60ghz Soptech Using Hfss & Ad

Microwave Devices Team
60GHz SoP Tech using HFSS & AD
2006. 10. 13 Dong-young Kim Microwave Devices Team IT
Outline
Motivation
Wireless Landscape Characteristics of WPAN(IEEE802.15.TG3c) Schematic diagram of our system
II

LTCC SoP at 60GHz

Characteristics of LTCC Substrate Characteristics of transmission line Characteristics of wire bonding Chip interconnection solution
III
Summary
2
Wireless Landscape
continually evolving
IEEE standards addressing high data rate transmission at mm-Wave,

10000
especially 60 GHz band
10GBase-T 1000Base-T USB2.0
IEEE 802.15.3c Standard Working Group

Participation of over 15 companies
Max Data Rate (Mbps)
1000
WPAN/WLAN Convergence
802.15.3c ? 60 GHz
802.11n UWB 802.11a
100
10Base-T
100Base-T
10
1Base-T
USB1.1
802.11b
Ethernet 1
60 GHz band World wide band allocations

7 GHz bandwidth 100Mbps to multi-Gbps rates
USB
USB1.0
WLAN
802.11
WPAN
0.1 1975
1980
1985
1990
1995
2000
2005
2010
Year
Drivers include: Frequency allocation WW, bandwidth, capacity, power, cost, and reliability
Characteristics of mmW WPAN
Wireless transmission New unlicensed 60 GHz band Short range < 10 meters High data rate > 100Mbps Multimedia capability
60 GHz is best solution for short range high data rate applications
Potential WPAN Applications

Ad-hoc information distribution with Point-to-Point network extension : - Easy and immediate construction of temporal broadband network such as in exhibition-site for Advertisement information distribution or Contents downloading service Broadcasting video signal transmission system in sports stadium : ~1.5Gbps
To Outside Broadcast Van
Rx
Small HDTV Camera
Inter-vehicle communication system :
Tx
Tx & Rx Transmitter & Receiver
5
WPAN Applications (continued)

Huge data file transmission : Ultra high speed download system mm-Wave video-signals transmission system :
BS
Communication Satellite
IP network
mmWave
LCD TV Portable PC within TV tuner Wall-mount TV
Broadcast Satellite Terrestrial Broadcast
mmWave
DV D
Central Transceiver
mmWave Tx Video signals
System
Tx
60GHz
Rx
TV with mmWave Rx Video signals

Millimeter-wave Transceiver
Note-PC
Conceptual Image
HD TV Data Distribution at Apartments/condominiums : mm-Wave PAN for on-demand transmission or/and re-broadcasting of video and data signal for ad-hoc terminals
Schematic Diagram of mmW WPAN
2 1
Switch Opt. Osc. Up Link Power Amp PD Antenna PD Drive Pre. Amp Amp

Power Amp Tx Filter
Down Link
60 GHz
Modulator Power Amp
LNA
Rx Filter
/AP AP AP AP MAC IF
AP RF
WT RF
WT WT WT IF MAC
WT
60GHz LAN
7
LTCC
(Low Temperature Cofired Ceramics)
Millimeter wave SoP Key Issues

Loss
- dielectric and conductor loss increase with frequency
Substrate solution
- Low dielectric loss at mmW-band, at 60 GHz - Low cost packaging materials
Transmission Line solution

- low loss transmission at 60 GHz
Chip interconnection solution

- Low loss flip-chip or wire bond - Microstrip or CPW transmission line
Substrate(LTCC) issues
Ferro A6S
Thermal Coefficient of Expansion (25 - 300C) Tape Shrinkage X,Y Z (unlaminated to fired) Fired Density Flexural Strength (3 point bend) Thermal Conductivity (With Thermal Vias) 2 W/mK >50 W/mK
(CaSiO3, (Na,Mg)SiO3, SiO2, CaB2O4 ]

Typical Fired Electrical Properties Dielectric Constant (1-100 5.9 0.20 GHz) Dissipation Factor (1-100 15.3 0.2 % GHz) Insertion Loss (10 GHz) 24 0.2 % 2.45 g/cm3 >160 MPa Bulk Resistivity <0.2 %
Typical Fired Physical Properties 8 ppm/C
<0.18 dB/in >1012 /cm
10
Design of 50 Line
Ansoft Designer (calculation of line width)
(microstrip: 100m]
Ansoft HFSS (Simulation of line width)
11
Transmission Line
Dielectric Thickness: 100 m
(Microstrip line]
0 0
-10
Insertion Loss(dB)
Return Loss(dB)
-1 -20
-2 -30
-40 2mm 4mm 2mm 4mm -50 50 55 60 measured measured simmulated simmulated 65
-3
-4 70
Frequency(GHz)
1(100m)
Line 2mm 4mm
S11[dB] -31.1 -22.8
S21[dB] -0.16 -0.41
S12[dB] -0.18 -0.42
S22[dB] -29.7 -24.3
12
Design of 50 Line
(microstrip: 200m]
13
Transmission Line
(Microstrip line]
-10
Sim lated S11, S22 u Sim lated S21, S12 u M easu red S11, S22 M easu red S21, S12
-20
-30
-40
50
55
60
65
70
75
Frequency (G z) H
2(200m)
Line 4mm 6mm
S11[dB] -23.9 -30.6
S21[dB] -1.25 -0.58
S12[dB] -1.18 -0.52
S22[dB] -17.3 -34.0
14
Design of 50 Line
(CBCPW: 100m]
15
Transmission Line
(CBCPW line]
0 0
-10 -1 -20 -2
S21
S11
-30 -3 -40
-50
2mm 4mm 2mm 4mm
mesaured mesaured simulated simulated
-4
-60 50 55 60 65 70
-5
Frequency (GHz)
1(100m)
Line 2mm 4mm
S11[dB] -22.4 -21.7
S21[dB] -0.15 -0.40
S12[dB] -0.12 -0.37
S22[dB] -20.4 -22.4
16
Design of 50 Line
(CBCPW: 200m]
17
Transmission Line
(CBCPW line]
0 0 -10
Insertion Loss(dB)
Return Loss(dB)
-1 -20
-2 -30
-40
3mm 5mm
-3
-50 50
55
60
65
-4 70
Frequency(GHz)
2(200m)
Line 3mm 5mm
S11[dB] -18.6 -43.5
S21[dB] -0.16 -0.35
S12[dB] -0.17 -0.39
S22[dB] -19.1 -27.3
18
Transmission Line
(summary]
Design of 50 transmission lines

- using Designer and HFSS
Simulated value is coincide with measurement. Microstrip or CBCPW line is suitable for transmission lines at 60GHz.
- low loss (0.1dB/mm)
19
Interconnection (wire bonding)

CBCPW Line ( :100m)
single wire double wire single ribbon
Wire or ribbon & Single or double
0
0.00 -0.05
S11 - 21.6dB - 28.6dB - 27.4dB - 24.3dB

0.05
S12 - 0.17dB - 0.10dB - 0.10dB - 0.09dB
double ribbon
0
S11 (dB)
S21(dB)
0.00 -0.05 -0.10 -0.15 -0.20
-5
-0.10 -0.15 -0.20 -0.25
h=100 D=200
S11 (dB)
-10 -15
-10
-0.30 56 58 60 62 64
S11 (dB)
56
58
60
62
64
-20
Wire, dia.=1mil (25) Ribbon, size=2x0.5mil

2
-20
-25
-30
-30
single-wire double-wire
50 55 60 65 70
single-ribbon double-ribbon
-40 50 55 60 65 70
-35
Frequency (GHz)
Frequency (GHz)
20

CBCPW Line ( :200m)
single wire double wire single ribbon
0
0.0 -0.1
S11 - 9.19dB - 14.5dB - 15.4dB - 22.1dB
S12 - 0.75dB - 0.35dB - 0.31dB - 0.12dB

0.0
double ribbon
S21(dB)
0
-0.2 -0.3 -0.4
-5
-5
-0.1
S11 (dB)
-0.5
-10
56
58
60
62
64
-10
-0.2
S11
-15
S11 S21
S21
-0.3
-15
-20 -0.4
double-wire single-ribbon
-20 50 52 54 56 58 60 62 64
-25
-0.5
Frequency (GHz)
-30 50 55 60 65 70
-0.6
Frequency (GHz)
21

h=100 D=200
h=200 D=200
Dielectric thickness (100m)

Single ribbon or double wire bonding - nearly 50 Ohm at 60GHz Low loss transmission S21=~-0.1dB and S11=~-20dB
Dielectric thickness (200m)

Single ribbon or double wire bonding - high Impedance state To match 50, Increase the line width. Double ribbon bonding is required. Low loss transmission S21=~-0.1dB and S11=~-20dB
22
Wire length v.s. Line loss

Gap distance : acceptable RF degradation during the interconnection
Gold single ribbon
@ 60 GHz
CPW dielectrics=100
15 10 5 S 11 or S 22 [dB]
0.5
h=100 Gap distance
S 21 or S 12 [dB]
0 -5
-0.5 S21 S11 S12 S22 200 300 400 500 -10 -15 0 100 Gap Distance []
100 Photograph of 100 gap
-1
23
Interconnect loss of wire-bonding

Low loss and Simple Process : Wire-Bonding technique Symmetric performance(S11S22) of Wedge bonding method
0.2 through line only 0.0 Insertion loss [dB ]
3mm
Wire-bonding v.s. Flip-chip bonding

ETRI(2006) IBM(2005)
solder ball
-0.2 -0.4 -0.6

1.5mm 1.5mm
single ribbon
single ribbon
with 200 interconnect

1.5mm 1.5mm
200
200
-0.8 50 55 60 Frequency [GHz] 65 70
- Ribbon wire loss 0.11dB @ 60 GHz
- Solder ball loss 0.7dB @ 60GHz
24
Amp module
Ribbon wedge W=~95
LNA
G=~80
Gap Distance
D<100
h=100
Chip interconnection Solution Chip set Solution

0.12 pHEMT LNA Via-hole ground CPW line Cavity structure, Ribbon Wedge bonding technique
LNA
Silver paste gap
via-to-via 250
Ground Via & Metal
Substrate Solution
Ferro A6-S LTCC Internal silver conductor External gold conductor
25
Amp module (LNA)

LNA module S-parameters
30 20 10
10.2mm
S21 [dB]
0 -10 -20 -30 -40

bare chip LTCC module
0 -5 S11 or S22 [dB] -10 -15 -20 -25 -30 50 55 60 65 Frequency [GHz] 70
bare chip S11 bare chip S22 LTCC module S11 LTCC module S22
13.1mm
-50 50 55 60 65 Frequency [GHz] 70
hp8720C N/A freq.=50~70GHz S21=~19.4dB and S21=-0.4 dB S11=~-3.5dB and S11=-5.3 dB S22=~-7.9dB and S22=1.2 dB
26
Summary
Design of 50 transmission lines

- using Designer and HFSS
Microstrip or CBCPW line is suitable for transmission lines at 60GHz.

- low loss (0.1dB/mm)
Single ribon bonding is adequate for interconnection

- simple - low loss (0.1dB/bonding)
Characteristics of Amp module

- Gain (S21) : 0.4 dB
27

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Microwave Devices Team