Toshiba Electronics announces DPAK+ MOSFETs for automotive applications New MOSFET technology delivers improved performance and

reliability in pin-to-pin compatible packaging

Dsseldorf, Germany, 28th June, 2011 Toshiba Electronics Europe (TEE) has announced a new range of rugged automotive power MOSFETs that combines the companys latest trench MOS process with its enhanced DPAK+ package technology. The new MOSFETs will significantly improve application performance while reducing PCB real estate and noise in a range of automotive applications including switching regulators, DC-DC converters and motor drives. Toshibas new automotive MOSFET line-up comprises 11 n-channel devices offering a choice of maximum voltage ratings of 40V, 60V and 100V, and 10 p-channel parts with maximum voltage ratings of -40V and -60V. Current ratings range from 8A to 80A depending on the device chosen. All of the MOSFETs are designed to operate in automotive environments with channel temperatures of up to 175C. The DPAK+ package has the same form factor as and is pin-to-pin compatible with a conventional DPAK package. However, a proprietary internal design reduces on resistance and thermal losses and ensures improved efficiency, current handling and reliability when compared with conventional DPAK alternatives. Based on Toshibas proven WARP technology, DPAK+ replaces conventional internal aluminium bondwires between the MOSFET die and the package leads with wider copper clamps. The clamping mechanism maintains a highly reliable mechanical connection

capable of withstanding repeated power cycling as well as exposure to shock and vibration. In addition, the larger cross-sectional area, combined with higher electrical connectivity, minimises I2R heating due to package losses and reduces package inductance. This, in turn, contributes to heat reduction, lower noise and faster device operation. MOSFETs in the new DPAK+ automotive family have low leakage currents and ultra-low on resistances as low as 2.4m (typical, VGS = 10V). Typical thermal resistance between channel and case is only 1.5/W, while power dissipation at 25C is just 100W. ###
About Toshiba Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the worlds largest semiconductor vendors. TEE offers one of the industry's broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs, ASSPs and display products for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions. TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Dsseldorf, Germany, with subsidiaries in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Takashi Nagasawa. Toshiba Corporation is a world leader and innovator in pioneering high technology, a diversified manufacturer and marketer of advanced electronic and electrical products spanning digital consumer products; electronic devices and components; power systems, including nuclear energy; industrial and social infrastructure systems; and home appliances. Founded in 1875, Toshiba today operates a global network of more than 730 companies, with 204,000 employees worldwide and annual sales surpassing US$75 billion. For more company information visit Toshiba's web site at www.toshiba-components.com Contact details for publication: Toshiba Electronics Europe, Hansaallee 181, D-40549 Dsseldorf, Germany Tel: +49 (0) 211 5296 0 Fax: +49 (0) 211 5296 792197 Web: http://www.toshiba-components.com/pressoffice/index.asp E-mail: memory-ic@toshiba-components.com Contact details for editorial enquiries: Henning Rausch, Toshiba Electronics Europe Tel: +49 (211) 5296 117 E-mail: HRausch@tee.toshiba.de Issued by: Simon Flatt/Andrew Town, Pinnacle Marketing Communications Ltd, Prosperity House, Dawlish Drive, Pinner, Middlesex, HA5 5LN, UK Tel: +44 (0) 20 8869 9229/+44 (0) 20 8429 6546 Fax: +44 (0) 20 8868 4373. Web: www.pinnacle-marketing.com E-mail: simon@pinnaclemarcom.com or andrew@pinnaclemarcom.com June 2011 Ref. 6122/A