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ID 3.5 A 3.5 A
TYPICAL RDS(on) = 4 EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED VERY LOW INTRINSIC CAPACITANCES GATE CHARGE MINIMIZED
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DESCRIPTION Using the latest high voltage MESH OVERLAY process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Companys proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics. APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING s SWITCH MODE POWER SUPPLIES (SMPS) s DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVE
s
TO-220
TO-220FP
Value STP4NB90 STP4NB90FP 900 900 30 3.5 2.2 14 100 0.8 4.5 -65 to 150 150 3.5(**) 1.26(*) 14 35 0.28 4.5 2000
Unit V V V A A A W W/ o C V/ns V
o o
C C
(1) ISD 3.5 A, di/dt 200 A/s, VDD V(BR)DSS, Tj TJMAX (**) Limited only TJMAX
October 1998
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STP3NB90/FP
THERMAL DATA
TO-220 R thj-case R thj-amb R thc-sink Tl Thermal Resistance Junction-case Max 1.25 62.5 0.5 300 TO220-FP 3.57
o o o
Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose
AVALANCHE CHARACTERISTICS
Symbol IAR E AS Parameter Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T j max) Single Pulse Avalanche Energy (starting T j = 25 o C, I D = I AR , V DD = 50 V) Max Value 3.5 233 Unit A mJ
Zero Gate Voltage V DS = Max Rating Drain Current (V GS = 0) V DS = Max Rating Gate-body Leakage Current (V DS = 0) V GS = 30 V
T c = 125 o C
ON ()
Symbol V GS(th) R DS(on) I D(on) Parameter Gate Threshold Voltage Static Drain-source On Resistance V DS = V GS V GS = 10V Test Conditions I D = 250 A I D = 1.7 A 3.5 Min. 3 Typ. 4 4 Max. 5 4.2 Unit V A
DYNAMIC
Symbol g fs () C iss C oss C rss Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions V DS > I D(on) x R DS(on)max V DS = 25 V f = 1 MHz I D = 1.7 A V GS = 0 Min. 1.6 700 90 7 Typ. Max. Unit S pF pF pF
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STP3NB90/FP
ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON
Symbol t d(on) tr Qg Q gs Q gd Parameter Turn-on Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Conditions V DD = 450 V R G = 4.7 V DD = 720 V ID = 1.7 A VGS = 10 V ID = 3.5 A V GS = 10 V Min. Typ. TBD Max. Unit ns ns nC nC nC
21 8 9
SWITCHING OFF
Symbol tr(Voff) tf tc Parameter Off-voltage Rise Time Fall Time Cross-over Time Test Conditions V DD = 720V I D = 3.5 A R G = 4.7 V GS = 10 V Min. Typ. TBD Max. Unit ns ns ns
() Pulsed: Pulse duration = 300 s, duty cycle 1.5 % () Pulse width limited by safe operating area
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STP3NB90/FP
D1
L2
F1
G1
Dia. L5 L7 L6 L4
P011C
L9
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F2
H2
STP3NB90/FP
L3 L6 L7
F1
G1
E F2
1 2 3 L2 L4
G
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STP3NB90/FP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 1998 STMicroelectronics Printed in Italy All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. http://www.st.com .
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