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ELECTRONIC DEVICES WITH BACKLIT
PARTIAL MIRROR STRUCTURE
Applicant: Apple Ines Cuperina, CA (US)
Inventors: Patrick R. Perry, Boulder Crack, CA,
(US): Jun Cheng, Shanghai (CN):
Martin Melcher, Paris (FR): Shravan
Bharadwa), Sen Jose, CA (US)
‘Wanshan LL. Suzhou (CN: Seott M.
Stryker, San Jose, CA (US)
Appl. Now 171675834
Tiled: Feb, 18, 2022
Related
S. Application Data
Provisional application No. 63/177.788, filed on Ape
21, 2021,
Publication Classification
In.
FIV 4300
(2006.01)
202203:
S8SAL
(43) Pub. Date: Oct. 27, 2022
Iv 800 (2006.01)
Goze 528 (2006.01)
(2) Us.
co F21V $3004 (2013.00), GO2B S816
(01301; Go2w wons (01301; GaR S28
(2013.01): Go2B 008s 2013.01); F27¥
115710 (2016.08)
7) ABSTRACT
A backlit partially reflective minor may be used to form
logo or other structure in an electronic device. Ue electronic
device may have a housing. The housing may have a wall
With one of more openings configured ta reeiveone or more
oeresponting logo-shped portions of the parally rete:
tive mimor The panially receive mizeor may’ be illuni-
nated using backlight illumination from a backlight that is
‘overlapped by the partially reflective mirror. The partially
reflective mirror may be formed from one at more protr-
ing srvetures om common substrate, One or mor thin
layers may be configured to provide the partaly reflective
iiror ‘with desied visible light reflection spectrum,
deste visible light transmission spect, and desitod
visible light absorption spectrum. ‘The reflectivity of the
mmirtor may be configure 50 that the misror serves as
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FIG. 10US 2022/0341585 Al
ELECTRONIC DEVICES WITH BACKLIT
PARTIAL MIRROR STRUCTURES.
[0001] This application claims the henefit of provisional
patent applestion No. 6177788, fled Apr 21, 2021,
‘whieh i hereby incorporated by reference herein in is
nlite
FIELD.
0002] This relates generally to electronic devices, and,
‘more partcilaty, electonic devices with ikisinatd stuc>
BACKGROUND
003], Electronic devices such as may have housings
formes fom metal and other materials. In some strange
ments, openings are formes in # howsing to occmmodate
‘components. Openings may also be formed inthe shapes of
Togos
SUMMARY
[0004] An electronic device such as lap computer oF
‘other device may’ have a howsing, Components such a8 3
‘splay and Keyboard may be mounted inthe housing,
10005] ‘The rearof the hosing may be provided wih log.
“The log or other sinctres inthe device may be provided
with a boeklt partially elective mieror. ‘The mire may
provide the logo or other structures with a shiny appearance
‘while blocking interior components fom view. Atthe same
time, the partial transparency of the mizror allows backlight
illumination from within the devie to pase through the
0006] ‘The rlletive miror may be formed from one oF
‘more proiruding structures on a common substrate. The
‘protruding sinictures may be received within comesponding
‘openings in wall inthe housing
10007] One or mow thin-film layers may be configured 10
Provide the partially reflective mine with desir visible
light reletion specirum, desired visible light transmission
spocttum, ad a desired visible light absorption spectrum.
The reflectivity ofthe mirtor may be configure 0 tha he
imieor serves a5 a one-way mitror for the logo or other
stracture The migror may have a newt color such 3 light
‘aay or may have a peu-ncutal color such as gold
[BRIEF DESCRIPTION OF THE DRAWINGS.
[0008] FIG. 1 i a side view ofan itustatve electronic
‘vice with backit miror strate in acondance with an
‘mosiment
[0009] "FIG. 2s. war view ofan stati housing with
‘bockt mimo tetare having he shape ofa opr logo
in secordance with an embodiment
[0010] FIG. 3 isa graph showing stave rele
Spectrum for bro structure in aocrdance with embod
[WO] 116. 4 sa eross-setonal sie vew ofan laste
{ive backit mimor strate in accordance with an embod
[0012] FIGS. 5, 6, and 7 are cross-setonal sie views of
isteative backihts for mimo stetues in accordance
‘with embodiment
[W013] FIGS. 8 and 9 are istrative back
scconlance with embodiments
Oct. 27, 2022
[0014] FIG. 10 is a perspective view of an illustrative
Keyboard key formed! fom a backlit mimor in accordance
with an embodiment
DETAILED DESCRIPTION
[0015] An clectronic device may have components
‘mounted in # housing. The housing may be formed from
lass, metal, polymer, ceramic, flber-composite material
‘erste materials such as sapphire, other material, and
‘or combinations of these materls. In a istrative con-
figuration, an electronic device housing maybe formed fom
‘met or other material with one oe more openings to receive
Jogo-shaped backlit partially reflective mieor stuctues. In
eneral, ay suitable portion of an eletrnic device may
Thave a backlit mimor: Configurations in which the backlit
mmiror has a logo shape and fs mounted ina housing wall
‘opening ae sometimes described herein as an example
0016}. FIG. 158-9 cross-sectional view of an hniative
‘electron device. Eleetonie device 10 of FIG. A may be a
‘computing device such a= a laplop computer, a compute
‘monitor containing an embedded compute, tablet com-
pole, cellule telephone, « media player, or ober handheld
tr portable electronic device, a smaller device sich a8 8
Wwantwateh orother devise Wor oma user's Wrist, a pendant
‘device, a headphone of earpioce devi, « head-mounted
‘device sichas eyeglasses, goueles, or other equipment worn
fon a user's head, or other wearable or miniature device, a
television, a computer display that does not contain an
‘embedded computer gaming devee, a navigation deview,
‘an embesidd system soch asa system in which electronic
‘equipment with display is mounted ina kiosk oF automo
bile sguiment that implements the functionality of two oF
more a these doves, or other electronic equipment. Ius-
trative configurations in which deve 10 sa portable device
such a a laptop computer may sometimes be described
hota aya example
0017) As shown in FIG, 1, device 10 may include boos:
ing 12, Howsing 12, which may sometimes be refered to as
‘an enclonire or eae, may be formed of plastic, glass,
‘eras, fiber composites, metal (64 slanles set, alt=
‘migum, te.) other suitable materials, ora combination of
ny two oF more of these materials. Housing 12 may be
formed using a unibody configuration in which some or all
‘of housing 12 is machined or molded wt a single severe o
may be formed using moltiple structures (ean intemal
frame structure, one of mote structures tht form exterioe
housing surices, ete)
0018] Inthe example of FIG. 1 device 10 includes upper
portion 12A (sometimes refered to ay a display housing
Portion oF lid) and lower potion 128 (sometime refered 10
fe base housing portion or base). Portions 12 and 23
may be coupled at hinge 14. Hinge allows portions 124
‘nd 128 to rate relative to each othe. This allows the lid
‘of housing 12 wo rotate relative To the base of housing 1210
‘open and close housing 12. Device 10 may be a laptop
‘computer that inchides keyboard 16 and trackpad 18 in base
housing portion 128 and that includes display 20 in display
housing portion 12 Housing portion 12A may have front
F and an opposing ear R. Display 20 may be mounted on
front F, so that display 20 s protected when portion 12A is
rotatd into closed position and so that display 20 visible
to 8 user when portion 12A js open a shown ja FIG. 1
{0019} Housing 12 (including a display cover layer portion
that covers display 20) may separate an interior region ofUS 2022/0341585 Al
device 10 such a interior region 36 from an exterior region
suroninding device 10 such as exterior region 38, Compo
nents 34 may he mounted in howsing 12 (e., components
‘Mimay be mounted to one oF more printed cites 2 i
interior region 46. Components 34 may include integrated
circuits, discrete componeats, input-output deviees such 35.
Sensors, trackpad 18, keyboard 16, display 20, et
[0020], Componeats 34 may inl contol eteuiey, The
contro circuitry may include storage and processing cit-
cuir for supporting the operation of deview 10, The sto
land processing circuitry may include storage such as hard
disk drive storoge, nonvolatile memory (eg lsh memory
for other eletically-programmable-ead-only memory con
Figured to form a slid state crv), volatile memory (e
Satie of dynamic random-secess-memors), ete. Processing
‘route ia the control circuitry may be used to contol the
‘operation of device 10. The procesing eitcutry muy be
hase on one oF more microprocessors, microcontrollers,
ligt signal processors, baschand processors, power mah
‘agement units, audio chips, application specie integrated
cients, et. The contr eiruiry may include communica
tions cteutry for supporting wited andor witeles commu-
ications between device 10 and extomal eguipanent, For
‘example, contol czcuitry indevice 10 may include wireless
‘comatunications circuitry sich as cellular telephone eomm-
‘munications cireitry, wireless local area network eomm-
nications circuitry, nd near-field communications circuitry.
[0021] | Componcats 34 may aso include input-ouspt ci
ccuitry. For example, input-output deviees in device 10 may
he used tallow dat to be supplied to device 10 and tallow
data to be provided fom device 10 to extemal doves
Tnpatoutput devices may include butoas, joysticks, soll
ing wheels, touch pas, Key pads, Keyboards, microphones,
speakers, tone generators, haptic ouput devices cameras
liph-emitting diodes and other stats indicators, data pons.
dlsplays,ef- A user can contol tbe operation af device 10,
‘by suppiying commands thong inpat-outpa devices and
may receive stats information sn other output fom device
10 using the opt resources of input-ouipu devices. The
input-output devices may inlude seasrs. The sensors may
include capacitive sensors, light-based proximity sensors
magnetic sensors, accclerometer, forse sensors, fovch ren
sors, Temperature sensors, pressure seusors, inertial mea-
Surement units, accelerometers, gyroscopes, compasses,
microphones, radio-nequency sensors, three-