPCS_INN
TP2
- 88 -
4. TROUBLE SHOOTING
- 89 -
4. TROUBLE SHOOTING
4.5.4 BLUETOOTH Checking Block
TP4 TP1
TP3 TP2
TP2
100p
0.1u
BLUETOOTH
BT_CLK
VREG_MSMP_2.7V
C90
1000p
C91
VREG_BT_2.85V
1u
C79
C80
10
14
C83
100p
C77
VCC_OUT
LBRQ-2B43A
VDD_MSM
VDD_BAT
CLK_REF
VDD_INT
L134
NA
GND1
16
RX_BB_TX_BB
GND2
FEED
L130
ANT
SYNC_DET_TX_EN
AMAA903015LG12 ANT104
M100
PGND4 20 PGND3 19 PGND2 18 PGND1 17 GND4 15 GND3 8 GND2 6 GND1 1
4 SBST 11 SBCK 12 SBDT
NA
13
BT_SBST BT_SBCK BT_SBDT
C70
BT_TX_RX_N
TCXO_BT
BT_DATA
1000p 7
XTAL_IN
C75
- 90 -
C84
2.2u
TP4
1u
TP1
TP3
4. TROUBLE SHOOTING
Start
1, TP TP2 Signals exits? YES TP3 Is clock ok? 19.2M
NO Change the Main board
NO Change the X100
YES NO Change the M100
TP4 Signals exits?
YES Change the Main board
- 91 -
4. TROUBLE SHOOTING
4.6 Power ON Troubleshooting

Power On sequence of CU515 is : PWR key press(Key PCB) PM_ON_SW_N go to low(D600),PM6650 KPDPWR_N pin(24) PM6650 Power Up VREG_MSMC_1.25V(C434), VREG_MSME_1.8V(C435), VREG_MSMP_2.7V(C426), VREG_MSMA_2.6V(C424), VREG_TCXO_2.85V(C414) power up and system reset assert to MSM Phone booting and PS_HOLD(D400) assert to PMIC
Start
Battery voltg. higher than 3.28V? YES
NO
Change or charging the Battery
NO D600 high to low when key press? YES NO

VREG_MSMC_1.25V,VREG_MSMP_2.7V, VREG_MSME_1.8V, VREG_TCXO_2.85V, VREG_MSMA_2.6V power up?
Check the Key Dome
Change the Main board
YES
Is clock ok? R408 : 19.2M X400(pin1,4) : 32.768Khz
NO Check the TXCO
YES Change the Main board
- 92 -
4. TROUBLE SHOOTING
VREG_MSMP VREG_MSMA
D400 PS_HOLD
VREG_TCXO
VREG_MSMC VREG_MSME
X400 : 32.768Khz
R408 : 19.2Mhz
- 93 -
4. TROUBLE SHOOTING
REF_BYP REF_GND REF_ISET VCOIN MSM_INT_N TCXO_IN PS_HOLD VREG_MSMA TCXO_EN VDD_ANA TCXO_OUT VDD_MSM SBST VREG_MSMP SBCK VBACKUP SBDT XTAL_OUT SLEEP_CLK XTAL_IN RUIM_RST(MPP6)
63 62 61 60 59 58 57 56 55 54 53 52 51 51K 50 49 51K 48 47 46 45 44 43
0.1u R405
C420 121K 1u PM_INT_N TCXO_PM smd_1608h_9_r C424
BACK_UP_BAT C421 JTAG_PS_HOLD D400 smd_1608h_9_r RB521S-30 0 4.7u PS_HOLD VREG_MSMA_2.6V R407
51
R408 R409 R411
C426
TCXO_EN +VPWR TCXO_MSM +VPWR VREG_MSMP_2.7V
4.7u
R410
VREG_MSMP_2.7V
SSBDT_PM TP400 SLEEP_CLK C428 C429 USIM_P_RST_N
X400
FC-255
32.768KHz
15p
15p
ind_2x1_6h1_r
4.7uH L402 C437 ind_2x1_6h1_r
L401
4.7uH
+VPWR AMUX_OUT
C436 4.7u
1608
1608 4.7u
C414 C403
1u 1u
VREG_TCXO_2.85V
VREG_MSMC
VREG_MSME
RUIM_RST(M VREG_RUIM VDD_RUIM
VREG_SYNTH_2.6V GSM_PA_PWR_CTL_REF
RUIM_M_CLK(MPP9)
29
30
31
32
33
34
35
36
37
38
39
40
41
RUIM_M_RST(MPP5)
RUIM_M_IO(MPP11)
RUIM_CLK(MPP10)
VSW_MSMC
VSW_MSME
VREG_MMC
VDD_MSMC
VDD_MSME
VREG_PA
VDD_PA
42
R417
R418
85
84
83
82
81
80
79
78
77
76
+VPWR
75 74
0.1u C434
C435
0.1u
VREG_MSMC_1.25V
VREG_MSME_1.8V
VDD_MAIN
GND_SLUG
VREG_TCXO
SPKR_IN_M
VDD_SPKR
SPKR_IN_P
SPKR_BYP
VREG_SYNT
REF_OUT(MPP8)
SPKR_OUT_M
1 2 3
ADC_BYP VCHG
- 94 -
SPKR_OUT_P
VREG_RFTX
AMUX_OUT
73
4. TROUBLE SHOOTING
4.7 Charger Troubleshooting

Charging Current Flow
Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT
Battery Charging Circuit

U402
VBATT 10 1 2 3 R413 4 0.1 P_DRAIN P_COLLECTOR EMITTER1 EMITTER2 COLLECTOR SOURCE BASE1 BASE2 GATE DRAIN 9 8 7 6 5 CHG_CNT_N USB_CNT_N BATT_FET_N VBATT
TA (5.1V)
+5V_PWR USB_VBUS ICHARGE
Pass Tr (ON) Battery FET (ON)
NUS3116MTR2G
ICHARGEOUT +VPWR
4.2~4.25V
Main Battery
Charging Procedure - Connect TA - Control the charging current by PM6650 IC - Charging current flows into the battery Check Point - Connection of TA - Charging current path - Battery
Troubleshooting Setup - Connect TA and battery to the phone
Troubleshooting Procedure - Check the charger connector - Check the charging current Path - Check the battery
- 95 -
4. TROUBLE SHOOTING
R413 U402

U402
VBATT +5V_PWR USB_VBUS ICHARGE R413 0.1 10 1 2 3 4 P_DRAIN P_COLLECTOR EMITTER1 EMITTER2 COLLECTOR SOURCE BASE1 BASE2 GATE DRAIN 9 8 7 6 5 CHG_CNT_N USB_CNT_N BATT_FET_N VBATT
NUS3116MTR2G
ICHARGEOUT +VPWR
Figure . Chraging part schemetics
- 96 -
4. TROUBLE SHOOTING
Figure . Chraging part schemetics
Start
Check the pin and battery Connect terminals of I/O connector
NO
Connection OK?
Change I/O connector
Yes NO
Is the TA voltage 5.1V?

Yes
Change TA
Is it charging properly After turning on U402 ?

NO
Yes
END
Change the board
- 97 -
4. TROUBLE SHOOTING
4.8 USB Troubleshooting

USB Initial sequence of CU515 is : USB connected to CU515 power on USB_VBUS(U402) go to 5V USB_D+ go to 3.3V USB_VP and USB_VN is triggered USB work.
Start
NO
Power is on?
Go to power on trouble shooting
YES NO Cable is inserted? YES NO U402 2pin is 5V? YES USB_D+ is 3.3V? YES Change the Main board NO
Check U401 Check U402 2Pin Insert cable
- 98 -
4. TROUBLE SHOOTING
D500
U402

U402
VBATT +5V_PWR USB_VBUS ICHARGE R413 0.1 10 1 2 3 4 P_DRAIN P_COLLECTOR EMITTER1 EMITTER2 COLLECTOR SOURCE BASE1 BASE2 GATE DRAIN 9 8 7 6 5
D500
USB_D6 5 1 2 3 USB_D+
CHG_CNT_N USB_CNT_N BATT_FET_N VBATT
USB_VBUS
NUS3116MTR2G
ICHARGEOUT +VPWR
PLR0504F
- 99 -
4. TROUBLE SHOOTING
4.9 SIM Detect Troubleshooting

USIM Initial sequence of L704i is : USIM_CLK,USIM_RST,USIM_DATA triggered VREG_USIM_2.85V go to 2.85V USIM IF work
Start
Re-insert the SIM card
Work well? No
VREG_USIM_2.85V is 2.8 V? USIM_P_CLK is run?
Yes
End
NO
Check CN503
YES Change SIM card
Yes Work well? No Change the Main board End
- 100 -
4. TROUBLE SHOOTING
Ground
USIM_P_DATA
USIM_P_CLK USIM_P_RST_N VREG_USIM_2.85
USIM
R516 15K
CN503
USIM_P_DATA 6 I_O 5 VPP 4 GND C523 0 1 VCC 2 RST 3 CLK C524 C525 C526 VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK
ENSY0017001 GCA267-6S-H14
L500
33p 0.1u 33p
NA
- 101 -
4. TROUBLE SHOOTING
4.10 Camera Troubleshooting

Camera control signals are generated by MSM6260.
Start
Check the camera connector and reconnect the camera Yes Camera is OK? END
NO
VREG_CAM_AVDDV is 2.8V?(C510) VREG_CAM_1.5V is 1.5V?(C508) VREG_MSMP_2.7V is 2.7V?(C511)
NO
Yes NO
Check the CAM_MCLK (FB501)
Yes Change the camera Yes Camera is OK NO

END
- 102 -
4. TROUBLE SHOOTING
FB501
C511
C510 C508
10
G1
G1
G2
G2
FL506
10
WLED_PWR BACK_UP_BAT LCD_IF_MODE CAM_MCLK
ICVE10184E150R101FR
FB501
HB-1M1005-600JT
CAM_DATA(0) CAM_DATA(1) CAM_DATA(2) CAM_DATA(3)
4 3 2 1
INOUT_A4 INOUT_B4 INOUT_A3 INOUT_B3 INOUT_A2 INOUT_B2 INOUT_A1 INOUT_B1
6 7 8 9
ICVE10184E150R101FR CAM_PWDN VREG_MSMP_2.7V VREG_CAM_AVDD VREG_CAM_1.5V MOTOR_PWR+VPWR UCLAMP0501H_TCT INSTPAR EVLC18S02015 VA505 C509 EVLC18S02015 VA506 EVLC18S02015 VA507 C511 D502
G1
G2
16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
VGA_CAM_RESET WLED_1 WLED_2 WLED_3

5
VGA_CAM_PWDN
FL505
4 3 2 1
6 7 8 9
ICVE10184E150R101FR
10 5
FL507
4 3 2 1
6 7 8 9
CAM_HSYNC CAM_VSYNC CAM_PCLK CAM_RESET
ICVE10184E150R101FR I2C_SCL I2C_SDA EVLC18S02015 VA508
C508
RB521S-30
1u
+VPWR
EVLC18S02015
C507
10u C510
0.1u
0.1u
0.1u
D503
VA509
- 103 -
4. TROUBLE SHOOTING
4.11 Keypad Backlight Troubleshooting

Key Pad Back Light is on as below : Key pressing KYBD_BACKLIGHT go to 0V Main LED On
Start
Key press
Signal +VPWR is above 3.2V?
NO Check battery Yes NO Change the Main board
Yes VA613 is 0V ? Yes Change the Main board
VA613
VPWR
- 104 -
4. TROUBLE SHOOTING
4.12 Folder ON/OFF Troubleshooting

Folder On/Off is worked as below : Folder On/Off Event Flip(U600 pin OUT) is triggered(On : about 2.1V, Off : 0V) MSM6260 Sense the Folder Event
Start
Check the magnet in Folder Assy
NO Insert the magnet

VREG_MSMP_2.7V
FOLDER_DETECT
R600 C600 62 100K
Yes
Approach the magnet to U600
U600
VDD G1 OUT G2
0.1u
R601
A3212EELLT-T
FOLDER_DETECT
FLIP(U600 pin 1) is 0V?
Change the U600
Yes Change the Main board
magnet
U600 OUT Pin
C601 10p
NO
- 105 -
4. TROUBLE SHOOTING
4.13 Main LCD Troubleshooting

Main LCD control signals are generated by MSM6260. The signal path is : MSM6260 C0N500 CN102 LCD Module
Start
Press END key
Key LED is on? Yes
NO GO to power on trouble shooting
Disconnect and reconnect The LCD connector(CN500)
LCD display OK? No
Yes END
Change the LCD module
LCD display OK? No
Yes END
LCD display OK? No
Yes END
Change the LCD FPCB
- 106 -
4. TROUBLE SHOOTING
4.14 Receiver Path

MSM6260 EAR1ON/EAR1OP CN500 CN102 Receiver
Start
Connect the phone to network Equipment and setup call Setup 1KHz tone out
YES Can you hear the tone? NO

The sine wave appears at PIN1,PIN2, CN500?
END
YES Change receiver
NO
The sine wave appears at PIN1,PIN2, CN500
YES
Check LCD FPCB. Check main/upper connector
NO Change the Main board
- 107 -
4. TROUBLE SHOOTING
CN102
CN500
- 108 -
4. TROUBLE SHOOTING
4.15 Headset path

MSM6260 HPH_R, HPH_L C504/C505 R504/R505 CON501(Earjack)
Start
Connect the phone to network equipment and setup call. Setup 1KHz tone out and insert headset.
YES Can you hear the tone? NO Sine wave appears at R504/R505 ? NO Sine wave appears at C504/C505? NO Change the Main board YES Re-solder C504/C505 YES Change the Head_Set END
- 109 -
4. TROUBLE SHOOTING
C504/ C505
R504/ R505
- 110 -
4. TROUBLE SHOOTING
4.16 Speaker phone path

MSM6260 Line_R, Line_L Audio AMP(U300) connector Speaker
Start
Connect the phone to network equipment and setup call Setup 1KHz tone out
Sine wave appears at C314/R303 and C317/R304?
NO
Check C314/R303 and C317/R304 or Change the Main board
YES NO SPK_AMP_EN(R305) is 2.6V? YES Sine wave appears at SPK+ YES NO Connecting speaker OK? YES NO Can you hear the tone? YES END Change the speaker Re-connect speaker NO Change the Main board Change the Main board
- 111 -
4. TROUBLE SHOOTING
Speaker AMP block
SPK+
- 112 -
4. TROUBLE SHOOTING
4.17 Main microphone

MIC300 C302,C303 MIC1P,MIC1N(MSM6260)
Start
Make a call
MIC_BIAS(C300or C301)
NO
is 1.8V YES Make sound to MIC
Change main board
Sine wave appears at C302,C303 ?
NO
Change the MIC
YES Change the Main board NO Work well?
YES END
MIC
C301 MICBIAS
C300 10u
MIC300
PWR
OUT
5 4 3 G2 2 G1 1
G3
47p
C302 C303 39p 10p
0.1u 0.1u
MIC1N MIC1P
SP0204LE5-PB
Close to MSM!
C304
C305
- 113 -
4. TROUBLE SHOOTING
MIC300
- 114 -
4. TROUBLE SHOOTING
4.18 Headset microphone

Headset C207 MIC2P(MSM6260)
Start
Make a call
OK Change the headset and retry NO

EAR_SENSE_N (R624) is 0V?
END YES NO Change the MAIN board
Yes NO
Sine wave appears at C207 ?
Change the headset or Main board and retry
Yes Change the Main B'd
- 115 -
VBATT_SENSE
VREG_MSMP_2.7V
VBATT_TEMP
47n
C506

USB_VBUS USB_D4 5 6
R508
680K
R509
80.6K
470K
0.068u
C513
470K
R510
VBAT
CN502
1 2 3
REM_PWR_ON_N
EAR_MIC2P EAR_MIC2N HPH_L HPH_R USB_D+ USB_DEAR_SENSE_N VBATT R506
USB_VBUS UART_TXD UART_RXD
VBAT_GND
C512
33u
4. TROUBLE SHOOTING
C514
0.01u
D507
PSD05-LF INSTPAR
D500
PLR0504F
C515 3 2 1
47p
C516
47p
R624
VA510
NA
100u
VA511 USB_D+
NA
R624
- 116 AC18 AC17 AA17 W17 AE18 AF18 T15 AA18 AA19 AC22 AC21 AC19 AC20 AF19 AE19 AF21 AF22 AF20 AE20 AA20
C503 RSB6.8CST2R D504 R503 RSB6.8CST2R D501 2.2K 15p
100u C505
VA512
NA
27
VA513
EVLC14S02050
C504
51 51
C517
1u
R504 R505
D508
SD12T1G
LINE_N LINE_P HPH_R HPH_L RCVRCV+ MICBIAS
D505
RSB6.8CST2R
C207
D506
RSB6.8CST2R
C518 C519 C520 C521
10p 33p 10p 33p
CN501
20 22
21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
ENRY0006801
GU041-18P-E1000
E_ON E_OP PH_R PH_L R1ON R1OP BIAS XOUT VREF _L_IP L_IN R_IP R_IN UXIN UXIP IC2N IC2P IC1N IC1P OMP 0.1u 0.1u C206 C207 EAR_MIC2N EAR_MIC2P MIC1N MIC1P
C205 0.1u 10%
4. TROUBLE SHOOTING
4.19 Vibrator
PM6650 Motor_ PWR- Go to 0V LCD FPCB Motor
Start
Operate the Vibrator
NO Motor_PWR(-) is 0V? YES Change vibrator

USB_D+ USB_SE0 USB_D47K C427 4.7u 1608
18 19 20 21 USB_DAT USB_D_P USB_SE0 GP1_DRV_N(MPP7) KPD_DRV_N LCD_DRV_N KPDPWR_N VIB_DRV_N RUIM_IO(MPP12) USB_D_M
Change the MAIN board or Check the LCD FPCB
R412
23
24
25
26
27
KYBD_BACKLIGHT PM_ON_SW_N MOTOR_PWRUSIM_P_DATA
Switcher Circuit for RF

R416 VREG_RF_SMPS 0 2012 C432 22u L400 4.7uH 0.1u
C433
Motor_PWR-
22
- 117 -
28
VREG_PA
VSW_PA
5. DOWNLOAD
5. DOWNLOAD
5.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 8 handsets at the same time.
5.2 Downloading Procedure

1) Setup Preferences
Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before getting started, set up LGMDP preferences from the Preferences of the file menu the way you want. Click on the File menu and select. Preferences. Play a success sound This is an experimental feature. To enable this simply check the box. It will be played a .wav file when the download has been completed. Automatically run Select Port When LGMDP starts This option is designed to give user convenient. When LGMDP starts, it will automatically select Select Port button to download new image file. Always on Top Check if LGMDP always appears at the top of the window so that user can monitor it all the time. Windows Size If you want to change program window size, change this option. XML Log Path You can change the directory path that XML log files are saved.
- 118 -
5. DOWNLOAD
- 119 -
5. DOWNLOAD
2) Connecting to PC
Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) and model name shall be different from that of the port number in the snapshot.)
- 120 -
5. DOWNLOAD
The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.
- 121 -
5. DOWNLOAD
The following slide describes how to use or set options in detail. (The model name shall be different from that of the model name in the snapshot.)
- 122 -
5. DOWNLOAD
1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse... button. The edit box shows the file path where new images are located. Please note that all images should be located in a selected folder. ( This program support the automatically loading image for some models based on MSM6275 ,MSM6280, MSM6260, MSM6245) 2) Click on the Browse... button to select image files to be downloaded on the handset. 3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option. Backup the NV data and restore the backed up NV data automatically. 4) Reset database & Contents: User related data including the setting data on the EFS is reset in the handset. The contents in the handset will be erased. Erase_EFS: The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV backup/restore is checked. Keep All Contents: Maintain user data including WAP, AD, DRM, Email, Play lists, images When downloading a new images, user data stated above are maintained if this option is enable. 5) Additional Options: Display Information is defaulty not selected and user cannot choose. Security: The security option is automatically selected based on the selected country when security box is selected. Integrity is selected when the selected country is UK, Italy, Hong Kong, Austria, or Israel. Ciphering is not applied or used for H3G user. Fake Security is not applied or used for H3G user. Integrity + Ciphering is selected when the selected country is Australia, Sweden, or Denmark. Please note that user cannot select the options stated above on the security 6) Clear: Clearing all directory paths of images in the dialog. 7) Start: Starting downloading the selected individual image.
- 123 -
5. DOWNLOAD
3) Starting downloading the selected individual image.

Select the image folder, where all the image files are located, by clicking on the Browse... button. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.)
if you select the image folder, the program will automatically load images accordingly.
- 124 -
5. DOWNLOAD
iif you select the image folder, the program will automatically load images accordingly.
Automatically load images
- 125 -
5. DOWNLOAD
If NV restore is failed, then the NV Data(*.nv2) is erased permantly. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse... button.
Click on the START button to start downloading. Normally LGMDP will downloaded all files that need downloading. To download selected image file only simply select the image file that user want to process downloading.
- 126 -
5. DOWNLOAD
4) Downloading
The following flow chart is whole process for downloading images to the handset. You will see snapshots for each step in the succeeding slides.
- 127 -
5. DOWNLOAD
This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory.
Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
Erasing the existing directories and files before the Module image is downloaded.
Downloading the AMSS modem image.
- 128 -
5. DOWNLOAD
Rebooting the handset and re-establishing the connection.
Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection.
Erasing the existing directories and files before downloading the selected Media image.
Downloading Media image in progress.
- 129 -
5. DOWNLOAD
Downloading Module image in progress.
Downloading process has completed successfully.
- 130 -
5. DOWNLOAD
5) Tools
Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu.
- 131 -
5. DOWNLOAD
Log Extractor is designed to extract log information from handset and store log related files in the selected root path in PC. This function is very useful for debugging. Select Log Extractor from the Tools of the file menu, and connect the phone with LGMDP by clicking on the Connect button. When clicking on the Connect button, this checks if the appropriate files such as LFAPP/RecMngr.bin, err directory, Debugging_Tip.txt, or Hidden_info.bin are placed on the handset. If they are exist, then appropriate check boxes are checked accordingly. Select directory to store log files by clicking on the ... button.
- 132 -
5. DOWNLOAD
5.3 Troubleshooting Download Errors

1) When the phone does not work
Reboot the phone as the emergency mode (keep pressing 2 and 5 key while the phone is being booted). and then try to download the images again.
The phone supports a special mode named emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation. (AMSS Modem, Media and Module Images dont be running in this mode.)
- 133 -
5. DOWNLOAD
2) NV Restore error
When you meet the NV Restore error,
- 134 -
5. DOWNLOAD
Connect to the phone.
- 135 -
5. DOWNLOAD
Click on Cancel.
- 136 -
5. DOWNLOAD
Click on NV Restore then several NV Backup files(*.nv2) are shown.
The files are saved every NV Backup. The name is based on the time when NV Backup is done.)
- 137 -
5. DOWNLOAD
Select the proper file and click on Restore.
- 138 -
5. DOWNLOAD
If you want image download and NV backup file restore at once, use the NV Default function.
- 139 -
5. DOWNLOAD
- 140 -
5. DOWNLOAD
5.4 Caution
1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message cal mode after completing download, you must do NV restore and image (media and module) download. 3) In emergency mode, you can not download the media and module image. So if you want download media and module image, connect the phone normal mode after emergency mode download, and then you can do it. 4) The NV data saved at LGMDP folder like this.
D:\LGMDP\004400-01-429926\_COM17_
LGMDP folder name IMEI number
Port number
5) Recommended that the Module and Media Image have to be downloaded at the same time. 6) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area..
- 141 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
6.1 GSM & UMTS RF Block
Fig 2.1-1.UMTS-850,1900+GSM-850/GSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram
- 142 -
6. BLOCK DIAGRAM
6.2 Interface Diagram

GSM Tx/Rx 1800/1900 850/900
GSM PAM
GSM 850 Rx GSM 900 Rx GSM 1800 Rx
TX_SAW 900
1.3M Camera Earpiece GSM-VCO MIC SPEAKE R Stereo Headset
FEM (SWPlexer + GSM_RX_SAW)
SPDT
TPA2005D1
GSM 1900 Rx
I/Q
RTR6275
WCDMA Tx/Rx 850
MICRO SD
Coupler
TX_SAW
MSM6260
W-VCO
LCD ( 2 QCIF)
1900
WCDMA PAM
Coupler TX_SAW
Duplexer
SSBI
Duplexer
1900
HDET
NAND 512M SDRAM 512M
LNA
RX_SAW
RFR6275
SSBI
SSBI
Power
USIM PM6650
USB +5V
LNA
850
W-VCO
RX_SAW
Bluetooth
CU515 Interface Diagram
- 143 -
6. BLOCK DIAGRAM
Main RF signal
GSM850 TX : GSM850 Tx RF signal GSM850 RX : GSM850 Rx RF signal GSM900 TX : GSM900 Tx RF signal GSM900 RX : GSM900 Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal UMTS 850 TX : UMTS 850 Tx RF signal UMTS 850 RX : UMTS 850 Rx RF signal UMTS 1900 TX : UMTS 1900 Tx RF signal UMTS 1900 RX : UMTS 1900 Rx RF signal TX_I/Q : I/Q for Tx of RF RX_I/Q : I/Q for Rx of RF
Control signal
ANT_SEL 0,1,2,3 : Ant Switch Module Mode Selection (UMTS, GSM850/GSM900 Tx/Rx, DCS Tx/Rx, PCS Tx/Rx) GSM PA_CTL signal GSM_PA_BAND : DCS or PCS /GSM Mode Selection GSM_PA_EN : Power Amp Gain Control Enable GSM_PA_RAMP : Power Amp Gain Control UMTS PA_CTL signal PA_ON1,2 : UMTS Tx Power Amp Enable
- 144 -
7. CIRCUIT DIAGRAM
8
L100 5.1nH
10
11
12
13
14
15
16
ANT100
ANT102 L102 1.5p
R100 3.3nH L104 10nH
SW100
ANT G2 G1 RF
C1 56nH L103
56p L101 NA 1 L105 PCN_RX1 PCN_RX2 PCS_RX1 PCS_RX2 EGSM_RX1 EGSM_RX2 GSM850_RX1 GSM850_RX2 VDD 2 13 14 15 16 17 18 19 7 L110 15nH VREG_RF_SMPS C10 33p C11 0.1u 5.1nH ANT
R101
RF-800
A
L107 L108 3.9nH 1.5p C4 51
9 1 PCN_PCS_TX 11 GSM850_EGSM_TX R103 20 WCDMA2100 21 WCDMA850 22 WCDMA1900 4 CTRL1 5 CTRL2 6 CTRL3 C8 56p C14 0.5p
A
TX_IP L109 NA L111 4.3nH WCDMA_1900_TX_OUT DCS_PCS_TX L112 22nH GSM_TX WCDMA_850_TX_OUT L113 NA L114 22nH DAC_REF C17 12p 24 RF_ON 56 VCNTRL 54 DAC_REF 14 R105 12K (1%) SSBDT_RTR R106 L117 27nH 680 (1%) 30 31 32 33 38 39 36 37 GCELL_INN GCELL_INP EGSM_INP EGSM_INN DCS_INP DCS_INN GPCS_INP GPCS_INN SBDT 12 RX_IP 13 RX_IN 10 RX_QP 11 RX_QN PWD_DET_IN VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10 VDDA11 VDDA12 VDDA13 VDDA14 GND1 GND2 GND3 GND4 GND5 PGND VDDM 40 4 6 8 9 15 16 19 20 28 49 48 47 45 41 17 PWR_DET 0 R110 R111 R112 0.1u 0.1u 5.1 VREG_RF_SMPS TX_ON TX_AGC_ADJ C5 C6 C9 C12 6p 6p 5p 12p C2 180p C3 180p TX_IM TX_QP C7 180p C13 180p TX_QM VTUNE-Connected directly to GND RX_IP RX_IM RX_QP RX_QM
WCDMA_850
1.2nH
FL100
L106
4.3nH
R104
U601
46 44 43 42 DA_HB1_OUT DA_HB2_OUT DA_LB1_OUT DA_LB2_OUT
RTR6275-CHARTERED
51 TX_IP 50 TX_IN 53 TX_QP 52 TX_QN 7 TCXO 5 V_TUNE1 RTR6275_TCXO C15 3300p
1.5nH
24 23 10 8 3 2
WCDMA_1900
DGM099M01
L115 56p
27nH L116 47nH
ANT_SEL0 ANT_SEL1 ANT_SEL2
1K 1K 1K
R107 R108 R109 C20 C21 C22
C18
3 R_BIAS1 27 R_BIAS2
C19 0.5p
2.7 2.2u
C24 0.1u
C26 0.1u
C27 0.1u
C25 0.1u
120p
120p
120p
L118 3.3nH C28 100p 22u C30
0.1u
+VPWR
C32
C23
0.5p
26 14 22p GND6 GND5 VCC GND4 GND3 GND8 GND7 GSM_OUT GND2 DCS_PCS_IN BS TX_EN 1 2 3 4 5 6 7 R119 GSM_PA_RAMP 39p 2.2K 5 GSM_PA_BAND R115 100 GSM_PA_EN R113 62 9.23dB 100 R116 DCS_PCS_TX C34
C33
C29
C31 L119
WLNA_IN 29 WLNA_OUT 34 WMIX_INP 35 WMIX_INN V_TUNE2
100p
C36
21 TEST 55 OPEN
10
R114
C37
C38
DGM099M01 ANT_SEL0 ANT_SEL1 ANT_SEL2 LOW HIGH LOW LOW HIGH HIGH HIGH LOW HIGH
10
22p
22p
22u
GND1 VRAMP GSM_IN 15
100p
U101 TQM7M5003
VBATT
C40
11
C39
ANTENNA SWITCH MODULE LOGIC

GSM900/GSM850 TX DCS/PCS TX GSM 850 RX GSM900 RX DCS RX PCS RX UMTS 850 UMTS 1900 HIGH LOW LOW HIGH HIGH LOW LOW LOW
12
13
C35 0.1u
47nH
VREG_SYNTH_2.6V
1 2 22 23 25 57
18
VREG_RF_SMPS 10u C41
HIGH 8 LOW LOW LOW LOW HIGH HIGH
RFOUT
GND5 GND4 GND3 GND2 GND1
RFIN VC
1 R120 7
8.1dB R118 GSM_TX 56 R121 120 120
2012
FL101
C16 1000p VTUNE-Connected directly to GND VREG_MSMP_2.7V
Near to 48 pin
D
1608
17
16
0.01u
DCS_PCS_OUT C44
LMSM32AA-533
C45 68p
200
R122
GSM_SAW_SW_MODE
EGSM GSM850
LOW HIGH
GSM/EDGE
E
remain LOW when not transmitting
C43 22p
C42
8 6 4 3 2
WCDMA
WCDMA_850
ANT
VREG_TCXO_2.85V
FL102
C51 TX RX GND1 GND2 GND3 GND6 GND5 GND4 C54 39p L120 15nH C57 0.5p 56p 12nH L121 RX_WCDMA_850
6.8p C46 C47 C48 C52
+VPWR C49 C50
19.2MHz 4 1 VCC VCONT 3 OUT GND 2
X100
TCXO
100ohm R123 TRK_LO_ADJ C53 0.01u
1000p
62p
2.2u
1u
CP0402A0836BNTR
0.1u
TG-5010LH_19_2M_75A
50OHM
B7637
F
COUP
U102
C56 1000p C59 0.01u
PA_ON1 TCXO_PM
C55 C58 RTR6275_TCXO C60
100p 1000p 1000p R124 100K
VREG_BT_2.85V
OUT
IN
20dB R125 8.5dB R127 110 56 110 PWR_DET 15 14 13 12 11 10 9 8
F
C61
L122
RFR6275_TCXO WCDMA_850_TX_OUT
WCDMA_1900
U105
PGND 1 GND4 VEN_CELL 2 RFOUT_CELL RFIN_CELL 3 VCC VMODE 4 VCCA VBATT 5 GND3 GND1 6 RFIN_PCS GND2 7 RFOUT_PCS VEN_PCS L123 1.2nH
2.7p C62
FL103
9 I1_CELL O1_CELL 1
3.3nH
VCC
1000p 4 R126 51 TCXO_BT
C63 NA C64
1000p
R128
FL104
ANT C66 TX 33p
PA_R0 C65 8.2p
8 G6 7 G5 6 I2_PCS
G4 G3 O2_PCS G2 G1
U103
TC7SH04FS
2
GND
U104 CP0402A0836BNTR
0.5p 1 2 OUT IN
L124 NA 1nH
AWT6321R
C67 C68
L126
DGLP36M01
WCDMA_1900_TX_OUT 3.9nH
50OHM
C90
0.1u
100p
ACMD-7402-TR1G
G7 G6 G5 G4 G3 G2 G1
4.7nH
10 5
L125
BLUETOOTH
BT_CLK
RX
VREG_MSMP_2.7V
COUP
L127
1u
L128 82p C71 0.5p
C72 0.01u
10
R129 51
14
C83
100p
C77
LBRQ-2B43A
VDD_MSM
VCC_OUT
VDD_BAT
CLK_REF
VDD_INT
RX_WCDMA_850
L134
C73 33p
R130
C76 L133
4p
82p
0.1u
VREG_W
7 HB_INP 6 HB_INM L136 1.2nH C81 100p 32 GPS_PLNA_IN 35 GPS_PLNA_OUT 37 GPS_INP 38 GPS_INM
29 GRX_IP 30 GRX_IM TCXO 45 C82 0.01u RFR6275_TCXO
BT_SBST BT_SBCK BT_SBDT
2.2n C88
R132
11.8K (1%) 5.62K (1%)
2 13 33
150p C89
U106
R_BIAS R_BIAS_UMTS R_BIAS_GPS
12 NC1 43 NC2 44 NC3 VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10 VDDA11 VDDA12 VDDA13 VDDA14 1 3 8 11 16 21 26 31 36 39 40 42 46 48
(PPS)
BT_TX_RX_N
TCXO_BT
BT_DATA
41 GPS_CP_OUT 47 UMTS_CP_OUT
C85
C86
10K
R131
C70
1000p 7
13
15nH L135
NA
RX_WCDMA_1900
15 HB_LNA_IN 9 HB_LNA_OUT
27 GRX_QP 28 GRX_QM
4 SBST 11 SBCK 12 SBDT
XTAL_IN
1.5K
G1 O1 IN G2 O2
C74
4p
15nH L132
33nH
C75
5 LB_INP 4 LB_INM
NA
L131 8.2nH
19 RX_IP 20 RX_IM
RX_IP RX_IM
GND1
16
RX_BB_TX_BB
B7838
GND2
FEED
L130
ANT
SYNC_DET_TX_EN
FL105
L129
1.2nH
14 LB_LNA_IN 10 LB_LNA_OUT
17 RX_QP 18 RX_QM
RX_QP RX_QM
AMAA903015LG12 ANT104
M100
PGND4 20 PGND3 19 PGND2 18 PGND1 17 GND4 15 GND3 8 GND2 6 GND1 1
C84
2.2u
22dB
C79
5.6nH
C80
RX_WCDMA_1900
NA
C69
1u
PA_ON2
1000p
C91
VREG_BT_2.85V
FL106
L140 C609 1.5p L141 3.9nH 2.7nH
2 3
L137
33p
R133
R134 L138 47nH 2.2u
0 VREG_RF_SMPS
C94
8.2p
B7847
0.068u
C608
G1 O1 IN G2 O2
C93 1.8p
L139 39nH
R135 330
C99 1.8p
L142 39nH
24 GND 49 GND_SLUG L143 33p VREG_MSMP_2.7V 51 R137 C107 100p 22 VDDM1 25 VDDM2
4.7
R621 R136 10 R620 4.7 R622 20 33p
33p 0.1u
33p
33p
33p 1u
C104 C102
C101
C602
C604 C606
C603
VREG_W
C106 C105
C605
RFR6275
1u
33p 0.1u
C97 33p C103 0.1u
SSBDT_RFR
23 SSBI 34 BLANK
C607
C95 33p
LG Electronics Inc.
LGMC
- 145 -
7. CIRCUIT DIAGRAM
%1
MODE ADC
MODE2 MODE1 VREG_MSMP_2.7V 0 0 MODE0 0 ( Default Pull-Down) Native, ARM JTAG HKADC[0] - AMUX_OUT HKADC[1] - VBATT_SENSE HKADC[2] - NA HKADC[3] - TTY_ADC_DET HKADC[4] - PCB_Rev_ADC HKADC[5] - VBATT_TEMP PMIC_AUXIN[1] PMIC_AUXIN[2] - PA_THERM 150K : 10K : 0.169V Rev 1.1 150K : 68K : 0.842V 150K : 100K : 1.08V 150K : 150K : 1.35V 150K : 300K : 1.8V 150K : 470K : 2.047V 150K : 680K : 2.212V HKADC(4):PCB_Rev_ADC(Ref : 2.7V)
BOOT_MODE3 BOOT_MODE2 BOOT_MODE1 0 0 1 1 R201 1% 150K R200 1% 10K 1005 0.1uF 16V +80/-20% 2012 10uF 6.3V +80/-20% Ceramic 0 1 0 1 1 1 1 1 8-bit, NAND, Normal 16-bit, NAND, Normal 8-bit, NAND, Trusted 16-bit, NAND, Trusted
R202
SDRAM_WE_N SDRAM_DQM(3) SDRAM_DQM(2) SDRAM_DQM(1) SDRAM_DQM(0)
VREG_MSME_1.8V AMUX_OUT VBATT_SENSE
MSM_RESIN_N RESOUT_EBI2_N
SDRAM_CLK SDRAM_CS_N(0) SDRAM_CLK_EN SDRAM_RAS_N SDRAM_CAS_N
VREG_MSMC_1.25V TTY_ADC_DET VBATT_TEMP EAR_MIC2N EAR_MIC2P MIC1N MIC1P
VREG_MSME_1.8V
VREG_MSMP_2.7V
VREG_MSMA_2.6V
SLEEP_CLK
TCXO_MSM
51K
LINE_N LINE_P HPH_R HPH_L RCVRCV+ MICBIAS
SDRAM_ADDR(0:14)
(CAD : 10uF=>Input MSMA_2.6V)

C200 4.7u Place near C202 0.01u C201 10u C203 0.1u C204 0.1u
SDRAM_ADDR(0) SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12) SDRAM_ADDR(13) SDRAM_ADDR(14)
R205 R206 R207
C206 C207
62
R204
AB1 R203 Y4 N4
51K 51K 10K
0.1u 0.1u
NA
C205 0.1u 10%
MSM pin W18 (CODEC VSS)
AA23
AB23
AC18
AC17
AA17
AA18
AA19 AC22
AC21
AC19
AC20
RESIN_N F11 RESOUT_N AA4 RESOUT_N_EBI1 AE17 WDOG_EN
AA20
AE21 AE22
AE18
AE19
AF20 AE20
AF18
AF19
AF21
AF22
W21
W17
AA2
AD1
N11
D18
A10
B10
A16
B16
MODE2 U23 MODE1 Y23 MODE0
P11
V21
V19
Y21
F13
T21
BOOT_MODE1 BOOT_MODE2 BOOT_MODE3 HKAIN0 HKAIN1 HKAIN2 HKAIN3 HKAIN4 HKAIN5
ROM1_CLK_SDRAM1_CLK XMEM1_CS_N2_SDRAM1_CS_N0 SDRAM1_CLK_EN ROM1_ADV_N_SDRAM1_RAS_N XMEM1_LWAIT_N_SDRAM1_CAS_N XMEM1_HWAIT_N_SDRAM1_CLK_EN1 WE1_N_SDRAM1_WE_N A1_25_SDRAM1_DQM3_GPIO75 A1_23_SDRAM1_DQM2_GPIO78 UB1_N_SDRAM1_DQM1 LB1_N_SDRAM1_DQM0 OE1_N XMEM1_CS_N0
A1_24_GPIO79 A1_1 A1_2 A1_3 A1_4 A1_5 A1_6 A1_7 A1_8 A1_9 A1_10 A1_11 A1_12 A1_13 A1_14
SDRAM_DATA(0:31)
TCXO USB_XTAL48_IN USB_XTAL48_OUT SLEEP_XTAL_IN SLEEP_XTAL_OUT
LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P COMP
T15
W6
M8
M4
M6
G1
N8
N6
N2 N1
K8
U8
U4
V1
P1
P2
P6
P8
V8
L2 V2
L1
L4
C208 0.01u
C209 0.01u
C210 0.01u
C211 0.1u
C212 0.01u
C213 0.01u
C214 0.1u
C215 0.1u
C216 0.1u
SDRAM_DATA(31) SDRAM_DATA(30) SDRAM_DATA(29) SDRAM_DATA(28) SDRAM_DATA(27) SDRAM_DATA(26) SDRAM_DATA(25) SDRAM_DATA(24) SDRAM_DATA(23) SDRAM_DATA(22) SDRAM_DATA(21) SDRAM_DATA(20) SDRAM_DATA(19) SDRAM_DATA(18) SDRAM_DATA(17) SDRAM_DATA(16) SDRAM_DATA(15) SDRAM_DATA(14) SDRAM_DATA(13) SDRAM_DATA(12) SDRAM_DATA(11) SDRAM_DATA(10) SDRAM_DATA(9) SDRAM_DATA(8) SDRAM_DATA(7) SDRAM_DATA(6) SDRAM_DATA(5) SDRAM_DATA(4) SDRAM_DATA(3) SDRAM_DATA(2) SDRAM_DATA(1) SDRAM_DATA(0) SUB_LCD_CS_N LCD_CS_N NAND_CLE NAND_CS_N EBI2_OE_N EBI2_WE_N NAND_ALE NAND_READY EBI2_DATA(15) EBI2_DATA(14) EBI2_DATA(13) EBI2_DATA(12) EBI2_DATA(11) EBI2_DATA(10) EBI2_DATA(9) EBI2_DATA(8) EBI2_DATA(7) EBI2_DATA(6) EBI2_DATA(5) EBI2_DATA(4) EBI2_DATA(3) EBI2_DATA(2) EBI2_DATA(1) EBI2_DATA(0) (ADS signal for LCD) LCD_ADS
T8 A1_22 T6 T4 R8 T2 T1 R6 R4 W4 V6 Y2 Y1 E1 R11 V4 U6 L6 L8 K4 J1 K6 J2 J4 P4 H4 G2 J6 AB4 D1 AB2 D2 E2 AC15 AF14
A1_21 A1_20 A1_19 A1_18 A1_17 A1_16 A1_15 GPIO_74 GPIO_73 GPIO_72 GPIO_71 GPIO_70 GPIO_69 GPIO_68 GPIO_67 SDRAM1_D15 SDRAM1_D14 SDRAM1_D13 SDRAM1_D12 SDRAM1_D11 SDRAM1_D10 SDRAM1_D9 SDRAM1_D8 SDRAM1_D7 SDRAM1_D6 SDRAM1_D5 SDRAM1_D4 SDRAM1_D3 SDRAM1_D2 SDRAM1_D1 SDRAM1_D0 XMEM2_CS_N1 LCD_CS_N_GPIO38
SDCC_DAT1_GPIO99 M25 SDCC_DAT2_GPIO100 M26 SDCC_DAT3_GPIO101 AE3 MDP_VSYNC_SECONDA_GPIO104 AD2 MDP_VSYNC_PRIMARY_GPIO105 WDOG_STB_SBCK1_GPIO0 SBDT1_GPIO1 PA_ON1_GPIO2 GRFC9_GPIO12 CAMCLK_PO_GP_MN_GPIO13 GPIO28 USB_RX_DATA_GPIO29 XMEM2_CS_N2_GPIO35 XMEM2_CS_N3_GPIO36 LCD_EN_GPIO37
H25 F26 H11 D5 J21 A6 N19 W15 AA15 AE13 H9 B6 F8 AA1 Y6 L25 H6 F18 H18 H13
F25
MICROSD_DATA(1) MICROSD_DATA(2) MICROSD_DATA(3) LCD_MAKER_ID
C217 1000p
C218 1000p
C219 1000p
C220 0.01u
C221 0.01u
C222 0.01u
C223 0.01u
C224 0.1u
C225 0.1u 2200p cap => place between D12(VDDA1) and F12(DAC_REF) C226 2200p
PA_ON1 W850 PAM CAM_MCLK LCD_IF_MODE PA_ON2 W1900 PAM MICROSD_DETECT CAM_PWDN
DAC_REF
C227 1000p
C228 1000p
C229 1000p
C230 1000p
C231 0.01u
C232 1000p
C233 1000p
C234 1000p
C235 0.1u
C236 0.1u
C237 0.1u Near to B18 (VDD_PLL) VREG_MSMA_2.6V
VDD_PAD2_0 AE11 VDD_PAD2_1 AE15 VDD_PAD2_2
VDD_PAD3_0 K25 VDD_PAD3_1 B15 VDD_PAD3_2 B9 VDD_PAD3_3
VDD_PLL B21 VDD_MDDI
VDD_PAD1_0 K2 VDD_PAD1_1 M2 VDD_PAD1_2 R2 VDD_PAD1_3 U2 VDD_PAD1_4
VDD_DIG_0 VDD_DIG_1 VDD_DIG_2 VDD_DIG_3 VDD_DIG_4 VDD_DIG_5 VDD_DIG_6 VDD_DIG_7 VDD_DIG_8 VDD_DIG_9 VDD_DIG_10 VDD_DIG_11 VDD_DIG_12
TP200
C240
TCXO_EN
R208
2K
(VDD_DAC_REF)
TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0
TX_AGC_ADJ TRK_LO_ADJ
VDD_PAD4_0
VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10
GPIO43 SYNTH2_GPIO65 GPIO66 XMEM1_CS_N1_GPIO76 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93
LCD_RESET_N
AA26 AE23
AA16
AE16
AE24
AF17
VGA_CAM_RESET
W2 AC2 AE8 C2 H2
C238 0.1u 10%
C239 0.01u
AE6
G25
D25
B24
B14
B11 B5
R25
B18
D12
U25
U26
P23
FOLDER_DETECT
Y26
T25
A3
F2
Close to MSM Q_OUT_N B12 Q_OUT A13 I_OUT_N B13 I_OUT F12 DAC_REF Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0
W23 V23 V25 W25 AA25 Y25 AB25 AC25 D17
F1 VSS_PAD1_0 K1 M1
RESERVED
(PLLOUT_TEST)
C26
U200-1 MSM6260_DATA
TX_QM TX_QP TX_IM TX_IP DAC_REF
33nF
A12
VSS_PAD1_1 VSS_PAD1_2 VSS_PAD1_3 U1 VSS_PAD1_4

R1
AF11
EBI2_DATA(0:15)
XMEM2_CS_N0 AF7 OE2_N AF4 WE2_N AE10 LB2_N_A2_0 T14 NAND2_FLASH_READY_GPIO33

AA10 AC9 W10 AA9 AE7 AC8 W9 AA8 AC7 AF5 AA7 AE5 AC6 AE4 AF3 AC5 AF13 AA14 T13 AC14 AE14 W13 AC13 AA13 AF12 AE12 AC12 AA12 W12 T12 AC11 AA11 AC10 W11 AF9 AE9
AF10 UB2_N W14
VSS_PAD2_0 VSS_PAD2_1 AF15 VSS_PAD2_2

R26
AF6
RX_QM RX_QP RX_IM RX_IP
VSS_PAD3_0 B17 VSS_PAD3_1 A15 VSS_PAD3_2 A9 VSS_PAD3_3

A18 A21 D13 D19 P26 U19 V26 W16 W18 W26 AB26 AC16 AC26 AD25 AF23 AF24
U200-2 MSM6260_POWER
TX_ON ANT_SEL2 ANT_SEL1 ANT_SEL0 GSM_SAW_SW_MODE
UART1_RFR_N_PA_POWER_CTL_M_GPIO98 UART1_CTS_N_GPIO97 UART1_DP_RX_DATA_GPIO96 UART1_DP_TX_DATA_GPIO95 GPIO44 GPIO39 GPIO64
CAMIF_DATA9_GPIO61 CAMIF_DATA8_GPIO60 CAMIF_DATA7_GPIO59 CAMIF_DATA6_AUX_TDO_GPIO58 CAMIF_DATA5_AUX_TDI_GPIO57 CAMIF_DATA4_AUX_TMS_GPIO56 CAMIF_DATA3_AUX_TCK_GPIO55 CAMIF_DATA2_AUX_TRST_N_GPIO54 CAMIF_VSYNC_GPIO16 CAMIF_HSYNC_GPIO15 CAMIF_PCLK_GPIO82 CAMIF_DATA0_GPIO83 CAMIF_DATA1_GPIO81 GPIO19 GPIO17 SYNTH1_GPIO41 RINGER_GPIO18
MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31
M21 UART3_DP_RX_DATA_GPIO85 M19
UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88
UART3_DP_TX_DATA_GPIO84 GPIO40 GPIO42
KEYSENSE4_N_GPIO48 KEYSENSE3_N_GPIO47 KEYSENSE2_N_GPIO46 KEYSENSE1_N_GPIO63 KEYSENSE0_N_GPIO62
UART3_CTS_N_GPIO86
H14 MMC_CMD_GPIO30 L14
USB_DAT_VP USB_SE0_VM N25 USB_OE_TP_N
PA_POWER_CTL GSM_PA_DAC_REF
I2C_SDA_GPIO26 I2C_SCL_GPIO27
A2_20_GPIO34 A2_19 A2_18 A2_17 A2_16 A2_15 A2_14 A2_13 A2_12 A2_11 A2_10 A2_9 A2_8 A2_7 A2_6 A2_5 A2_4 A2_3 A2_2 A2_1
GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_DATA_GPIO20 BT_TX_RX_N_GPIO21 BT_SBDT_GPIO22
B4 T23 T19 D11 H10 F10 D9 A8 B8 G23 F23 E26 R19 H21 E25 A22
A1 VSS1 A2
B1
B2
D4
H8
F21
L11
L16
P13 P14
P15
D23 F6
H19
M11
M12 M13
M14
M15
N12
R12
A25
A26
B25
B26
K10
N13
N14
N15
P12
R13
R14
R15
T11
T16
W8
GSM_PA_BAND GSM_PA_EN for VSS_THERMAL
BT_CLK BT_SBST BT_SBCK BT_DATA BT_TX_RX_N BT_SBDT
MDDIH_STBN A20 MDDIH_STBP B19 MDDIH_DATN B20 MDDIH_DATP
D10 GPIO52 A7
GPIO45 GPIO53
GPIO51 B7 GPIO50 F9 GPIO49
A4
D8 F7
E4
D6
D7
SBST SBDT SBCK
U21
R23
D14
R21
N26
N23
H26
K21
N16
D20
D22
C25
D21
B3 E23
K23
K26
H23
A19
TP201
AD26
M23
M16
G21
R209
51
KEY_ROW(4) KEY_ROW(3) KEY_ROW(2) KEY_ROW(1) KEY_ROW(0)
KEY_COL(5) KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4)
LCD_BL_CTRL CAM_RESET EAR_SENSE_N
UART_RXD (NAND_BOOT_ERR) UART_TXD
GSM_PA_RAMP GSM_PA_PWR_CTL_REF
VGA_CAM_PWDN
USIM_CLK USIM_RST_N USIM_DATA
PM_INT_N PS_HOLD
MICROSD_CMD MICROSD_DATA(0) MICROSD_CLK
USB_DAT USB_SE0 USB_OE_N
CAM_DATA(7) CAM_DATA(6) CAM_DATA(5) CAM_DATA(4) CAM_DATA(3) CAM_DATA(2) CAM_DATA(1) CAM_DATA(0) CAM_VSYNC CAM_HSYNC CAM_PCLK
SSBDT_RTR SSBDT_RFR SSBDT_PM
C241 0.1u 10%
R619
1M
R16
P19
P21
P16
P25
F4
G6
J23
J25
L12
F16
L26
F14
L23
L21
F20
L15
J19
J26
L19
VDD_EF_USE
MDDIC_DATP A23 MDDIC_DATN B22 MDDIC_STBP B23 MDDIC_STBN
Place near MSM pin AD26
R210 R211
2200 2200 VREG_MSMP_2.7V
(Check CAM_DATA PINOUT !!!!) I2C_SDA I2C_SCL
W19
VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 VSS13 VSS14 VSS15 VSS16 VSS17 VSS18 VSS19 VSS20 VSS21 VSS22 VSS23 VSS24 VSS25 VSS26 VSS27 VSS28 VSS29 VSS30 VSS31 VSS32 VSS33 VSS34 VSS35 VSS36 VSS37 VSS38
D2_15 D2_14 D2_13 D2_12 D2_11 D2_10 D2_9 D2_8 D2_7 D2_6 D2_5 D2_4 D2_3 D2_2 D2_1 D2_0
GP_PDM2_PA_RANGE1 H17 GP_PDM1_PA_RANGE0 TRST_N TCK TMS TDI TDO RTCK

H15 D16 F15 D15 A17 H16 K19 N21
PA_R0 JTAG_TRST_N JTAG_TCK JTAG_TMS JTAG_TDI JTAG_TDO JTAG_RTCK SPK_AMP_EN
AUX_PCM_CLK_GRFC14_GPIO80 AUX_PCM_DIN_GRFC13_GPIO14 G4 AUX_PCM_DOUT_GRFC12_GPIO103 J8 AUX_PCM_SYNC_GRFC11_GPIO102 H12 TX_ON_GRFC10
VSSA1 VSSA2 VSSA3 VSSA4 VSSA5 VSSA6 VSSA7 VSSA8 VSSA9 VSSA10 VSSA11 VSSA12 VSSA13 VSSA14 VSSA15 VSSA16
VSS_DIG_0 VSS_DIG_1 VSS_DIG_2 VSS_DIG_3 VSS_DIG_4 VSS_DIG_5 VSS_DIG_6 VSS_DIG_7 VSS_DIG_8 VSS_DIG_9 VSS_DIG_10 VSS_DIG_11 VSS_DIG_12 VSS_DIG
C1 H1 W1 AC1 AF8 AF16 T26 G26 D26 A24 A14 A11 A5 AC23
NC VSS39 VSS41 VSS43 VSS44 VSS45 VSS46 VSS47 VSS48 VSS49 VSS50
AA21 AA6 AC4 AE1 AE2 AE25 AE26 AF1 AF2 AF25 AF26
w18 (Analog VSS guard ring for CODEC)
LG Electronics Inc.
LGMC
- 146 -
7. CIRCUIT DIAGRAM
MEMORY
N3 N4 N5 N6 N9 N10 N11 N12 N13 P7 P8 R2 R7 R9 T2 T3 T7 T13 U1 U3 U14 V1 V2 V13 V14 Y1 Y2 Y3 Y4 Y11 Y12 Y13 Y14 W1 W2 W3 W4 W11 W12 W13 W14 NC84 NC85 NC86 NC87 NC88 NC89 NC90 NC91 NC92 NC93 NC94 NC95 NC96 NC97 NC98 NC99 NC100 NC101 NC102 NC103 NC104 NC105 NC106 NC107 NC108 NC109 NC110 NC111 NC112 NC113 NC114 NC115 NC116 NC117 NC118 NC119 NC120 NC121 NC122 NC123 NC124
SDRAM_DATA(0:31) SDRAM_DATA(0) TP300U4 SDRAM_DATA(1) T4 SDRAM_DATA(2) T5 SDRAM_DATA(3) V5 SDRAM_DATA(4) U5 SDRAM_DATA(5) T6 SDRAM_DATA(6) V6 SDRAM_DATA(7) U7 SDRAM_DATA(8) T9 SDRAM_DATA(9) T10 SDRAM_DATA(10) V10 SDRAM_DATA(11) T11 SDRAM_DATA(12) U11 SDRAM_DATA(13) V11 SDRAM_DATA(14) T12 SDRAM_DATA(15) U12 SDRAM_DATA(16) P3 SDRAM_DATA(17) R3 SDRAM_DATA(18) P4 SDRAM_DATA(19) R4 SDRAM_DATA(20) P5 SDRAM_DATA(21) R5 SDRAM_DATA(22) P6 SDRAM_DATA(23) R6 SDRAM_DATA(24) P9 SDRAM_DATA(25) P10 SDRAM_DATA(26) R10 SDRAM_DATA(27) P11 SDRAM_DATA(28) R11 SDRAM_DATA(29) P12 SDRAM_DATA(30) R12 SDRAM_DATA(31) R13 SDRAM_DQM(0) SDRAM_DQM(1) SDRAM_DQM(2) SDRAM_DQM(3) EBI2_DATA(0:15) EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) EBI2_DATA(8) EBI2_DATA(9) EBI2_DATA(10) EBI2_DATA(11) EBI2_DATA(12) EBI2_DATA(13) EBI2_DATA(14) EBI2_DATA(15)
TP310
SDRAM_ADDR(0:12) A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 C3 D3 E3 E2 D12 C12 D11 C11 D10 C10 E4 D9 C9
TP301 SDRAM_ADDR(0)
U8 T8 V7 U9 M11 M13 L10 L12 J9 H12 H10 G12 M12 L9 L11 K9 H13 H11 H9 G11 A1 A2 A3 A4 A11 A12 A13 A14 B1 B2 B3 B4 B11 B12 B13 B14 C1 C2 C5 C13 C14
DQM0 DQM1 DQM2 DQM3 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 IO12 IO13 IO14 IO15 IO16 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21
0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u
U301 TY9000A800KOGG40
C308 C306 C307 C309 C310 C311 C312 C313
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31
SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12) R300 100K RESOUT_EBI2_N EBI2_WE_N SDRAM_RAS_N SDRAM_WE_N SDRAM_CAS_N SDRAM_CLK SDRAM_CS_N(0) NAND_ALE NAND_CLE EBI2_OE_N NAND_READY SDRAM_CLK_EN SDRAM_ADDR(13) SDRAM_ADDR(14) VREG_MSME_1.8V VREG_MSMP_2.7V
MIC
C301 MICBIAS
C300 10u
MIC300
PWR G2
_WP _WEN _RAS _WED _CAS CLK _CS ALE CLE _CE _RE RY__BY CKE BA0 BA1 VCCD1 VCCD2 VCCD3 VCCD4 VCCD5 VCCD6 VCCQD1 VCCQD2 VCCN2 VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 NC62 NC63 NC64 NC65 NC66 NC67 NC68 NC69 NC70 NC71 NC72 NC73 NC74 NC75 NC76 NC77 NC78 NC79 NC80 NC81 NC82 NC83
L6 K6 D5 D6 E6 C8 E5 M3 M4 M9 M10 M2 D8 C4 D4 C7 D2 D13 V3 V8 V12 V4 V9 K12 C6 F7 G2 G13 L13 P2 P13 R8 U2 U6 U10 U13 J11 J13 K1 K2 K3 D7 J12 K4 K5 K10 K11 K13 K14 L1 L2 L3 L4 L5 L14 M5 M6 N2
TP302 TP303 TP304 TP305 TP306 TP307 TP308 TP309
OUT
5 4 3 2 G1 1
G3
47p
C302 C303 39p 10p
0.1u 0.1u
MIC1N MIC1P
2.2K R302
51K R301
SP0204LE5-PB
Close to MSM!
C304 C314 LINE_N C317 LINE_P 0.01u 0.01u 62K R303 62K R304
NAND_CS_N
Speaker AMP
TPA2005D1ZQYR
VREG_MSMP_2.7V D1 C316 INVDD1 VDD2 NC B4 C4 B1 A4 D4 1u +VPWR
C315
C305
0.01u
C1
0.1u
IN+
U300
VOVO+
SPK+
FB300 HH-1M1005-601JT FB301 HH-1M1005-601JT 1 2 C320 C321 1000p 1000p
LGMC
SPK_AMP_EN R305
A1 100K
_SD
GND1
JTAG
CN300
G1
VREG_MSMP_2.7V JTAG_TDI JTAG_PS_HOLD MSM_RESIN_N JTAG_RTCK
1 2 3 4 5 G2
10 9 8 7 6
AXK8L10125G
D1 D14 E1 E7 E8 E9 E10 E11 E12 E13 F2 F3 F4 F5 F6 F8 F9 F10 F11 F12 F13 G3 G4 G5 G6 G7 G8 G9 G10 H2 H3 H4 H5 H6 J2 J3 J4 J5 J6 J10
NC22 NC23 NC24 NC25 NC26 NC27 NC28 NC29 NC30 NC31 NC32 NC33 NC34 NC35 NC36 NC37 NC38 NC39 NC40 NC41 NC42 NC43 NC44 NC45 NC46 NC47 NC48 NC49 NC50 NC51 NC52 NC53 NC54 NC55 NC56 NC57 NC58 NC59 NC60 NC61
UART
CN301
3G 2.5G 1 2 3 4 5 6 7 8 9 10 DSR 11 RTS 12
CTS GND GND RX RX TX TX VCHAR NC1 ON_SW ON_SW VBAT VBAT NC2 PWR NC3 URXD NC4 UTXD
TP311 TP312 TP313
GND300
GND301
GND302
UART_RXD UART_TXD +5V_PWR PM_ON_SW_N VBATT USB_VBUS USB_DUSB_D+
C318 10u
JTAG_TCK JTAG_TMS JTAG_TRST_N JTAG_TDO
C319
A2 A3 B3 C2 C3 D2 D3
ENEY0003801 24-8000-002-000-829
LG Electronics Inc.
- 147 -
7. CIRCUIT DIAGRAM
VREG_TCXO_2.85V
VREG_CAM_AVDD
PMIC VPWR BYPASS

VDD_MSMC : 4.7uF VDD_MSME : 4.7uF VDD_PA : 4.7uF VDD_MSM : 0.1uF VDD_ANA : 0.1uF VDD_RUIM : 0.1uF VDD_RF : 0.1uF VDD_WLAN : 0.1uF VDD_MAIN : 0.1uF VDD_SPKR : 0.1uF +VPWR C404 C405 C406 C408 C409 C410 C407 C411 C412 C413 C402
VREG_SYNTH_2.6V GSM_PA_PWR_CTL_REF
VREG_CAM_1.5V
VREG_BT_2.85V
LCD_BACK_LIGHT_CHARGE_PUMP
U400
+VPWR 5 IN C1+ 10 C400 1u 9 C17 C401 C2+ CP C2EN_SET 6 WLED_1 WLED_2 WLED_3
1u
WLED_PWR R623 R401 R403
4.7u
4.7u
LCD_BL_CTRL 2.2u
11
C415
C414 C403
C438
C418
C419
REM_PWR_ON_N
GND
1 D1 2 D2 3 D3 12 NC
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
4.7u
4.7u
4.7u
33u
1u 1u
C417
R404
+VPWR AMUX_OUT
100K
+VPWR
+VPWR
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
CBL0PWR_N(MPP3)
CBL1PWR_N(MPP4)
AMUX_IN2(MPP2)
AMUX_IN1(MPP1)
REF_OUT(MPP8)
SPKR_OUT_M
SPKR_OUT_P
VREG_RFRX1
VREG_RFRX2
SPKR_IN_P
VREG_RFTX
VREG_WLAN
GND_SLUG
VDD_MAIN
SPKR_IN_M
VREG_TCXO
VREG_SYNT
VDD_SPKR
SPKR_BYP
VDD_RF
VDD_WLAN
AMUX_OUT
64
+VPWR
+5V_PWR ICHARGE CHG_CNT_N ICHARGEOUT VBATT BATT_FET_N MSM_RESIN_N C425 1u USB_OE_N USB_CNT_N USB_VBUS USB_DAT USB_D+ USB_SE0 USB_D47K C427 4.7u 1608 0.1u 10K 1u
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
ADC_BYP VCHG ISNS_P CHG_CTL_N ISNS_M VBAT BAT_FET_N FLSH_DRV_N PON_RESET_N VREG_USB USB_ID VREG_5V USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P
REF_BYP REF_GND REF_ISET VCOIN MSM_INT_N TCXO_IN PS_HOLD
63 62 61 60 59 58 57 56 55 54 53 52 51 51K 50 49 51K 48 47 46 45 44 43
0.1u R405
C420 121K 1u PM_INT_N TCXO_PM smd_1608h_9_r C424
BACK_UP_BAT C421 JTAG_PS_HOLD D400 smd_1608h_9_r RB521S-30 0 4.7u PS_HOLD VREG_MSMA_2.6V R407 Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT
C422
R406
C423
SBST VREG_MSMP SBCK VBACKUP SBDT XTAL_OUT RUIM_M_CLK(MPP9) RUIM_M_RST(MPP5) RUIM_M_IO(MPP11) RUIM_CLK(MPP10) SLEEP_CLK XTAL_IN RUIM_RST(MPP6) VREG_RUIM VDD_RUIM RUIM_IO(MPP12)
R409 R411
C426
U401 PM6650-3P
VREG_MSMA TCXO_EN VDD_ANA TCXO_OUT VDD_MSM
51
R408
TCXO_EN +VPWR TCXO_MSM +VPWR VREG_MSMP_2.7V
4.7u
1u
1u
AAT3157ITP-T1
R410

VREG_MSMP_2.7V
SSBDT_PM TP400 SLEEP_CLK C428 C429 USIM_P_RST_N
U402 X400
FC-255 VBATT +5V_PWR USB_VBUS 15p ICHARGE R413 0.1 10 1 2 3 4 P_DRAIN P_COLLECTOR EMITTER1 EMITTER2 COLLECTOR SOURCE BASE1 BASE2 GATE DRAIN 9 8 7 6 5 CHG_CNT_N USB_CNT_N BATT_FET_N VBATT
USB_SE0 USB_D_M KPD_DRV_N LCD_DRV_N GP1_DRV_N(MPP7) KPDPWR_N VIB_DRV_N
VREG_MSMC
VREG_MSME
VSW_MSMC
VSW_MSME
VREG_MMC
VDD_MSMC
VDD_MSME
32.768KHz
VREG_PA
VSW_PA
VDD_PA
R412
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
KYBD_BACKLIGHT PM_ON_SW_N MOTOR_PWRUSIM_P_DATA L400 4.7uH 2012 C432 22u 0.1u L401
R414 4.7uH L402 ind_2x1_6h1_r ind_2x1_6h1_r 2.2u 2.2u 0
0 R415
+VPWR USIM_RST_N USIM_P_CLK USIM_CLK USIM_DATA VREG_USIM_2.85V VREG_MICROSD_3.0V
15p
NUS3116MTR2G
ICHARGEOUT +VPWR
Switcher Circuit for RF

R416 VREG_RF_SMPS 0
C430
4.7uH
C433
C436 4.7u
1608
1608 4.7u
0.1u C434
R417
Power Line --> Route carefully!!!!! Draw the Artwork_line thickly !!!!! --->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-
VREG_MSMC_1.25V
R418
VREG_MSME_1.8V
C435
0.1u
C437
C431
Section Designer
Date
Sign & Name MODEL
Sheet/
CU515
Sheets
4/6
Checked DRAWING NAME Approved
PMIC
DRAWING
LG Electronics Inc.
NO.
LG Electronics Inc.
LGMC
- 148 -
7. CIRCUIT DIAGRAM
LCD_CAM_CONNECTOR(T=1.0,PLUG)
VA502 ESD9X5.0ST5G INSTPAR VA503 ESD9X5.0ST5G
TTY DETECT
EAR_MIC2P MICBIAS HH-1M1005-601JT LCD_CS_N LCD_ADS EBI2_WE_N SUB_LCD_CS_N C500 15p EAR_MIC2P
GB042-60P-H10-E3000
ICVE10184E150R101FR
9 8 7 6 INOUT_B1 INOUT_A1 INOUT_B2 INOUT_A2 INOUT_B3 INOUT_A3 INOUT_B4 INOUT_A4 G2 G1 1 2 3 4
INSTPAR
RCV+ RCVLCD_MAKER_ID LCD_RESET_N

10
FB500 R500 10u
10
FL500
5
2.2K
TTY_ADC_DET
FL501
EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3)
ICVE10184E150R101FR
G1 G2
8 7 6
4 3 2 1
6 7 8 9
ICVE10184E150R101FR
10
FL503
EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) WLED_PWR BACK_UP_BAT LCD_IF_MODE CAM_MCLK
4 3 2 1
6 7 8 9
ICVE10184E150R101FR
FB501
HB-1M1005-600JT
10 5
G1
G1
G2
G2
FL506
2 1
INOUT_A1 INOUT_B1
8 9
ICVE10184E150R101FR
10 5
ICVE10184E150R101FR CAM_PWDN VREG_MSMP_2.7V VREG_CAM_AVDD VREG_CAM_1.5V MOTOR_PWR+VPWR UCLAMP0501H_TCT INSTPAR EVLC18S02015 VA505 C509 EVLC18S02015 VA506 EVLC18S02015 VA507 C511 D502
FL507
R624
27
G1
G2
470K 680K VBATT_SENSE

6 7 8 9
4 3 2 1
INOUT_A3 INOUT_B3 INOUT_A2 INOUT_B2 INOUT_A1 INOUT_B1
C506
INOUT_A4 INOUT_B4
R508
47n
CAM_HSYNC CAM_VSYNC CAM_PCLK CAM_RESET
REM_PWR_ON_N
ICVE10184E150R101FR I2C_SCL I2C_SDA EVLC18S02015 VA508 VREG_MSMP_2.7V 80.6K EVLC18S02015 VBATT_TEMP C513 R510 R509
RB521S-30
USB_VBUS UART_TXD UART_RXD

RSB6.8CST2R RSB6.8CST2R
C508
VA509
PSD05-LF INSTPAR
0.01u
47p
+VPWR
33u
47p
NA
D503
C514
VA510
0.068u
C515
VA511
VA512
470K
C512
VA513
D507
C516
C517
D508
D505
D506
VREG_MICROSD_3.0V
NUS3065MUTAG
4 DRAIN CNTRL GND IN SRC GATE 5 6 7 8 9
Micro SD
VREG_MSMP_2.7V 0.1u R512 R513 R514 R515 R511 R517 NFM21PC105B1A3 4 G2 OUT U502 MICROSD_DATA(2) MICROSD_DATA(3) MICROSD_CMD MICROSD_CLK MICROSD_DATA(0) MICROSD_DATA(1) MICROSD_DETECT UCLAMP0501H_TCT G1 IN 3 1
3 2 1
U501
OUT VCC
DRAIN_THERMAL
100K
100K
100K
100K
S500
GND DAT2_RSV
R516 15K
CD_DAT3_CS CMD_DI
CN503
USIM_P_DATA 6 I_O 5 VPP 4 GND C523 0 1 VCC 2 RST 3 CLK C524 C525 C526 VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK CD
VDD CLK_SCLK VSS DAT0_DO DAT1_RSV
ENSY0017001 GCA267-6S-H14
L500
33p 0.1u 33p
NA
GCC111-8S-S-E1000 D509
100K
NA
470K
USIM
C522
+5V_PWR
NA
NA
NA
NA
NA
VA514
VA515
VA516
VA518
INSTPAR
VA517
VA519
VA520
NA
LGMC
- 149 -
C518 C519 C520 C521
10p 33p 10p 33p
VBAT_GND
NA
NA
1u
SD12T1G
VBAT
C507
10u C510
0.1u
0.1u
0.1u
1 2 3
EVLC14S02050
CN502
1u
20 22
LG Electronics Inc.
ENRY0006801
INOUT_A2 INOUT_B2
INOUT_A1 INOUT_B1
100u
GU041-18P-E1000
4 3
INOUT_A4 INOUT_B4 INOUT_A3 INOUT_B3
6 7
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
INOUT_B2 INOUT_A2 INOUT_B3 INOUT_A3 INOUT_B4 INOUT_A4 G2 G1
2 3 4
FL502
10
ICVE10184E150R101FR
9 8 7 6 INOUT_B1 INOUT_A1 INOUT_B2 INOUT_A2 INOUT_B3 INOUT_A3 INOUT_B4 INOUT_A4 G2 G1 1 2 3 4
EBI2_DATA(12) EBI2_DATA(13) EBI2_DATA(14) EBI2_DATA(15) USB_D6 5 WLED_1 WLED_2 WLED_3 USB_VBUS 4
G1
G2
C501
CN500
INOUT_B1 INOUT_A1
EBI2_DATA(8) EBI2_DATA(9) EBI2_DATA(10) EBI2_DATA(11)
D500
1 2 RSB6.8CST2R RSB6.8CST2R 2.2K 15p 3 USB_D+
FL504
VGA_CAM_RESET
10
CN501
21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
10
C503
R503
VGA_CAM_PWDN
FL505
4 3 2
INOUT_A4 INOUT_B4 INOUT_A3 INOUT_B3 INOUT_A2 INOUT_B2
6 7 8
EAR_MIC2P EAR_MIC2N HPH_L HPH_R USB_D+ USB_DEAR_SENSE_N VBATT R506
100u C505
C504
51 51
R504 R505
D504
D501
PLR0504F
7. CIRCUIT DIAGRAM
ON_SW
END
PM_ON_SW_N D600 RB521S-30 VA600 END VREG_MSMP_2.7V
FOLDER_DETECT
R600 C600 100K 62
SPK_EN
U600
VDD G1 OUT G2
VOL
KEY_ROW(4) KEY_COL(5) CN600 1 2 3 4 5 KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_COL(5) VA601 EVLC18S02015
R601
A3212EELLT-T
EVLC18S02015
FOLDER_DETECT C601 10p
VREG_MSMP_2.7V
2 4 6 8
100K
KEY
RA600 1 3 5 7 100K
EVLC18S02015
CN601 1 2 3 VA602
0.1u
R602
KEY_BACK_LIGHT LED(16EA)
HOT600
HOT3
CLR
CLR
MENU
LD600 MENU +VPWR KEY_COL(4) KEY_COL(3) KEY_COL(2) KEY_COL(1) KEY_COL(0) EVLC14S02050 EVLC14S02050 EVLC14S02050 EVLC14S02050 EVLC14S02050 EVLC14S02050 EVLC14S02050 EVLC14S02050 EVLC14S02050 EVLC14S02050 KEY_ROW(4) KEY_ROW(3) KEY_ROW(2) KEY_ROW(1) KEY_ROW(0) 100ohm LD601 R604 100ohm LD604 R607 100ohm LD607 R610 100ohm LD608 LD605 LD602 R605 100ohm R608 100ohm R611 100ohm LD606 LD610 R613 100ohm LD611 R614 100ohm 100ohm LD609 LD612 R615 100ohm KYBD_BACKLIGHT LD613 R616 100ohm R612 100ohm LD615 LD603 R606 100ohm LD614 R617 100ohm R618 100ohm R609 R603
KEY_ROW(0)
600
1 KEY_ROW(1)
601
2
602
3
LEFT
LEFT
UP
UP
603
4 KEY_ROW(2)
604
5
605
6
OK
OK
RIGHT
RIGHT
606
7 KEY_ROW(3)
607
8
608
9
SND
SND
SEARCH
VA603 VA604 VA605 VA606 VA607 VA608 VA609 VA610 VA611 SEARCH VA612
HOT601
KEY_COL(0) KEY_ROW(4) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4) HOT4
609
0
HOT602
HOT5
DN
DN
BACK
BACK
VA613 EVL14S02200
Section Designer
Date
Sign & Name MODEL
Sheet/
CU515
Sheets
6/6
Checked DRAWING NAME Approved
KEY
DRAWING
LG Electronics Inc.
NO.
LG Electronics Inc.
LGMC
- 150 -
7. CIRCUIT DIAGRAM
FPCB_TO_LCD CONNECTOR FPCB_TO_MAIN CONNECTOR

GB042-60S-H10-E3000 CN101
RCV+ RCVLCD_MAKER_ID LCD_RESET_N EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) EBI2_DATA(4) EBI2_DATA(5) SBCL0001701 EBI2_DATA(6) NBL414R-F9J EBI2_DATA(7) WLED_PWR BAT100 LCD_IF_MODE CAM_MCLK CAM_DATA(0) CAM_DATA(1) CAM_DATA(2) CAM_DATA(3) CAM_PWDN VREG_MSMP_2.7V VREG_CAM_AVDD VREG_CAM_1.5V MOTOR_PWR+VPWR
C
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
CN102
G1 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 G2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 MOTOR_PWR20 +VPWR
EBI2_OE_N LCD_MAKER_ID LCD_IF_MODE LCD_ADS VREG_MSMP_2.7V LCD_CS_N LCD_ADS EBI2_WE_N SUB_LCD_CS_N EBI2_DATA(8) EBI2_DATA(9) EBI2_DATA(10) EBI2_DATA(11) EBI2_DATA(12) EBI2_DATA(13) EBI2_DATA(14) EBI2_DATA(15) VGA_CAM_RESET WLED_1 WLED_2 WLED_3 VGA_CAM_PWDN CAM_DATA(4) CAM_DATA(5) CAM_DATA(6) CAM_DATA(7) CAM_HSYNC CAM_VSYNC CAM_PCLK CAM_RESET I2C_SCL I2C_SDA EBI2_DATA(15) EBI2_DATA(14) EBI2_DATA(13) EBI2_DATA(12) EBI2_DATA(11) EBI2_DATA(10) EBI2_DATA(9) EBI2_DATA(8) RCVRCV+
SPKSPK+
VSYNCOUT EBI2_WE_N LCD_CS_N LCD_RESET_N SUB_LCD_CS_N EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) WLED_PWR WLED_1 WLED_2 WLED_3
AXK8L40125G
MOT
MOTOR_PWR+VPWR
MOT+
MOTOR_PWR+
CN103
CAM_DATA(7) CAM_DATA(6) CAM_DATA(5) CAM_DATA(4) CAM_DATA(3) CAM_DATA(2) CAM_DATA(1) CAM_DATA(0) CAM_PCLK CAM_RESET CAM_PWDN
G1 1 2 3 4 5 6 7 8 9 10 11 12 G3 G2 24 23 22 21 20 19 18 17 16 15 14 13 G4
I2C_SCL I2C_SDA CAM_VSYNC CAM_HSYNC CAM_MCLK VREG_CAM_AVDD VREG_MSMP_2.7V VREG_CAM_1.5V
Add the VGA Camera signal at Rev F
AXT324164
FPCB_TO_CAMERA CONNECTOR
D D
TP3
TP4 TP5
TP6
VISION MARK
E
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 151 -
- 152 -
8. BGM Pin Map
8. BGM Pin Map
U301 Memory : TY900A800KOGG40 (EUSY0336902)
Do Not Use
- 153 -
8. BGM Pin Map
U200 Modem MSM6260 EUSY0334501
Do Not Use
- 154 -
9. PCB LAYOUT
U600-Hall IC A3212EELLT-T Cannot detect folder open/close
- 155 -
9. PCB LAYOUT
CN500-LCD connector GB042-60P-H10-E3000 No LCD display No receiver sound No camera preview No vibration U400-Charge pump for LCD backlight AAT3157ITP-T1 No LCD backlight
U300-Speaker amp. TPA2005D1ZQYR No speaker sound U301-Memory TY9000A800JOGG Cannot boot the phone ANT104-Bluetooth antenna AMAA903015LG12 No B/T connection M100-Bluetooth module LBRQ-2B43A No B/T connection U200-MODEM MSM6260 Cannot boot the phone
U402-Charging TR. & FET NUS3116MTR2G Cannot charge the battery U501-Overvoltage protection IC NUS3065MUTAG Cannot protect overvoltage U401-Power management IC PM6650-3P Cannot boot the phone MIC300-Microphone SP0204LE5-PB The person on the other end of the line cannot hear anything U106-WCDMA Receiver RFR6275 WCDMA Rx performance U106-WCDMA Receiver RFR6275 WCDMA Rx performance FL104-Duplex ACMD-7402-TR1G WCDMA1900 Duplex SW100-Antenna Switch Mobile Switch
U601-RF Transceiver RTR6275 GSM Rx, Tx performance & WCDMA Tx performance U105-WCDMA PAM AWT6321R WCDMA Tx power FL100-FEM DGM099M01 Cannot connect the network U101-GSM PAM TQM7M5003 GSM Tx power
- 156 -
9. PCB LAYOUT
CN102-camera connector AXK8L40125G No LCD display No receiver sound
CN103-camera connector AXT324164 No camera preview
CN101-LCD connector GB042-60S-H10-E3000 No LCD display No receiver sound No camera preview No vibration
LGMC
- 157 -
9. PCB LAYOUT
LGMC
- 158 -
10. Calibration & RF Auto Test Program (Hot Kimchi)

10.1 Configuration of HOT KIMCHI
10.1.1 Configuration of directory
Jhangee
Common Debug Auto Cal CalAuto Hot_Kimchi ComLMPLib_2_11.dll Dll_EzLooksMQ_015.dll GuiTk115d.dll HK_32.exe ShieldBox_DIID.dll
At_Serial_Cmd.xml Diag_NV6250_RevB.dll Diag_NV6275.dll Diag_NV6280.dll Diag_NV.dll DLL_E5515CD.dll DLL_PwrControlD.dll DLL_SerialATD.dll LG_CL_015.dll PwrSupply_Cmd.xml
Model
CU515 LG_RfTest_E5515C_107.dll LG_NsTest_E5515C_239.dll QMSL_MSVC6R.dll
AutoSetup_100.xml Cal_Setup_Test.xml Ezlooks.xml LG_RfCal_Q3G6280N_Polar_003.dll NstProcedure_CU515_101.xml script_100.xml
UI : Directory : File Multi HK.reg
LG_UI_Qu6275_004.dll
Spec_CU515_110.xml
- 159 -
10.1.2 Description of basic files

1. Cal_Setup_Test.xml : Parameter Setup File for Calibration items 2. NstProcdure_CU515_101.xml : Scenario Setup File for Auto RF-Test 3. Spec_CU515_110.xml : Specification File of RF Test items 4. LG_RfCal_Q3G6280N_Polar_003.dll : RF Calibration DLL File including RF Calibration sequence functions 5. LG_NsTest_E5515C_239.dll : Auto RF-Test DLL File including RF Test sequence functions 6. DLL_E5515CD.DLL : GPIB DLL File including measuring functions in E5515CD Test Set
10.2 How to use HOT KIMCHI
1 2 3
* Procedure
1. Click Logic Operation of SETTING menu bar 2. Select UART Port that PC can communicate with the phone 3. Select LOGIC MODE that you want - Logic Mode -> 1: Calibration Only 2: Auto Test Only 3: Calibration + Auto
- 160 -
CU515
5 Click Star t 4 Select CU515
* Procedure
4. Select the model name CU515 5. Click Start button
- 161 -
- 162 -
11. EXPLODED VIEW & REPLACEMENT PART LIST

11.1 EXPLODED VIEW
11
12
10
13
78
22 82
80
38
21
25
54
14
16
15
18
32
53
SNGF0027001
33
77
19
20 26 79 24
29
27
28
17
30
31
34
41
43
36 49 52 35
45
46
47
74
58
48
50
51
57 56 64
59
63
66
67
55
85
72
MMAA0000601
42
37 40 65 39
81
76
75
73
62
60
68
61
84 69
83 70
71
- 163 -
ASS'Y EXPLODED VIEW
G B C D H
I L
M Q N O P R
F K E J U T S R Q P O N M L K J I H G F E D C B A
- 164 -
11.2 Replacement Parts <Mechanic component>

Level 1 2 3 2 3 AAAY00 MCJA00 APEY00 ACGG00 Location No. Description IMT,FOLDER ADDITION COVER,BATTERY PHONE COVER ASSY,FOLDER COVER ASSY, FOLDER(LOWER) BRACKET,LCD COVER,FOLDER(LOWER) DECO,RECEIVER FILTER,RECEIVER GASKET,SHIELD FORM HINGE,FOLDER INSULATOR MAGNET,SWITCH PAD,RECEIVER TAPE,DECO Part Number TIFF0015001 AAAY0205201 MCJA0044101 APEY0404201 ACGG0083101
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Spec
Color Gray
Remark
CU515 ATTBK MOLD, PC LUPOY SC-1004A, , , , , CU420 ATTGR
Dark Silver Black Dark Silver Black 71,U
ACGH00
ACGH0049201
Black
5 5 5 5 5 5 5 5 5 5
MBFF00 MCJH00 MDAH00 MFBB00 MGAD00 MHFD00 MIDZ00 MMAA00 MPBM00 MTAA00
MBFF0013901 MCJH0039201 MDAH0022001 MFBB0022501 MGAD0153701 MHFD0015301 MIDZ0149901 MMAA0001601 MPBM0018801 MTAA0136801
PRESS, STS, , , , , MOLD, PC LUPOY SC-1004A, , , , , PRESS, Al, , , , , COMPLEX, (empty), , , , , CUTTING, EPDM, , , , , COMPLEX, (empty), , , , , CUTTING, EPDM, , , , , 7100 magnetic CUTTING, EPDM, , , , , COMPLEX, (empty), , , , ,
Black Black Silver Black Gold Gray Gray Blue Silver Black Transparent Without Color Transparent Black Black
21 25 29 27 80 38 79 24 26 28
MTAC00
TAPE,SHIELD
MTAC0061301
CUTTING, EPDM, , , , ,
82
5 5 5
MTAF00 MTAK00 MTCB00
TAPE,MOTOR TAPE,CAMERA TERMINAL,PIN COVER ASSY, FOLDER(UPPER) WINDOW ASSY,LCD FILM,INMOLD WINDOW,LCD(SUB) COVER,FOLDER(UPPER)
MTAF0012801 MTAK0001401 MTCB0011201
CUTTING, EPDM, , , , , COMPLEX, (empty), , , , , PRESS, PB, , , , ,
20 19 22
ACGJ00
ACGJ0064201
Black
5 6 6 5
AWAB00 BFAA00 MWAF00 MCJJ00
AWAB0027301 BFAA0068901 MWAF0037901 MCJJ0048601
WINDOW ASSY LCD (SUB) ; ,BLACK ,0.01 ,600 ,500 MOLD, PMMA HI835M, , , , , MOLD, PC LUPOY SC-1004A, , , , ,
Black Transparent Transparent Black Without Color
MICC00
INSERT,FRONT(UPPER)
MICC0010301
13
MGAD00
GASKET,SHIELD FORM
MGAD0151601
Gold
- 165 -
Level 5 5 5 5 5 5 5 6 5 5 5 5 4 5 5 5 6 6 5 5 5 5 5 5 5 5
Location No. MGAZ00 MGAZ01 MPBG00 MPBJ00 MPBM00 MPBQ00 MPBT00 MTAB00 MPBU00 MSAB00 MTAB01 MTAE00 ACGK00 MBIB00 MBJL00 MCJK00 MICE00 MICZ MFBD00 MGAD00 MGAD01 MIDZ00 MSGB00 MSGC01 MTAJ00 MTCB00
Description GASKET GASKET PAD,LCD PAD,MOTOR PAD,RECEIVER PAD,LCD(SUB) PAD,CAMERA TAPE,PROTECTION PAD,CONNECTOR SHEET,OPERATING TAPE,PROTECTION TAPE,WINDOW(SUB) COVER ASSY,FRONT BUSHING,HINGE BUTTON,SIDE COVER,FRONT INSERT,NUT INSERT FILTER,MIKE GASKET,SHIELD FORM GASKET,SHIELD FORM INSULATOR STOPPER,HINGE STOPPER,FOLDER TAPE,FLEXIBLE PCB TERMINAL,PIN
Part Number MGAZ0058701 MGAZ0058801 MPBG0069601 MPBJ0044601 MPBM0018201 MPBQ0032301 MPBT0041901 MTAB0174101 MPBU0002401 MSAB0018601 MTAB0176101 MTAE0031601 ACGK0089801 MBIB0005701 MBJL0041601 MCJK0072201 MICE0002001 MICZ0021501 MFBD0023601 MGAD0150201 MGAD0150401 MIDZ0135401 MSGB0019701 MSGC0000701 MTAJ0000801 MTCB0011101 CASTING, Mg Alloy, , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , COMPLEX, (empty), , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,
Spec
Color Gold Gold Black Black Black Black Black Transparent Black Black Black Transparent Black Black Black Black Gold Black Black Gold Gold Gray Transparent Black Black Black Black Without Color Black Without Color Black Gold
Remark 10 78 77 5 8 7 4
3 33 11 12 M 35 34 41 43 44 40 49 65 39 36 42 52 37
MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , CUTTING, BeCu, , , , , M1.4 * 2.0 COMPLEX, (empty), , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , COMPLEX, (empty), , , , , MOLD, Silicone Rubber KE941-U, , , , , MOLD, Urethane Rubber S190A, , , , , COMPLEX, (empty), , , , , PRESS, PB, , , , ,
GMEY00
SCREW MACHINE,BIND
GMEY0011201
1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
54,H
MCCH00
CAP,SCREW
MCCH0106601
MOLD, Silicone Rubber KE941-U, , , , ,
30,J
MTAZ00
TAPE
MTAZ0194801
4 4
MCCH01 MGAD00
CAP,SCREW GASKET,SHIELD FORM
MCCH0106801 MGAD0156401
MOLD, Silicone Rubber KE941-U, , , , , COMPLEX, (empty), , , , ,
32,I
- 166 -
Level 4 4
Location No. MIDZ00 MKAG00
Description INSULATOR KEYPAD,MAIN
Part Number MIDZ0142601 MKAG0000601 CUTTING, EPDM, , , , ,
Spec
Color Blue Black Without Color Transparent Transparent Black Transparent Black
Remark 9 45,N
MOLD, PC LUPOY SC-1004A, , , , ,
MLAC
LABEL,BARCODE
MLAC0003401
EZ LOOKS(user for mechanical)
4 4 5 5 3 4 4 4 4 4 4
MTAB00
TAPE,PROTECTION
MTAB0173701 MWAC0080101 MPBG0062101 MTAD0069301 ACGM0090901 MBFK0003401 MBJL0041501 MCCC0045301 MCCG0008401 MCJN0068201 MFBC0031601
CUTTING, EPDM, , , , , CUTTING, PMMA HI835M, , , , , CUTTING, EPDM, , , , , COMPLEX, (empty), , , , ,
53,L 31,K
MWAC00 WINDOW,LCD MPBG00 MTAD00 ACGM00 MBFK00 MBJL00 MCCC00 MCCG00 MCJN00 MFBC00 PAD,LCD TAPE,WINDOW COVER ASSY,REAR BRACKET,SPEAKER BUTTON,SIDE CAP,EARPHONE JACK CAP,MULTIMEDIA CARD COVER,REAR FILTER,SPEAKER
Q 48 57 67 70 63 56
MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , ,
Black Black Black Black Black Black Without Color Gold
MFCA00
FINGER,GROUND
MFCA0000502
PRESS, BeCu, , , , ,
74
4 4 4 4 4 4 4 4 4 4 4 4 4 4 3 3
MFCA01 MFCA02 MGAD00 MGAD01 MIDZ00 MLAB00 MLEY00 MPBN00 MPBN02 MPBZ00 MPBZ01 MSAB00 MSAB01 MSAB02 GMEY00 MCCH00
FINGER,GROUND FINGER,GROUND GASKET,SHIELD FORM GASKET,SHIELD FORM INSULATOR LABEL,A/S LOCKER PAD,SPEAKER PAD,SPEAKER PAD PAD SHEET,OPERATING SHEET,OPERATING SHEET,OPERATING SCREW MACHINE,BIND CAP,SCREW
MFCA0008201 MFCA0000501 MGAD0153901 MGAD0150101 MIDZ0135301 MLAB0001102 MLEY0000801 MPBN0042501 MPBN0043401 MPBZ0188001 MPBZ0193901 MSAB0017601 MSAB0018701 MSAB0019201 GMEY0009201 MCCH0107001
PRESS, BeCu, , , , , t=0.1, 1p COMPLEX, (empty), , , , , CUTTING, EPDM, , , , , COMPLEX, (empty), , , , , C2000 USASV DIA 4.0 SIM LOCKER CUTTING, EPDM, , , , , COMPLEX, (empty), , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , CUTTING, EPDM, , , , , 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm MOLD, Silicone Rubber KE941-U, , , , ,
75 81
Brown Gold Transparent White Silver Black Black Black Black Black Black Black Black Black
83 73 64 61 66 50 59 58 84 69 68
55,R 72,T
- 167 -
Level 3 5 5
Location No. MLAK00 ADCA00 MLAZ00
Description LABEL,MODEL DOME ASSY,METAL LABEL
Part Number MLAK0006901 ADCA0066901 MLAZ0038301 PID Label 4 Array
Spec
Color
Remark
White Without Color
46,O
- 168 -
11.2 Replacement Parts <Main component>

Level 4 5 Location No. SACY00 SACE00 Description PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,SMT PCB ASSY,FLEXIBLE,SMT BOTTOM Part Number SACY0061101 SACE0055501
Spec
Color
Remark 14,B
SACC00
SACC0034701
BAT100
BATTERY,CELL,LITHIUM
SBCL0001701
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free
SACD00
PCB ASSY,FLEXIBLE,SMT TOP CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD PCB,FLEXIBLE VIBRATOR,MOTOR RECEIVER CAMERA
SACD0045301
CN101
ENBY0036801
60 PIN,0.4 mm,ETC , ,H=1.0, Socket
CN102
ENBY0020201
40 PIN,0.4 mm,ETC , ,H=0.9, Header
CN103
ENBY0034001
24 PIN,0.4 mm,ETC , ,P4S H=1.5, Socket
6 4 4 4
SPCY00 SJMY00 SURY00 SVCY00
SPCY0103001 SJMY0002601 SURY0013501 SVCY0015001
POLYI ,0.5 mm,MULTI-5 , ,; , , , , , , , , , 3.0 V,80 mA,12*3.4 , ASSY ,105 dB,32 ohm,13*3.4 , ,; , , , , , ,WIRE , CMOS ,MEGA ,1.3M SS-LSI (1/5"), 7x12x4.1t, HPCB MAIN ,M_176*220 S_96 64 Mono ,38.5*51.8*3.2 ,262k ,TFT ,TM ,S6B0724 , 3 PIN,3 mm,ETC , ,H=6.5 3.0 ,-2 dBd, ,GSM850+EGSM+DCS+PCS+W-BAND II+W-BAND V, INTERNAL ,; ,QUAD ,-2.0 ,50 ,3.0 ASSY ,8 ohm,90 dB,17 mm,20mm elco8000 ,; , , , , , , ,CONNECTOR CU420 ATTGR CU420 ATTGR POLYI ,0.2 mm,DOUBLE ,CU420 SPK SIDEKEY ,; , , , , , ,,,, POLYI ,0.2 mm,DOUBLE ,CU420 VOLUME SIDEKEY ,; , ,,,,,,,, CU420 ATTGR Dark Silver 16,C 17,E 15,D
SVLM00
LCD MODULE
SVLM0025601
18,F
ENZY00
CONNECTOR,ETC
ENZY0015701
60
SNGF00
ANTENNA,GSM,FIXED
SNGF0027001
62
SUSY00
SPEAKER
SUSY0021602
51
3 4
SAFY00 SAFB00
PCB ASSY,MAIN PCB ASSY,MAIN,INSERT
SAFY0200901 SAFB0072201
47,P
SPKY00
PCB,SIDEKEY
SPKY0047401
SPKY004 PCB,SIDEKEY
SPKY0047301
SAFF00
PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT BOTTOM
SAFF0122101
SAFC00
SAFC0090801
CU420 ATTGR
ANT104
ANTENNA,GSM,FIXED
SNGF0028501
3.0 ,-2.0 dBd, ,BLUETOOTH, SMD, 9.0*3.0*1.65 ,; ,SINGLE ,-2.0 ,50 ,3.0
- 169 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C1 C10 C101 C102 C103 C104 C105 C106 C107 C11 C12 C13 C14 C15 C16 C17 C18 C19 C2 C20 C200
Description CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER
Part Number ECZH0000841 ECZH0000830 ECZH0000830 ECZH0003103 ECZH0003103 ECZH0000830 ECZH0003103 ECZH0000830 ECZH0000813 ECZH0003103 ECZH0000816 ECCH0001002 ECZH0001002 ECCH0000149 ECCH0000143 ECZH0000816 ECZH0000841 ECZH0001002 ECCH0001002 ECCH0000129 ECTZ0004701
Spec 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 3.3 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 120 pF,50V,J,NP0,TC,1005,R/TP 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP 10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 120 pF,50V,J,NP0,TC,1005,R/TP
Color
Remark
C201
CAP,TANTAL,CHIP
ECTH0004807
6 6 6 6 6 6 6 6 6
C202 C203 C204 C205 C206 C207 C208 C209 C21
CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
ECCH0000155 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0000155 ECCH0000155 ECCH0000129
- 170 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C210 C211 C212 C213 C214 C215 C216 C217 C218 C219 C22 C220 C221 C222 C223 C224 C225 C226 C227 C228 C229 C23 C230 C231 C232 C233 C234 C235 C236 C237 C238 C239
Description CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP
Part Number ECCH0000155 ECZH0003103 ECCH0000155 ECCH0000155 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0000143 ECCH0000143 ECCH0000143 ECCH0000129 ECCH0000155 ECCH0000155 ECCH0000155 ECCH0000155 ECZH0003103 ECZH0003103 ECCH0000147 ECCH0000143 ECCH0000143 ECCH0000143 ECZH0001002 ECCH0000143 ECCH0000155 ECCH0000143 ECCH0000143 ECCH0000143 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0000155
Spec 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 120 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 2.2 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP
Color
Remark
- 171 -
Level 6 6 6 6 6 6 6 6 6 6
Location No. C24 C240 C241 C25 C26 C27 C28 C29 C3 C30
Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,TANTAL,CHIP
Part Number ECZH0003103 ECCH0000161 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0000813 ECZH0003103 ECCH0001002 ECTH0001703
Spec 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 47 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
Color
Remark
C300
CAP,TANTAL,CHIP
ECTH0004807
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
C301 C302 C303 C304 C305 C306 C307 C308 C309 C31 C310 C311 C312 C313 C314 C315 C316 C317
CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
ECCH0000122 ECZH0003103 ECZH0003103 ECCH0000120 ECCH0000110 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0000198 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0000155 ECZH0003103 ECCH0000155 ECCH0000155
C318
CAP,TANTAL,CHIP
ECTH0004807
C319
CAP,CHIP,MAKER
ECZH0001215
- 172 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C32 C320 C321 C33 C34 C35 C36 C37 C38 C39 C4 C40 C400 C401
Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER
Part Number ECZH0003103 ECCH0000143 ECCH0000143 ECZH0003103 ECZH0000813 ECZH0003103 ECCH0000115 ECCH0000115 ECCH0000115 ECZH0000813 ECZH0000822 ECCH0000393 ECZH0001215 ECZH0001215
Spec 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
Color
Remark
C402
CAP,TANTAL,CHIP
ECTH0005501
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
C403 C404 C405 C406 C407 C408 C409 C41 C410 C411 C412 C413 C414 C415 C417 C418
CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER
ECZH0001215 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECZH0003103 ECCH0005604 ECZH0003103 ECCH0007802 ECCH0007802 ECCH0007802 ECZH0001215 ECCH0006201 ECCH0000198 ECZH0001215
- 173 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C419 C42 C420 C421 C422 C423 C424 C425 C426 C427 C428 C429 C43 C430 C431 C432 C433 C434 C435 C436 C437 C438 C44 C45 C46 C47 C48 C49 C5 C50 C500
Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP
Part Number ECZH0001215 ECCH0000155 ECZH0003103 ECZH0001215 ECZH0001215 ECZH0003103 ECCH0007802 ECZH0001215 ECCH0007802 ECCH0007802 ECCH0000112 ECCH0000112 ECCH0000115 ECCH0000198 ECCH0000198 ECCH0000393 ECZH0003103 ECCH0007802 ECCH0007802 ECZH0003103 ECZH0003103 ECCH0006201 ECCH0000120 ECZH0000844 ECZH0000843 ECTH0005101 ECCH0000143 ECZH0003103 ECCH0000107 ECZH0001215 ECCH0000112
Spec 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 62 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,10V ,M ,STD ,1608 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 6 pF,50V,D,NP0,TC,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP
Color
Remark
- 174 -
Level
Location No. C501
Description
Part Number
Spec 10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 15 pF,50V,J,NP0,TC,1005,R/TP 100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 68 nF,10V ,K ,X7R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP
Color
Remark
CAP,TANTAL,CHIP
ECTH0004807
C503
CAP,CERAMIC,CHIP
ECCH0000112
C504
CAP,TANTAL,CHIP
ECTH0005202
C505
CAP,TANTAL,CHIP
ECTH0005202
6 6 6 6 6 6 6
C506 C507 C508 C509 C51 C510 C511
CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,TANTAL,CHIP CAP,CHIP,MAKER
ECCH0002002 ECZH0001215 ECZH0003103 ECZH0003103 ECZH0000841 ECTH0003701 ECZH0003103
C512
CAP,TANTAL,CHIP
ECTH0005501
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
C513 C514 C515 C516 C517 C518 C519 C52 C520 C521 C522 C524 C525 C526 C53 C54 C55 C56
CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP
ECZH0003121 ECCH0000155 ECCH0000122 ECCH0000122 ECZH0001215 ECCH0000110 ECZH0000830 ECCH0001001 ECCH0000110 ECZH0000830 ECZH0003103 ECZH0000830 ECZH0003103 ECZH0000830 ECCH0000155 ECCH0000120 ECZH0000813 ECCH0000143
- 175 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C57 C58 C59 C6 C60 C602 C603 C604 C605 C606 C607 C608 C609 C61 C62 C63 C65 C66 C67 C69 C7 C70 C71 C72 C73 C74 C76 C77 C79 C8 C80 C81
Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER INDUCTOR,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER
Part Number ECZH0001002 ECCH0000143 ECCH0000155 ECCH0000107 ECCH0000143 ECZH0000830 ECZH0000830 ECZH0000830 ECZH0001215 ECZH0001215 ECCH0000198 ECZH0003124 ECZH0000822 ECCH0000143 ECCH0000175 ECCH0000143 ECZH0000846 ECZH0000830 ECZH0001002 ELCH0004718 ECCH0001002 ECCH0000143 ECZH0001002 ECCH0000155 ECZH0000830 ECCH0000105 ECCH0000105 ECCH0000143 ECZH0001215 ECZH0000841 ECZH0001215 ECZH0000813
Spec 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 6 pF,50V,D,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 68 nF,16V ,K ,X7R ,HD ,1005 ,R/TP 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 5.6 nH,S ,1005 ,R/TP , 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 4 pF,50V,C,NP0,TC,1005,R/TP 4 pF,50V,C,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
Color
Remark
- 176 -
Level 6 6 6 6 6
Location No. C82 C83 C84 C85 C86
Description CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER
Part Number ECCH0000155 ECZH0000813 ECCH0000198 ECCH0000127 ECZH0003103
Spec 10 nF,16V,K,X7R,HD,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 82 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 2.2 nF,16V ,J ,STD ,SMD ,1608 mm,R/TP ,; , ,5% ,[empty] ,[empty] ,-55TO+125C ,[empty] ,1.6X0.8X0.7MM ,R/TP 150 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
Color
Remark
C88
CAP,FILM,MPP
ECFD0000105
6 6 6 6 6 6 6 6 6
C89 C9 C90 C91 C93 C94 C95 C97 C99
CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD
ECCH0000187 ECZH0000806 ECZH0003103 ECZH0000813 ECCH0000183 ECZH0000846 ECZH0000830 ECZH0000830 ECCH0000183
CN300
ENBY0018501
10 PIN,.4 mm,STRAIGHT , ,H=0.9,HEADER
CN500
ENBY0036701
60 PIN,0.4 mm,ETC , ,H=1.0, Plug
CN501
CONNECTOR,I/O
ENRY0006801
18 PIN,0.4 mm,ETC , , ,; ,18 ,0.40MM ,ANGLE ,RECEPTACLE ,SMD ,R/TP , 6 PIN,ETC , ,2.54 mm,H=1.4 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) SC70-6L ,6 V,200 W,R/TP ,PB-FREE VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) SOD-523 ,5 V,240 W,R/TP ,Vc 12.5V , 160pF , 1.6*0.8*.06 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1
CN503
CONN,SOCKET
ENSY0017001
D400
DIODE,SWITCHING
EDSY0011901
D500
DIODE,TVS
EDTY0008607
D501
DIODE,TVS
EDTY0009401
D502
DIODE,SWITCHING
EDSY0011901
D503
DIODE,TVS
EDTY0007501
D504
DIODE,TVS
EDTY0009401
D505
DIODE,TVS
EDTY0009401
D506
DIODE,TVS
EDTY0009401
- 177 -
Level 6 6
Location No. D507 D508
Description DIODE,TVS DIODE,TVS
Part Number EDTY0008601 EDTY0007401
Spec SOD-323 ,6 V,400 W,R/TP ,PB-FREE SMD ,12 V,350 W,R/TP , EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) 600 ohm,1005 ,DC Res.0.6ohm, R.C.500mA 600 ohm,1005 ,DC Res.0.6ohm, R.C.500mA 600 ohm,1005 ,DC Res.0.6ohm, R.C.500mA 60 ohm,1005 , 850.900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,Quad GSM, Triple WCDMA with 4 Rx SAW Filter, 5.4x5.0x1.2 836.5 MHz,25 MHz,4.4 dB,17 dB,897.5 MHz,35 MHz,4.4 dB,10 dB,3.2*2.5*1.5 ,SMD ,Pb-free_Tx Dual SAW & Switch Module 836.5 MHz,881.5 MHz,2.0 dB,2.7 dB,49 dB,61 dB,3.0*2.5*1.25 ,SMD , 836.5 MHz,25 MHz,2.2 dB,40 dB,1880 MHz,58.75 MHz,4 dB,30 dB,2.0*1.6*0.68 ,SMD ,824M~849M,1850.625M~1909.375M,10p,B,50,50,DCN+ USPCS Tx,BIDIR ,; ,836.5, 1880 ,2.0*1.6*0.68 ,SMD ,R/TP 1880 MHz,1960 MHz,3.8 dB,3.5 dB,43 dB,52 dB,3.8*3.8*1.4 ,SMD ,FBAR 881.5 MHz,2.0*1.4*0.78 ,SMD , 1960 MHz,2.0*1.4*0.68 ,SMD ,5pin, Unbal-Bal, 50/100, B7834 Low Loss ver. SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pb-free 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
Color
Remark
D600
DIODE,SWITCHING
EDSY0011901
6 6 6 6
FB300 FB301 FB500 FB501
FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP
SFBH0009801 SFBH0009801 SFBH0009801 SFBH0000909
FL100
FILTER,SEPERATOR
SFAY0008502
FL101
FILTER,SAW,DUAL
SFSB0000601
FL102
DUPLEXER,DCN
SDDY0004101
FL103
FILTER,SAW,DUAL
SFSB0001601
FL104
DUPLEXER,PCS
SDPY0002902
FL105
FILTER,SAW
SFSY0018201
FL106
FILTER,SAW
SFSY0024901
FL500
FILTER,EMI/POWER
SFEY0010501
FL501
FILTER,EMI/POWER
SFEY0010501
FL502
FILTER,EMI/POWER
SFEY0010501
FL503
FILTER,EMI/POWER
SFEY0010501
FL504
FILTER,EMI/POWER
SFEY0010501
FL505
FILTER,EMI/POWER
SFEY0010501
FL506
FILTER,EMI/POWER
SFEY0010501
FL507
FILTER,EMI/POWER
SFEY0010501
6 6
L100 L102
INDUCTOR,CHIP CAP,CHIP,MAKER
ELCH0003814 ECZH0000822
- 178 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. L103 L104 L105 L106 L107 L108 L110 L111 L112 L114 L115 L116 L117 L118 L119 L120 L121 L122 L123 L124 L125 L126 L128 L129 L131 L132 L133 L135 L136 L137 L138 L139
Description INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP CAP,CERAMIC,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP CAP,CHIP,MAKER INDUCTOR,CHIP INDUCTOR,CHIP
Part Number ELCH0003825 ELCH0001041 ELCH0003814 ELCH0004733 ELCH0004720 ELCH0005012 ELCH0001401 ELCH0004733 ELCH0001413 ELCH0001413 ELCH0005813 ELCH0001421 ELCH0005813 ELCH0003826 ELCH0001421 ELCH0001401 ELCH0004701 ELCH0001034 ELCH0001009 ELCH0001403 ELCH0001420 ELCH0004704 ECCH0000127 ELCH0001009 ELCH0004705 ELCH0001031 ELCH0005006 ELCH0001031 ELCH0001009 ECZH0000830 ELCH0001421 ELCH0004716
Spec 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 10 nH,S ,1005 ,R/TP ,PBFREE 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005 4.3 nH,S ,1005 ,R/TP ,Coil 1.2 nH,S ,1005 ,R/TP , 3.9 nH,S ,1005 ,R/TP , 15 nH,J ,1005 ,R/TP ,Pb Free 4.3 nH,S ,1005 ,R/TP ,Coil 22 nH,J ,1005 ,R/TP ,PBFREE 22 nH,J ,1005 ,R/TP ,PBFREE 27 nH,J ,1005 ,R/TP , 47 nH,J ,1005 ,R/TP ,PBFREE 27 nH,J ,1005 ,R/TP , 3.3 nH,S ,1005 ,R/TP ,chip 47 nH,J ,1005 ,R/TP ,PBFREE 15 nH,J ,1005 ,R/TP ,Pb Free 12 nH,J ,1005 ,R/TP , 3.3 nH,S ,1005 ,R/TP ,PBFREE 1.2 nH,S ,1005 ,R/TP , 1 nH,S ,1005 ,R/TP ,PBFREE 3.9 nH,S ,1005 ,R/TP ,PBFREE 4.7 nH,S ,1005 ,R/TP , 82 pF,50V,J,NP0,TC,1005,R/TP 1.2 nH,S ,1005 ,R/TP , 8.2 nH,J ,1005 ,R/TP , 15 nH,J ,1005 ,R/TP ,PBFREE 33 nH,J ,1005 ,R/TP , 15 nH,J ,1005 ,R/TP ,PBFREE 1.2 nH,S ,1005 ,R/TP , 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 47 nH,J ,1005 ,R/TP ,PBFREE 39 nH,J ,1005 ,R/TP ,
Color
Remark
- 179 -
Level 6 6 6 6
Location No. L140 L141 L142 L143
Description INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP CAP,CHIP,MAKER
Part Number ELCH0005803 ELCH0001420 ELCH0004716 ECZH0000830 2.7 nH,S ,1005 ,R/TP ,
Spec
Color
Remark
3.9 nH,S ,1005 ,R/TP ,PBFREE 39 nH,J ,1005 ,R/TP , 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD ,2.5X2X1MM ,11MM ,R/TP 4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD ,2.5X2X1MM ,11MM ,R/TP 4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD ,2.5X2X1MM ,11MM ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 4.5x3.2x1.2 Bluetooth RF Module UNIT ,-42 dB,6.15*3.76*1.25 ,Silicon mic , ,-42 ,300 ,OMNI ,[empty] ,6.15*3.76*1.25 ,SMD 3.3 nH,S ,1005 ,R/TP ,PBFREE 51 ohm,1/16W ,J ,1005 ,R/TP 1.5 nH,S ,1005 ,R/TP ,PBFREE 12 Kohm,1/16W ,F ,1005 ,R/TP 680 ohm,1/16W ,F ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 5.1 ohm,1/16W ,J ,1005 ,R/TP 2.7 ohm,1/16W ,J ,1005 ,R/TP 62 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,F ,1005 ,R/TP 100 ohm,1/16W ,F ,1005 ,R/TP 100 ohm,1/16W ,F ,1005 ,R/TP 56 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 120 ohm,1/16W ,J ,1005 ,R/TP 120 ohm,1/16W ,J ,1005 ,R/TP 200 ohm,1/6W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP
L400
INDUCTOR,SMD,POWER
ELCP0008004
L401
INDUCTOR,SMD,POWER
ELCP0008004
L402
INDUCTOR,SMD,POWER
ELCP0008004
6 6
L500 M100
RES,CHIP,MAKER MODULE,ETC
ERHZ0000401 SMZY0012601
MIC300
MICROPHONE
SUMY0010602
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
R100 R103 R104 R105 R106 R107 R108 R109 R110 R112 R113 R114 R115 R116 R118 R119 R120 R121 R122 R123
INDUCTOR,CHIP RES,CHIP,MAKER INDUCTOR,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP
ELCH0001034 ERHZ0000490 ELCH0001033 ERHZ0000212 ERHZ0000310 ERHZ0000404 ERHZ0000404 ERHZ0000404 ERHZ0003801 ERHY0013101 ERHZ0000500 ERHZ0000206 ERHZ0000201 ERHZ0000201 ERHZ0000495 ERHZ0000443 ERHZ0000411 ERHZ0000411 ERHZ0000527 ERHY0003301
- 180 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. R124 R125 R126 R127 R128 R129 R130 R131 R132 R133 R135 R136 R137 R200 R201 R202 R203 R205 R206 R207 R208 R209 R210 R211 R300 R301 R302 R303 R304 R305 R404 R405
Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER
Part Number ERHZ0000406 ERHZ0000495 ERHZ0000490 ERHZ0000408 ERHZ0000408 ERHZ0000490 ERHZ0000529 ERHZ0000203 ERHZ0000351 ERHY0005902 ERHZ0000326 ERHZ0000402 ERHZ0000490 ERHZ0000537 ERHZ0000222 ERHZ0000493 ERHZ0000500 ERHZ0000493 ERHZ0000493 ERHZ0000203 ERHZ0000236 ERHZ0000490 ERHZ0000243 ERHZ0000243 ERHZ0000406 ERHZ0000493 ERHZ0000443 ERHZ0000308 ERHZ0000308 ERHZ0000406 ERHZ0000406 ERHZ0004201
Spec 100 Kohm,1/16W ,J ,1005 ,R/TP 56 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 110 ohm,1/16W ,J ,1005 ,R/TP 110 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 1.5 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,F ,1005 ,R/TP 11800 ohm,1/16W ,F ,1005 ,R/TP 5.62 Kohm,1/16W ,F ,1005 ,R/TP 330 ohm,1/16W ,F ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 680000 ohm,1/16W ,F ,1005 ,R/TP 150 Kohm,1/16W ,F ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 62 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,F ,1005 ,R/TP 2000 ohm,1/16W ,F ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,F ,1005 ,R/TP 2200 ohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 62 Kohm,1/16W ,F ,1005 ,R/TP 62 Kohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 121000 ohm,1/16W ,F ,1005 ,R/TP
Color
Remark
- 181 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. R406 R408 R409 R411 R412 R413 R500 R503 R504 R505 R506 R508 R509 R510 R511 R512 R513 R514 R515 R516 R517 R602 R619 R620 R621 R622 R624 RA600 S500 SPK SW100 U101
Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,ARRAY,R CONN,SOCKET CONN,RECEPTACLE CONN,RF SWITCH PAM
Part Number ERHZ0000405 ERHZ0000490 ERHZ0000493 ERHZ0000493 ERHZ0000287 ERHZ0004301 ERHZ0000443 ERHZ0000443 ERHY0000105 ERHY0000105 ERHZ0000288 ERHZ0000537 ERHZ0000318 ERHZ0000288 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000422 ERHZ0000487 ERHZ0000406 ERHZ0000407 ERHZ0000488 ERHZ0000488 ERHZ0000435 ERHZ0000451 ERNR0000404 ENSY0018801 ENEY0003801 ENWY0004401 SMPY0013501
Spec 10 Kohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 47 Kohm,1/16W ,F ,1005 ,R/TP 0.1 ohm,1/4W ,F ,ETC ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W,F,1005,R/TP 51 ohm,1/16W,F,1005,R/TP 470 Kohm,1/16W ,F ,1005 ,R/TP 680000 ohm,1/16W ,F ,1005 ,R/TP 80.6 Kohm,1/16W ,F ,1005 ,R/TP 470 Kohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 15 Kohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 1000 Kohm,1/16W ,J ,1005 ,R/TP 4.7 ohm,1/16W ,J ,1005 ,R/TP 4.7 ohm,1/16W ,J ,1005 ,R/TP 20 ohm,1/16W ,J ,1005 ,R/TP 27 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP 8 PIN,ETC , ,2.54 mm,Micro-SD Socket, Normal 2 PIN, , , ,SMD , dB,H=2.2 35 dBm,51 %, A, dBc, dB,7x7x1.1 ,SMD ,Polar Edge
Color
Remark
- 182 -
Level
Location No. U102
Description COUPLER,RF DIRECTIONAL IC
Part Number
Spec 19.8 dB,0.28 dB,33 dB,1.0*0.5*0.4 ,SMD ,Pbfree_Coupler_DCN Tx ,; ,[empty] ,836.5MHz ,25MHz ,SMD ,R/TP SON5-P-0.50 ,5 PIN,R/TP ,INVERTER GATE, Pb Free 20.5 dB,0.25 dB,34 dB,1.0*0.5*0.4 ,SMD ,Pbfree_Coupler_USPCS Tx ,; ,[empty] ,1880MHz ,60MHz ,SMD ,R/TP 28 dBm,39 %, A, dBc, dB,3x5x1 ,SMD ,HELP3 Dual PAM ,; , , , , , , , ,R/TP ,R/TP ,14 QFN ,48 PIN,R/TP ,WCDMA Dual Receiver IC for USA, 7X7X0.9 CSP ,409 PIN,R/TP ,HSDPA3.6Mbps Baseband MicroStar Junior ,15 PIN,R/TP ,1.1W Class-D Mono Audio AMP FBGA ,225 PIN,ETC ,1G(LB/128Mx16/2.7V) NAND+512(16Mx32) SDRAM , ,IC,MCP TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge Pump(AAT2154 Low cost version) BCCS ,84 PIN,R/TP ,PA buck --> General Buck (for RF CMOS Chip) ,; ,IC,PMIC WDFN ,8 PIN,R/TP ,-12V, 6.3A, Single P-MOSFET & DUAL Transistor TLLGA ,8 PIN,R/TP ,OVP SMD ,3 TERMINAL EMI FILTER QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD , 14 V, ,SMD ,50pF, 1005 18 V, ,SMD , 18 V, ,SMD , 19.2 MHz,1.5 PPM,10 pF,SMD ,3.3*2.5*1.0 , ,; , ,2PPM ,2.8V , , , , ,SMD ,P/TP 32.768 KHz,20 PPM,9 pF,65 Kohm,SMD ,4.9*1.8*0.9 ,
Color
Remark
SCDY0003901
U103
EUSY0278501
U104
COUPLER,RF DIRECTIONAL
SCDY0003801
U105
PAM
SMPY0015801
U106
IC
EUSY0300401
U200
IC
EUSY0334501
U300
IC
EUSY0160001
U301
IC
EUSY0336901
U400
IC
EUSY0238702
U401
IC
EUSY0347301
U402
IC
EUSY0332901
6 6
U501 U502
IC FILTER,EMI/POWER
EUSY0333701 SFEY0006501
U601
IC
EUSY0300502
6 6 6 6 6 6 6 6 6 6
VA502 VA503 VA505 VA506 VA507 VA508 VA509 VA513 VA601 VA602
DIODE,TVS DIODE,TVS VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR
EDTY0009101 EDTY0009101 SEVY0003801 SEVY0003801 SEVY0003801 SEVY0003801 SEVY0003801 SEVY0001001 SEVY0003801 SEVY0003801
X100
VCTCXO
EXSK0007802
X400
X-TAL
EXXY0016601
- 183 -
Level
Location No. SAFD00
Description PCB ASSY, MAIN,SMT TOP
Part Number
Spec
Color
Remark
SAFD0090301
CU420 ATTGR
C600
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C601
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
LD600
DIODE,LED,CHIP
EDLH0012902
SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P SNOWWHITE ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 ,5mA , , ,65mW ,[empty] ,[empty] ,2P FR-4 ,0.8 mm,STAGGERED-8 , ,; , , , , , , , , , 62 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP
LD601
DIODE,LED,CHIP
EDLH0012902
LD602
DIODE,LED,CHIP
EDLH0012902
LD603
DIODE,LED,CHIP
EDLH0012902
LD604
DIODE,LED,CHIP
EDLH0012902
LD605
DIODE,LED,CHIP
EDLH0012902
LD606
DIODE,LED,CHIP
EDLH0012902
LD607
DIODE,LED,CHIP
EDLH0012902
LD608
DIODE,LED,CHIP
EDLH0012902
LD609
DIODE,LED,CHIP
EDLH0012902
LD610
DIODE,LED,CHIP
EDLH0012902
LD611
DIODE,LED,CHIP
EDLH0012902
LD612
DIODE,LED,CHIP
EDLH0012902
LD613
DIODE,LED,CHIP
EDLH0012902
LD614
DIODE,LED,CHIP
EDLH0012902
LD615
DIODE,LED,CHIP
EDLH0012902
6 6 6 6 6
PCB R600 R601 R603 R604
PCB,MAIN RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP
SPFY0151201 ERHZ0000500 ERHZ0000406 ERHY0003301 ERHY0003301
- 184 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. R605 R606 R607 R608 R609 R610 R611 R612 R613 R614 R615 R616 R617 R618 U600 VA600 VA603 VA604 VA605 VA606 VA607 VA608 VA609 VA610 VA611 VA612 VA613
Description RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP IC VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR
Part Number ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 EUSY0129503 SEVY0003801 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0000701
Spec 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 2x2 mm MLPD ,3 PIN,R/TP ,Hall Effect Switch, Pb Free 18 V, ,SMD , 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,120pF, 1005
Color
Remark
- 185 -
11.3 Accessory
Level
Location No. SBPL00
Description
Part Number
Spec 3.7 V,1000 mAh,1 CELL,PRISMATIC ,553446 INNERPACK, STD ,; , , , ,PRISMATIC , , ,BLACK , , 100-240V ,5060 Hz,5.1 V,.7 A,UL/CSA ,AC-DC ADAPTOR ,; ,85Vac ~ 264Vac ,5.1V +0.15, -0.2V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,0.7 A,UL/CSA ,AD-DC ADAPTOR ,; ,85Vac~264Vac ,5.1 +0.15, -0.2V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,.7 A,UL/CSA ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V (+0.15V, -0.2V) ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,.7 A,UL/CSA ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1 (+0.15V, -0.2V) ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR ,
Color
Remark
BATTERY PACK,LI-ION
SBPL0086901
Black
85,S
SSAD00
ADAPTOR,AC-DC
SSAD0024401
ADAPTOR,AC-DC
SSAD0024402
ADAPTOR,AC-DC
SSAD0024403
ADAPTOR,AC-DC
SSAD0024404
- 186 -
Note
Note

En Cu515 Tu515 SVC Eng 1106

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Dokumentinformationen

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En Cu515 Tu515 SVC Eng 1106

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Service Manual

Internal Use Only

Service Manual CU515/TU515

Date: November, 2007 / Issue 1.0

3. TECHNICAL BRIEF ........................13

6. BLOCK DIAGRAM ........................142

4. TROUBLE SHOOTING ...................69

11. EXPLODED VIEW & REPLACEMENT PART LIST ..... 163

LGE Internal Use Only

LGE Internal Use Only

1.2 Regulatory Information

LGE Internal Use Only

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices ATTENTION

LGE Internal Use Only

2.2 Using Condition (Accessory)

LGE Internal Use Only

2) General Using Condition

2.3 Radio Performance

LGE Internal Use Only

2)Transmitter - WCDMA Mode

LGE Internal Use Only

3)Receiver - WCDMA Mode

LGE Internal Use Only

2.4 Current Consumption

2.5 Operation Time

2.6 RSSI Bar

LGE Internal Use Only

2.7 Battery Bar

LGE Internal Use Only

Fig 1.1 Block diagram of RF part

QUALCOMMs branded chipset that implements a Zero-IF radio architecture.

LGE Internal Use Only

LGE Internal Use Only

3.2 GSM Mode

ANTENNA SWITCH MODULE LOGIC

ANT_SEL1 LOW HIGH LOW LOW HIGH HIGH HIGH LOW

ANT_SEL2 HIGH HIGH LOW LOW LOW LOW HIGH HIGH

Table 1.1 Antenna Switch Module Control logic

LGE Internal Use Only

LGE Internal Use Only

LGE Internal Use Only

3.2.2 GSM Transmitter out put

LGE Internal Use Only

3.3 UMTS Mode

Figure 1.3.1-1 RFR6275 IC functional block diagram

LGE Internal Use Only

LGE Internal Use Only

RTR6275 IC functional block diagram

LGE Internal Use Only

3.4 LO Phase-locked Loop

RFR6275 PLLs functional block diagram

LGE Internal Use Only

3.4.1 UMTS Rx PLL (PLL3)

3.4.2 Transceiver PLL (PLL1)

LGE Internal Use Only

3.5 Off-chip RF Components

LGE Internal Use Only

3.5.2 UMTS duplexer

LGE Internal Use Only

3.5.3 UMTS Power Amplifier

LGE Internal Use Only