Hot Chemical Test to Determine Counterfeit Parts

In this step of the USBid Inspection Process, a plastic epoxy package is partially submerged in 200 ml of o Dynasolve 750 heated to 100 C for 45 minutes. A typical set up for this procedure should include a hooded enclosure that is properly vented as seen in the following photograph.

Figure 1: Typical HCT Setup

Figure 2: Close up of Partially Submerged Device

Once the device is removed from the bath, it is examined for evidence of changes to the surface texture between the submerged and unexposed portions of the component. Typically, a device that has been resurfaced will exhibit some combination of discoloration, sanding marks, and surface texture differential between the two portions of the chip. Any plastic epoxy package that is altered by the HCT bath should

be considered nonconforming and subject to further evaluation as it is may be resurfaced and suspect counterfeit by definition as seen in the following photograph.

Figure 3: Device After HCT Bath

Figure 4: Device Before HCT Bath

The HCT bath (part number TE28F800B5T90) etched the reworked surface and reveals hidden markings and sand marks. It should be noted that this part passed both the 3:1 and acetone tests prior to being subjected to the HCT test.

Counterfeit Part? Discoloration alone does not conclusively demonstrate the device under test has been resurfaced. The NEC part shown below was subjected to the USBid Counterfeit Inspection Process, including microscopic surface analysis, mechanical inspection, 3:1 testing, acetone testing, a hot chemical test (HCT), and a die authenticity test among other techniques. This photo of a part number UPD7225G00 controller was taken immediately after the device was removed from the HCT bath and prior to the die authenticity test - the submerged portion shows near total bleaching.

Figure 5: NEC Device After HCT Bath

Is this part resurfaced? Some additional data and observations about this order: 1. 2. 3. 4. 5. 6. Conclusion The HCT results don't often produce the bleached package shown above which initially caused some concern. It was determined this part was not counterfeit based on analysis of the above observations. Die authenticity test showed a match of the pat number and manufacturer with the product data sheet Resurfaced product typically exhibits a single date and lot code for the entire lot - it's too much work for the counterfeiters to come up with multiple topside markings (especially 22 different ones for a single order) A smooth surface under the bleached portion of the package indicates these parts were not sanded for subsequent resurfacing The mold cavities showed no indication of being filled-in nor did the texture of the cavity resemble that of the surrounding package surface. Lot Size = 2000 22 different years of date codes ('86 - '07) were observed within the lot No scratches or abrasions visible beneath the bleached surface Mold cavities are smooth and shiny prior to the bath Vendor was on probation (Not an Approved Vendor) Die Authenticity Test revealed a NEC logo and D7225J marking on the die

Like most counterfeit analysis techniques, the HCT test does not always conclusively predict the authenticity of a given device. A thorough review of a battery of tests is required to more accurately determine whether a part is counterfeit or not.

About USBid USBid Inc., is an independent distributor of electronic components located in Palm Bay, Florida, USA. Since 1998, we have been helping customers locate and purchase hard-to-find and long lead time components. We are ISO 9001:2008 certified and ESD S20.20 compliant. USBid.com understands that sourcing parts in the "open market" is challenging. That's why we conduct 100% visual inspections and offer die authenticity analysis and functional testing to manufacturer datasheet specifications. USBid Inc., reviews customer feedback to achieve 100% customer satisfaction through continuous improvement.