Beruflich Dokumente
Kultur Dokumente
Features
Independently Drives 4 N-Channel FET in Half Bridge or Full Bridge Configurations Bootstrap Supply Max Voltage to 95VDC Drives 1000pF Load at 1MHz in Free Air at 50C with Rise and Fall Times of Typically 10ns User-Programmable Dead Time On-Chip Charge-Pump and Bootstrap Upper Bias Supplies DIS (Disable) Overrides Input Control Input Logic Thresholds Compatible with 5V to 15V Logic Levels Very Low Power Consumption Undervoltage Protection Pb-free Available
Applications
Medium/Large Voice Coil Motors Full Bridge Power Supplies Switching Power Amplifiers High Performance Motor Controls
Ordering Information
PART NUMBER HIP4081AIP HIP4081AIPZ (Note) HIP4081AIB HIP4081AIBZ (Note) TEMP RANGE (C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 PACKAGE 20 Ld PDIP 20 Ld PDIP (Pb-free) 20 Ld SOIC (W) 20 Ld SOIC (W) (Pb-free) PKG. DWG. # E20.3 E20.3 M20.3 M20.3
Pinout
HIP4081A (PDIP, SOIC) TOP VIEW
BHB BHI DIS VSS BLI ALI AHI HDEL LDEL 1 2 3 4 5 6 7 8 9 20 19 18 17 16 15 14 13 12 11 BHO BHS BLO BLS VDD VCC ALS ALO AHS AHO
NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J Std-020B.
AHB 10
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Harris Corporation. Copyright Intersil Americas Inc. 2003, 2004. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
12V BHO BHS BHI BLI HIP4081A ALI AHI ALO AHS AHO BLO LOAD
GND
GND
(1/2 HIP4081A)
AHB 10 HIGH VOLTAGE BUS 80VDC
UNDERVOLTAGE
CHARGE PUMP
DRIVER 11
ALO CBF
1 BHB HIP4081/HIP4081A 12V DIS PWM INPUT 2 BHI 3 DIS 4 VSS 5 BLI 6 ALI 7 AHI 8 HDEL 9 LDEL 10 AHB
BHO 20 BHS 19 BLO 18 BLS 17 VDD 16 VCC 15 ALS 14 ALO 13 AHS 12 AHO 11 12V LOAD
+ 6V
GND
HIP4081A
Absolute Maximum Ratings
Supply Voltage, VDD and VCC . . . . . . . . . . . . . . . . . . . . -0.3V to 16V Logic I/O Voltages . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V Voltage on AHS, BHS . . . -6.0V (Transient) to 80V (25C to 125C) Voltage on AHS, BHS . . . -6.0V (Transient) to 70V (-55C to 125C) Voltage on ALS, BLS . . . . . . . -2.0V (Transient) to +2.0V (Transient) Voltage on AHB, BHB . . . . . . . . VAHS, BHS -0.3V to VAHS, BHS +VDD Voltage on ALO, BLO . . . . . . . . . . . . .VALS, BLS -0.3V to VCC +0.3V Voltage on AHO, BHO . . . . . . . VAHS, BHS -0.3V to VAHB, BHB +0.3V Input Current, HDEL and LDEL . . . . . . . . . . . . . . . . . . -5mA to 0mA Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns NOTE: All Voltages relative to VSS, unless otherwise specified.
Thermal Information
Thermal Resistance (Typical, Note 1) JA (C/W) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 DIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Storage Temperature Range . . . . . . . . . . . . . . . . . . . -65C to 150C Operating Max. Junction Temperature . . . . . . . . . . . . . . . . . . 125C Lead Temperature (Soldering 10s)). . . . . . . . . . . . . . . . . . . . . 300C (For SOIC - Lead Tips Only
Operating Conditions
Supply Voltage, VDD and VCC . . . . . . . . . . . . . . . . . . +9.5V to +15V Voltage on ALS, BLS . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +1.0V Voltage on AHB, BHB . . . . . . . . . VAHS, BHS +5V to VAHS, BHS +15V Input Current, HDEL and LDEL . . . . . . . . . . . . . . . .-500A to -50A Operating Ambient Temperature Range . . . . . . . . . . .-40C to 85C
CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K and TA = 25C, Unless Otherwise Specified TJ = 25C TJS = -40C TO 125C MAX MIN MAX UNITS
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
SUPPLY CURRENTS AND CHARGE PUMPS VDD Quiescent Current VDD Operating Current VCC Quiescent Current VCC Operating Current AHB, BHB Quiescent Current Qpump Output Current AHB, BHB Operating Current AHS, BHS, AHB, BHB Leakage Current AHB-AHS, BHB-BHS Qpump Output Voltage IDD IDDO ICC ICCO IAHB, IBHB IAHBO, IBHBO IHLK VAHB-VAHS VBHB-VBHS All inputs = 0V Outputs switching f = 500kHz All Inputs = 0V, IALO = IBLO = 0 f = 500kHz, No Load All Inputs = 0V, IAHO = IBHO = 0 VDD = VCC = VAHB = VBHB = 10V f = 500kHz, No Load VBHS = VAHS = 80V, VAHB = VBHB = 93V IAHB = IAHB = 0, No Load 8.5 9.5 1 -50 0.6 11.5 10.5 12.5 0.1 1.25 -30 1.2 0.02 12.6 14.5 15.5 10 2.0 -11 1.5 1.0 14.0 7.5 8.5 0.8 -60 0.5 10.5 14.5 15.5 20 3 -10 1.9 10 14.5 mA mA A mA A mA A V
INPUT PINS: ALI, BLI, AHI, BHI, AND DIS Low Level Input Voltage High Level Input Voltage Input Voltage Hysteresis Low Level Input Current High Level Input Current IIL IIH VIN = 0V, Full Operating Conditions VIN = 5V, Full Operating Conditions VIL VIH Full Operating Conditions Full Operating Conditions 2.5 -130 -1 35 -100 1.0 -75 +1 2.7 -135 -10 0.8 -65 +10 V V mV A A
TURN-ON DELAY PINS: LDEL AND HDEL LDEL, HDEL Voltage VHDEL, VLDEL IHDEL = ILDEL = -100A 4.9 5.1 5.3 4.8 5.4 V
GATE DRIVER OUTPUT PINS: ALO, BLO, AHO, AND BHO Low Level Output Voltage High Level Output Voltage Peak Pullup Current VOL VCC-VOH IO + IOUT = 100mA IOUT = -100mA VOUT = 0V 0.7 0.8 1.7 0.85 0.95 2.6 1.0 1.1 3.8 0.5 0.5 1.4 1.1 1.2 4.1 V V A
HIP4081A
Electrical Specifications
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K and TA = 25C, Unless Otherwise Specified (Continued) TJ = 25C PARAMETER Peak Pulldown Current Undervoltage, Rising Threshold Undervoltage, Falling Threshold Undervoltage, Hysteresis SYMBOL IO UV+ UVHYS TEST CONDITIONS VO UT = 12V MIN 1.7 8.1 7.6 0.25 TYP 2.4 8.8 8.3 0.4 MAX 3.3 9.4 8.9 0.65 TJS = -40C TO 125C MIN 1.3 8.0 7.5 0.2 MAX 3.6 9.5 9.0 0.7 UNITS A V V V
Switching Specifications
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K, CL = 1000pF. TJ = 25C TJS = -40C TO 125C MAX 60 70 70 90 25 25 75 85 70 550 620 MIN 50 40 40 30 200 MAX 80 90 90 110 35 35 95 105 90 600 690 UNITS ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
PARAMETER Lower Turn-off Propagation Delay (ALI-ALO, BLI-BLO) Upper Turn-off Propagation Delay (AHI-AHO, BHI-BHO) Lower Turn-on Propagation Delay (ALI-ALO, BLI-BLO) Upper Turn-on Propagation Delay (AHI-AHO, BHI-BHO) Rise Time Fall Time Turn-on Input Pulse Width Turn-off Input Pulse Width Turn-on Output Pulse Width Turn-off Output Pulse Width Disable Turn-off Propagation Delay (DIS - Lower Outputs) Disable Turn-off Propagation Delay (DIS - Upper Outputs) Disable to Lower Turn-on Propagation Delay (DIS - ALO and BLO) Refresh Pulse Width (ALO and BLO) Disable to Upper Enable (DIS - AHO and BHO)
SYMBOL TLPHL THPHL TLPLH THPLH TR TF TPWIN-ON TPWIN-OFF TPWOUT-ON TPWOUT-OFF TDISLOW TDISHIGH TDLPLH TREF-PW TUEN
TEST CONDITIONS
MIN -
RHDEL = RLDEL = 10K RHDEL = RLDEL = 10K RHDEL = RLDEL = 10K RHDEL = RLDEL = 10K
50 40 40 30 240 -
TRUTH TABLE INPUT ALI, BLI X 1 0 0 X NOTE: AHI, BHI X X 1 0 X U/V X 0 0 0 1 DIS 1 0 0 0 X ALO, BLO 0 1 0 0 0 OUTPUT AHO, BHO 0 0 1 0 0
BHI
DIS
4 5
VSS BLI
ALI
AHI
HDEL
LDEL
10
AHB
11 12 13 14 15 16 17 18 19 20
AHO AHS ALO ALS VCC VDD BLS BLO BHS BHO
XLI
XHI
XLO
XHO
THPLH
TLPLH
TR (10% - 90%)
TF (10% - 90%)
XLI
XLO
XHO
(10% - 90%)
(10% - 90%)
TDIS
XLI
XHI
XLO
XHO TUEN
10.0
9.5
9.0
8.5
8.0 0 100 200 300 400 500 600 700 800 900 1000 SWITCHING FREQUENCY (kHz)
25.0
4.0
75C 25C
20.0
3.0
0C -40C
15.0
10.0
2.0
5.0
1.0
0.0 0 100 200 300 400 500 600 700 800 900 1000 0.0 0 100 200 300 400 500 600 700 800 900 1000 SWITCHING FREQUENCY (kHz) SWITCHING FREQUENCY (kHz)
-100
1.5
-110
0.5
1000
-120 -50
-25
100
125
FIGURE 9. ALI, BLI, AHI, BHI LOW LEVEL INPUT CURRENT IIL vs TEMPERATURE
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K and TA = 25C, Unless Otherwise Specified
80
14.0
70
13.0
60
12.0
50
11.0
40
10.0 -40
30 -40
-20
20
40
60
80
100
120
FIGURE 10. AHB - AHS, BHB - BHS NO-LOAD CHARGE PUMP VOLTAGE vs TEMPERATURE
525
500
70
60
475
50
450
40
425 -50
425
70
60
400
50
40
375
30 350 -50
20
-40
-20
20
40
60
80
100
120
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K and TA = 25C, Unless Otherwise Specified (Continued)
80
70
60
60
50
50
40
40
30
30
20 -40
-20
20
40
60
80
100
120
70
70
60
60
50
50
40
40
30
30 20 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C)
20
12.5
12.5
11.5
11.5
10.5
10.5
9.5
9.5
8.5 -40
-20
120
8.5 -40
-20
20
40
60
80
100
120
10
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K and TA = 25C, Unless Otherwise Specified
1500
5.0
4.5
4.0 -40
-20
120
0 10
FIGURE 23. HIGH LEVEL OUTPUT VOLTAGE VCC - VOH vs BIAS SUPPLY AND TEMPERATURE AT 100mA
3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0
1250
750 -40C 500 0C 25C 250 75C 125C 0 10 12 14 BIAS SUPPLY VOLTAGE (V)
14
15
16
FIGURE 24. LOW LEVEL OUTPUT VOLTAGE VOL vs BIAS SUPPLY AND TEMPERATURE AT 100mA
3.5
3.0 2.5 2.0 1.5 1.0 0.5 0.0 6 7 8 9 10 11 12 13 14 15 16 VDD, VCC, VAHB, VBHB (V)
FIGURE 27. LOW VOLTAGE BIAS CURRENT IDD (LESS QUIESCENT COMPONENT) vs FREQUENCY AND GATE LOAD CAPACITANCE
11
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K and TA = 25C, Unless Otherwise Specified (Continued)
200 100 50
FIGURE 28. HIGH VOLTAGE LEVEL-SHIFT CURRENT vs FREQUENCY AND BUS VOLTAGE
9.0 BIAS SUPPLY VOLTAGE, VDD (V) UV+ 8.8 DEAD-TIME (ns) 75 100 125 150 120 150
90
8.6
60
UV8.4
30 8.2 50 25 0 25 50 0 10 50 100 150 200 HDEL/LDEL RESISTANCE (k) 250 TEMPERATURE (C)
12
IN2
IN1
+12V Q1 R29 JMPR5 CONTROL LOGIC SECTION + C6 DRIVER SECTION CR2 HIP4080A/81A U1 C4 1 BHB BHO 20 2 HEN/BHI BHS 19 3 DIS BLO 18 4 V SS 5 OUT/BLI 6 IN+/ALI 7 IN-/AHI 8 HDEL 9 LDEL R33 10 JMPR4 3 IN-/AHI 2 CW CD4069UB 1 2 CW 1 R34 3 CR1 C3 CX C5 CY 10 AHB BLS 17 16 V
DD
POWER SECTION B+ 2 C8
R21
1 3 1 Q3 2
U2 CD4069UB
JMPR1
OUT/BLI
13
13 5 11 ENABLE IN I R32
U2 CD4069UB U2 CD4069UB
12
JMPR2
IN+/ALI
JMPR3 HEN/BHI
HIP4081A HIP4081A
U2
R30
R31 COM
U2
CD4069UB 9 U2 8 O
1. DEVICE CD4069UB PIN 7 = COM, PIN 14 = +12V. 2. COMPONENTS L1, L2, C1, C2, CX, CY, R30, R31, NOT SUPPLIED. REFER TO APPLICATION NOTE FOR DESCRIPTION OF INPUT LOGIC OPERATION TO DETERMINE JUMPER LOCATIONS FOR JMPR1 - JMPR4.
CD4069UB
GND
+12V
JMPR5
R29
R27
R28
R26
C7
C6
R32
L1
IN1 I O IN2
JMPR1 JMPR2 JMPR3 JMPR4
L2
U2
HIP4080/81
HDEL
C5
CX
ALS
R30
CY
BLS
R31
14
B+
COM
HIP4081A HIP4081A
R23
O LDEL
C3
MILLIMETERS MIN 0.39 2.93 0.356 1.55 0.204 24.89 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 26.9 8.25 7.11 NOTES 4 4 8 5 5 6 5 6 7 4 9 Rev. 0 12/93
MIN 0.015 0.115 0.014 0.045 0.008 0.980 0.005 0.300 0.240
A A1 A2 B B1 C D D1 E E1
-C-
eA eC
C
C A B S
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
e eA eB L N
2.93
15
M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES SYMBOL A A1 B MIN 0.0926 0.0040 0.014 0.0091 0.4961 0.2914 MAX 0.1043 0.0118 0.019 0.0125 0.5118 0.2992 MILLIMETERS MIN 2.35 0.10 0.35 0.23 12.60 7.40 MAX 2.65 0.30 0.49 0.32 13.00 7.60 NOTES 9 3 4 5 6 7 8o Rev. 1 1/02
L SEATING PLANE
C D
h x 45o
-A-
D -C-
E e
A1 0.10(0.004) C
H h L N
e
B 0.25(0.010) M C A M B S
NOTES: 1. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width B, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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