SO T2

BT168GWF
SCR, fast, logic level
Rev. 01 27 December 2010 Product data sheet

1. Product profile
1.1 General description
Planar passivated, fast, sensitive gate Silicon Controlled Rectifier in a SOT223 surface-mounted plastic package

23

1.2 Features and benefits

Fast commutation performance for higher frequency Full wave rectified AC applications Sensitive gate suitable for logic level controls

1.3 Applications
Earth leakage circuit breakers (ELCB/GFI) Ignition circuits (gas appliances, small engines and HID lighting)

1.4 Quick reference data

Table 1. Symbol VDRM VRRM ITSM Quick reference data Parameter repetitive peak off-state voltage repetitive peak reverse voltage non-repetitive peak on-state current average on-state current RMS on-state current half sine wave; Tj(init) = 25 C; tp = 10 ms; see Figure 4; see Figure 5 half sine wave; Tsp 112 C; see Figure 3 half sine wave; Tsp 112 C; see Figure 1; see Figure 2 VD = 12 V; IT = 10 mA; Tj = 25 C; see Figure 9 Conditions Min Typ Max Unit 600 600 8 V V A

IT(AV) IT(RMS)

0.63 A 1 A

Static characteristics IGT gate trigger current 70 200 450 A

NXP Semiconductors

BT168GWF
SCR, fast, logic level

2. Pinning information
Table 2. Pin 1 2 3 4 Pinning information Symbol Description K A G A cathode anode gate anode
1 2 3 4 A G
sym037

Simplified outline

Graphic symbol
K

SOT223 (SC-73)

3. Ordering information
Table 3. Ordering information Package Name BT168GWF SC-73 Description plastic surface-mounted package with increased heatsink; 4 leads Version SOT223 Type number

4. Limiting values
Table 4. Symbol VDRM VRRM IT(AV) IT(RMS) ITSM Limiting values Parameter repetitive peak off-state voltage repetitive peak reverse voltage average on-state current RMS on-state current non-repetitive peak on-state current I2t for fusing rate of rise of on-state current peak gate current peak reverse gate voltage peak gate power average gate power storage temperature junction temperature over any 20 ms period half sine wave; Tsp 112 C; see Figure 3 half sine wave; Tsp 112 C; see Figure 1; see Figure 2 half sine wave; Tj(init) = 25 C; tp = 10 ms; see Figure 4; see Figure 5 half sine wave; Tj(init) = 25 C; tp = 8.3 ms I2t dIT/dt IGM VRGM PGM PG(AV) Tstg Tj tp = 10 ms; sine-wave pulse IT = 2 A; IG = 10 mA; dIG/dt = 100 mA/s Conditions Min -40 Max 600 600 0.63 1 8 9 0.32 50 1 5 2 0.1 150 125 Unit V V A A A A A2 s A/s A V W W C C

In accordance with the Absolute Maximum Rating System (IEC 60134).

BT168GWF

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Product data sheet

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BT168GWF
SCR, fast, logic level

1.2 IT(RMS) (A) 0.8

001aab498

2 IT(RMS) (A) 1.5

001aab500

(1)

0.4 0.5

0 50

50

100 Tsp (C)

150

0 102

101

1 10 surge duration (s)

Fig 1.

RMS on-state current as a function of solder point temperature; maximum values

1

Fig 2.

RMS on-state current as a function of surge duration; maximum values

001aab496

110 Tsp(max) (C) 113

Ptot (W) 0.8 2.2 2.8 0.6

a= 1.57 1.9

116 4 conduction angle (degrees) 30 60 90 120 180 0 0.2 0.4 0.6 IT(AV) (A) form factor a 4 2.8 2.2 1.9 1.57

0.4

119

0.2

122

125 0.8

Fig 3.

Total power dissipation as a function of average on-state current; maximum values

BT168GWF

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Product data sheet

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NXP Semiconductors

BT168GWF
SCR, fast, logic level

103 ITSM (A) 102

IT

001aab497

ITSM

t tp Tj(init) = 25 C max

10

1 105

104

103 tp (s)

102

Fig 4.
10 ITSM (A) 8

Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values
001aab499

4
IT ITSM

2
t tp Tj(init) = 25 C max

0 1 10

102 number of cycles

103

Fig 5.

Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values

BT168GWF

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NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 01 27 December 2010

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NXP Semiconductors

BT168GWF
SCR, fast, logic level

5. Thermal characteristics
Table 5. Symbol Rth(j-sp) Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to solder point thermal resistance from junction to ambient free air Conditions full cycle; see Figure 8 minimum footprint; printed-circuit board mounted; in free air; see Figure 6 pad area; printed-circuit board mounted; in free air; see Figure 7 Min Typ 156 70 Max 15 Unit K/W K/W K/W

3.8 min 36 1.5 min 18

6.3 1.5 min (3) 1.5 min 4.6

001aab508

60

4.6

4.5

2.3 10

All dimensions are in mm

7 15 50
001aab509

All dimensions are in mm Printed-circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 um thick). Fig 6. Minimum footprint SOT223 Fig 7. Printed-circuit board pad area SOT223

BT168GWF

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NXP B.V. 2010. All rights reserved.

Product data sheet

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NXP Semiconductors

BT168GWF
SCR, fast, logic level

102 Z th(j-sp) (K/W) 10

003aae245

P
101

tp
102 105 104 103 102

101

tp (s)

10

Fig 8.

Transient thermal impedance from junction to solder point as a function of pulse width

BT168GWF

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NXP B.V. 2010. All rights reserved.

Product data sheet

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BT168GWF
SCR, fast, logic level

6. Characteristics
Table 6. Symbol IGT IL IH VT VGT Characteristics Parameter gate trigger current latching current holding current on-state voltage gate trigger voltage Conditions VD = 12 V; IT = 10 mA; Tj = 25 C; see Figure 9 VD = 12 V; IG = 0.5 mA; RGK = 1 k; Tj = 25 C; see Figure 10 VD = 12 V; RGK = 1 k; Tj = 25 C; see Figure 11 IT = 1.2 A; Tj = 25 C; see Figure 12 VD = 12 V; IT = 10 mA; Tj = 25 C; see Figure 13 VD = 600 V; IT = 10 mA; Tj = 125 C ID IR dVD/dt off-state current reverse current VD = 600 V; Tj = 125 C; RGK = 1 k VR = 600 V; Tj = 125 C; RGK = 1 k Min 70 3 0.5 0.2 350 Typ 200 7.5 4.1 1.35 0.5 0.3 0.05 0.05 800 25 Max 450 13 10 1.7 0.8 0.1 0.1 Unit A mA mA V V V mA mA V/s V/s

Static characteristics

Dynamic characteristics rate of rise of off-state voltage VDM = 402 V; Tj = 125 C; RGK = 1 k; exponential waveform; see Figure 14 VDM = 402 V; Tj = 125 C; exponential waveform; gate open circuit; see Figure 14 tgt gate-controlled turn-on time ITM = 2 A; VD = 600 V; IG = 10 mA; dIG/dt = 0.1 A/s; Tj = 25 C

3 IGT IGT(25C) 2

001aab502

3 IL IL(25C) 2

001aab503

0 50

50

100 Tj (C)

150

0 50

50

100 Tj (C)

150

Fig 9.

Normalized gate trigger current as a function of junction temperature

Fig 10. Normalized latching current as a function of junction temperature

BT168GWF

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NXP B.V. 2010. All rights reserved.

Product data sheet

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NXP Semiconductors

BT168GWF
SCR, fast, logic level

3 IH IH(25C) 2

001aab504

5 IT (A) 4

001aab505

(1)

(2)

(3)

2 1 1

0 50

50

100 Tj (C)

150

0 0.4

1.2

2 VT (V)

2.8

Fig 11. Normalized holding current as a function of junction temperature

1.6 VGT VGT(25C) 1.2
001aab501

Fig 12. On-state current as a function of on-state voltage

104 dVD/dt (V/s)
(1) 001aab507

103

0.8

102
(2)

0.4 50

10 0 50 100 Tj (C) 150 0 50 100 Tj (C) 150

Fig 13. Normalized gate trigger voltage as a function of junction temperature

Fig 14. Critical rate of rise of off-state voltage as a function of junction temperature; typical values

BT168GWF

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NXP B.V. 2010. All rights reserved.

Product data sheet

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BT168GWF
SCR, fast, logic level

7. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads SOT223

c y HE b1 v M A

Q A A1

1
e1 e

2
bp

3
w M B detail X

Lp

2 scale

4 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 1.8 1.5 A1 0.10 0.01 bp 0.80 0.60 b1 3.1 2.9 c 0.32 0.22 D 6.7 6.3 E 3.7 3.3 e 4.6 e1 2.3 HE 7.3 6.7 Lp 1.1 0.7 Q 0.95 0.85 v 0.2 w 0.1 y 0.1

OUTLINE VERSION SOT223

REFERENCES IEC JEDEC JEITA SC-73

EUROPEAN PROJECTION

ISSUE DATE 04-11-10 06-03-16

Fig 15. Package outline SOT223 (SC-73)

BT168GWF All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 01 27 December 2010

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NXP Semiconductors

BT168GWF
SCR, fast, logic level

8. Soldering
7 3.85 3.6 3.5 0.3 1.3 1.2 (4) (4)
4

solder lands solder resist 3.9 6.1 7.65 solder paste occupied area

Dimensions in mm

2.3 1.2 (3) 1.3 (3) 6.15

2.3

sot223_fr

Fig 16. Reflow soldering footprint for SOT223 (SC-73)

8.9 6.7

1.9 solder lands solder resist 6.2 8.7 occupied area Dimensions in mm
1 2 3

1.9 (3)

preferred transport direction during soldering

2.7 1.1

2.7 1.9 (2)

sot223_fw

Fig 17. Wave soldering footprint for SOT223 (SC-73)

BT168GWF

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NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 01 27 December 2010

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BT168GWF
SCR, fast, logic level

9. Revision history
Table 7. Revision history Release date 20101227 Data sheet status Product data sheet Change notice Supersedes Document ID BT168GWF v.1

BT168GWF

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NXP B.V. 2010. All rights reserved.

Product data sheet

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BT168GWF
SCR, fast, logic level

10. Legal information

10.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]

Product status[3] Development Qualification Production

Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.

Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customers sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customers applications and products planned, as well as for the planned application and use of customers third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customers applications or products, or the application or use by customers third party customer(s). Customer is responsible for doing all necessary testing for the customers applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customers third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective

10.3 Disclaimers
Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

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NXP B.V. 2010. All rights reserved.

Product data sheet

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BT168GWF
SCR, fast, logic level
product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors specifications such use shall be solely at customers own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors standard warranty and NXP Semiconductors product specifications.

agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customers general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors warranty of the

10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, IC-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE are trademarks of NXP B.V. HD Radio and HD Radio logo are trademarks of iBiquity Digital Corporation.

11. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

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Product data sheet

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SCR, fast, logic level

12. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Contact information. . . . . . . . . . . . . . . . . . . . . .13

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.

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For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 December 2010 Document identifier: BT168GWF