HGR14 CM402

HGR14
1.
APPENDIX 1. RECOGNITION DEVICE

(HGR-14)
This describes the recognition device (HGR-14).
HGR14-E-PMCA-0000
HGR14-E-PMC01-A00-00 App. 1-1

HGR14
App. 1.1 Outline of Recognition Methods
1.

App. 1.1.1 Types of Recognition Methods
The recognition device provides three types of recognition methods as shown in Table 1−1
according to the reference number.
Use the appropriate one according to the recognition target.
Name Reference Features Target

1: A master image is taught beforehand, and • Components that
the deviation from the master is are not registered
recognized. in App. 1.2.2 List
Four-point block 2: A master image needs teaching of the Reference
1 1–46
matching beforehand. Numbers
3: The positional deviation (X- and • New components
Y-coordinate) and the inclination are etc.
obtained from the four-block master image.
1: A master image is taught beforehand, and • Board recognition
the deviation from the master is mark
recognized. • Placement-point
2: A master image needs teaching recognition mark
One-point block
2 47–50 beforehand.
matching
3: The positional deviation (X- and
Y-coordinate) is obtained from the
one-block master image. The inclination is
not obtained.
1: The positional deviation (X- and • Square chip
Y-coordinate) and the inclination are • Mini-mold
obtained on the basis of the characteristic transistor etc.
points on the outline.
2: A master image does not need teaching
Outline
3 51–250 beforehand.
recognition
3: A target shape is predetermined for each • Board
reference. recognition mark
4: In case of a recognition error, the factor in • Placement-point
the error can be analyzed from the code. recognition mark
etc.
Table 1−1 Recognition methods
[Features of the outline recognition]

1) Recognition is carried out on the basis of the characteristic points
(corners, pins, etc.) unique to the component shape.
The right figure shows the characteristic points unique to a square
shape (a square chip); the chip center and inclination are obtained
from the information of these four (or three) points.
2) It is possible to judge conforming components by the chip data: L
(length), W (width), P (pitch), etc.
The criteria vary with the reference. HGR14-001E
( App. 1.3 Input Data Items by Shape)
Fig. 1−1 Features of the outline recognition
App. 1-2 HGR14-E-PMC01-A01-00

HGR14
App. 1.1.2 New Component Reference Selecting Procedure

When you create the data of a new component, check whether the outline recognition method is
available ( App. 1.2.1 List of the Outline-Recognition Shapes); only when the outline
recognition method is unavailable, use the block matching method.
HGR14-002E
∗1: One type of shape has more than one reference number (Ref); however, there is no
difference in the recognition algorithm among those numbers.
Even when the dimensions are different, you can usually set the same reference number
(Ref).
HGR14-E-PMC01-A01-00 App. 1-3

HGR14
App. 1.2 Creating the Outline Recognition Data

App. 1.2.1 List of the Outline-Recognition Shapes
For the outline recognition, the reference numbers are predetermined for each shape. See the
description for each shape. The list of the outline-recognition shapes is organized as the figure
2−1 shows.
1 2 3 4
HGR14-004E
Fig. 2−1 Example of the list of the outline-recognition shapes
① Shape number
② Corresponding shape
Corresponding outside shape
③ Type (Specific component)

Components corresponding to this shape
Shows the types of the chip data library.
∗ “Type” shows a typical example. Therefore some components cannot be recognized owing to
the special shape or can be recognized as the other shape.
④ Reference number
App. 1-4 HGR14-E-PMC01-A01-00
HGR14
List of the outline-recognition shapes −1 <Square shape>

∗ Long side ÷ Short side ≤ 1.2 makes a regular square.
∗ Long side ÷ Short side ≥ 1.2 makes a rectangle.
Shape
Shape (Appearance) Type Reference number Remarks
number
Rectangle with acute Fixed resistor 51–56
corners Capacitor 88
Chip inductor 89
1a
Trimmer capacitor 157
Filter
, etc.
Rectangle with round Cylindrical resistor 59–60
corners Cylindrical capacitor
1b , etc.
Rectangle with electrodes Tantalum capacitor 57–58

etc. Coil 82
1c 151
155
Regular square with acute Fixed resistor 51–56

corners Capacitor 88
Chip inductor 89
1d
Trimmer capacitor 157
Filter
, etc.
Regular square with round Cylindrical resistor 59–60
corners Cylindrical capacitor
1e , etc.
1 Regular square with Tantalum capacitor 57–58

electrodes etc. Coil 82
1f 151
155
Square with unstraight Resistor network 131–135

sides , etc.
1g
Special shape including a Plate spring 101

quadrangle Shield
1h , etc.
Quadrangle with chipped Shield 156 Only the side-center images are
corners Transparent resin detected.
component
1i
Quadrangle with acute Shield 159 Only the corner images are detected.
corners Transparent resin
component
1j
HGR14-E-PMC01-A01-00 App. 1-5

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List of the outline-recognition shapes −2 <Mini-mold type>
Shape
number
Square with two pins S mini Di, mini Di 75–76
, etc. 82
95
2a
152
Square with three pins SS mini Di, 61–68

S mini Di, mini Di 83
SS mini Tr, 100
2b S mini Tr, mini Tr 103
, etc. 153
Square with four pins SS mini Di, 69

SS mini Tr, 104
2c
S mini Tr, mini Tr 120
, etc. 123–124
154
Square with five pins SS mini Di, 70
SS mini Tr, 105
2d
, etc. 154
Square with six pins SS mini Di, 69

SS mini Tr, 106
2e
2 , etc. 154
App. 1-6 HGR14-E-PMC01-A01-00

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List of the outline-recognition shapes −3 <Power-mini-mold type (Electric power type)>
Shape
number
Three pins on one side Mini power Tr 73–74 Only the pins located at both ends are
, etc. 87 detected.
3a
Two pins on one side N-Tr 161–165 Only the pins located at both ends are
, etc. detected.
3b
N pins on one side N-Tr 161–165 Only the pins located at both ends are
, etc. detected.
3c
HGR14-E-PMC01-A01-00 App. 1-7

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List of the outline-recognition shapes −4 <Multi-pin type (Batch recognition)>
Shape
number
Pins on one side Connector 171–190
IrDA 191–192
4a , etc. 196
Pins on two sides SOP, SON 171–190

, etc. 191–192
4b 196
Pins on three sides Not supported.
4c
Pins on four sides QFP, QFN 171–190

, etc. 191–192
4d 196
J-lead component The presence or absence of pins is

not detected.
4e
Currently not in use
Circular electrodes inside a BGA, CSP (µ BGA), LGA 201–205

quadrangle
4f
4
J-leads on two sides SOJ 166–170
4g
J-leads on four sides PLCC 166–170
4h
Solder balls arranged on Flip chip 222 Up to 8 balls can be detected.

unspecified positions 1
4i
Solder balls arranged on FC-BGA 237–238 Up to 4000 balls can be detected.

unspecified positions 2 Teaching is required for each
4j component.
Two sets of pins on two sides DIMM 193
4k
App. 1-8 HGR14-E-PMC01-A01-00

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List of the outline-recognition shapes −5 <Special type>
Shape
number
Special shape 1 Glass tube diode 77–79
, etc.
5a
Special shape 2 Coil 96–97

, etc.
5b
Special shape 3 Semi-fixed potentiometer 1–46 A square appearance can be

, etc. (Four-point block recognized with the shape number
5c match) ‘1d’ (Ref. Nos. 51 to 56).
Special shape 4 Aluminum electrolytic 71–72

capacitor
5d , etc.
Special shape 5 3Pin-FET 76

, etc.
5e
Special shape 6 FET 90–91

, etc.
5f
5
Special shape 7 Horned tantalum 92–93 Horned tantalum capacitor as shown
capacitor below cannot be recognized.
5g , etc.
Special shape 8 Shield 160

Insert connector (Outside
5h shape)
, etc.
Special shape 9 Lateral-irradiation-type 114 Such a component from which its

chip LED silhouette will not be obtained
5i , etc. correctly because light passes
through the mold package
Special shape 10 Filter 80

HIC
5j , etc.
Special shape 11 Filter 81

HIC
5k , etc.
Special shape 12 Disk 128

Solder ball
5l , etc.
HGR14-E-PMC01-A01-00 App. 1-9

HGR14
Shape
number
Special shape 13 Compound-shape 241 Such a component that has two or
component more shape characteristics
5m • Pin-jack component Teaching is required for each
• Multi-lead component component.
, etc.
App. 1-10 HGR14-E-PMC01-A01-00

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List of the outline-recognition shapes −6 <Special-purpose type>
Shape
number
Special shape 1 Board recognition mark 125, 126 125: Threshold and lamp value
Placement-point automatic setting
6a recognition mark 126: Threshold value automatic setting
, etc. Lamp value manual setting
HGR14-E-PMC01-A01-00 App. 1-11

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App. 1.2.2 List of the Reference Numbers [Outline Recognition] (V7.00)

∗ The (Reserved) reference numbers are not available.
Ref. Corresponding component Ref. Corresponding component Ref. Corresponding component

No. Shape number No. Shape number No. Shape number
Fixed resistor Refl. only: Quadrangular
51 81 5k 111 (Reserved)
Capacitor component (with corners)
52 Chip inductor 82 2a Refl. only: Mini Di (Two pins) 112 (Reserved)
Trimmer capacitor
53 1a 83 2b Refl. only: Mini Di/Tr (Three pins) 113 (Reserved)
Filter
1d
54 84 2c Refl. only: Mini Di/Tr (Four pins) 114 1j Lateral-irradiation-type chip LED
55 85 2d Refl. only: Mini Di/Tr (Five pins) 115 (Reserved)
(For 1005/0603 size only)
56 86 2e Refl. only: Mini Di/Tr (Six pins) 116 (Reserved)
57 87 3a Refl. only: Mini power Tr 117 (Reserved)
1c
Tantalum capacitor 1a
58 1f 88 Refl. only: Chip C/R 118 (Reserved)
1d
Cylindrical resistor 1a Refl. only: Chip R
59 89 119 (Reserved)
1b Cylindrical capacitor 1d (Flip-over inspection)
1e 2b–
60 90 120 Mini Di/Tr (Four/Five/Six pins)
5f FET 2e
5g Horned tantalum capacitor Mini Di/Tr (Four pins):
63 93 123 2c
Wide electrodes
Mini Di/Tr (Four pins):
64 94 (Reserved) 124 2c
Mini Di (Three pins) Wide electrodes
2b
Mini Tr (Three pins) Shape-specified board mark
65 95 2a Mesa diode 125 6a
(Automatic)
Shape-specified board mark
66 96 126 6a
5b Diamond-shaped coil (Manual)
68 98 (Reserved) 128 5l Disk component / Solder ball
2c
69 Mini Di/Tr (Four, Six pins) 99 (Reserved) 129 (Reserved)
2e
70 2d Mini Di/Tr (Five pins) 100 2b Mini Di/Tr (Three pins) 130 (Reserved)
71 Aluminum electrolytic 101 1h Plate spring, Shield 131
5d
72 capacitor 102 (Reserved) 132
73 103 2b Mini Di/Tr (Three pins) 133 1g Resistor network
3a Mini power Tr
74 104 2c Mini Di/Tr (Four pins) 134
75 105 2d Mini Di/Tr (Five pins) 135
2a Mini Di (Two pins)
76 106 2e Mini Di/Tr (Six pins) 136 (Reserved)
77 107 (Reserved) 137 (Reserved)
78 5a Glass tube diode 108 (Reserved) 138 (Reserved)
Refl. only: Quadrangular
component
80 5j 110 (Reserved) 140 (Reserved)
(without
corners)
App. 1-12 HGR14-E-PMC01-A01-00

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Ref. Corresponding component Ref. Corresponding component Ref. Corresponding component

No. Shape number No. Shape number No. Shape number
141 (Reserved) 181 221 (Reserved)
142 (Reserved) 182 222 4i Flip chip
143 (Reserved) 183 SOP 223 (Reserved)
QFP
144 (Reserved) 184 Connector 224 (Reserved)
4a
147 (Reserved) 187 4b Trans. only: QFP, SOP, Connector 227 (Reserved)
148 (Reserved) 188 4d SOP, QFP, Connector 228 (Reserved)
Detection of excessive
number of pins
150 (Reserved) 190 SOP, QFP, Connector 230 (Reserved)
1c Trans. only: Tantalum-type Di Intended for short-lead
151 191 231 (Reserved)
1f (Lateral pickup) components only
152 2a Trans. only: Mini Di (Two pins) 192 232 (Reserved)
153 2b Trans. only: Mini Di/Tr (Three pins) 193 4k Intended for DIMM sockets only 233 (Reserved)
2c– Trans. only: Mini Di/Tr
154 194 234 (Reserved)
2e (Four, Five, Six pins)
1c Trans. only: Tantalum C
155 195 235 (Reserved)
1f (Lateral pickup)
Trans. only: Quadrangular component 4a–
156 1i 196 QFN/SON/IrDA 236 (Reserved)
(without corners) 4d
1a
157 Trans. only: Chip C, R 197 (Reserved) 237
1d
4j Non-grid-array FC-BGA
1c
158 Trans. only: Tantalum C 198 (Reserved) 238
1f
Trans. only: Quadrangular
159 1j 199 (Reserved) 239 (Reserved)
component (with corners)
160 5h Two corners outside 200 (Reserved) 240 (Reserved)
161 201 241 5m Compound-shape component
162 202 242 (Reserved)
163 3b N-Tr 203 4f BGA/CSP (µ BGA) 243 (Reserved)
164 204 244 (Reserved)
165 205 245 (Reserved)
4g SOJ
168 4h PLCC 208 (Reserved) 248 (Reserved)
175 4a SOP 215 (Reserved) 255 (Reserved)
4b QFP
176 4d Connector 216 (Reserved)
177 217 (Reserved)
178 218 (Reserved)
179 219 (Reserved)
180 220 (Reserved)
HGR14-E-PMC01-A01-00 App. 1-13

HGR14
App. 1.2.3 List of the Recognition Methods by Reference (V7.00)

: Automatic selection (for the high-speed head, transmission-only nozzles or
reflection-only nozzles; for the general-purpose head, based on a size (L < 3.0 & W
< 3.0: Transmission))
: Transmission
: Reflection
− : Not supported.
Transmission : Component's silhouette image recognition against the background of the reflector
Reflection : Lead/Electrode image recognition through the use of the light reflected by the
component's underside
Ref. High-speed Multi-functional Ref. High-speed Multi-functional Ref. High-speed Multi-functional

No. head head No. head head No. head head
51 81 111
52 82 112
53 83 113
54 84 114
55 85 115
56 86 116
57 87 117
58 88 118
59 89 119
60 90 120
61 91 121
62 92 122
63 93 123
64 94 124
65 95 125
66 96 126
67 97 127 − −
68 98 128
69 99 129
70 100 130
71 101 131
72 102 132
73 103 133
74 104 134
75 105 135
76 106 136
77 107 137 − −
78 108 138
79 109 139
80 110 140
App. 1-14 HGR14-E-PMC01-A01-00

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Ref. High-speed Multi-functional Ref. High-speed Multi-functional Ref. High-speed Multi-functional

No. head head No. head head No. head head
141 181 221
142 182 222
143 183 223
144 184 224 − −
145 185 225 − −
146 186 226 − −
147 187 227
148 188 228 − −
149 189 229
150 190 230
151 191 231 −
152 192 232 −
153 193 233 −
154 194 234 −
155 195 235 −
156 196 236 −
157 197 237
158 198 238
159 199 239
160 200 240
161 201 241
162 202 242 −
163 203 243 −
164 204 244 −
165 205 245 −
166 206 246 − −
167 207 247 − −
168 208 248
169 209 249 − −
170 210 250
171 211 251 − −
172 212 252 − −
173 213 253
174 214 254
175 215 255 − −
176 216
177 217
178 218
179 219
180 220
HGR14-E-PMC01-A01-00 App. 1-15

HGR14
App.1.3 Input Data Items by Shape
1.

For the outline recognition, the reference numbers are predetermined for each shape.
( App. 1.2.1 List of the Outline-Recognition Shapes)
See the description for each shape. The description is organized as the figure 3−1 shows.
∗ Set the reference numbers and the input data correctly; otherwise, the recognition rate will be
affected and the faulty placement can occur.
1 2 3 4 5
6 7
10
HGR14-005E
Fig. 3-1 Example of the description for each shape in the outline recognition
App. 1-16 HGR14-E-PMC01-A02-00

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① Shape number
② Corresponding shape
The outside shape corresponding to this/these reference number(s)
③ Reference number
④ Corresponding component
The typical components corresponding to this/these reference number(s)
⑤ Support Ver.
Only these versions support the recognition.
⑥ Shape and input data
⑦ Recognition method and results
⑧ Criteria
The data necessary for the outline recognition, and the brief explanation of the recognition
(The shaded data-input items are not necessary; however, be sure to input “0” in them.)
⑨ Recognizable posture
The recognizable postures vary with references.
⑩ (Remarks)
Notes on the outline recognition are described. Be sure to read them.
HGR14-E-PMC01-A02-00 App. 1-17

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Shape Corresponding
Reference number Corresponding component (Type) Support Ver.
number shape
1a Rectangle with 51–56 Fixed resistor V7.00 or later
acute corners 88 Capacitor
1d Regular square 89 Chip inductor
with acute corners 157 Trimmer capacitor
Filter , etc.
Shape and input data Recognition method and results
Length L Width W
Criteria
1) Length: L−(20%), +(10% to 20%) Component is recognized through
2) Width: W−(15% to 35%), +(20%) both the corner points and the
3) Parallelism of the opposite sides: (51 to 54) ±7.5[°] straight lines.
(It can also be recognized through
(Top view) (55 to 56) ±5.0[°]
only three corner points.)
4) Orthogonality of the adjacent sides: 90±8[°]
: Detection point
5) Angle: (Rectangle) Recognition angle±60[°]
(Regular square) Recognition angle ±30[°]
: Detection center
(0603) Recognition angle ±10[°], etc.
Recognizable postures (Only the following styles of packing can be recognized. <With some exceptions>)
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. When L (length)/W (width), the chip size input values, is within 1.2, the recognition of the shape
number “1d” is automatically applied and the recognition angle tolerance becomes ±30[°]. In this
case, if a component is picked up beyond 60[°] from the style-of-packing angle, it may be placed
with it rotated by 90[°]; therefore, be careful with a pickup condition.
2. The chip size tolerance depends on the reference number and the chip size.
Reference number Corresponding component L size tolerance W size tolerance
54 The one whose width (W) and
−20%, +10% −35%, +20%
thickness (T) are close to each other
55–56 1005 size or over −20%, +10% −15%, +20%
0603 size or under −20%, +20% −15%, +20%
Other than those above 1005 size or over −20%, +10% −25%, +20%
3. To perform a flip-over check against resistors, use No. 89 (Reflection).
(Conditions) A glass-coated surface must be black and silk characters must not be written all over
the center of the component.
The nozzles whose tips are not black must be smaller than components.
4. To specify the recognition method: reflected illumination or transmitted illumination, use No. 88
(Reflection) or No. 157 (Transmission).
5. For 0603-size components with No. 55–56, recognition-result X and Y are limited for the purpose of
restricting the pickup position.
(Recognition XY limits) Component direction L: ±0.2 [mm] Component direction W: ±0.1 [mm]
App. 1-18 HGR14-E-PMC01-A02-00

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Shape Corresponding
number shape
1b Rectangle with 59–60 Cylindrical resistor V7.00 or later
round corners Cylindrical capacitor
1e Regular square , etc.
with round
corners
Length L Width W
Component is recognized through

both the corner points and the
straight lines.
Criteria
(Top view)
1) Length: L−(30%), +(20%)
2) Width: W−(30%), +(20%) : Detection point
3) Parallelism of the opposite sides: ±8[°] : Detection center

4) Pickup angle ±30[°] (Regular square)
Pickup angle ±60[°] (Rectangle), etc.
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
number “1e” is automatically applied and the recognition angle tolerance becomes ±30[°]. In this
HGR14-E-PMC01-A02-00 App. 1-19

HGR14
Shape Corresponding
number shape
1c Rectangle with 57–58 Tantalum capacitor V7.00 or later
electrodes, etc. 82 Coil
Regular square 151
1f
with electrodes, 155
etc.
Length L Width W
Criteria
1) Length: L−(20%), +(20%) the straight lines.
(Top view)
2) Width: W−(20%), +(20%)
3) Angle: (Rectangle) Recognition angle ±60[°]
: Detection point
(Regular square) Recognition angle ±30[°],
etc. : Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
number “1f” is automatically applied and the recognition angle tolerance becomes ±30[°]. In this
2. If a component’s silhouette has dropouts or noises, use No. 58.
(Dropouts) (Noises)
3. In the reflecting recognition, depending on the mold color, the area other than electrodes may
become white. In that case, use No. 82.
No.57/58 No.82
Mold: Black Mold: Other than black
4. For the components that need a lateral pickup check, use No. 151, 155.
D1
A 12%-or-more difference between D1 and D2 shows
lateral pickup.
D2
App. 1-20 HGR14-E-PMC01-A02-00

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Shape Corresponding
number shape
1g Square with 131–135 Resistor network V7.00 or later
unstraight sides , etc.

Length L Width W

the corner points.
(It can also be recognized through
Criteria only three corner points.)
(Top view)
1) Length: L−(22%), +(22%)
2) Width: W−(22%), +(22%)
: Detection point
3) Angle: (Rectangle) Recognition angle±60[°]
(Regular square) Recognition angle ±30[°] : Detection center
4) Orthogonality of the adjacent sides: 90±10[°], etc.
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. When L (length)/W (width), the chip size input values, is within 1.2, the recognition angle tolerance
becomes ±30[°] automatically. In this case, if a component is picked up beyond 60[°] from the
style-of-packing angle, it may be placed with it rotated by 90[°]; therefore, be careful with a pickup
condition.
2. When the four corners are concave, L should be set as shown in the right
figure.
3. The length of concaved side should be input as L.
HGR14-E-PMC01-A02-00 App. 1-21

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Shape Corresponding
number shape
1h Special shape 101 Plate spring V7.02 or later
including a Shield
quadrangle , etc.

Length L Width W
Criteria Component is recognized through

the straight lines.
1) Length: L−(20%), +(20%)
(Top view)
2) Width: W−(20%), +(20%)
3) Angle: (Rectangle) Recognition angle±60[°] : Detection point
(Regular square) Recognition angle ±30[°],
: Detection center
etc.
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. When L (length)/W (width), the chip size input values, is within 1.2, the recognition angle tolerance
becomes ±30[°] automatically. In this case, if a component is picked up beyond 60[°] from the
style-of-packing angle, it may be placed with it rotated by 90[°]; therefore, be careful with a pickup
condition.
2. Applicable shape
• Quadrangle with the sides including a straight line by 50% or more on each, or from each end
by 20% or more on each
50% or more 20% or more 20% or more
∗ When one side has two or more straight

lines, there shall be a 20% or more
difference against W or L.
W W
W
L L L
App. 1-22 HGR14-E-PMC01-A02-00

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Shape Corresponding
number shape
1i Quadrangle with 156 Shield V7.00 or later
chipped corners Transparent resin component

Length L Width W

the straight lines.
Criteria
1) Length: L±(15%)
(Top view) : Detection point
2) Width: W±(25%)
4) Angle: Recognition angle±30[°], etc.
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. Applicable shape of component
(Top view)
HGR14-E-PMC01-A02-00 App. 1-23

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Shape Corresponding
number shape
1j Quadrangle with 159 Shield V7.00 or later
acute corners Transparent resin component

Length L Width W

the straight lines.
Criteria
1) Length: L ±(15%)
(Top view)
: Detection point
2) Width: W ±(25%)
4) Angle: Recognition angle ±30[°], etc.
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. Applicable shape of component
(Top view)
App. 1-24 HGR14-E-PMC01-A02-00

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Shape Corresponding
number shape
2a Square with two 75–76 S mini Di, mini Di V7.00 or later
pins 82 , etc.
95
152

Length L Width W

Criteria the center between the tips of the
1) Length: L±(20%) two pins.
(Top view)
2) Width: (75, 152) W−(35%), +(50%)
(76, 82) W−(30%), +(50%) : Detection point
(95) W−(45%), +(50%)
: Detection center
3) Angle: (75, 95) Recognition angle ±60[°]
(76, 82, 152) Recognition angle ±30[°], etc.
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. When the right and left pins differ in width, input the wider one.
For the example as shown in the right figure, input W1.
2. If a lead’s silhouette is separated from the mold or when the mold is transparent, use No. 76. In this
case, only the lead tips of the two pins will be detected.
Silhouette separation
(Transparent resin mold)

3. When leads are short and jutting straight out of the component underside, use No. 82 (Reflecting
recognition).
(Straight) (Normal)
b
(Side view)
a
Short lead: A lead whose length (a) is shorter than its width (b) (Top view)
4. For mesa diodes, whose leads look like triangles, use No. 95.
HGR14-E-PMC01-A02-00 App. 1-25

HGR14
Shape Corresponding
number shape
2b Square with three 61–68 SS mini Di, S mini Di, mini Di V7.00 or later
pins 83 SS mini Tr, S mini Tr, mini Tr
100 , etc.
103
153
Length L Width W
Criteria
1) Length: L ±(20%)
2) Width: W ±(20%) Component is recognized through
the center among the tips of the
3) Isosceles ratio: ±10% three pins.
(Top view) 4) Orthogonality of the triangle: 90±10[°] : Detection point
5) Angle: (61 to 68, 103) Recognition angle ±90[°]
(83, 100) Recognition angle ±30[°], etc. : Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
case, only the lead tips of the three pins will be detected.

recognition).
(Straight) (Normal)
b
a (Side view)
Short lead: A lead whose length (a) is shorter than its width (b)
3. To detect the presence or absence of the unnecessary pins—other than the three pins to be
detected—for the purpose of preventing improper components from being set, use No. 103.
Lead to be detected
Inspection position of unnecessary lead
App. 1-26 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
2c Square with four 69 SS mini Di, S mini Di, mini Di V7.00 or later
104 , etc.
120
123–124
154
Length L Width W
Criteria
1) Length: (69, 123, 124, 154) L±(25%)
(84, 104, 120) L±(20%)
2) Width: (69, 123, 124, 154) W±(25%) Component is recognized through
(84, 104, 120) W±(20%) the center among the tips of the
four pins.
(Top view) 3) Parallelism of the opposite sides: ±10[°]
4) Orthogonality of the adjacent sides: 90±10[°] : Detection point
5) Angle: (69, 123, 124, 154) Recognition angle ±60[°]
: Detection center
(84, 104, 120) Recognition angle ±30[°], etc.
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
case, only the lead tips of the four pins will be detected.

2. When leads are short and jutting straight out of the component underside, use No. 84 (Reflecting recognition).
(Straight) (Normal)
b
a
Short lead: A lead whose length (a) is shorter than its width (b) (Side view)
3. To detect the presence or absence of the unnecessary pins—other than the four pins to be detected—for the
purpose of preventing improper components from being set, use No. 104.
Lead to be detected
(No.123: Style-of-packing 0°) (No.124: Style-of-packing 0°)
4. To check the polarity of the component only one of
whose leads is different in width, use No. 123, 124. W W
Input the width (W) of the side without a wider lead.
5. To specify the recognition method: reflected illumination or transmitted illumination, use No. 84 (Reflection) or
No. 154 (Transmission).
HGR14-E-PMC01-A02-00 App. 1-27

HGR14
Shape Corresponding
number shape
2d Square with five 70 SS mini Di, S mini Di, mini Di V7.00 or later
105 , etc.
120
154
Length L Width W
Criteria
1) Length: (70, 105) L±(25%)
(85, 120) L±(20%)
2) Width: (70, 105) W±(25%) Component is recognized through
(85, 120) W±(20%) the center among the tips of the
(Top view) four external pins.
3) Parallelism of the opposite sides: ±10[°]
5) Angle: (70, 105) Recognition angle ±60[°]
: Detection center
(85, 120) Recognition angle ±30[°], etc.
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)

recognition).
(Straight) (Normal)
b
a
3. To detect the presence or absence of the unnecessary pins—other than the four pins to be
Lead to be detected
Inspection position of necessary lead
App. 1-28 HGR14-E-PMC01-A02-00
HGR14
Shape Corresponding
number shape
2e Square with six pins 69 SS mini Di, S mini Di, mini Di V7.00 or later
86 SS mini Tr, S mini Tr, mini Tr
106 , etc.
120
154
Length L Width W
Criteria
1) Length: (69, 106) L±(25%)
(86, 120) L±(20%)
2) Width: (69, 106) W±(25%) Component is recognized through
the center among the tips of the
(86, 120) W±(20%) four external pins.
(Top view) 3) Parallelism of the opposite sides: ±10[°]
5) Angle: (69, 106) Recognition angle ±60[°] : Detection center

(86, 120) Recognition angle ±30[°], etc.
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
recognition).
(Straight) (Normal)
b
a
3. To detect the presence or absence of the unnecessary pins—other than the four pins to be
Lead to be detected
Inspection position of necessary lead
HGR14-E-PMC01-A02-00 App. 1-29

HGR14
Shape Corresponding
number shape
3a Three pins on one 73–74 Mini power Tr V7.00 or later
side 87 , etc.

Length L Width W Transmission with No. 73
Criteria
No. 74, 87, or reflection
1. Transmitting recognition with reference number 73
1) Width: W ±(25%)
2) Leads-on-both-sides inclination error ±10[°]
2. Reference number 74, 87, or reflecting recognition
(Top view) 1) Length: L ±(20%)
Component is recognized through the
2) Width: W ±(20%) center between the tips of the two
3) Orthogonality of the triangle: 90±10[°] external pins.
4) Angle: Recognition angle ±30[°], etc. : Detection point
: Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. If a lead’s silhouette is separated from the mold, use No. 74. In this case, only the lead tips will be
detected.
2. To specify the recognition method as the reflecting recognition, use No. 87.
App. 1-30 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
3b Two pins on one 161–165 N-Tr V7.00 or later
side , etc.
3c N pins on one side

Length L Width W
No. 164 only
Criteria
1. Transmitting recognition with reference numbers
161–164
1) Width: W ±(25%)
2) Leads-on-both-sides inclination error ±10[°] Component is recognized through the
(Top view) 3) Angle: Recognition angle ±60[°], etc. center between the tips of the two
external pins.
2. Reference number 165 or reflecting recognition
1) Length: L ±(20%) : Detection point
2) Width: W ±(20%)
: Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. If a lead’s silhouette is separated from the mold, use No. 165. In this case, only the lead tips will be
detected.
2. When the lengths of leads on both sides vary widely, use No. 164 that compensates for an angle in
the center of mold and in the center between leads on both sides.
L/2
1. C
W/2
W/2
HGR14-E-PMC01-A02-00 App. 1-31

HGR14
Shape Corresponding
number shape
4a Pins on one side 171–190 Connector V7.00 or later
191–192 IrDA
196 , etc.
Length L Width W
No. of pins
N4
No. of tempo-
rary pins V4
Pitch P4
Pin
information 4
Criteria
171–189, 191, 192
1) Pitch: P4 ±(20% to 50%) (It varies depending on
the pitch.)
2) Angle: Recognition angle ±30[°] center among the tips of all the pins.
3) Straightness of a pin line etc.
: Detection point
(Top view) 2. Reference number 187, 190, or reflecting recognition
1) Pitch: P4 ±(Pitch tolerance) : Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. For QFP extended data, input data to the fourth side, irrespective of the style-of-packing angle.
2. Normally, pitch tolerance should be set to 20% to 30%. (As for CM301, this is an option.)
3. Precautions for inputting pin information
The registered pin information is used for positioning and for judging the conforming components.
Do not register such as a radiator panel that you might potentially misread as a pin. Otherwise,
that will cause a recognition error and inaccuracy. Pins will not be detected in the parts where are
not registered in the pin information. The recognition results are calculated from the virtual pins
(actual pins and temporary pins). The center of a pin line can be shifted in 1/2-pitch intervals.
Example 1: Radiator panel or mold in a pin line Example 2: Connector the center of whose pin line
(No. of actual pins N4 = 6, No. of leans to one side
temporary pins V4 = 10) (No. of actual pins N4 = 8, No. of temporary
pins V4 = 10)
Radiator plate, etc.
Set temporary pins to adjust the center.

Actual pin Temporary pin Recognition center
4. When the lead surfaces are not light-reflective or when there are many inconsistencies in light, use
the transmitting recognition No. 187 (General-purpose head).
App. 1-32 HGR14-E-PMC01-A02-00
HGR14
Shape Corresponding
number shape
4b Pins on two sides 171–190 SOP V7.00 or later
191–192 SON
196 , etc.
Length L Width W
No. of pins N2 No. of pins N4
No. of tempo- No. of tempo-
rary pins V2 rary pins V4
Pitch P2 Pitch P4
Pin information 2 Pin information 4
Criteria
171–189, 191, 192
1) Pitch: P4 ±(20% to 50%) (It varies depending on
the pitch.)
2) Angle: Recognition angle ±30[°] Component is recognized through the
center among the tips of all the pins.
(Top view) 3) Straightness of a pin line etc.
2. Reference number 187, 190, or reflecting recognition : Detection point
1) Pitch: P4 ±(Pitch tolerance)
: Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. For QFP extended data, input data to the second and fourth sides, irrespective of the
style-of-packing angle.
Example 1: Radiator panel or mold in a pin line Example 2: Connector whose pins are spaced in two lines in
(No. of actual pins N2/N4 = 6, No. of a staggered configuration
temporary pins V2/V4 = 10) (No. of actual pins N2/N4 = 8, No. of temporary pins V2/V4 = 16)
Set temporary pins with half a pitch.

Actual pin Temporary pin Recognition center
4. For the general-purpose head, when the lead surfaces are not light-reflective or when there are
many inconsistencies in light, use the transmitting recognition No. 187.
5. For the high-speed head, in the case of back-electrode components such as SON, use the reflecting
recognition No. 196.
HGR14-E-PMC01-A02-00 App. 1-33
HGR14
Shape Corresponding
number shape
4c Pins on three sides
Reserved
Criteria
(Top view)
Style-of-
packing No.
Style of
packing
Feed
direction
Style-of-
packing angle
(Remarks)
Not supported.
App. 1-34 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
4d Pins on four sides 171–190 QFP V7.00 or later
191–192 QFN
196 , etc.
Length L Width W
No. of pins No. of pins No. of pins No. of pins
N1 N2 N3 N4
No. of No. of No. of No. of
temporary temporary temporary temporary
pins V1 pins V2 pins V3 pins V4
Pitch P1 Pitch P2 Pitch P3 Pitch P4
Pin Pin Pin Pin
information 1 information 2 information 3 information 4
Criteria
171–189, 191, 192 Component is recognized through
1) Pitch: P4 ±(20% to 50%) (It varies depending on the center among the tips of all the
the pitch.) pins.
2) Angle: Recognition angle ±30[°]
(Top view)
3) Straightness of a pin line etc. : Detection point
2. Reference number 187, 190, or reflecting recognition
1) Pitch: P4 ±(Pitch tolerance) : Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
Example 1: Missing pins in a pin line
(No. of actual pins N1/N2/N3/N4 = 6,
No. of temporary pins V1/V2/V3/V4 = 10) Actual pin
Temporary pin
Recognition center
3. For the general-purpose head, when the lead surfaces are not light-reflective or when there are
many inconsistencies in light, use the transmitting recognition No. 187.
4. For the high-speed head, in the case of back-electrode components such as QFN, use the reflecting
recognition No. 196.
HGR14-E-PMC01-A02-00 App. 1-35

HGR14
Shape Corresponding
number shape
4e J-lead component , etc.
Reserved
Criteria
(Top view)
Style-of-
packing No.
Style of
packing
Feed
direction
Style-of-
packing angle
(Remarks)
The presence or absence of pins is not detected.
Currently not in use
App. 1-36 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
4f Circular electrodes 201–205 BGA V7.00 or later
inside a quadrangle CSP (µ BGA)
LGA
, etc.

Length L Width W
No. of ball rows N1 No. of ball columns N2
Ball pitch of row P1 Ball pitch of column P2
Ball pattern c
Ball diameter R Ball diameter tolerance
Criteria
1) Length: L ±(20%) the center among all the balls.
2) Width: W ±(20%)
(Bottom view) : Detection point
3) Ball diameter: R ±(Ball diameter tolerance)
4) Angle: Recognition angle ±35[°], etc. : Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. For CM301, ball diameter and ball tolerance are optional. (Fixed at 30%)
2. Normally, ball diameter tolerance should be set to 20% to 30%.
3. Precautions for inputting the ball pattern
1) Input the ball pattern with the component whose style-of-packing angle is 0° flipped
horizontally.
Flip horizontally 10
No. of rows
1
1 10
No. of columns
4. For LGA, in lamp value teaching, set lateral lighting (Lamp5) to 0, and then increase reflection
(Lamp4) until electrodes reflect light. The data setting procedure is the same as that for BGA.
(Supported by multi-functional head only)
HGR14-E-PMC01-A02-00 App. 1-37

HGR14
5. To check the component that has more matrices/balls than specified in data, use No. 202/203/204.
1) No. 202: Checks the extra balls inside the ball pattern.
2) No. 203: Checks the extra balls outside the ball pattern.
3) No. 204: Checks the extra balls inside and outside the ball pattern.
Target component 202 203 204
Point to detect the presence of a ball

Point to detect the absence of a ball
6. To make the polarity determined with the outside shape of a component, use No. 205.
(Component shapes available for polarity determination)
1) For polarity determination, one or more corners shall have about-45° cuts. The cutout areas
are used for determination; however, convex R cannot be supported.
OK: 45°cut OK: Concave R cut NG: Convex R cut
ＢＢＢ
ＡＡＡ
Lengths A and B shall be as follows.

Min.: 0.5 mm
Max.: One-tenth of the shorter one of the chip dimensions L and W
2) The following four patterns represent polarity.

One corner cut Four corners cut Three corners cut Four corners cut
Only the polarity corner cut Only the polarity corner not Only the polarity corner
Only the polarity corner cut
deeply cut cut shallowly
∗ The three corners other than a polarity corner shall be of the same shape.
3) A polarity corner shall be different from the other corners in the above lengths A and B by 0.5
mm or more. Polarity is determined with the difference between a polarity corner and the
other corners. You do not need to input the lengths A and B.
4) In polarity determination, a complete contrast is required in the outer regions of a component.

For the components that are based on polyimides or on the thin glass epoxies where resists
are not applied and whose outer regions are transparent, the polarity cannot be determined.
App. 1-38 HGR14-E-PMC01-A02-00

HGR14
Automatic teaching function for multi-pin/bump component data

For multi-pin components (Shape No.: 4a–4d, 4g–4h) and bump components (Shape No.: 4f),
their data can be created automatically by teaching.
(V7.55-080 and later versions)
[Target components]
1. Multi-pin components
(Applicable shapes)
• Components for which the QFP extended data is used
• Components one or more of whose mold sides have three or more pins of the same shape,
with equal pitches
• There are three patterns of the side with pins as follows:
Three or more pins Three or more pins Three or more pins

on four sides on two sides opposed on one side only
(Representative components)
QFP, SOP, Connector, PLCC, SOJ, QFN, SON, LCC, etc.
2. Bump components
(Applicable shapes)
• Components for which the BGA extended data is used
• Components whose mold underside (placement surface) has 3×3 or more bump-shaped
electrodes of the same shape like a square lattice, with equal pitches
• The horizontal and vertical pitches of bumps can be different from each other; however, the
pitches in the same direction need to be equal.
• 3×3 or more bumps

• Arranged like a square lattice
• Equal pitches in the same direction
(Representative components)
BGA, CSP
[Data to be created]
The recognition data to be created by this function are as follows:
• Chip dimensions L and W
• Style-of-packing angle
• Extended QFP data: To be created at the time of teaching of multi-pin components
(No. of pins, No. of temporary pins, Pin pitch, Pin pattern)
• Extended BGA data: To be created at the time of teaching of bump components
(No. of bump rows/columns, Bump pitch, Bump diameter, Bump pattern)
∗ The following pages describe the procedure for creating actual recognition data.
HGR14-E-PMC01-A02-00 App. 1-39

HGR14
Automatic teaching procedure for multi-pin/bump component data

The following describes the automatic teaching procedure for multi-pin/bump component data.
<Preparations>
1. Have the target component ready.
2. Register the component data on PT.
∗ Only the items required for recognition are
listed below.
Input item
• REF: See below (∗1).
• Length (L)
• Width (W)
∗ Dimensions showing the maximum outline

should be entered in the length (L) and width
(W) fields.
Accurate dimensions are not required.
9Q4C-EPt-Pl-001
3. Transfer the data from PT to the

machine.
∗ After that, the teaching should be performed on the machine.

Feed the target component to the machine via the feeder or tray.
∗1
Reference number (REF) to be registered on PT
(For multi-pin components)

• In reteaching of the existing recognition data : Use the preset REF number as it is.
• In creation of new data from scratch : REF = 254
(For bump components)
• In reteaching of the existing recognition data : Use the preset REF number as it is.
• In creation of new data from scratch : REF = 253
∗ In the case of REF 253/254, PT will not check the extended data.
App. 1-40 HGR14-E-PMC01-A02-00

HGR14
<Component’s center position teaching>

1. Press [Production data teach] on the
data modification menu screen in the
main menu.
EJM6A-Dm-0001
1
2. Press [Chip recog].
EJM6A-Dm-0028
3. Press [Chip select] to choose the target

component.
UNLOCK
3 4. Press + [Pickup].
4
UNLOCK
5
5. Press + [Teach start].
4Z4C-EEn-DmPtCr-022
To the next page
HGR14-E-PMC01-A02-00 App. 1-41

HGR14
• The X/Y/θ-corrected image of the component

is displayed in the center of the screen.
∗ Normally, here, the image and frame do not

need moving and rotating; however, if the
component has not reached the center or if it
is inclined in θ direction, fine-adjust the box
frame position, the size, and the image X/Y/θ.
(Adjustment guideline)
• Multi-pin component
Adjust the box frame to

the pin tips.
4Z4C-EEn-DmPtCr-023
• Bump component
Adjust the box frame to

the outline of mold.
∗ After the setting of component’s center position is complete, press [Complete] to proceed.
<Electrode detection>
When you press [Complete] after the component’s center position teaching, the positions of the
component’s electrodes are detected and displayed on the screen.
• Multi-pin component • Bump component
Quadrangular frames are Round frames are displayed

displayed in the pin positions in the bump positions
detected. detected.
Solid line: With a pin {: With a bump
Broken line: Without a pin ¯: Without a bump
∗ When electrodes are detected successfully, press [Complete] to finish teaching.

If they are not detected successfully, press [Electrode modify] to modify the data of the detected
electrodes.
App. 1-42 HGR14-E-PMC01-A02-00

HGR14
<Modifying the data of the detected electrodes>
If electrodes are not detected successfully, modify the data of the detected electrodes here.
It, however, is only the data of presence or absence of electrodes that can be modified; the data
of their positions cannot be modified.
• When you press [Electrode modify] or

[ElectrodeSet], a cursor appears on the
screen.
∗ Put the cursor on the target electrode position,

and press [Electrode add/delete].
When there is an electrode It is deleted.
When there isn’t an electrode It is added.
• To enlarge the image, press [Image disp

change].
The scale of image is changed.
∗ When the modification to the electrode data is

finished, press [Complete].
Teaching is complete.
4Z4C-EEn-DmPtCr-024
∗ For some components such as connector and SOP, the post-teaching style-of-packing angle
may be different from the pre-teaching one preset. In such a case, the component angle in the
second-or-later teaching differs from that in the first one. If the style-of-packing angle is changed,
check the scanning angle.
HGR14-E-PMC01-A02-00 App. 1-43

HGR14
Shape Corresponding
number shape
4g J-leads on two sides 166–170 SOJ V7.00 or later
, etc.

Length L Width W
No. of pins No. of pins
N2 N4
No. of No. of
temporary temporary
pins V2 pins V4
Pitch P2 Pitch P4
Pin
Pin
information
information 2 Component is recognized through
4
the center among the tips of all the
Criteria
pins.
2) Parallelism of pin lines: ±6[°] : Detection point
3) Pin pitch error: ± (Pitch tolerance) : Detection center

Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. For QFP extended data, input data to the second and fourth sides, irrespective of the
style-of-packing angle.
Example 1: Radiator panel or mold in a pin line
(No. of actual pins N2/N4 = 6, No. of temporary pins
V2/V4 = 10)
Actual pin
Temporary pin
Recognition center
App. 1-44 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
4h J-leads on four 166–170 PLCC V7.00 or later
sides , etc.

Length L Width W

Criteria
pins.
1) Length: L ±(20%)
2) Width: W ±(20%)
(Top view)
3) Parallelism of pin lines: ±6[°] : Detection point
4) Pin pitch error: ± (Pitch tolerance) : Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
Example 1: Missing pins in a pin line

(No. of actual pins N1/N2/N3/N4 = 6,
No. of temporary pins V1/V2/V3/V4 = 10)
Actual pin
Temporary pin
Recognition center
HGR14-E-PMC01-A02-00 App. 1-45

HGR14
Shape Corresponding
number shape
4i Solder balls arranged 222 Flip chip V7.02 or later
on unspecified , etc.
positions 1
Length L Width W
Ball Ball Ball diameter
position X1 position Y1 R1
position X2 position Y2 R2

position X8 position Y8 R8 Component is recognized through
Criteria the center among the specified
balls.
(Bottom view) 1) Ball diameter: R ±(Ball diameter tolerance), etc.
: Detection point
: Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. The following are the limits of recognition of a target component. Viewed from above
1) Minimum ball diameter: φ0.1 [mm]
(On the order of 0.3 [mm], maximum)
2) Minimum distance between adjacent balls:
Ball diameter × 1.6 [mm]
3) Ball position: Specified by position-coordinate data
4) No. of balls to be recognized: 2 to 8
Flipped horizontally HGR14-007E
2. Precautions for inputting the data

1) Input the coordinates of balls (see the right figure).
Input the ball coordinates from the center with the component
whose the style-of-packing angle is 0° flipped horizontally.
2) Avoid similar combinations in choosing the electrode positions.
Good example: No similar Bad example: Electrodes with a similar
combinations positional relationship are recognized by
mistake.
(Specified ball (Recognition (Specified ball (Recognition result)
positions) result) positions)
HGR14-023E
App. 1-46 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
4j Solder balls 237–238 FC-BGA V7.02 or later
arranged on , etc.
unspecified
positions 2

Length L Width W
Ball Ball diameter
diameter R tolerance
Positioning is carried out with the

center among the balls on the
Criteria specified rows and columns.
1) Length: L ±(20%) As for the other balls, the
2) Width: W ±(20%) presence or absence of them is
(Bottom view) detected.
3) Ball diameter: R ±(Ball diameter tolerance)
: Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. The components need production data teaching.
For the teaching procedure, see ‘Non-grid-array BGA teaching procedure’ on the following pages.
HGR14-E-PMC01-A02-00 App. 1-47

HGR14
Non-grid-array BGA teaching procedure

The following explains the teaching procedure for a component with solder balls on its back such
as BGA/µ BGA (CSP) whose balls are not arranged in a grid pattern.
<Preparations>
2. Use PT to register the component data
with BGA expansion data.

listed below.
Input item
• REF: 237/238
• Width (W)
• Length (L)
• Extended data type: BGA extended data
9Q4C-EPt-Pl-001
BGA extended data

• Ball diameter
• Ball diameter tolerance

machine.
9Q4C-EPt-Pl-002

App. 1-48 HGR14-E-PMC01-A02-00

HGR14
<Teaching>
main menu.
EJM6A-Dm-0001
1
EJM6A-Dm-0028

component.
UNLOCK
4
UNLOCK
5 5. Press + [Teach start].
HGR14-017E
To the next page
HGR14-E-PMC01-A02-00 App. 1-49

HGR14

∗ Normally, here, the image does not need

rotating and moving; however, if the
is inclined in θ direction, fine-adjust X/Y/θ.
HGR14-018E
6. Press [Ball area set].

∗ When a white-line box appears, set the
maximum area where balls exist using the
movement/zoom-in/zoom-out key. Normally,
fit that to the outside shape of the component.
7. Press [Complete].
• Proceeds to the next step.
6
HGR14-018E 7
8. Press [Based pos set].

∗ When a white-cross-hairs box appears, set it
on the rows and columns of the balls to be
recognized for positioning the component.
• Automatic extraction of the solder balls starts.
HGR14-019E
To the next page
App. 1-50 HGR14-E-PMC01-A02-00

HGR14
• When the extraction is complete, the result

appears on the screen.
∗ When you can verify that all the solder balls

have been extracted, the teaching is
complete.
HGR14-020E
∗ Now, the teaching is over; however, if some solder balls are left undetected in spite of the
automatic extraction process, add such solder balls following the procedure on the following
pages.
HGR14-E-PMC01-A02-00 App. 1-51

HGR14
<<Adding the undetected solder balls / Deleting the extra solder balls detected>>
1. Put a cursor on the desired ball position,

and choose [Ball add/del].
To add a ball position
∗ To delete a ball position, specify the
already-detected position; to add one, specify
the undetected position.
∗ Put a cursor on the position where you wish to

add a ball.
HGR14-021E
To delete a ball position

∗ Put a cursor on the ball position you wish to
delete.
HGR14-022E
∗ When you wish to add/delete more than one
ball, perform steps 1–2 as many times as the
balls.
HGR14-022E 2
∗ When the automatic extraction process cannot detect many (two or more) solder balls, the
luster of the solder balls may be insufficient because of oxidation and the like. Modify the set
values of the LED lighting for solder balls, following ‘Reference: Individual lamp value setting
modifying procedure’ on the next page.
• When there are a lot of undetected balls, increase (brighten) the lamp-5 value.
• When there are a lot of extra balls detected, decrease (darken) the lamp-5 value.
App. 1-52 HGR14-E-PMC01-A02-00

HGR14
<<Reference: Individual lamp value setting modifying procedure>>
1. Press [Configuration].
1
4Z4C-EEn-DmPtCr-019
2. Press [Lamp].
3. Press [ESC].
2 3
UNLOCK
4
4Z4C-EEn-DmPtCr-019
5. Set the lamp values.
5
HGR14-023E 6
HGR14-E-PMC01-A02-00 App. 1-53

HGR14
Shape Corresponding
number shape
4k Two sets of pins on 193 DIMM V7.02 or later
two sides , etc.

Length L Width W
No. of pins No. of pins No. of pins No. of pins
N1 N2 N3 N4
No. of No. of No. of No. of
temporary temporary temporary temporary
pins V1 pins V2 pins V3 pins V4
Pitch P1 Pitch P2 Pitch P3 Pitch P4
Pin Pin Pin Pin

information information information information
1 2 3 4 Component is recognized through
Criteria
pins.
2) Parallelism of pin lines: ±6[°]
3) Pin pitch error: ± (Pitch tolerance) : Detection point
4) Angle: Recognition angle ±30[°], etc. : Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
<Corresponding component shape>
DIMM connector
This kind of connector has a side 1, side 2, side 3, and side 4. There is a no-pins section
between sides 1–2 and between sides 3–4 respectively. However, the connector with such
no-pins sections cannot be recognized as a normal one because they are not an integral multiple
of each-side’s pitch.
Side 2 Side 3
No pins No pins
Side 1 Side 4
App. 1-54 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
5a Special shape 1 77–79 Glass tube diode V7.00 or later
, etc.

Length L Width W

electrodes.
Criteria
(Top view)
1) Length: L ±(10%)
: Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
HGR14-E-PMC01-A02-00 App. 1-55

HGR14
Shape Corresponding
number shape
5b Special shape 2 96–97 Coil V7.00 or later
, etc.

Length L Width W

Criteria quarter section of the mold.
1) Length: L−(30%), +(20%)
(Top view)
2) Width: W−(30%), +(20%),
: Detection point
3) Pickup angle ±60[°], etc.
: Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
App. 1-56 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
5c Special shape 3 1–46 Semi-fixed potentiometer V7.00 or later
(Four-point block match) , etc.

Length L Width W

four points taught at the
Criteria
style-of-packing angle of 0[°].
(Top view) 1) Angle: Recognition angle ±30[°], etc.
: Detection point
: Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
1. For a square shape, use the recognition of the shape numbers 1c and 1f.
HGR14-E-PMC01-A02-00 App. 1-57

HGR14
Shape Corresponding
number shape
5d Special shape 4 71–72 Aluminum electrolytic capacitor V7.00 or later
, etc.

Length L Width W

Criteria
the straight lines.
(Top view) 1) Length: L−(30%), +(20%)
2) Width: W−(30%), +(20%)
: Detection point
: Detection center
Style-of-
0 1 2 3
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90°
packing angle
(Remarks)
App. 1-58 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
5e Special shape 5 76 3Pin-FET V7.00 or later
, etc.

Length L Width W

Criteria the tips of the two pins.
(Top view)
1) Length: L±(20%)
2) Width: W−(30%), +(50%) : Detection point
: Detection center
Style-of-
0 1 2 3 4 5 6 7
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90° +45° −45° +135° −135°
packing angle
(Remarks)
1. Polarity will not be determined.
2. When there are multiple pins, the two pins (on the opposite sides)—approaching the length L nearly
at the specified style-of-packing angle—will be detected.
HGR14-E-PMC01-A02-00 App. 1-59

HGR14
Shape Corresponding
number shape
5f Special shape 6 90–91 FET V7.00 or later
, etc.

Length L Width W
Criteria
1) Length: L ±(20%) tips of the four pins.
(Top view) 2) Width: W ±(20%)
: Detection point
: Detection center
Style-of-
0 1 2 3 4 5 6 7
packing No.
Style of
packing
Feed
direction
Style-of-
±0° ±180° +90° −90° +45° −45° +135° −135°
packing angle
(Remarks)
1. To avoid such a wrong recognition as 90-degree rotation, the recognizable angle becomes narrow.
(Pickup angle: ±30 degrees)
2. If a component is picked up beyond ±60 degrees from the pickup angle, it may be placed with it
rotated by 90 degrees; therefore, be careful with a pickup condition.
App. 1-60 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
5g Special shape 7 92–93 Horned tantalum capacitor V7.00 or later
, etc.

Length L Width W

Criteria four corners.
(Top view) 1) Length: L−(40%), +(30%)
2) Width: W ±(25%) : Detection point
: Detection center
Style-of-
0 1 2 3 4 5 6 7
packing No.
Style of
packing
Feed
direction
Style-of-
+0° ±180° +90° −90°
packing angle
(Remarks)
1. Be aware that the dimensions, L and W, are different from the normal catalog-data dimensions (the
mold).
2. Be aware that the recognition-result X and Y are obtained as illustrated in the figure above, not from
the tip of the horn.
3. Be aware that the horned tantalum capacitor as shown below cannot be recognized with these
reference numbers.
HGR14-E-PMC01-A02-00 App. 1-61

HGR14
Shape Corresponding
number shape
5h Special shape 8 160 Shield V7.00 or later
Insertion connector (Outside shape)
, etc.

Length L Width W
Criteria Component is recognized at the

two corners of the mold.
: Detection center
Style-of-
0 1 2 3 4 5 6 7
packing No.
Style of
packing
Feed
direction
Style-of-
+0° ±180° +90° −90°
packing angle
(Remarks)
1. Applicable shape
Silhouette shall include two corners and the center of a component (a screen).
HGR14-016E
2. When you cannot obtain or find it hard to obtain the silhouette of the whole component because
silhouette exists only at two corners, use Ref. No. 114.
App. 1-62 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
5i Special shape 9 114 Lateral-irradiation-type chip LED V7.00 or later
, etc.

Length L Width W
Criteria Component is recognized at the

1) Length: L ±(10%) two corners of the electrodes.
(Top view)
: Detection point
: Detection center
Style-of-
0 1 2 3 4 5 6 7
packing No.
Style of
packing
Feed
direction
Style-of-
+0° ±180° +90° −90°
packing angle
(Remarks)
1. This type of recognition processing detects the outside shape of a component taking advantage of
the fact that its electrodes (and a part of its mold) turn black in silhouette. Thus, low-level shadows
lying around a component may cause a false detection of its outside shape. Remove contamination
from a nozzle and a head reflector (these are backgrounds against a component) to prevent
shadows.
Contamination-derived shadows
HGR14-E-PMC01-A02-00 App. 1-63

HGR14
Shape Corresponding
number shape
5j Special shape 10 80 Filter V7.00 or later
HIC
, etc.

Length L Width W
Component is recognized at the

Criteria straight lines of the electrodes.
(Bottom view) 1) Length: L ±(15%)
: Detection center
4) Orthogonality of the adjacent sides: ±10[°]
Style-of-
0 1 2 3 4 5 6 7
packing No.
Style of
packing
Feed
direction
Style-of-
+0° ±180° +90° −90°
packing angle
(Remarks)
1. When electrodes are mirrorlike or when there is no contrast between electrodes and a mold
because the mold’s color is bright, use the outside shape of the component for recognition. For a
component whose end faces consists of straight lines, use No. 58; for a component whose end
faces consists of rough lines, use No. 159; for a component whose end faces consists of rough lines
and chipped corners outside, use No. 156.
2. Applicable shape of (back-electrode) component
(Bottom view)
App. 1-64 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
5k Special shape 11 81 Filter V7.00 or later
HIC
, etc.

Length L Width W

Criteria corners of the electrodes.
: Detection center
4) Orthogonality of the adjacent sides: ±10[°]
Style-of-
0 1 2 3 4 5 6 7
packing No.
Style of
packing
Feed
direction
Style-of-
+0° ±180° +90° −90°
packing angle
(Remarks)
1. When electrodes are mirrorlike or when there is no contrast between electrodes and a mold
because the mold’s color is bright, use the outside shape of the component for recognition. For a
component whose end faces consists of straight lines, use No. 58; for a component whose end
faces consists of rough lines, use No. 159.
2. Applicable shape of (back-electrode) component
(Bottom view)
HGR14-E-PMC01-A02-00 App. 1-65

HGR14
Shape Corresponding
number shape
5l Special shape 12 128 Disk V7.00 or later
Solder ball
, etc.

Length L Width W

Criteria circumference of a circle.
(Top view) 1) Length: L±(20%), etc.
: Detection point
: Detection center
Style-of-
0 1 2 3 4 5 6 7
packing No.
Style of
packing
Feed
direction
Style-of-
+0° ±180° +90° −90°
packing angle
(Remarks)
1. Angles will not be detected.
2. Also a circle shaped like a doughnut can be recognized.
3. This is for the transmitting recognition only.
App. 1-66 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
5m Such a component 241 Compound-shape component V7.55-080
that has two or more and later
shape
characteristics

Length L Width W

shape characteristics to be
Criteria registered by teaching.
(The figure above exemplifies the three
corners used as shape characteristics.)
2) Width: W ±(30%)
3) Angle: Recognition angle ±30[°], etc. : Detected shape characteristic
: Detection center
Style-of-pac
0 1 2 3 4 5 6 7
king number
Style of
packing
Feed
direction
Style-of-pac
+0° ±180° +90° −90°
king angle
(Remarks)
1. This recognition processing carries out teaching twice or more to register every shape
characteristics. The component is positioned on the basis of the registered shapes.
The shapes that can be used as characteristics are the following seven:
1) Lead group 5) Corner
2) Ball group 6) Rectangle
3) Electrode 7) Line
4) Round
2. This recognition processing requires the actual component to be undergone the production data
teaching.
For information about the teaching procedure, see the compound recognition teaching procedure on
the following pages.
HGR14-E-PMC01-A02-00 App. 1-67

HGR14
Compound-shape component teaching procedure

The following describe the teaching procedure for the compound-shape component that is
positioned on the basis of the two-or-more shape characteristics registered.
<Preparations>

2. Register the component data on PT.
listed below.
Input item
• REF: 241
• Length (L)
• Width (W)
∗ Dimensions showing the maximum outline

should be entered in the length (L) and width
(W) fields.
9Q4C-EPt-Pl-001 Accurate dimensions are not required.

machine.

App. 1-68 HGR14-E-PMC01-A02-00

HGR14
<Component’s center position teaching>

main menu.
EJM6A-Dm-0001
1
EJM6A-Dm-0028

component.
UNLOCK
4
UNLOCK

5
4Z4C-EEn-DmPtCr-025
To the next page
HGR14-E-PMC01-A02-00 App. 1-69

HGR14

∗ Normally, here, the image and frame do not

need moving and rotating; however, if the
is inclined in θ direction, fine-adjust the box
frame position, the size, and the image X/Y/θ.
The center of this box frame (the intersection of
broken lines in the box) becomes the
recognition center position.
If wishing to set the recognition center into
another position because of pickup surface
conditions, use the center of this box to change
the recognition center position.
4Z4C-EEn-DmPtCr-026
∗ After the setting of component’s center
position is complete, press [Complete] to
proceed to the shape teaching.
<Shape teaching>
• When you press [Complete] after the
component’s center position teaching, the
shape selection window opens.
∗ Choose the shapes to register.

It is seven types of shapes that can be
chosen.
For details about the shapes, see “
Individual shapes of compound-shape
components.”
4Z4C-EEn-DmPtCr-027 ∗ To open this window to register the next

shape, press [Shape select].
• When a shape is chosen, a quadrangular

frame (a shape detection area) appears on
the screen.
∗ Using the box moving keys and the
box scaling keys , adjust the box to

the target shape.
For details about shape area settings, see “
Individual shapes of compound-shape
components.”
∗ After the setting of shape detection area is

complete, press [Shape search] to check it.
4Z4C-EEn-DmPtCr-028
To the next page
App. 1-70 HGR14-E-PMC01-A02-00

HGR14
• The specified shape is detected in the set

area, and displayed.
∗ Check the detected shape.

<When detected successfully>
Press [Shape entry] to register the detected shape.
<If not detected successfully>
Press [Shape edit], and the shape selection
area appears. Correct the area frame position,
and detect it again.
4Z4C-EEn-DmPtCr-029
∗ Perform the above procedure for each shape to register.

After the registration of all shapes is complete, press [Registration shape list] to proceed.
<Confirming the registered shapes>

• When you press [Registered shape list] after
the shape teaching, the currently registered
shapes are displayed in list form.
∗ Pressing the up/down keys selects the

registered shapes one by one. If an
unnecessary shape has been registered,
select this shape and press [Use/Unused] to
decide whether to accept it.
• An unregistered shape appears with a broken

line, not with a usual solid line. Pressing
[Use/Unused] toggles the state between
registered and unregistered.
(Accepting the registered shapes)

4Z4C-EEn-DmPtCr-031
• Pressing the up/down keys selects the
registered shapes one by one.
• The registered and unregistered shapes
appear with solid and broken lines,
respectively.
• After the settings are complete, press

[Complete] to finish the teaching.
HGR14-E-PMC01-A02-00 App. 1-71

HGR14
Individual shapes of compound-shape components

The following describe the characteristics of each shape and the precautions for each individual
shape characteristics.
1. Lead group
This is used for four or more leads of the same shape,
with equal pitches.
<Shape registration teaching>

• Enclose the desired lead group shape with a shape detection area to register that.
• When the shape is detected successfully, the individual leads are enclosed with quadrangular
frames, and “¯” appears in the center of the lead group end.
<Precautions>
• When the number of leads is less than four or if many inconsistencies in intensity of the
background among leads hinder the successful detection of lead group, use the shape
<Electrode> to register the individual leads.
• When there are some missing leads, divide <Lead group> in two or more, or register the
individual leads as <Electrode>.
• If such as mold’s burrs are causing inconsistencies in intensity in the leads’ base, exclude it
from a shape detection area.
<Remarks>
In such an above case, If the image of leads’ base is

register a lead group and an unstable due to bent leads and
electrode. mold’s burrs, exclude that from a
shape detection area.
App. 1-72 HGR14-E-PMC01-A02-00

HGR14
2. Ball group
This is used for 1 ¯ 3 or more round shapes (bumps)
of the same shape like a square lattice, with equal pitches.

• Enclose the desired ball group shape with a shape detection area to register that.
• When the shape is detected successfully, the individual bumps are enclosed with round
frames, and “¯” appears in the center of the bump group.
<Precautions>
• The horizontal and vertical pitches of bumps can be different from each other; however, the
pitches in the same direction need to be equal.
• When the number of bumps is less than three or when their pitches are different, use the shape
<Round> to register the individual bumps.
• When there are some missing bumps, divide <Bump group> in two or more, or register the
individual bumps as <Round>.
<Remarks>
When there are some missing

bumps as shown above,
register two ball groups.
HGR14-E-PMC01-A02-00 App. 1-73

HGR14
3. Electrode
This is used for only one electrode (lead).
Also when there are some leads of the different shape,
register the individual leads as <Electrode>.

• Enclose the three sides (end and both sides) of the desired electrode shape with a shape
detection area to register that.
(When the whole electrode is enclosed with a shape detection area and registered, its
orientation is determined automatically.)
• When the shape is detected successfully, the three sides of the electrode are enclosed with a
straight-line frame, and “¯” appears in the electrode end.
<Precautions>
• Only one electrode must be included in a shape detection area.
(If there are two or more electrodes in a shape detection area, they may be detected as one.)
• If such as mold’s burrs are causing inconsistencies in intensity in the leads’ base, exclude it
from a shape detection area.
<Remarks>
If the electrode’s base

is connected with
another shape as
shown above, exclude
that from a shape
detection area.
App. 1-74 HGR14-E-PMC01-A02-00

HGR14
4. Round
This is used for only one round shape (such as a bump).
Also when there are some bumps of the different pattern,
register the individual ones as <Round>.

• Enclose the desired round shape with a shape detection area to register that.
• When the shape is detected successfully, the circumference of the round shape is enclosed
with a round frame, and “¯” appears in the center of the round shape.
<Precautions>
• Only one round shape must be included in a shape detection area.
(If there are two or more round shapes in a shape detection area, their sizes and positions may
not be measured correctly.)
HGR14-E-PMC01-A02-00 App. 1-75

HGR14
5. Corner
This is used for the corner that consists of two sides
intersecting at right angles.

• Enclose the two sides of the desired corner with a shape detection area to register that.
• When the shape is detected successfully, straight lines appear on the corner sides, and “¯”
appears in the corner.
<Precautions>
• Only one corner must be included in a shape detection area.
If there are two or more corners in a shape detection area, the corner with the highest contrast
is selected automatically. (That is not related to the corner positions in the area.)
• When the sides of corner are not intersecting at right angles, use the shape <Line> to register
the individual sides.
<Remarks>
If there are two corners as

shown above, include one of
them in a shape detection
area.
App. 1-76 HGR14-E-PMC01-A02-00

HGR14
6. Rectangle
This is used for only one rectangular shape.

• Enclose the desired rectangular shape with a shape detection area to register that.
• When the shape is detected successfully, the perimeter of the rectangle is enclosed with a
quadrangular frame, and “¯” appears in the center of the rectangle.
<Precautions>
• Only one rectangular shape must be included in a shape detection area. (If there are two or
more rectangles in a shape detection area, they may be detected as one.)
• If the image of one side of rectangle is unstable (e.g. lead’s base), use the shape <Electrode>
to register that.
<Remarks>
If the edge of one side is

not clear as shown
above, use <Electrode>.
HGR14-E-PMC01-A02-00 App. 1-77

HGR14
7. Line
This is used for the straight line.

• Enclose the desired line with a shape detection area to register that.
• When the shape is detected successfully, a straight line appears on the line, and “¯” appears
in the center of the line. (“W” and “B” appear on the white-level side and the black-level side,
respectively.)
<Precautions>
• Only one line must be included in a shape detection area.
If there are two or more lines in a shape detection area, the line with the highest contrast / the
longest length is selected automatically. (That is not related to the line positions in the area.)
• When a line is bending on its way, adjust the size and position of a shape detection area so
that it will enclose only the straight-line section.
<Remarks>
When a line is
bending on its way as
shown above,
register only the
straight-line section.
App. 1-78 HGR14-E-PMC01-A02-00

HGR14
Shape Corresponding
number shape
6a Special purpose 1 125: Lamp value automatic setting Board recognition mark V7.00 or later
126: Lamp value manual setting Placement-point recognition mark
, etc.
Shape number
Color
Size (a, b, c, d)
See the below tables.
See the below tables. X-Y coordinates: Center

coordinates
(Top view) ANS : If the correlation value of
matching is OK, a value 100
Criteria is sent back.
1) Correlation value (= Matching rate shall be larger than

the threshold value input.
Recognizable shapes (Only the following shapes can be recognized. <With some exceptions>)
Shape
1 2 3 4 5 6 7 8 9 10
number
Shape
Recogni-
tion results
(X-Y
coordinate)
The recognition result is obtained from the center coordinates of each of the marks (a and b). (For a circle, the center
Remarks
coordinates)
(Remarks)
1. For the board recognition by the shape data, a target image is created from the following data:
• Shape number
• Color
• Size
; and the recognition is carried out through matching.
2. For the reference number 125, the recognition device automatically sets the lamp value.
If a malfunction occurs, however, set the lamp value using the reference number 126.
HGR14-E-PMC01-A02-00 App. 1-79

HGR14
App.1.4 Outline Recognition Error Messages
1. ・

App.1.4.1 Messages During Production
For the outline recognition (the reference No. 51 or later), the on-screen recognition-result code
(A: or ANS:) tells you the recognition result.
Recognition-result 50 or above : Successfully completed recognition

code (The recognition-result coordinates and the
inclination are displayed.)
Other than those above : Recognition error
A recognition error occurs when a component is judged as unrecognizable or defective.

The recognition-result code tells you the details.
( App. 1.4.3 Recognition Error Message List)
HGR14-003E
Fig. 4−1 Recognition-result screen (In operation)
No. Name Explanation

Shows that it is the outline recognition.
Recognition target
Number of outline points
NUM
Shows the number of outline-pixel points of the recognition target.
Recognition-result code
A The recognition results are displayed.
In case of a recognition error, the code number tells you the details.
X Recognition-result X-coordinate [mm]
Y Recognition-result Y-coordinate [mm]
Recognition-result inclination [°]
When recognition is complete successfully, the position (X-Y coordinates) and inclination of
THETA
the recognition target are displayed.
In case of a recognition error, all displays 0.
PU Unit number (PU number)
C Chip number
H Head number
∗ The recognition-result coordinates show the distance from the center of the camera (the center
of cross hairs). (Fig. 4-2)
App. 1-80 HGR14-E-PMC01-A03-00

HGR14
Fig. 4−2 Coordinate system of the recognition screen
∗ For the recognition with the line camera, the screen is not displayed during production.
App.1.4.2 Recognition Information After Production (Memory Function)

Since the recognition device stores past recognition errors, you can check the details on errors
even after production.
Use this function for the reference for solution. ( App. 1.4.3 Recognition Error Message List)
4Z4C-001P
Fig. 4−3 Recognition-error screen
HGR14-E-PMC01-A03-00 App. 1-81

HGR14
No. Name Explanation

Chip-data
Shows the outer dimensions of the chip data sent from the main body.
dimensions
Outline Shows the outline of the recognition target.
Characteristic point
Shows the extracted characteristic points. (Up to 20 points)
(∗ )
LINE (Current scene number) / (All scene numbers)
Number of outline points
NUM
Shows the number of outline-pixel points of the recognition target.
Recognition-result code
ANS The recognition results are displayed.
In case of a recognition error, the code number tells you the details.
Chip data L, W
L, W
Shows the chip data information sent from the main body.
Reference information
A, B The reference values for the recognition-error details are stored.
The indication varies according to the recognition-result code.
Ref Reference number
Number of characteristic points
Ct
Shows the number of extracted characteristic points.
t Threshold value
H Nozzle number or head number
PU Unit number
Line camera in use (front/rear) and scan direction
Ch
F: Front, R: Rear, +: Positive scanning, −: Negative scanning
Sq Placement sequence
Line camera scan speed
Sp
1: Low speed, 2: Medium speed, 3: High speed
Lamp value to be used mainly
Lmp For the transmitting recognition, the transmitted illumination value
For the reflecting recognition, the reflected illumination value
[Reference example]
In the example of the figure 4−3, ANS. (Recognition-result code) 26 tells you that L (length) is
abnormal.
In addition, as compared with the on-screen outer dimensions of the chip data (L: 2.00, W: 1.25)
sent from the main body, it can be inferred that (1) Component setting error (the unit number 1 is
erroneously set) and (2) Error in the L and W dimensions of the chip data are the causes of the
recognition error because an actual outline is large; that helps you find the causes of errors.
App. 1-82 HGR14-E-PMC01-A03-00

HGR14
App.1.4.3 Recognition Error Message List

The descriptions for recognition errors are categorized as shown in Table 4−1: those common to
all the reference numbers and those intended for each reference.
This table shows the list of the descriptions for recognition errors; for further information, see
“App. 1.4.4 Troubleshooting against Recognition Errors.”
Note that, for the individual items, such as prescribed values vary according to the reference
numbers.
Hardware-related items
Number Description
0
1 Error in CPU functions
2 Error in image capture
3 Error in image-processing special functions
4 Error in image memory and camera
5 Error in reference number
6
7 Error in image capture (Line-camera scan start position failure)
8 Error in image capture (Line-camera scan timeout)
9
Common items
Number Description
10 Error in pixel rate
11 Chip data setting error
12 Reserved reference
13 Reference that is not targeted for automatic measurement
14 No component picked up
15 No recognition target
16 (Ditto)
17 Outline error
18 No recognition target near the outline-trace starting point
19 Lamp value setting error
∗1) Note that, in the following cases, all recognition-error codes can be displayed.
1) Chip data setting error
(Length, width, pitch, pin information, and reference number)
2) Setting error in lamp value (Lamp) or in threshold value (TH)
There is a possibility that the error code contradicting the true factor can be displayed.
∗2) In case of the recognition-error code No. 0 to No. 9 (hardware-related), something may be
wrong with the recognition device.
In this case, contact us.
HGR14-E-PMC01-A03-00 App. 1-83

HGR14
Individual items
Number Description
20 The number of characteristic points is out of prescription.
21 Error in style of packing or in pickup angle
22 Reference number setting error
23 Chip data (Input parameters) setting error
24
25 Error in L (length)
26 Error in W (width)
27 Error in L (length) or in W (width)
28
29
30 Error in P (pitch)
31 Error in the number of pins
32 Error in pin width
33 Pins are not aligned.
34 Pins are not aligned. (Error in lead length)
35 Error in P (pitch)
36 Error in the number of pins
37 Error in pitch or in the number of pins
38 Error in pin pattern
39
40 Error in parallelism
41 Error in orthogonality
42 Error in parallelism or in orthogonality
43 Error in angle
44
45 Special code <See the individual description.>
50 Successfully completed teaching
Table 4-1
∗ No. 35 to No. 38 are the errors related to the pin information.
App. 1-84 HGR14-E-PMC01-A03-00

HGR14
App.1.4.4 Troubleshooting Against Recognition Errors

How to use the details on recognition errors
In operation, the codes displayed on the recognition-error screen are categorized as follows.
For the individual items, such as prescribed values vary according to the reference numbers;
therefore, see the corresponding individual item.
Code 0–9 : Error in hardware → Contact us.

Code 10–19 : Common items → See the common items.
Code 20–49 : Individual items → See the individual item corresponding to the
reference.
Explanation of the details on recognition errors

The details on recognition errors include “Code,” “Description,” “Cause,” and “Solution.”
There can be several causes; therefore, choose the applicable factor and implement the
corresponding solution.
1 2 3
HGR14-006E
① Recognition-error code (ANS: or A:)
② Possible factors
③ Checks and solutions for the left-hand factors (There can be the other solutions.)
④ The outline example of the recognition-error screen, and the estimated image
⑤ [Reference] The number inside the parentheses shows an individual-item number.
⑥ Shows the factor to which a recognition error is attributed or an estimated reference value (chip
data), etc.
The indication varies according to the code.
⑦ Shows the item if the data needs modifying, etc.
HGR14-E-PMC01-A03-00 App. 1-85

HGR14
Reference No. Shape number Type

Common − − 1/1
Code Description Cause Solution

10 Error in pixel rate 1) Incorrect value in machine Check the machine parameters.
parameters <pixel rate>
(The value shall be positive.)
11 Chip data setting error 1) Incorrect L/W value Check the chip data.
(The value shall be positive.)
12 Reserved reference 1) This is a reserved reference Check the chip data.

(44) number.
(Unavailable for component
recognition.)
13
14 No component picked up 1) There is no components picked up. Check the pickup condition.
Common items
15 No matching component 1) Error in lamp or in set values With the production-data

16 teaching, check the screen at the
17 <Error screen> time of recognition.
18 • Component is in the screen
19 center.
• (Transmitting recognition)
Background = Reflector
shows white evenly.
• (Reflecting recognition)
Electrodes shine white.
2) Chip data setting error Check the chip data.
<Estimated image> • L/W
• Reference No.
3) Error in screen scaling Check the chip data.

(The whole component cannot fit in • L/W
the screen.)
4) Pickup trouble Check the pickup condition.

(The whole component cannot fit in
the screen.)
App. 1-86 HGR14-E-PMC01-A03-00

HGR14

51–56, 88, 89, 157 1a, 1d Fixed resistor, capacitor, etc. 1/2

20 The number of characteristic 1) Pickup error or pickup trouble Check the component height, the
(20) points is out of prescription. (Only the outline of the nozzle can pickup position, the pickup offset,
<Error screen> be viewed on the error screen.) and the nozzle in use to stabilize
the pickup condition.
2) Reference number error Check the chip data.
<Estimated image>
[Prescribed value] 3 to 20 points
21 Pickup angle error 1) Recognition angle tolerance Check the component height, the
43 <Error screen> exceeded pickup position, the pickup offset,
(15) Rectangular component: and the nozzle in use to stabilize
(25) ±60° or over the pickup condition.
Regular-square component:
±30° or over Check the style-of-packing angle.
Individual items
(Layout data)
25 L setting error 1) L setting error Set L correctly.

(10) <Error screen> (Chip data)
(11)
2) Wrong component Check the target component.
26 W setting error 1) W setting error Set W correctly.

(11-13) <Error screen> (Chip data)
(21)
27 L or W setting error 1) L or W setting error Set L or W correctly.

HGR14-E-PMC01-A03-00 App. 1-87

HGR14

51–56, 88, 89, 157 1a, 1d Fixed resistor, capacitor, etc. 2/2

41 Error in orthogonality 1) L or W setting error Set L or W correctly.
(10–11) <Error screen> (Chip data)
2) Pickup error or pickup trouble Check the component height, the

pickup position, the pickup offset,
and the nozzle in use to stabilize
45 Shape error 1) Pickup error or pickup trouble Check the component height, the
(15–17) <Error screen> (Oblique pickup, intrusion of foreign pickup position, the pickup offset,
47 objects) and the nozzle in use to stabilize
(1) the pickup condition.
2) Nozzle contamination Clean the nozzle tip and reflector.
<Estimated screen>
Individual items
App. 1-88 HGR14-E-PMC01-A03-00

HGR14

57–58, 82, 151,155 1c, 1f Tantalum capacitor, coil, etc. 1/1

21 Recognition angle error 1) Recognition angle tolerance Check the component height, the
±30° or over Check the style-of-packing angle.
(Layout data)

<Error screen> (Chip data)


Individual items
45 Edge point detection error 1) L or W setting error Set L or W correctly.

(43) <Error screen> The image (screen) size to be used (Chip data)
for recognition is determined from
L/W in chip data.

<Estimated screen> the pickup condition.
25 Lateral pickup error 1) Pickup error or pickup trouble Check the component height, the
(20) (Reference No. 151, 155) pickup position, the pickup offset,
HGR14-E-PMC01-A03-00 App. 1-89

HGR14

Cylindrical resistor, cylindrical
59–60 1b, 1e capacitor, etc.
1/1

(20) points is out of prescription. (Only the outline of the nozzle can pickup position, the pickup offset,
<Error screen> be viewed on the error screen.) and the nozzle in use to stabilize
21 Pickup angle error 1) Recognition angle tolerance Check the component height, the
(15) <Error screen> exceeded pickup position, the pickup offset,
43 Rectangular component: and the nozzle in use to stabilize
±30° or over
Check the style-of-packing angle.
(Layout data)

Individual items

45 Shape error 1) Pickup error or pickup trouble Check the component height and
<Error screen> the pickup height to stabilize the
pickup condition.
<Estimated image>
App. 1-90 HGR14-E-PMC01-A03-00

HGR14

SS mini Di, S mini Di, mini Di,
61–68, 83,100, 103, 153 2b 1/1
etc.

(20) points is out of prescription. pickup position, the pickup offset,
<Error image> and the nozzle in use to stabilize
2) Component error (Bent pins etc.) Check the target component.
21 Pickup angle error 1) Beyond the recognizable area Check the pickup condition.
(15) <Error screen> (Within ±90[°])
(Layout data)

2) Component error (Bent pins, etc.) Check the target component.

Individual items


(16)

45 <Error screen> (Chip data)
(8)
(11)

HGR14-E-PMC01-A03-00 App. 1-91

HGR14

69, 70, 84–86,
SS mini Di, S mini Di, mini Di,
104–106, 120, 2c, 2d, 2e 1/1
etc.
123, 124, 154
∗ The following figures show the case where the style of packing is 0° or 180°.
20 The number of characteristic 1) Pickup error or pickup trouble Check the pickup condition.
(20) points is out of prescription. (Check the chip data and the
<Error image> height detection system.)
2) Reference number error Check the reference number of

the chip data.
43 <Error screen> (Style of packing: Within ±60[°])
(15) Check the style-of-packing angle.
(Chip data)

(38)
Individual items
42 Error in parallelism or in 1) L or W setting error Set L or W correctly.

(39) orthogonality (Chip data)
–(43) <Error image> 2) Component error (Bent pins, etc.) Check the packing state of the
component.
App. 1-92 HGR14-E-PMC01-A03-00

HGR14

Aluminum electrolytic
71–72 5d 1/2
capacitor etc.
∗ The following figures show the case where the style of packing is −90°.
20 The number of characteristic 1) Pickup error or pickup trouble Check the component height and
(20) points is out of prescription. the pickup position to stabilize the
<Error image> pickup condition.
<Estimated image>
43 <Error screen> (Style of packing: Within ±60[°])
(15) Check the style-of-packing angle.
Individual items

2) Pickup error or pickup trouble Check the pickup condition.

HGR14-E-PMC01-A03-00 App. 1-93

HGR14

Aluminum electrolytic
71–72 5d 2/2
capacitor etc.
(38)
46 Edge recognition error 1) L or W setting error Set L or W correctly.

(18) 2) Pickup error or pickup trouble Check the pickup condition.
Individual items
App. 1-94 HGR14-E-PMC01-A03-00

HGR14

73–74, 87 3a Mini power Tr etc. 1/1
∗ The following figures show the case where the style of packing is 0°.
(20) points is out of prescription. (Only the outline of the nozzle can (Check the chip data and the
<Error image> be seen on the error screen.) height detection system.)
2) Reference number error Check the reference number.

(Chip data)
<Estimated image>
[Prescribed value] 3 points or more
(15) <Error screen> (Style of packing: Within ±90[°])
Check the packing state of the

component.
Individual items

2) Component error
30 Pin pitch error 1) Component error (Bent pins, etc.) Check the packing state of the
(26) <Error image> component.
33 Pins are not aligned. 1) Component error (Bent pins, etc.) Check the packing state of the
(27) <Error screen> component.
HGR14-E-PMC01-A03-00 App. 1-95

HGR14
Reference No. Shape Type

number
75–76, 82, 95, 152 2a S mini Di, mini Di, etc. 1/1

<Error screen> be seen on the error screen.) height detection system.)

the chip data.
(Chip data)
3) Component error (Bent pins etc.) Check the packing state of the
<Estimated image>
component.
Information A: Pickup trouble angle

Information B:
<Estimated image>
Individual items

(Refer to <Information A>.)
2) Information A: Estimated value of L

Information B:
32 Pin width error 1) Pickup trouble (Chip tombstoning) Check the pickup condition.
(26) <Error screen>
(27)
<Estimated image>
2) Information A: (It has no meanings.) (Chip recognition teaching)
Information B:
App. 1-96 HGR14-E-PMC01-A03-00

HGR14

76 5e 3Pin-FET etc. 1/1

20 The number of characteristic 1) Wrong style-of-packing angle or Check the component height, the
points is out of prescription. pickup trouble pickup position, the pickup offset,
<Error screen> and the nozzle in use to stabilize
3) Component error Check the target component.

Bent or broken leads
<Error screen> exceeded pickup position, the pickup offset,
±30° or over and the nozzle in use to stabilize

Individual items
(Layout data)


HGR14-E-PMC01-A03-00 App. 1-97

HGR14

77–79 5a Glass tube diode etc. 1/1
∗ The following figures show the case where the style of packing is ±90°.
<Error image> be seen on the error screen.) height detection system.)

the chip data.
(Chip data)
<Estimated image>
Individual items

App. 1-98 HGR14-E-PMC01-A03-00

HGR14

number
80 5j Filter, HIC, etc. 1/1


(Layout data)


Individual items
41 Parallelism error in two sides 1) Pickup trouble Check the component height, the
in outline pickup position, the pickup offset,
<Error image> and the nozzle in use to stabilize
2) There is no contrast between Adjust the lamps so that there will

electrodes and a mold. be a contrast between electrodes
and a mold.
(Only general-purpose head
allowed)
HGR14-E-PMC01-A03-00 App. 1-99

HGR14

number
81 5k Filter, HIC, etc. 1/1

20 Component’s corner position 1) Component’s angles are not acute. Check the target component.
(20) detection error
<Error image>

(Layout data)

Individual items

<Error image> (Chip data)
2) There is no contrast between Adjust the lamps so that there will

electrodes and a mold. be a contrast between electrodes
and a mold.
allowed)
App. 1-100 HGR14-E-PMC01-A03-00

HGR14

90–91 5f FET etc. 1/1
∗ The following figures show the case where the style of packing is −45° or 135°.
(20) points is out of prescription.
<Error image>
2) Component error Check the packing state of the

component.
<Estimated image>
(Chip data)
Individual items


component.
41 Error in perpendicularity 1) Component error Check the packing state of the

(4) <Error image> component.
3) L or W setting error Set L or W correctly.

(Chip data)
HGR14-E-PMC01-A03-00 App. 1-101

HGR14

Horned tantalum capacitor
92–93 5g 1/2
etc.
(20) points is out of prescription.
<Error image>

component.
<Estimated image>
Individual items


App. 1-102 HGR14-E-PMC01-A03-00

HGR14

Horned tantalum capacitor
92–93 5g 2/2
etc.
(41)
40 Error in angle 1) Component error Check the packaging state of the

43 <Error screen> component.
(40)
(43)
Individual items
HGR14-E-PMC01-A03-00 App. 1-103

HGR14
Reference No. Shape number Type Recognition

method
96–97 5b Coil etc. Transmission 1/1

(15) ±60° or over and the nozzle in use to stabilize
(25) the pickup condition.

(Layout data)


Individual items


46 <Error screen> The image (screen) size to be used (Chip data)
L/W in chip data.
App. 1-104 HGR14-E-PMC01-A03-00

HGR14

101 1h Plate spring, shield, etc. 1/1

±30° or over
(Layout data)



Individual items


(43) <Error screen> The image (screen) size to be used (Chip data)
L/W in chip data.

<Estimated image> the pickup condition.
HGR14-E-PMC01-A03-00 App. 1-105

HGR14

Lateral-irradiation-type chip
114 5i LED etc.
1/1


(Layout data)


Individual items

48 Electrode’s shape error 1) The candidate points for electrodes Check the component height, the
49 <Error screen> cannot be detected. pickup position, the pickup offset,
(The two corners showing the and the nozzle in use to stabilize
distance relation of L are not found.) the pickup condition.

(Layout data)
App. 1-106 HGR14-E-PMC01-A03-00

HGR14

128 5l Disk, solder ball, etc. 1/1

26 Detection size error 1) L or W setting error Set L or W correctly.

Individual items
HGR14-E-PMC01-A03-00 App. 1-107

HGR14

131–135 1g Resistor network etc. 1/2
<Error screen> be seen on the error screen.) height detection system.)

the chip data.
(Chip data)
<Estimated image>
21 Pickup angle error 1) Beyond the recognizable angle Check the pickup condition.
43 <Error screen> range
(15)
2) Pickup trouble Check the style-of-packing angle.

(Chip length L)/(Chip length W)
Individual items
1) ≤ 1.2 Style of packing ±60°

2) 1.2 ≤ Style of packing ±90°
(3) <Error screen>
(7)

(6)

(8)
(9)
App. 1-108 HGR14-E-PMC01-A03-00

HGR14

131–135 1g Resistor network etc. 2/2
(5)
45 Shape error 1 1) (The shape of the component is not Check the component height and
(11) <Error screen> clear.) the pickup height to stabilize the
Pickup error or pickup trouble pickup condition.
(Oblique pickup, intrusion of foreign
objects)
<Estimated screen>
Individual items
46 Shape error 2 1) Error in reference number Set the reference number of the
(39) <Error screen> This reference is used exclusively chip data correctly.
(40) for a multiple resistor. (Component shape list)
Components with no concavities on
the longer side cannot be
recognized.
HGR14-E-PMC01-A03-00 App. 1-109

HGR14

Shield, transparent resin
156 1i component etc.
1/1


(Layout data)


Individual items

App. 1-110 HGR14-E-PMC01-A03-00

HGR14

Shield, transparent resin
159 1j component, etc.
1/1

20 Component’s corner position 1) Component’s angles are not acute. Check the target component.
(20) detection error
<Error screen>

(Layout data)

Individual items

HGR14-E-PMC01-A03-00 App. 1-111

HGR14

Shield, insertion connector
160 5h (outside shape), etc.
1/1

points is out of prescription. (Only the outline of the nozzle can pickup position, the pickup offset,
<Error screen> be seen on the error screen.) and the nozzle in use to stabilize
<Estimated image>
Individual items


(Layout data)

App. 1-112 HGR14-E-PMC01-A03-00

HGR14

161–165 3b, 3c N-Tr etc. 1/1
<Error image> be viewed on the error screen.) height detection system.)

the chip data.
(Chip data)
<Estimated image>
Individual items
26 W setting error 1) Component error (Bent pins, etc.) Check the packing state of the
2) W setting error Set W correctly.

(Chip data)
45 Pin error 1) Component error (Bent pins, etc.) Check the packing state of the
<Error image> component.
2) W setting error Set W correctly.

(Chip data)
HGR14-E-PMC01-A03-00 App. 1-113

HGR14

171–192, 196 4a Connector, IrDA, etc. 1/2
20 The number of characteristic 1) Chip data (pin count, temporary pin Set the chip data correctly.
(20) points is out of prescription. count, pin pitch, and pin missing
<Error image> data) setting error (Chip data)
Individual items
23 Pin information data input 1) The number of pins is not within the Set the chip data correctly.
(40) error range 2–80.
–(48) 2) Setting error in temporary pin count
or in pitch
3) Pin pattern setting error (Chip data)
27 L or W setting error 1) Chip data L or W setting error Set L or W correctly.
2) Chip data setting error Set the chip data correctly.

component.
33 Pins are not aligned. 1) Component error (Floating pin, etc.) Check the packing state of the
34 <Error image> component.
(27)
(34) 2) Chip data setting error Set the chip data correctly.
App. 1-114 HGR14-E-PMC01-A03-00

HGR14

171–192, 196 4a Connector, IrDA, etc. 2/2
35 Pin pitch error 1) Component error (Bent pins, etc.) Check the packing state of the

3) Nozzle contamination Clean the nozzle.
(CM95R-M/L only)
4) Reflector contamination Clean the reflector.
(CM95R-M/L only)
43 Angle error in pin line 1) Component error Check the packing state of the

Individual items
HGR14-E-PMC01-A03-00 App. 1-115

HGR14

166–170,
4b, 4d, 4g, 4h, 4k SOP, QFP, etc. 1/2
171–192, 193, 196

20 The number of characteristic 1) Pin information (pin count, Set the pin information correctly.
(0) points is out of prescription. temporary pin count, pin pitch, and (Chip data)
–(4) <Error image> pin missing data) setting error
(20)
Individual items
23 Pin information data input 1) The number of pins is not within the Set the chip data correctly.
(40) error range 2–80.
–(49) 2) Setting error in temporary pin count
or in pitch
3) Pin pattern setting error (Chip data)
25 L setting error 1) Setting error in L or in pin Set L or the pin information
(29) <Error screen> information correctly.
(30)
2) Component error Check the packaging state of the

component.
26 W setting error 1) Setting error in W or pin information Set W or the pin information
(29) <Error screen> correctly.
component.
App. 1-116 HGR14-E-PMC01-A03-00

HGR14

166–170,
4b, 4d, 4g, 4h, 4k SOP, QFP, etc. 2/2
171–192, 193, 196


component.
33 Pins are not aligned. 1) Component error (Floating lead, Check the packing state of the
34 <Error image> etc.) component.
(27)
(34)
35 Pin pitch error 1) Component error (Bent leads, etc.) Check the packing state of the

Individual items
40 Error in parallelism 1) Component error (Bent leads, etc.) Check the packing state of the
(30)
43 Angle error in pin line 1) Component error (Bent leads, etc.) Check the packing state of the
HGR14-E-PMC01-A03-00 App. 1-117

HGR14

BGA, CSP, (µ BGA), LGA,
201–205 4f 1/3
etc.

points is out of prescription.
43 (Style of packing: Within ±30[°])
2) Component error Check the component’s

condition.
Individual items
2) Component error Check the component’s

condition.
35 Ball pitch error 1) Component error Check the component’s

condition.
36 Error in the number of balls 1) Chip data setting error Set the chip data correctly.
App. 1-118 HGR14-E-PMC01-A03-00

HGR14

201–205 4f 2/3
etc.

37 Chip data error 1) Chip data setting error Set the chip data correctly.
(Number of virtual balls)
(Number of virtual balls) (Ball pitch)
(Ball pitch) (Chip size)
(Chip size)
38 Chip data error 1) Chip data setting error Set the chip data correctly.
(Number of actual balls)
(Number of actual balls) (Ball pattern)
(Ball pattern)
40 Parallelism error in ball line 1) Component error Check the component’s

condition.
Individual items
(21)
44 Ball diameter undetectable 1) Dent in ball Check the component’s

condition.
2) Owing to an error in ball Set the ball pattern correctly.
arrangement pattern setting, the
position with no ball is set as that
Since ball is not shining with ball.
circularly, it cannot be
detected.
HGR14-E-PMC01-A03-00 App. 1-119

HGR14

201–205 4f 3/3
etc.

45 Recognition area error In the BGA recognition, the balls to be Reteach the recognition position,
The balls to be recognized recognized are out of the recognizable and then make it recognized.
are out of the recognizable area.
area.
Ball to be recognized
In the case of batch recognition, this
means all balls; in the case of divided
recognition, it means 1/4 of all balls on
each corner.
46 Ball brightness error ・ Ball missing Check whether the ball

arrangement pattern is correct.
There is a ball that is

obviously different from the
others in brightness.
Individual items
47 Ball shape defective 1) Dent in ball Check the component’s

condition.
2) Owing to an error in ball pattern Set the ball pattern correctly.
setting, the position with no ball is
set as that with ball.
Ball is not shining circularly.

48 Ball shape defective 1) Dent in ball Check the component’s
(In reference ball detection) condition.
(Ball near the reference corner)
2) Owing to an error in ball Set the ball arrangement pattern

arrangement pattern setting, the correctly.
Ball is not shining circularly. with ball.
49 Reference ball detection error 1) Dent in ball Check the component’s
condition.
(Ball near the reference corner)
2) Owing to an error in ball Set the ball arrangement pattern

arrangement pattern setting, the correctly.
with ball.
App. 1-120 HGR14-E-PMC01-A03-00

HGR14

222 4i Flip chip etc. 1/1

20 Ball detection count error 1) The number of detected balls falls Set the ball pattern correctly.
short of that of balls specified in the (BGA extended data)
chip data.
35 Ball detection position error 1) The positions of detected balls are Set the ball positions correctly.
out of the misalignment tolerance (FC extended data)
specified in the chip data.
Check the target component.
Individual items

(Layout data)
44 Ball detection error 1) Dent in ball Check the target component.
2) Position data setting error Set the ball positions correctly.

(FC extended data)
3) Luster of balls is insufficient. Adjust the lamps so that there will

be a contrast between electrodes
and a mold.
allowed)
47 Ball diameter error 1) Ball missing Check the target component.
2) Ball diameter data setting error Set the ball diameter correctly.
(BGA extended data)
3) Luster of balls is insufficient. Adjust the lamps so that there will

be a contrast between electrodes
and a mold.
allowed)
HGR14-E-PMC01-A03-00 App. 1-121

HGR14

237–238 4j FC-BGA etc. 1/1

21 Component angle error 1) Beyond the recognizable area Check the style-of-packing angle.
43 <Error screen> (Recognition angle: Within ±30[°]) (Layout data)

22 Component’s outline 1) L or W setting error Set L or W correctly.

42 detection error (Chip data)
<Error screen>
3) Component’s end faces shine Adjust the lamps so that there will
white. be a contrast between electrodes
and a mold.
allowed)
23 Input ball diameter error 1) Diameter data has become 0.0 Set the chip data correctly.
Teaching incomplete [mm].
2) Recognition was carried out without Put the components through the
teaching with actual components. recognition teaching process.
Individual items

44 Ball detection error 1) Dent in ball Check the target component.

2) Luster of balls is insufficient.
Adjust the lamps so that there will
3) Ball missing be a contrast between electrodes
and a mold.
46 Luster of balls is insufficient. 1) Poor brightness of balls
(Tolerance: Brightness average of
allowed)
all balls -20%)
2) Ball missing
Check whether the ball diameter
47 Ball diameter error 1) Ball diameter is out of tolerance and the diameter tolerance are
(Tolerance: Ball diameter × correct.
Specified value) (BGA extended data)
2) Ball missing
App. 1-122 HGR14-E-PMC01-A03-00

HGR14

Compound-shape
241 5m 1/2
component

20 Image state error 1) Pickup error or pickup trouble Check the component height, the
(10) Pickup angle error pickup position, the pickup offset,
–(13) and the nozzle in use to stabilize

(Layout data)
2) Wrong component Check the chip data.
3) Nozzle/Reflector contamination Clean the nozzle tip and reflector.
23 Component teaching result 1) The teaching has not been carried Recheck the component data.
error out successfully.
Through the chip recognition
teaching, reteach the component
shape characteristics.
Individual items

–(11)
(21)
–(22) 2) Wrong component Check the target component.

–(11)
(21)
実際のチップ
–(22) 2) Wrong component Check the target component.
チップサイズの大きさ

HGR14-E-PMC01-A03-00 App. 1-123

HGR14

Compound-shape
241 5m 2/2
component

35 Lead detection error 1) Component error (Bent leads, etc.) Check the packing state of the
–(11)
2) Lead image state error Adjust the lamps so that there will
36 be a contrast between leads and
the background.
3) Pickup error or pickup trouble Check the target component.

∗It can occur only when a lead
group is registered.
38 Ball detection error 1) Component error (Dent in ball, etc.) Check the packing state of the
2) Ball image state error Adjust the lamps so that there will
be a contrast between balls and a
mold.
3) Pickup error or pickup trouble Check the target component.

Individual items
∗It can occur only when a ball group

is registered.
App. 1-124 HGR14-E-PMC01-A03-00

HGR14

Board recognition mark
125,126 6a Placement-point recognition 1/1
mark, etc.

46 Recognition-judgment rate 1) Error in mark shape Check the board recognition
47 failure Wrong shape, color, or size data.
Shape number / Color
designation / Size
2) The mark is contaminated. During production, set the
position manually.
3) The illumination value is improper. In the case of the automatic lamp
mode (Ref. 125), change it to
manual (Ref. 126) and set the
lamp values.
4) The recognition criterion of the Change the criterion.
machine parameters is too high.
Note:
The criterion shall not be 75 or
less.
Otherwise, the mark position can
be misjudged.
19 Automatic lamp setting failure 1) Error in mark shape Check the board recognition
data.
Shape number / Color
designation / Size
Individual items
2) The recognition-target mark does Modify the board mark

not exist on the screen. coordinates so that the board
mark will be displayed in the
center of the screen.
HGR14-E-PMC01-A03-00 App. 1-125

HGR14
App.1.5 Recognition Device Maintenance
Recognition Device Maintenance

The recognition-device maintenance function provides various kinds of maintenance related to
the recognition device.
For example, you can update the recognition device, check the version, check the
recognition-error information, and much more.
App.1.5.1 Recognition-Device Maintenance Screen
1. Press Machine
in the main menu.
adjust
• The machine adjustment menu screen is

displayed.
1
EJM6A-Main-0002
2. Press [Recog unit maint].

• The recognition device maintenance screen is
displayed.
EJM6A-Ma-0001
To the next page
App. 1-126 HGR14-E-PMC01-A03-00

HGR14
<Descriptions of items>
[Ref no]
Changes the reference number.
[Threshold]
Changes the binary threshold value.
[Teach scrn]
Displays the block match teaching screen of
the currently designated reference number.
[Area]
Displays a square frame.
[Recog]
Carries out the recognition process.
[Error scrn]
Displays the stored error screen.
[Scale]
Displays the scale for adjustment.
[Cross line]
Displays the cross hairs for adjustment.
[Ver. Memory]
Displays the version of the recognition device.
[Img print]
Prints the error screen.
HGR14-E-PMC01-A03-00 App. 1-127

HGR14
App.1.5.2 Error-Screen Display

Since the recognition device stores past recognition errors, you can check the details on errors
even after production. Use this function for the reference for solution.
1. Enter the error-screen display mode.

• Press [Error scrn].
• The latest error image is displayed.
2. Search for the error screen of which you

wish to track down the cause.
1 • To toggle the screens, press [∇] and [∆].

[∆]: To the next screen
[∇]: To the previous screen
[Reset]: Deletes the error information.
4Z4C-001P
• Use ‘C (chip number)’ and ‘PU (unit number)’
on the recognition-device screen as the clues
to search.
( App.1.4.2 Recognition Information After
Production (Memory Function))
Investigate the details of the error, on the basis of the reference number and the error number on
the recognition-error screen. Troubleshoot the errors following this manual, which contains the
details of errors and the solutions. ( App. 1.4 Outline Recognition Error Messages)
NOTICE
If an error of unknown factor occurs, fax or mail us the printout of the
recognition-error screen and the printout of the chip data. And if possible, mail
several samples of the components, too.
3. Print out the error screen to be

investigated.
• Press [Img print].
4Z4C-001P
App. 1-128 HGR14-E-PMC01-A03-00

HGR14
The information required for investigating the cause (Outline recognition)

Please send us the following information for quick investigation of the cause.
Printout of the recognition-error screen : One sheet
Printout of the chip data ∗1) : One sheet
(Or six sheets, for a special component)
Component sample : Several
∗1):
Such as QFP/SOP include “QFP/SOP camera recognition data” and “QFP/SOP batch
recognition pin missing information.”
① Recognition-error screen
4Z4C-001P
HGR14-E-PMC01-A03-00 App. 1-129

HGR14
② Chip data
A sheet of the printout of the Six sheets of the printouts of the

regular-component data special-component data (QFP, SOP, etc.)
“QFP/SOP camera recognition data” Four sheets of the printouts of “QFP/SOP batch
recognition pin missing information”
(From the first to the fourth side)
App. 1-130 HGR14-E-PMC01-A03-00

HGR14
App.1.5.3 Recognition Device Update

This section describes updating the recognition system.
The recognition system for update is copied from the floppy disk to RAM; when no problem is
found as a result of the comparison (reading inspection) between the system in the floppy disk
and that in RAM, the system is written into the memory.
<Item explanation>
‘ROM version’ : Current recognition ROM version
‘System version’ : Version of the recognition system to be uploaded
‘Total block’ : Current recognition system volume
‘Sending block’ : Transferred recognition system volume
1. Press Machine
in the main menu.
parameter
• The machine parameter menu screen is

displayed.
1
EJM6A-Main-0002
2. Press [Machine mainte].

• The machine maintenance menu screen is
displayed.
EJM6A-Mp-0001
To the next page
HGR14-E-PMC01-A03-00 App. 1-131

HGR14
3. Press [Compo unit update].

• The component unit update screen is
displayed.
EJM6A-Mp-0004
4. Press [Recog unit].
EJM6A-Mp-0012
5. Into the floppy disk drive, insert the

floppy disk with the recognition system
for update.
6. Press [Update start].

• The recognition system update process
begins.
EJM6A-Mp-0012
6
App. 1-132 HGR14-E-PMC01-A03-00

HGR14
M
INDEX Messages during production ...................................1-80
A N
Automatic teaching function for multi-pin/bump Non-grid-array BGA teaching procedure .................1-48
component data .................................................. 1-39
Automatic teaching procedure for multi-pin/bump O
component data .................................................. 1-40
One-point block matching..........................................1-2
B Outline recognition............................................. 1-2, 1-3
Outline recognition error messages.........................1-80
Ball group................................................................ 1-73
Block matching ......................................................... 1-3 R
C Recognition device maintenance...........................1-126
Recognition device update ....................................1-131
Chip data............................................................... 1-130 Recognition error message list ................................1-83
Common items........................................................ 1-83 Recognition information after production (Memory function)
Component’s center position teaching .......... 1-41, 1-69 .............................................................................1-81
Compound-shape component teaching procedure .. 1-68 Recognition-error screen .......................................1-129
Corner ..................................................................... 1-76 Recognizable posture ..............................................1-17
Corresponding component ..................................... 1-17 Rectangle.................................................................1-77
Corresponding shape ...................................... 1-4, 1-17 Reference number ........................................... 1-4, 1-17
Criteria .................................................................... 1-17 Round ......................................................................1-75
E S
Electrode................................................................. 1-74 Shape number ................................................. 1-4, 1-17
Error-screen display.............................................. 1-128 Support Ver. .............................................................1-17
Explanation of the details on recognition errors ..... 1-85
T
F
The information required for investigating the cause
Four-point block matching ........................................ 1-2 (Outline recognition)...........................................1-129
Troubleshooting against recognition errors .............1-85
H Type ...........................................................................1-4
Hardware-related items .......................................... 1-83

How to use the details on recognition errors .......... 1-85
I
Individual items ....................................................... 1-84
Individual shapes of compound-shape components
............................................................................ 1-72
Input data items by shape....................................... 1-16
L
Lead group.............................................................. 1-72
Line ......................................................................... 1-78
List of the outline-recognition shapes ................ 1-4, 1-5
Mini-mold type....................................................... 1-6
Multi-pin type (Batch recognition) ......................... 1-8
Power-mini-mold type (Electric power type) ......... 1-7
Special type........................................................... 1-9
Special-purpose type............................................1-11
Square shape........................................................ 1-5
List of the recognition methods by reference ......... 1-14
List of the reference numbers [Outline recognition] .. 1-12
HGR14-E-PMC0Z-A01-00 App. 1
HGR14
= MEMO =
App. 2 HGR14-E-PMC0Z-A01-00

HGR14 CM402

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HGR14

APPENDIX 1. RECOGNITION DEVICE

This describes the recognition device (HGR-14).

HGR14-E-PMC01-A00-00 App. 1-1

App. 1.1 Outline of Recognition Methods

Name Reference Features Target

Table 1−1 Recognition methods

[Features of the outline recognition]

Fig. 1−1 Features of the outline recognition

App. 1-2 HGR14-E-PMC01-A01-00

App. 1.1.2 New Component Reference Selecting Procedure

HGR14-E-PMC01-A01-00 App. 1-3

App. 1.2 Creating the Outline Recognition Data

Fig. 2−1 Example of the list of the outline-recognition shapes

③ Type (Specific component)

List of the outline-recognition shapes −1 <Square shape>

Rectangle with electrodes Tantalum capacitor 57–58

Regular square with acute Fixed resistor 51–56

1 Regular square with Tantalum capacitor 57–58

Square with unstraight Resistor network 131–135

Special shape including a Plate spring 101

HGR14-E-PMC01-A01-00 App. 1-5

List of the outline-recognition shapes −2 <Mini-mold type>

Square with three pins SS mini Di, 61–68

Square with four pins SS mini Di, 69

Square with six pins SS mini Di, 69

App. 1-6 HGR14-E-PMC01-A01-00

List of the outline-recognition shapes −3 <Power-mini-mold type (Electric power type)>

HGR14-E-PMC01-A01-00 App. 1-7

List of the outline-recognition shapes −4 <Multi-pin type (Batch recognition)>

Pins on two sides SOP, SON 171–190

Pins on three sides Not supported.

Pins on four sides QFP, QFN 171–190

J-lead component The presence or absence of pins is

Circular electrodes inside a BGA, CSP (µ BGA), LGA 201–205

J-leads on two sides SOJ 166–170

J-leads on four sides PLCC 166–170

Solder balls arranged on Flip chip 222 Up to 8 balls can be detected.

Solder balls arranged on FC-BGA 237–238 Up to 4000 balls can be detected.

Two sets of pins on two sides DIMM 193

App. 1-8 HGR14-E-PMC01-A01-00

List of the outline-recognition shapes −5 <Special type>

Special shape 2 Coil 96–97

Special shape 3 Semi-fixed potentiometer 1–46 A square appearance can be

Special shape 4 Aluminum electrolytic 71–72

Special shape 5 3Pin-FET 76

Special shape 6 FET 90–91

Special shape 8 Shield 160

Special shape 9 Lateral-irradiation-type 114 Such a component from which its

Special shape 10 Filter 80

Special shape 11 Filter 81

Special shape 12 Disk 128

HGR14-E-PMC01-A01-00 App. 1-9

App. 1-10 HGR14-E-PMC01-A01-00

List of the outline-recognition shapes −6 <Special-purpose type>

HGR14-E-PMC01-A01-00 App. 1-11

App. 1.2.2 List of the Reference Numbers [Outline Recognition] (V7.00)

Ref. Corresponding component Ref. Corresponding component Ref. Corresponding component

App. 1-12 HGR14-E-PMC01-A01-00

Ref. Corresponding component Ref. Corresponding component Ref. Corresponding component

HGR14-E-PMC01-A01-00 App. 1-13

App. 1.2.3 List of the Recognition Methods by Reference (V7.00)