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1. Introduction
Based on the ability to integrate passive functions into a LTCC multilayer, several filter designs were accomplished within a European funded IST programme [2]. The target application was a handheld device for the Tetra-standard (380 MHz 430 MHz). One of the demonstrators was a harmonic filter. Its purpose is to let the working frequencies pass and to block the 1st and further harmonics. A LC-filter with 2 poles was designed to meet the systems requirements [1].
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14th European Microelectronics and Packaging Conference, Friedrichshafen, Germany, 23-25 June 2003 is required for a 5.2 pF capacitor. Even with 6 layers, the single plate size measures 1.2 mm by 1.2 mm. The general construction is shown in Fig. 1. The integrated passives are embedded in the LTCC. Additional components are mounted on top of the substrate. A smooth surface for automated pick & place is achieved by plastic overmold. Its influence on the filter behaviour can be neclected in the frequency range considered [3]. The interconnection to the board is made by solder bumps. The bump diameters are 300 m and the pitch is 800 m. Due to the small dimensions of the filters, the thermal mismatch between the LTCC and an organic base board is not critical. Bumps not required for electrical functions are connected to ground and provide additional shielding and higher mechanical strength.
Fig. 3: 3D-view of the harmonic filter without external capacitors and overmold In order to verify the properties of the embedded elements, the full circuit was divided into two subcircuits. The cut-line was drawn in the middle of the substrate, thus dividing the two poles of the filter. Subcircuit a) consists of C1-3 and L1, sub-circuit b) comprises L2 and C4/5. These sub-circuits were implemented on the demonstrator coupon.
Fig. 1: General construction of a hybrid filter Typically, fully integrated LC filter components are produced by component suppliers like Epcos and Murata. They take advantage of their experience in handling very thin ceramic sheets. However, only mainstream markets are served due to their high volume. The general concept of hybrid filters can be applied by LTCC module manufacturers without changing of their tooling. Due to the very small size of these filters, they can be very cost competitive even in small and medium volume. Compared to an onboard solution they can be tested separately. If necessary, fine tuning of the electrical behaviour could be implemented as well.
4. Parameter Extraction
Simple two-port-circuits can be described by the classic models shown in Fig. 4. Such a device is completely characterised by the full set of S-parameters (s11...s22). In reality it is rather difficult to realise just a single series or shunt element. Due to parasitics associated to the package or interconnection, further elements are added to the schematic. The result is usually a - or T-circuit. The harmonic filter sub-circuits mentioned above comply with the -model (Fig. 4c).
z a) b) y c) y
1
z y
2
3. Harmonic Filter
The designed harmonic filter consists of three embedded passives (2 inductors and 1 capacitor) and four external 0402 capacitors (Fig. 2).
z1 d) y z2 e) ZL , l,
Fig. 4: Typical two-port circuits a) series impedance; b) shunt admittance; c) -circuit; d) T-circuit; e) transmission line For separating the individual elements, the Sparameter matrix is to be transformed into the ABCD- or chain-matrix (equ. 1).
1 + s11 s 22 AB CD = 1 s s 11 22 ( s11 s 22 s12 s 21 ) 1 + s11 + s 22 + ( s11 s 22 s12 s 21 ) 2 s 21 2s 21 + ( s11 s 22 s12 s 21 ) 1 s11 + s 22 ( s11 s 22 s12 s 21 ) 2 s 21 2s 21
Fig. 2: Harmonic filter schematic (C1, C3, C4 and C5 are SMDs) An eight-layer LTCC substrate was selected for the demonstrator, dictated by the more complex applications on the same substrate. However, only 6 ceramic layers are necessary to implement the harmonic filter (Fig. 3). The lowest two tapes are just feed-trough layers.
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14th European Microelectronics and Packaging Conference, Friedrichshafen, Germany, 23-25 June 2003
1 + zy 2 z AB CD = y + y + z ( y + y ) 1 + zy 1 2 1 2 1
-circuit T-circuit
(2) (3)
AB 1 + yz1 CD = y
z1 + z 2 + y ( z1 + z 2 ) 1 + yz 2
The elements of the ABCD-matrix can be directly used to calculate the impedances and admittances. For the -model:
z=B
y1 =
D 1 B
y2 =
A 1 B
z1 =
z2 =
A 1 C
D 1 C
Calculation results do not include second order effects (e.g. resonances). Therefore, the model is only valid up to the first self resonance frequency. The complete sub-circuit analysis is performed in the following steps: 1) 2) 3) 4) Full 2-port S-Parameter measurement De-embedding of feeding lines (if necessary) Transformation into ABCD-matrix Calculation of lumped elements based on Pi- or Tmodel 5) Generation of a basic lumped model 6) Adding of further parasitic elements (e.g. self resonance effects) 7) S-Parameter modelling and fine tuning of model 4.1 Sub-circuit analysis were measured in the
S11, S21 [dB]
Fig. 7: Calculated elements of sub-circuit a) Cp1 and Cp2 are parasitic capacitances of the embedded elements to ground. Cpl1 is the self capacitance of inductor L1 plus additional capacitances caused by the SMD land pads.
0 0 -10 -20 -30 -40 -50 -60 Frequency [GHz] S11 [dB] sim S21 [dB] sim S11 [dB] meas S21 [dB] meas 0,5 1 1,5 2 2,5 3
The sub-circuits configurations: with two SMD caps with one SMD cap
without external components Element extraction was done in the opposite sequence from simple to complex. Fig. 5 shows the depopulated sub-circuit a). Only the embedded components L1, C2 and the empty SMD land pads contribute to the circuit (Fig. 6). The corresponding model (Fig. 7) and the comparison between measured and simulated S-parameters demonstrate the validity of the model up to the 1st resonance point (Fig. 8).
Fig. 8: Comparison measured vs. calculated Sparameters of sub-circuit a) The same was repeated with C3 mounted (Fig. 9/10).
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14th European Microelectronics and Packaging Conference, Friedrichshafen, Germany, 23-25 June 2003
Fig. 10: Sub-circuit with C3 The calculated model elements (Fig. 11) reveal the impact of C3 on the self capacitance of L1 (Cpc3). Not only the land pads of C3 contribute to the additional capacitance (already included in the first model). Even with the air-gap between the SMD body and the LTCC, the high k-ceramics adds almost 1 pF. Fig. 14: Calculated elements of sub-circuit a) Capacitor C1 does not contribute to additional parasitic capacitances. The lumped element model was further improved by adding of some inductances (Fig. 15). Simulated and measured S-parameters are in good match up to 1.8 GHz (Fig. 16).
Fig. 15: Detailed model of sub-circuit a) Fig. 11: Calculated elements of sub-circuit a) with C3 The entire sub-structure a) is shown in Figs. 12 and 13.
0,00 -5,00 -10,00 -15,00 -20,00 [dB] -25,00 -30,00 -35,00 -40,00 -45,00 -50,00 S11 model S21 model S11 meas. S21 meas. 0 500 1000 1500 2000 2500 3000
Frequency [MHz]
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14th European Microelectronics and Packaging Conference, Friedrichshafen, Germany, 23-25 June 2003 Similar parameter extraction was done on sub-circuit b) and finally on the full circuit without any SMD component mounted. The latter provides also coupling information between L1 and L2 (magnetic field coupling) as well as C2 and L2 (capacitive coupling). Fig. 17/18 show the model of this circuit and the corresponding Sparameters.
0,5
1,5
2,5
S11 [dB] meas S21 [dB] meas S11 [dB] sim S21 [dB] sim Frequency [GHz]
Fig. 19: Frequency response of a 5.6pF 0402 capacitor connected as a shunt element. Fig. 17: Model of Harmonic filter without SMDs
0 0 -10 0,5 1 1,5 2 2,5 3
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S11 [dB] orig S21 [dB] orig S11 [dB] F1 S21 [dB] F1
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4.2 External Component Analysis The influence of additional SMD capacitors on the filter behaviour can not be neglected. In general, the quality factor is reduced with increasing frequency and the self inductance (mainly determined by the construction) leads to a certain self resonance frequency. This property can cause problems in applications requiring a stable capacitance over a wide frequency range. On the other hand, it may also be helpful to add further poles to the filter. One solution to cope with the undesired resonances is offered by face-down chip capacitors [4]. However, the line inductance caused by the substrate itself must be addressed in the design. Fig. 19 shows measured and simulated Sparameters for a 5.6 pF capacitor. The quality factor at the resonance frequency was about 40.
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-40
-50
Fig. 20: Comparison of S-parameters prior and after component optimisation One concern was the repeatability of these filters in manufacturing. There are three major contributors for filter distortion: material tolerances (tape thickness, r) manufacturing tolerances (line width, stacking alignment)
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14th European Microelectronics and Packaging Conference, Friedrichshafen, Germany, 23-25 June 2003 component tolerances Since all filters were processed with one manufacturing lot, the material is identical for all. The material vendor offers a tape thickness lot-to-lot variation of less than 7 % [5]. For the quantities of interest one large tape lot could be used for the product. The thickness tolerances within one manufacturing lot are very small. Manufacturing tolerances can be monitored on different laminates within one production lot. Three filters from three different substrates or laminates were evaluated (Fig. 21). They reveal a very close fit over the frequency range of interest. Component tolerances are specified by the vendor. Their impact on the filter behaviour can be predicted with the lumped circuit model.
0,00 0,00
S11 [dB] F1
good cooperation in this project. The work carried out in the project Multi-Modules was funded by the EU within the programme IST under the project number 199920260.
References
[1] J. Mller, C. Guichaoua: Lumped and distributed element design for LTCC radio filters, Proceedings of the IMAPS Nordic Annual Conference 2002, September 29 October 2 2002, Stockholm/ Sweden. [2] IST-Project description: http://www.anita.eadstelecom.com/Multimodules/ [3] J. Mller: Design Considerations for Hybrid LTCC-RF-Filters, Proceedings Ceramic Interconnect Technology: The Next Generation, Denver/CO, April 7-9, 2003. [4] H. Goldberger, T. Troianello: 0.1pF 180pF, 1% Tolerance 0402 RF Capacitor Capacitance Stability from 1 MHz to Several GHz, http://www.vishay.com/docs/49111/paper_go.pdf [5] DuPont Green Tape 951 data http://www.dupont.com/mcm/product/tape.htm sheet:
0,40
0,80
1,20
1,60
S21 [dB] F1 S11 [dB] F2 S21 [dB] F2 S11 [dB] F3 S21 [dB] F3
7. Acknowledgements
The author would like to thank the colleagues from the Technical University of Ilmenau for the support in measuring the structures and Claude Guichaoua for the
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