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SIX SIGMA BLACKBELT PROJECT

Reduction of Blo Holes defect

Team Leader: Ernest Manuel
Member: Fernando Arce Noel Castillo Eric Garalde Jhonny Ledesma Annaliza Kalaw Lexter Roxas Quinee Laco

Champion: Eduardo Bagadiong Josephine Tablada

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DEFINE PHASE
Project Charter Project Background Metric Chart Baseline Data Savings Computation

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 PROJECT CHARTER
Project Title: Reduction of Blo Holes defect in PICO fuses Problem Statement
On the current PICO fuse process , several inspector were being utilized to sort out cosmetic defect induced during coating process with blo holes as the top contributor. Reducing blo holes will result to reduction of inspection process.

Business Case
This project adheres to the core values and beliefs for continuous improvement through Lean Six Sigma strategies by elimination of non value added process and reducing scrap cost by 50% .

Goal Statement
To reduce blo holes defect from 1.6% to 0.8% July 2008 .

Scope and Limitations

PICO Fast Acting,250V and Slo blo products.Team will study, investigate and perform experiment. Team can implement any decisions based on good data after discussion with MRB.

Financial Benefit
Annual savings of $114,000.

Stakeholders
Littelfuse Philippines Inc Associates

Team Leader Members

Ernesto Manuel

Time Line
Start Define and Measure Analyze and Improve Control Completion
Feb 2008 Feb 20,2008 March 20,2008 March 21,2007 June 21,2008 July 22, 2008 - Sept 2008 Oct 2008
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Fernando Arce , Noel Castillo , Jessie Dela Pena, Ruel A. , Quennie Laco .

Champion

Eduardo Bagadiong

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PICO LEAN INITIATIVE PROJECT BACKGROUND

2004 PICO Layout

Current state

Identify waste

Continuous Incremental Improvement

Measure & Adjust

Future state

Implement
2004 PICO PRODUCTION AREA (24,010 sq ft) CYCLE TIME: 27 HOURS / FEET TRAVELLED: 525 FT

The Lean Process

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PICO Lean Initiatives

2004 PICO Layout 2007 PICO Layout LEAN BENEFITS
Able to accommodate new product on same floor area (TR/TE and Thinfilm and Distribution center) Leadtime is down from 8 weeks to 3 weeks Process yield is up from 82% to 93% Quality also improved , our DPPM was down from 332 ( 2004 ) to 10 ( 2007 ) Work in process was reduced by 500%

Feet traveled = 525 ft Hours = 27 hours

Feet traveled = 148 ft Hours = 3.5 hours

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PICO PROCESS FLOW

VISUAL INSPECTION LASER MARKING EPOXY COATING ASSEMBLY PROCESS

MULTIMAG FA JI 100% RES. TEST PAPER AND LABELING TO TAPE

PREMELT

VISUAL INS.

WHEELCOATER (COATING/ LASER MARKING/100% RESISTANCE )

ASSEMBLY

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PURSUIT OF PERFECTION !!!

2009 CURRENT LAYOUT Sources of Muda

1 Sorter associate ( INSPECT fuses while on rolling on belt) - done 1 Reeler associate ( INSPECT cross fuses while on conveyor) 2 VI associate (INSPECT fuse on tape) Paper to tape ( TRANSFER fuse to paper tape for final packaging / 100% resistance TESTING)

127 ft

2 JI associate ,

re-INSPECT fuse
prior Final Audit

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 BACKGROUND BACKGROUND
Visual Defect Breakdown

Team will focus on reduction of Blo defect on this project.

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 BACKGROUND BACKGROUND
Scrap Reduction cost savings:

Monthly Projected Output: Baseline Data Target Projected monthly Saved Qty Unit Cost Monthly Savings

20,000,000 97.30% 98.30% 200,000 $0.025 $5,000.00

Annual savings
Labor cost savings:

$60,000.00

Inspection cost: 3000 / year for 1 associate Target number of inspection process to be remove: 3 associates / line ( a total of 6 lines ) = $ 54000

Total annual cost savings : $ 114000

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 BACKGROUND

MEASURE PHASE
Operational Definition Detailed Process Map Attribute Agreement Analysis Baseline Metrics and Sigma Level

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 Process Flow Chart

Premelt Premelt Multimag Multimag Wheelcoating Wheelcoating Visual Visual Inspection Inspection Color Band Color Band Radial Radial Tegam Tegam JI Inspection JI Inspection

Process Mapping
KPIV KPIV
Caps & Lead Solder Lead Caps & Lead CLI Track/ Harmonica Top / Bottom Tray Heat Set-up Glassing Pin Tray Turning Temperature Coating wheel Bend Fuse MM Fall Apart Fuse Bare Fuse Coating Rejects Damage Lead Good Fuse VI Escapee Rejects Good Fuse Damaged Lead VI Escapee Rejects Good Fuse Damaged Lead

TYPE TYPE

Process Process

KPOV KPOV
Quality of Caps & lead D-M-A-I-C Solder Weight/ No Melt / Empty Bend/ Exposed Copper

Premelt

Multimag (CLI)

Bended/Damaged Lead Broken Glass Flyaway Empty/ Double Unseated

C C C C

Wheelcoating VI

Coating Rejects Blo Holes Fallout Resistance defect VI Escapee Rejects Good Fuse VI Escapee Rejects Good Fuse Damaged Lead VI Escapee Rejects Good Fuse Damaged Lead
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Radial

Tegam

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 BACKGROUND
MEASURE PHASE
DEFECT DEFINITION

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 BACKGROUND
MEASURE PHASE
Attribute Agreement Analysis (3 inspectors using 25 Good / 25 Reject w/ 3 trial each )
AssessmentAgreement AssessmentAgreement

1ST Run Date: March 10, 2008

AppraiservsSt andard
95.0% CI Percent

Validation Run: Date: March 24, 2008

AppraiservsStandard
95.0% CI Percent

WithinAppraisers
80 75 70 Percent Percent 65 60 55 50 45 Hazel Qunnie Appraiser Tina 80 75 70

WithinAppraisers
95.0% CI Percent

95 90 85 Percent 80 75 70 65

95 90 85 Percent 80 75 70 65

95.0% CI Percent

65 60 55 50 45 Hazel Qunnie Appraiser Tina

Hazel

Qunnie Appraiser

Tina

Hazel

Qunnie Appraiser

Tina

All Appraisers vs Standard Assessment Agreement # Inspected # Matched Percent 50 16 95 % CI

All Appraisers vs Standard Assessment Agreement # Inspected # Matched Percent 50 32 95 % CI

32.00 (19.52, 46.70)

64.00 (49.19, 77.08)

# Matched: All appraisers' assessments agree with the known standard. Fleiss' Kappa Statistics Response A R Kappa SE Kappa Z P(vs > 0) 0.0000 0.0000

# Matched: All appraisers' assessments agree with the known standard. Fleiss' Kappa Statistics Response A R Kappa SE Kappa Z P(vs > 0) 0.0000 0.0000

0.687838 0.0471405 14.5912 0.687838 0.0471405 14.5912

0.852435 0.0471405 18.0829 0.852435 0.0471405 18.0829

conclusion: kappa level is only 0.68 , need to conduct eyeball correlation to correct judgment of inspectors.

conclusion: kappa level improved by 25% after eyeball correlation and now above 0.7 requirement . We can now proceed with the analyze phase. .

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 BACKGROUND
MEASURE PHASE
5 why analysis on Blo Holes , Fallout and Coating defect

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 BACKGROUND
MEASURE PHASE
Prioritization of possible root cause

Y (% rate) = f(X1) + f(X2) + f(X3)

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 BACKGROUND
MEASURE PHASE

Baseline data
Sigma Performance
CURRENT
1 2 3 4 5

Number Of Units Processed Total Number Of Defects Made

(Include Defects Made And Later Fixed)

N= D= O=

60,000,000 1,702,345 1 28372

Number Of Defect Opportunities

Per Unit

Solve For Defects Per Million Opportunities Look Up Process Sigma In Abridged Sigma Conversion Table Sigma=

3.41

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 BACKGROUND

ANALYZE PHASE
Validation of factors. Using Dorian Shainin methodology:
Dont let the engineer do the guessing Let the parts do the talking

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Effect of Cap retention

7 lbs min

0.115 max

P-Value = 0.00

P-Value = 0.03

Remarks: p-value<0.05, accept Ha: proportion A proportion B Conclusion: there is Significant difference exist , lower cap retention will result blo holes defect.

Remarks: p-value<0.05, accept Ha: proportion A proportion B Conclusion: there is Significant difference exist , lower cap top to cap top dimension will result to lesser blo holes defect.

SIGNIFICANT
Negative correlation exist between cap retention and cap top to cap top. Lower cap top will result to higher cap retention value . 19

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ANALYZE PHASE
X1 :Variation on Solder Weight Validation run: Build 2 sets of samples using solder weight with an average of 0.043 grams and 0.045 grams respectively. Compare the cap retention using hypothesis test .
BoxplotofCapretention( 0 .0 4 3 gvs.0 .0 4 5 g)
14 12 10 8 6 4
1 0 .0 2

capret ention

7 .5 0 6 6 7

P-Value = 0.00
2 0.043gcapret 0.045gcapret

Remarks: p-value<0.05, accept Ha: proportion A proportion B Conclusion: there is Significant difference exist , lower solder weight will result to lower cap retention.

SIGNIFICANT
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ANALYZE PHASE
X3: improper handling of trays during assembly process Validation run: Build 2 sets of samples using tray with bend upright (mis-align fuse condition ) and trays in a good condition. Compare the cap top using hypothesis test .
BoxplotofCaptoptocaptop( Misalignvs.ALignfuse)
0.125

0.120 capt opt ocapt op

0.115

0.11386

BEND UPRIGHT

0.110

0.108903

0.105

P-Value = 0.004
caprentionmisalignfuse Cap top mis-align fuse captopalignfuse Cap top align fuse

Remarks: p-value<0.05, accept Ha: proportion A proportion B Conclusion: there is Significant difference exist , lower solder weight will result to lower cap retention. SIGNIFICANT
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ANALYZE PHASE
X5 : Not optimize wheelcoater temperature setting
-Temperature are being adjusted to optimize the diameter , length of fuse and quality of cured epoxy powder .Fuse after curing process should pass acetone test and no significant change on resistance value of the fuse.
Shift to Shift variation on wheelcoater

2.8%
3.00% 2.50% 2.00% 1.50% 1.00% 0.50% 0.00% 471 ( optr A) 473 (Optr A) 471 ( optr B)

2.0%

coating defect fallout Blo holes

CURRENT - defect increases during transition of single coating to double coating since NO define temperature setting per series (single or double coating ) . - Temperature specification is too wide

SIGNIFICANT

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 BACKGROUND

IMPROVE PHASE
Hypothesis test for solder wt evaluation DOE on wheelcoater Hypothesis test for Coating Adjuster Improvement plan on Handling of trays

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 BACKGROUND IMPROVE PHASE

Low Cpk of Solder Weight at Premelt Machine
Current: -Too many moving parts - adjustment of solder pellet length base on on set screw position - difficult to troubleshoot - Pinch wheel is adjusted by screw

Modified: -Less moving parts -adjustment of solder cut is base on digital controller integrated on servo motor - Rubber lining on both pinch wheels instead of on just one wheel - Spring loaded pinch wheels with adjustable spring load instead of pinching the solder wire thru set screw - rollers are equipped with bearings 24 P-Value = 000

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 BACKGROUND IMPROVE PHASE

Low Cpk of Solder Weight at Premelt Machine

EFFECT OF OPTIMIZE PREMELT

2.8%
3.00% 2.50% 2.00% 1.50% 1.00% 0.50%

2.1%
high resistance open fuse flyaway fallout Fallapart Blo holes

P-Value = 000
0.00% current Premelt Optimize Premelt

Using optimize premelt machine , projected reduction of defect related to solder weight is only at 0.7% . Cost of 1 machine: $3050 Total cost for 10 machines: $30500 ROI at 0.7% defect reduction: 9 months

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IMPROVE PHASE
Low Cpk of Solder Weight at Premelt Machine

Blo holes fallout, resistance and mechanical bond defect

Still OK

On current specification , defect such as blo holes , fallout and resistance are already being encountered even with just a shift of below 3 % from the nominal value Improvement plan: Shift the nominal solder weight specification by 11% , from 0.0045g to 0.0050g to compensate the variation of solder weight. This will improve the cap retention by approximately 25%.

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IMPROVE PHASE
Low Cpk of Solder Weight at Premelt Machine
Increase nominal solder weight specification from 0.045g to 0.050g ( 11% increase) to compensate variation of premelt operation.

Increase on Solder weigth evaluation

defect related to solder will be reduced from 3.5% to 2.28% will have 1.2% reduction on defect. Supporting document: PCP 08-043

low resistance

4.00% 3.00% 2.00% 1.00% 0.00%

0.0045 grams 0.0050 grams

open fuse flyaw ay coating defect fallout exposed solder Fallapart Blo holes

increasesolderwt summary

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IMPROVE PHASE
Not optimize wheelcoater temperature setting
-Temperature are being adjusted to optimize the diameter , length of fuse and quality of cured epoxy powder .Fuse after curing process should pass acetone test and no significant change on resistance value of the fuse. Note temperature should not exceed 300C (melting point of solder ) to avoid solder reflow.

CURRENT
- defect increases during transition of single coating to double coating since NO define temperature setting per series (single or double coating ) . - Temperature specification is too wide - Perform DOE :

IMPROVEMENT PLAN ( PCP 08-044)

- to define optimize set up per series to minimize variation on set up - to allow entrapped air to escaped prior curing process 28

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IMPROVE PHASE
X2 : Not optimize wheelcoater temperature setting DOE on Wheelcoater Temperature Design: 4 factors w / 2 level each

Pareto chart shows that Preheat has the most significant effect in reducing blo holes defect . Main effect graph shows that higher preheat will result to lesser blo holes.

Next step: Validate result of DOE optimize setting on larger samples.

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IMPROVE PHASE
Not optimize wheelcoater temperature setting

Validation run on DOE setting

2.50% 2.00% 1.50% 1.00% 0.50% 0.00% Exposed cap fallout exposed solder Blo holes

old setting

DOE best setting

Using DOE set up , projected reduction on wheelcoater defect is at 0.9%.

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CONTROL PHASE
Summary of Corrective / Preventive Actions and Documentations SPC and Reaction Plan Trend Chart Acknowledgement

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 BACKGROUND CONTROL PHASE

Summary of Corrective and Preventive Action

WP107PICO MultimagTurningOperation

DOandDontsof handlingtrays

solderweight drawing

F9006 WheelcoaterTemperatureSettingl

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 BACKGROUND
CONTROL PHASE
Update SPC Chart to Reflect change on Solder Weight specification from 0.0045g 5% to 0.0050 5% )

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 BACKGROUND
CONTROL PHASE
Update SPC Chart to Reflect change on Cap retention specification from 7lbs min to 10 lbs min

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 BACKGROUND
CONTROL PHASE
Generate Out of Control Reaction plan for Blo Holes and Exposed solder

BloHolesOCAP flow

Out of Control Action Plan will serve as systematic guideline for troubleshooting blo holes and exposed solder defect.

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 BACKGROUND
CONTROL PHASE

Perform eyeball correlation

Orientation on Do and Donts of Handling trays

Increase solder wt from 0.045 to 0.050g DOE on wheelcoater temperature

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 BACKGROUND
CONTROL PHASE
Intangible Benefits
Break traditional set up for PICO Wheelcoater process Application of Six Sigma Tools in doing Process Improvement. Develop TEAMWORK while ACHIEVING WORK SATISFACTION in making improvement

Tangible Benefits
$ 60,000 annual cost saving on scrap $ 54,000 annual savings on wages and fringes as a result of reduction of 10 sorter associates

Future Plans
Pursue Solder weight Cpk improvement as a greenbelt project

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 BACKGROUND

Acknowledgement

The team would like to acknowledge our associates for sharing their genuine ideas and our fellow Technician and PE for their cooperation and during the evaluation run Also for the guidance of our superiors: Ms. Zorayda Zordilla Improvement Manager Mrs. Josephine Tablada - Production Manager Sir Ed Bagadiong Plant Manager Sir Dan Onken - Operations Director

To the management for giving us a chance to be part of LF 6 sigma culture There's always room for improvement, you know--it's the biggest room in the house."-Louise Heath Leber

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