Technical Paper

Advantages of Multi-layer Fuse Design:

Raychem Ci rcui t Protecti on Fast
Acting Surface-mount Fuses
Introduction
Raychem Fast Acting Surface-Mount (SFF) fuses use a multilayer
design which sandwiches up to three fuse elements between
layers of a matrixed glass ceramic material. This configuration
has the benefit of supporting higher current ratings in a smaller
package size, and providing better arc suppression characteristics
with less chance of a package breach exposing the surrounding
environment to arcing fuse material when the fuse opens.
Multi-layer Design Overview
The multi-layer design of Raychem's SFF fuse family allows fuse
elements to be stacked in parallel within a single device. The
elements are embedded within the fuse body and surrounded
on all sides by absorption material. Figure 1 compares the multi-layer
design of Raychem's SFF fuses with typical single layer, glass
coated designs.
Figure 1. Multi-layer chip fuse vs single layer glass coated fuse
-1-
Glass/Ceramic
Substrate
Multiple Fuse
Elements
Substrate
Material
Single Fuse
Element
Glass
Coating
Multi-layer Design Single-layer Glass Coated Design
The paralleled fuse elements provide very similar opening
characteristics to single layer devices. Resistance imbalances
between the elements are very small. Any difference in resistance
will automatically be compensated by higher or lower current
flow in the elements. Because the fuse elements are in parallel,
their voltage drop must be the same. As a result, the higher
resistance fuse element will carry proportionally less current. This,
and the close physical proximity of the fuse elements within the
construction, maintains a very consistent temperature on both
elements. Therefore, premature opening of the fuse due to current
imbalance between the fuse elements does not occur. When the
fuse does open, one element will always open before the other.
The small difference in time between the opening of each fuse
element has no impact on the effectiveness of the fuse.
Additionally, the absorption characteristics of the matrixed glass ceramic
surrounding each element results in a very clean opening characteristic
as presented below. The matrixed glass ceramic material of the
fuse body contributes significantly to the fuse performance. This
material very efficiently absorbs the vaporizing fuse material
when the fuse opens. The multi-layer design surrounds each
fuse element with the matrixed glass ceramic material providing
a larger volume of absorption material to the vaporizing fuse
element. The benefit of this combination of material and multiple
layers is excellent absorption and arc suppression characteristics.
- 2 -
Arc Containment
Another advantage of the multi-layer design is that the fuse
elements are deeply buried within the fuse body. This reduces the
chance that a high energy open will rupture the fuse surface and
expose a high energy arc to the surrounding area, possibly even
emitting molten metal. Figure 4 displays the exterior of Raychem
s multi-layer fuse compared to glass coated designs after the fuse
has blown.
Figure 4. Post blow views of Raychems multi-layer fuse vs
glass coated designs
No Visible Failure
or Breach
Fuse Element Failure Zones
Multi-layer Design Glass Coated Designs
Higher Current Ratings
In 0402(1005mm), 0603(1608mm) and 1206(3216mm) package
sizes Raychems SFF fuses have some of the highest current
levels commercially available today. The multi-layer design makes
this possible. The ability to stack fuse elements in parallel allows
greater current handling capacity within a given package size.
Enhanced Arc Suppression Characteristics
The multi-layer design has the benefit of exposing more fuse
element surface area to the glass-ceramic absorption material.
When the fuse elements open, there is more material for the
vaporizing fuse metals to absorb into, resulting in a very efficient
and effective quenching of the fuse arc.
Figure 1 compared the multi-layer design of Raychems SFF fuses
with standard glass coated designs. The glass coated designs rely
on the coating on only one side of the fuse element to absorb the
vaporizing fuse material when it opens. Therefore, there is much
less absorption material available to absorb the fuse metals. The
result can be prolonged arcing and possible coating breach.
Figure 2 shows how the absorption characteristics of the two
designs differ. The multi-layer design indicates a clean separation
with the fuse element evenly diffusing into the surrounding
ceramic substrate. In the glass coated design, theelement diffusion
takes place in a small portion of the device and is only absorbed
by the glass material directly above the area of failure.
Figure 2. Blown element comparison between multi-layer
and glass coated devices
Single-layer Glass Coated Design
Fault Zones
Multi-layer Design
The difference in the arc quenching performance can also be
observed in the electrical signal characteristic at the time the fuse
opens. Figure 3 presents opening characteristics of both designs
at close to maximum ratings. The noisy tail displayed on the single-
layer glass coated device indicates a sustained arc that slows the
circuit disconnect in the presence of a fault. In this example, the
arc is sustained for approximately 12ms, longer than the time it
takes the fuse to begin opening under the fault current. The multi-
layer design shows a very clean open characteristic indicating very
efficient arc suppression.
Figure 3. Electrical characteristic of multi-layer and glass
coated designs at failure
Single-layer Glass Coated Design Multi-layer Design
Selecting Raychem Surface Mount Chip Fuses
Fuse selection seems straightforward in that you pick one which
has a current rating just a bit higher than your worstcase system
operating current. Unfortunately, its not that simple. There are
derating considerations for operating current and application
temperature. Turn-on and other system operati ons (l i ke
processor speed changes or motor start up) cause current surges
or spikes that also require consideration when selecting a fuse.
So selecting the right fuse for your application is not as simple
as knowing the nominal current drawn by the system. However, by
following the guideline presented in this paper, selecting the proper
fuse does become a straightforward process.
- 3 -
Fuse Selection Flowchart
The basic considerations for fuse selection are shown in the
flowchart presented in Figure 1. Following this flow chart will help
you select a fuse best suited for your application conditions.
Figure 1. Fuse Selection Flowchart
Temperature Derating
A fuse is a temperature sensitive device. Therefore, operating
temperature will have an effect on fuse performance and lifetime.
Operating temperature should be taken into consideration when
selecting the fuse current rating. The Thermal Derating Curve
for Raychem surface mount chip fuses is presented in Figure 2.
Use it to determine the derating percentage based on operating
temperature and apply it to the derated system current.
Apply Temperature Derating
The minimum fuse current rating is determined by the following
formula:
Ifuse (Isys/0.75)/Ktemp
Where:
Ktemp is the % derating determined from the Thermal Derating
Curve in Figure 2
Figure 2. Thermal Derating Curve
If there are no pulse currents present in the application, then
the fuse current rating may be selected. Finally, only the voltage
rating must be reviewed for final fuse part number selection.
Example 1Select a fuse for a system that draws 1.0 amp
steady state during normal operation and operates at ambient
temperatures up to 70C. I gnori ng for now the vol tage
requirement, what is the minimum required current rating for the
fuse in this application?
Ifuse (Isys/0.75)/Ktemp
Where:
Isys = 1.0A
Ktemp = 88% (determined from Figure 2)
Ifuse (1.0A/0.75)/0.88
Ifuse 1.52A
So a fuse with a current rating above 1.52A should be selected.
Application Current
Fuses require derating for both steady state and transient state
conditions. The final current rating for the fuse used in any
application will be a combination of both of these effects. It is
easiest to analyze the derating requirements separately for the
two conditions. Some applications may not require consideration
of transient currents.
Steady State Derating
It is recommended that Raychem surface mount chip fuses not
be operated at steady state currents greater than 75% of the
nominal 25C current rating.
Apply Standard Derating (75%)
Ifuse Isys/0.75
Where:
Ifuse is the rated data sheet current at 25C
Isys is the nominal steady state system current
Transient State or Pulse Derating
The term Pulse is used to describe any type of transient current
that may be applied to the fuse. Common examples of pulses are
inrush currents observed at system turn-on, motor start-up currents
and more extended duration peak currents observed during high
speed processing activity in computing systems.
These pulses have an effect on the fuse element because the
transient heating they induce causes thermal cycling within the
device. Over a large number of pulses, this can affect the life of
the fuse. Therefore, the pulse energy and the number of times
the fuse may be subjected to the pulse must be considered when
selecting the proper fuse for the application.
- 4 -
The I
2
t parameter provides a measure of the fuses ability to
withstand the energy of a pulse. By determining the I
2
t energy of
the pulse, it can be compared to the fuses I
2
t curve to determine
what the rated current of the fuse must be to help ensure reliable
operation of the fuse.
Determine Pulse Waveform
Calculating Pulse I
2
tThe energy contained in a current pulse
depends on the pulse waveforms shape, peak current and
duration. The basic formula for I
2
t is:
I
2
t = o
t
[A (t)]
2
dt
Figure 3 presents the most common current waveforms and
simplified equations for their I
2
t. In most systems, current
waveforms could be approximated as either one of those on
Figure 3 or their sequence. In case of such a sequence the
resulting I
2
t is the sum of I
2
t of those individual waveforms.
Figure 3. Waveform I
2
t Formulas
Determine Pulse Waveform
Once the I
2
t value for the application waveform has been
determined, it must be derated based on the number of cycles
expected over the system lifetime. Since the stress induced
by the current pulse is mechanical in nature, the number of
times the stress is applied has significant bearing on how much
derating must be applied to the fuse rating. Figure 4 presents
the current pulse derating curve for Raychem surface mount chip
fuses up to 100,000 cycles.
Pulse Temperature Derating
Once the pul se cycl e derati ng has been appl i ed to the
calculated I
2
t value, derating for operating temperature should
be applied according to the thermal derating curve shown in
Figure 2.
Allowance for Circuit Variation
Apply an additional 30% safety margin to tolerate the variances
introduced by other components in the circuit.
The derated I
2
t value can then be used to determine the rated
fuse current. This is done by referring to the minimal fuse I
2
t vs
clear time curves. The best way to explain how this is done is
through an example.
Example 2Select a 0603 size fuse that can handle a 1.0A
steady state system current, is subjected to a capacitor charging
turn-on pulse, peaks at 6 amps and lasts .005sec. The system
runs at 24VDC, expects to see 100,000 cycles over its lifetime and
normally operates at 70C.
Step 1Apply the 75% steady state derating and the 88%
thermal derating at 70C as determined in Example 1.
Ifuse (Isys/0.75)/Ktemp
Where:
Isys = 1.0A
Ktemp = 88% (determined from Figure 2)
Ifuse (1.0A/0.75)/0.88
Ifuse 1.52A
This is the minimum current rating the fuse must have to
properly protect the system under steady state conditions only.
Reviewing the datasheet indicates the 0603SFF200F/32 is the
recommended device. (See tables in Appendix E.)
Step 2Determine which pulse waveform in Figure 3 most
cl osel y represents the appl i cati on and cal cul ate the
waveforms I
2
t value.
Since a capacitor must be charged every time the system is
powered, the fuse will be subjected to a current pulse most like
that of waveform #4 in Figure 3. Using the associated formula,
the I
2
t value is calculated as:
I
2
tpulse = (1/2)(6A)
2
x 0.005sec
I
2
tpulse = 0.09 A
2
sec
Figure 4. Raychem Surface Mount Chip Fuse Pulse Derating
Curve
- 5 -
Step 3Apply Pulse Cycle DeratingDerate the I2t value based
on the number of cycles required by the application.
At 100,000 pulses, Figure 4 indicates a 40% derating of the I
2
t
value is required.
I
2
tdpulse = 0.09/0.4 A
2
sec
I
2
tdpulse = 0.225 A
2
sec
Where: I
2
tdpulse is the derated value for pulse waveforms.
Step 4Apply Pulse Temperature DeratingDerate the I
2
t value
based on system operating temperature. In this example apply
88% thermal derating at 70C from Figure 2.
I
2
tdpulse = 0.225/0.88 A
2
sec
I
2
tdpulse = 0.256 A
2
sec
Step 5Apply Derating for Variance in the CircuitApply 30%
safety margin (divide by 0.7) for variance introduced by other
components in the application.
I
2
tdpulse = 0.256/0.7 A
2
sec
I
2
tdpulse = 0.365 A
2
sec
Step 6Select Fuse Current Rating for Pulse Environment
Determine which fuse has an I
2
t rating greater than I
2
tdpulse at
.005sec. The minimum I
2
t versus clear time can be found in
Figure 5 for Fast Acting Fuses and Figure 6 for Slow Blow Fuses.
(Larger charts are available in Appendices A and C).
Using Figure 5, the Fast Acting 0603SFF Family Minimum I
2
t vs
Clear Time curves, it can be determined that Curve H has an I
2
t
value greater than 0.365 A
2
sec at .005sec. This means that a 3.5A
fuse, part number 0603SFF350F/32, would meet the pulse and
cycle derating requirements for this application example. Refer to
Appendix E for part number selection.
Using the Slow Blow 0603SFS Family Minimum I
2
t vs Clear Time
Curves in Figure 6, it can be determined that Curve C has an I
2
t
value greater than 0.365 A
2
sec at .005sec. This means that a
2.0A fuse, 0603SFS200F/32, will meet this application example
requirement. Refer to Appendix E for part number selection.
Step 7Select Fuse Current RatingCompare the steady state
current requirement from Step 1 to the current requirement for
the pulse environment in Step 6 and determine which value is
higher. The higher value will define the final fuse current rating.
In this case for the steady state condition, a 2.0A Fast Acting Fuse
from the 0603SFF Family is recommended. However, applying
the pulse condition, a 3.5A Fast Acting Fuse from the 0603SFF
Family or a 2.0A Slow Blow Fuse from the 0603SFS Family could
be used. The 3.5A Fast Acting Fuse has a higher current rating
than the 2.0A Fast Acting Fuse; therefore, the 2.0A Fast Acting
Fuse can be eliminated as an option for this application example.
Now, the choice is between the 3.5A Fast Acting Fuse and the 2.0A
Slow Blow Fuse. Fast Acting Fuses open very quickly in response
to an overcurrent condition and transient current spikes not part of
their normal operation. Slow Blow Fuses have a delayed opening
sustained in overcurrent conditions or expected pulsed currents.
Since this is an application where the fuse will be subjected to a
current pulse, a Slow Blow Fuse is a better choice.
Step 8Check Voltage RatingThe system voltage is 24V.
The 0603SFF350F/32 and 0603SFS200F/32 are rated for
use at 32VDC. They both meet the voltage requirements.
NOTE: The fuse selection method presented in this paper is intended as a guideline to
determine the fuse most suitable for an application. We recommend testing the fuse
in the actual application with the worst case scenario to confirm suitable performance.
We also recommend verifying fuse clearing time to ensure that the right fuse is
selected to provide the protection needed for the circuit and complies with required
regulatory and safety standards. Visit our website at www.circuitprotection.com for the
most up to date information.
Figure 5. 0603SFF (Fast Actiing) Family Minimum I2t vs Clear
Time Curves
Figure 6. 0603SFS (Slow Blow) Family Minimum I2t vs Clear
Time Curves
* Please note clear time curves are minimum threshold, not typical.
- 6 -
Appendix A
- T -
Appendix B
- 8 -
Appendix C
- 9 -
Appendix D
- 1u -
Appendix E
Typical Electrical
Characteristics
Max
Interrupt Ratings
0603SFF (1608mm) Fast Acting
Surface Mount Chip Fuses
0603SFF050F/32
0603SFF075F/32
0603SFF100F/32
0603SFF150F/32
0603SFF200F/32
0603SFF250F/32
0603SFF300F/32
0603SFF350F/32
0603SFF400F/32
0603SFF500F/32
0603SFF600F/24
0.50
0.75
1.00
1.50
2.00
2.50
3.00
3.50
4.00
5.00
6.00
0.485
0.254
0.131
0.059
0.044
0.032
0.025
0.024
0.018
0.013
0.010
32
32
32
32
32
32
32
32
32
32
24
50
50
50
35
35
35
35
35
35
35
35
* Measured at 10% of rated current and 25C
Shape and Dimensions
Inch (mm)
Recommended Pad Layout
Inch (mm)
Typical Electrical
Characteristics
Max
Interrupt Ratings
0603SFS (1608mm) Slow Blow
Surface Mount Chip Fuses
0603SFS100F/32
0603SFS150F/32
0603SFS200F/32
0603SFS250F/32
0603SFS300F/32
0603SFS350F/32
0603SFS400F/32
0603SFS450F/32
0603SFS500F/32
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.200
0.100
0.052
0.041
0.031
0.021
0.017
0.015
0.013
0.09
0.18
0.82
0.63
0.87
1.20
2.30
2.70
3.20
32
32
32
32
32
32
32
32
32
* Measured at 10% of rated current and 25C
Melting I
2
t at 0.001 sec clear time
Shape and Dimensions
Inch (mm)
Recommended Pad Layout
Inch (mm)
Part
Number
Nominal
I
2
t
(A
2
sec)
Voltage
(V
DC
)
Current
(A)
NOTE: Additional sizes and current ratings are available. Go to www.circuitprotection.com or refer to the latest catalog.
40
40
40
40
40
40
40
40
40
Rated
Current
(A)
Nominal
Cold DCR
()*
Raychem Circuit Protection Products
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Part
Number
Rated
Current
(A)
Nominal
Cold DCR
()*
Voltage
(V
DC
)
Current
(A)