PRESS RELEASE

For More Information, Call: For Release 12:00 noon, 30 October 2006
Rob Santilli on 01235 833 934 http://www.aml.co.uk/
e- mail: info@aml.co.uk

Radical moves by AML!

After waiting patiently AML’s customers can finally Activate, Align and Bond in-
situ, in one chamber, but not only that, they will have the new AML ‘Radical’
activation technology which provides benefits over the existing crude plasma
activation used by competitors. The new ‘RAD’ system was pre-ordered by
QinetiQ plc in the UK who will be the first company in the world to have the new
‘RAD’ system. Other customers have been waiting for it to be available before
purchasing a wafer-bonding machine.
This follows the sale of AML’s first 8” machine, which was recently commissioned
at IME in Singapore, and a high profile sale to ISSY is the USA, a leading MEMS
manufacturer. The AML pipeline also contains many new developments including
a new hot embossing tool for the fabrication of polymer micro-nano structures for
micro fluidic devices and bio sensors and the launch of their new BONDCENTRE
which provides wafer bonding process development & services to support the
machines…who knows they might even start making mask aligners!

The ability to bond wafers together at lower and lower temperatures has been a
prime requirement for many in the MEMS, IC, III-V and optical industries. It
simply gives you more design freedom and possibilities. The introduction of the
only in-situ, single machine process that can Activate, Align & Bond in one
chamber will make introducing such techniques much more feasible. AML have
now introduced this into their acclaimed range of Aligner-Wafer Bonders.

The use of Radicals, to activate a surface to enable low temperature bonding,

offers many advantages over the use of plasmas. E.g. plasma roughens the
surface and this can actually making bonding more difficult, and because of this
the plasma process has a very small process window. Radicals are less
damaging to any existing structures that may be present on the wafers, and also
offer a more stable, reliable, better bond and bond strength than plasma
activation. Because the process is carried out in one chamber, it also offers
advantages in terms of yield. Technical Director Tony Rogers and Nick Aitken of
AML are presenting a paper describing this at the prestigious Electrochemical
Society conference in Cancun, Mexico at the end of October.

Rob Santilli says “this is just a reflection of what AML stands for i.e. we come
from a process background rather than just being an engineering or ‘metal
bashing’ operation that look to their customers to develop their machines. We put
a huge effort into R&D and I think this pays off in the machines we produce and
the processes we can offer.
He went on to say, “If anyone now buys a competitor’s machine, then they are
doing their organisations a disservice and their purchasing departments could be
seen as being negligent, the AML machines are that far ahead.” Combine this
with AML’s new BONDCENTRE which offers bonding process development, and
a commercial bonding service, technology transfer and training and you have an
unbeatable, world class capability.

Rob also added “We used to compete on price because our simple, elegant
design and ability to provide two machines (aligner & bonder) for the price of one
enabled us to do this. However we now focus on just providing the very best
machine on the market in terms of performance (including industry best
throughput & best vacuum encapsulation) and value for money (lowest cost per
bond) – so we may no longer be the cheapest, which was especially difficult
when the opposition were having to practically give their machines away to
compete with us! If you haven’t got an AML bonder you’re not serious about
bonding. “

Wafer bonding is a technique that originally had limited applications when it was
first used in MEMS but now the use of the technique has exploded into many
new areas e.g. mainstream IC, III-V, and optical devices and applications e.g.:
• MEMS devices - Pressure Sensors, Accelerometers, Microfluidic devices

• Vacuum encapsulation (absolute pressure, IR detectors…)

• 1st Level Packaging to isolate package induced stresses.
• Wafer scale Packaging – MEMS & IC
• III-Vs e.g. high performance LEDs bonded reflector - heat sink
• 3D Interconnects
• Temporary bonds for handling thin wafers
• Advanced bonded substrates e.g. SOG, SOI, SOS, GaAs on Si…
• Smart cut - Layer transfer

AML’s continued success has enabled them to move into a brand new building,
which they decided to buy rather than rent. Tony Rogers of AML is seen below
accepting the keys. The new building is a few yards away from the new Diamond
Light Synchrotron and the Rutherford Labs that are also on the Harwell site,
which Lord Sainsbury has identified to become one of the UK’s most important
science and Technology Centres.

Please e-mail sue@aml.co.uk for pictures