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SOT-666 DSILC6-4P6
Flip-Chip DSILC6-4F2
Functional diagram
Description
The DSILC6-4xx is a monolithic application specific discrete dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet, display and camera serial interfaces (LVDS).
I/O4
VCC
I/O3
I/O1
VCC
I/O2
I/O4
I/O1 GND I/O2
GND
I/O3
The device is ideal for applications where both reduced printed circuit board space and power absorption capability are required.
Features
Diode array topology
I/O1 I/O4
VCC GND
I/O2 I/O3
4 line protection 5 V VCC protection Very low capacitance: 1 pF typ. Lead-free pacakge RoHS compliant
Order Code
Part Number DSILC6-4P6 DSILC6-4F2 Marking G EI
Benefits
Very low capacitance between lines to GND for optimized data integrity Low PCB space consumption: 2.9 mm max for SOT-666 and 1.5 mm max for Flip-Chip Cut-off frequency > 2 GHz High reliability offered by monolithic integration MDDI, SMIA, MIPI specification compliant
May 2007
Rev 3
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www.st.com 11
Characteristics
DSILC6-4xx
1
Table 1.
Symbol VPP IPP PPP Tstg Tj TL
Characteristics
Absolute ratings
Parameter Peak pulse voltage Peak pulse current Peak pulse power Storage temperature range Maximum junction temperature Lead solder temperature (10 seconds duration) IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge SOT-666 I/O to GND Pulse waveform = 8/20 s SOT-666 Flip-Chip Flip-Chip Value 8 15 5 7 90 120 -55 to +150 125 260 Unit kV A W C C C
Table 2.
Symbol VRM IRM VBR VF VCL IPP
Value Symbol IRM VBR VF Parameter Leakage current VRM = 5 V 6 1 SOT-666 Flip-Chip SOT-666 Flip-Chip SOT-666 Flip-Chip SOT-666 Flip-Chip 2 2.5 1.5 1.8 1.0 1.25 0.75 0.9 2.5 3 1.8 2.0 1.25 1.5 0.9 1.20 0.06 0.05 pF Test Conditions Min Typ Max 0.5 A V V Unit
Breakdown voltage I = 1 mA between VBUS and GND R Forward voltage IF = 10 mA VI/O = 0 V, F = 1 MHz, VOSC = 30 mV VI/O = 1.65 V, VCC = 4.3 V, F = 1 MHz, VOSC = 400 mV VI/O = 0 V, F = 1 MHz, VOSC = 30 mV VI/O = 1.65 V, VCC = 4.3 V, F = 1 MHz, VOSC = 400 mV VI/O = 0 V, F = 1 MHz, VOSC = 30 mV VI/O = 0 V, F = 1 MHz, VOSC = 30 mV
Ci/o-i/o
Ci/o-GND Ci/o-i/o
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DSILC6-4xx
Characteristics
Figure 1.
Relative variation of leakage current versus junction temperature - SOT-666 (typical values)
Figure 2.
Relative variation of leakage current versus junction temperature Flip-Chip (typical values)
IRM[Tj] / IRM[Tj=25C]
100
VR = 5V
100
IRM[Tj] / IRM[Tj=25C]
VR = 5V
10
10
Tj(C)
1 25 50 75 100 125
1 25 50
Tj(C)
75 100 125
Figure 3.
Remaining voltage after Figure 4. DSILC6-4P6 during ESD 15 kV positive surge (air discharge)
10 V/div
Remaining voltage after DSILC6-4F2 during ESD 15 kV positive surge (air discharge)
10 V/div
50 ns/div
50 ns/div
Figure 5.
Remaining voltage after Figure 6. DSILC6-4P6 during ESD 15 kV negative surge (air discharge)
5 V/div
Remaining voltage after DSILC6-4F2 during ESD 15 kV negative surge (air discharge)
5 V/div
50 ns/div
50 ns/div
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Characteristics
DSILC6-4xx
Figure 7.
Figure 8.
0.00
0.00
- 5.00
- 5.00
- 10.00
- 10.00
- 15.00
- 15.00
- 20.00
F(Hz)
- 20.00 100.0k
- 25.00
F (Hz)
100.0M Line 2 Line 4 1.0G
1.0M 3.0M 10.0M 30.0M 100.0M 300.0M Line 2 Line 4 1.0G 3.0G
10.0M
Line 1 Line 3
Figure 9.
Figure 10. Crosstalk results for lines 1/2 and 1/3 DSILC6-4F2
0.00
S21 (dB)
- 20.00
- 40.00
- 60.00
- 80.00
- 100.00
- 120.00
F(Hz)
- 140.00 100.0k
- 140.00
F (Hz)
1.0G
1.0M Xtalk 3.0M 1/2 10.0M 30.0M 100.0M 300.0M Xtalk 1/3 1.0G 3.0G
10.0M
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DSILC6-4xx
Application examples
2
2.1
Application examples
MDDI
Lower Clamshell Upper Clamshell
Hinge
Analog Earpiece Audio
Power
DSILC6-4xx
Base band IC
GND
GND
PRIMARY LCD
SECONDARY LCD
2.2
SMIA
DATA1+ DATA1-
DSILC6-4xx
CLOCK+ CLOCK-
SMIA device
5/11
Application examples
DSILC6-4xx
2.3
Ethernet 1 Gb
+5V
SMP75-8
BI_DA+ BI_DA-
SMP75-8
DATA TRANSCEIVER
SMP75-8
BI_DC+ BI_DC-
SMP75-8
BI_DD+ BI_DD-
2.4
USB 2.0
+ 3.3V DEVICEUPSTREAM RPU TRANSCEIVER
SW2
VBUS RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS GND TX LS/FS + TX LS/FS -
+ 5V
USB connector
Protecting Bus Switch
HUBDOWNSTREAM TRANSCEIVER
SW1
VBUS D+
DRS RS RPD
USBLC6-2SC6
GND
RS RS RPD
SW1
USB connector
VBUS D+
DRS RS
USBLC6-2P6
RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS -
GND
RS
GND TX LS/FS +
DSILC6-4xx
RPD
RS RPD
TX LS/FS -
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DSILC6-4xx
DSI
Product Designation Low capacitance Breakdown Voltage 6 = 6 Volts Number of lines protected 4 = 4 lines Packages P6 = SOT-666 F2 = Flip-Chip
LC
6 - 4
xx
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Package information
DSILC6-4xx
Package information
Table 3.
Ref.
L3 b
A A3 b
D E1
0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.27
b1 D
0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.012 0.067 0.067 0.051
E
L2 E A3
E1 e L1 L2
L3
0.62
2.60
0.99
0.30
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Package information
500 m 50
1.1 mm 50 m
315 m 50
1.57 mm 50m
x x z y ww
All dimensions in mm
In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
8 +/- 0.3
ST E
ST E
ST E
xxz yww
xxz yww
xxz yww
4 +/- 0.1
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Ordering information
DSILC6-4xx
Ordering information
Ordering code DSILC6-4P6 DSILC6-4F2 Marking G EI Package SOT-666 Flip-Chip Weight 2.9 mg 2.22 mg Base qty 3000 5000 Delivery mode Tape and reel Tape and reel
Revision history
Date 10-Aug-2006 04-Jan-2007 Revision 1 2 Initial release. Added Flip-Chip package. Added applications examples for SMIA, Ethernet 1 Gb, and USB. Updated Tj max to 150. Added VRM line in Table 2. Modified MDDI example figure. Modified Functional diagram on page 1 to show Top side view instead of Bump side view of DSILC64F2. Removed VRM line in Table 2. Added characteristic curves specific to each package for ESD, Frequency response and Crosstalk Description of Changes
28-May-2007
10/11
DSILC6-4xx
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