Toshiba launches 19nm process NAND flash memory The worlds finest process yields single chips with

a 64 gigabit capacity
Dsseldorf, Germany, 26th April 2011 Toshiba Electronics Europe, reinforcing its leadership in the development and fabrication of cutting-edge, high density NAND flash memories, today announced that it has fabricated NAND flash memories with 19nm*1 process technology, the finest level yet achieved. This latest technology advance has already been applied to 2-bit-per-cell 64-gigabit (Gb) chips that are the world's smallest and offer the highest density on a single chip (8 gigabytes (GB))*2. Toshiba will also add 3-bitper-cell products fabricated with the 19nm process technology to its product line-up. Samples of 2-bit-per-cell 64-gigabit will be available from the end of this month with mass production scheduled for the third quarter of the year (July to September 2011). Toshiba leads the industry in fabricating high density, small die size NAND flash memory chips. Application of the 19nm generation process technology will further shrink chip size, allowing Toshiba to assemble sixteen 64Gbit NAND flash memory chips in one package and to deliver 128GB devices for application in smartphones and tablet PCs. The 19nm process products are also equipped with Toggle DDR2.0, which enhances data transfer speed. As the market for mobile equipment, such as smartphones, tablet PCs, and SSDs (solid state drives) expands, demand for smaller, higher density memory products grows. By accelerating process migration in NAND flash memory, Toshiba aims to reinforce and extend its leadership in the NAND flash memory market. Note: *1 nm = nanometer (1 billionth of a meter) *2 Source: Toshiba Corporation, April 2011

About Toshiba Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the worlds largest semiconductor vendors. TEE offers one of the industry's broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs, ASSPs and display products for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions. TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Dsseldorf, Germany, with subsidiaries in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Hitoshi Otsuka. Toshiba Corporation is a world leader and innovator in pioneering high technology, a diversified manufacturer and marketer of advanced electronic and electrical products spanning digital consumer products; electronic devices and components; power systems, including nuclear energy; industrial and social infrastructure systems; and home appliances. Founded in 1875, Toshiba today operates a global network of more than 730 companies, with 204,000 employees worldwide and annual sales surpassing US$75 billion. For more company information visit Toshiba's web site at www.toshiba-components.com Contact details for publication: Toshiba Electronics Europe, Hansaallee 181, D-40549 Dsseldorf, Germany Tel: +49 (0) 211 5296 0 Fax: +49 (0) 211 5296 792197 Web: http://www.toshiba-components.com/pressoffice/index.asp E-mail: MAC/IC: mac-ic@toshiba-components.com Contact details for editorial enquiries: Henning Rausch, Toshiba Electronics Europe Tel: +49 (211) 5296 117 E-mail: HRausch@tee.toshiba.de Issued by: Simon Flatt/Andrew Town, Pinnacle Marketing Communications Ltd, Prosperity House, Dawlish Drive, Pinner, Middlesex, HA5 5LN, UK Tel: +44 (0) 20 8869 9229/+44 (0) 20 8429 6546 Fax: +44 (0) 20 8868 4373. Web: www.pinnacle-marketing.com E-mail: simon@pinnaclemarcom.com or andrew@pinnaclemarcom.com April 2011 Ref. 6110/A