Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

Specificatio n number: The date:

MAF(AC)-C02 April 4, 2006

Communication specifications

At the deliver y destin ation Device name Model name

Aligner MAF-AMAF-C

This document was accepted. Date of acceptance Date Receipt stamp

Please send back a part of this specifications after it stamps it at once after it accepts.

Tatsmo Ltd.
System equipment

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

Specificatio n number: Approva Examin l ation

MAF(AC)-C02 Making Busines s

A.RS-485 communication command content explanation

1.Link communication specification (1)Interface RS485 (2)Connected method Half duplex multi-drop connection(16 or less) (3)Synchronize system Start-stop synchronization (4)Transmission rate 9600bps 19200bps 38400bps 57600bps (5)Data form One start bit Eight data bit No parity One stop bit (6)Communication code ASCII 7 bit code (7)Body number(address) 0 F(The hexadecimal number and the 0th are the control stations. ) 2.Transmission control character (1)EOT(End of Transmission) A (2)ENQ(Enquiry) (3)ACK(Acknowledge) B (4)NAK(Negative Acknowledge) (5)STX(Start of Text) C (6)ETX(End of Text) Transmission end(04H) Positive response(06H) Negative response(15H) Text beginning(02H) Text conclusion(03H)

Inquiry(05H)

3.Communication protocol 1 Data transmission control procedure(phase) Phase 1 Connection of data transmission line(regulations and off the subject) Phase 2 Establishment of data link Phase 3 Transmission of information Phase 4 Conclusion Phase 5 Cutting of line(regulations and off the subject) (2)Polling procedure Polling is operation that the control station regularly solicits the transmission of the message to the tributary station by one game to prevent the right to become a master station being fought. (procedure 1) Data link initialization (procedure 2) The polling sequence is transmitted. (phase 2) (procedure 3) Data transfer(phase 3) (procedure 4) End of data transmission Transmission of all data end
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Mistake of data form etc. (procedure 5) No response of master station After time of the time-out, the control station is a conclusion of the data link. (procedure 6) Conclusion of data link(phase 4) When it wants to discontinue communicating or you want to conclude the data link

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

(1 ) [ EO T ] (2 ) < ADD>< CMD> [ ENQ ]

(4 ) [ EO T ] (3 ) [ S T X ]< CMD><D A T A> [ E T X ] (5 )

(6 ) [ EO T ]

ADD : CMD :

Figure 1. Polling procedure (3)Selecting procedure Selecting means Control station..plural..bureau..information message..receive..solicit..operation.Farstoserecting is adopted for Selecting. (procedure 1) Initialization of data link (procedure 2) Transmission of selecting sequence(phase 2) (procedure 3) Data transmission (procedure 4) Positive response(phase 3) (procedure 5) Negative response Abnormality of data form etc. (procedure 6) No response After time of the time-out, the master station is a conclusion of the data link. (procedure 7) Conclusion of data link(phase 4)

( )
(1 ) [ EO T ] (2 ) (3 ) < A DD> [ S T X ]< CMD><D A T A> [ E T X ]

[ACK ] [N A K ] (6 ) (4 ) (5 )

(7 ) [ EO T ]

ADD :

CMD : Figure 2. Selecting procedure

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

4.Command No. Comm and 1 CPI 2 RST 3 PAU 4 CNT 5 VVN 6 VVF 7 NYG 8 ALG 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 OCH DEF ERF STS WCH VCH RWF VER RRG DWL UPL RER CER REV RRE PNO TRN ADM ALS RXY SLM RLM

list Summary Reset of CPU Initialization of Aligner Temporary stop Temporary stop release Aligner chuck vacuum ON Aligner chuck vacuum OFF It moves to the wafer specification position. Alignment execution(After it samples it, move to a specified position and a specified angle. ) The wafer is moved to a specified position and a specified angle. (It is effective only after alignment is executed. ) Set of default data value Release of error Demand of status Reading of wafer existence(Electromagnetic valve operation and exist. ) Reading of wafer existence(There is no electromagnetic valve operation. ) Reading of wafer size(It is effective only after the ALG command is executed. ) Reading of soft version Reading of motor control IC and lead register Setting of parameter setting value Reading of parameter setting value Reading of error log Clearness of error log Setting of alignment correction value (offset value) Reading of alignment correction value (offset value) Reading of Aligner software product No. Low speed one-wafer rotation Reading of alignment execution frequency Alignment execution(It is movement, and vacuum OFF in vacuum ON, sampling, and a specified position and a specified angle. ) Chuck XY positional reading Setting of wafer eccentric amount limit value Reading of wafer eccentric amount limit value

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5.Command details explanation (1)CPI Sum mary Exam ple Rema (host) [STX]CPI[ETX] [ACK] After ACK is transmitted, CPU is reset. Please do not transmit the command between 1(sec) after receiving ACK. (Aligner) CPU is reset.

rks (2)RST Sum mary Exam ple Rema rks

Aligner is initialized.

(host) [STX]RST[ETX] [ACK] After ACK is transmitted, Aligner is initialized.

(Aligner)

(3)PAU Sum mary Exam ple Rema rks (4)CNT Sum mary Exam ple Rema rks (5)VVN Sum mary Exam ple Rema (host) [STX]VVN[ETX] [ACK] After ACK is transmitted, the vacuum of Aligner chuck is pulled. (Aligner) The vacuum of Aligner chuck is turned on. (host) [STX]CNT[ETX] [ACK] After ACK is transmitted, the temporary stop is released. (Aligner) The temporary stop of Aligner is released. (host) [STX]PAU[ETX] [ACK] It enters the state of the temporary stop after ACK is transmitted. (Aligner) Aligner is put into the state of the temporary stop.

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rks

(6)VVF Sum mary Exam ple Rema rks (7)NYG Sum mary Exam ple Rema rks (host) [STX]NYG,*[ETX] [ACK] After ACK is transmitted, Aligner chuck is moved to a specified position. RST" After the command is executed, the command is accepted. * :Specified number(1 8) (Aligner) Aligner chuck is moved to a specified position. (host) [STX]VVF[ETX] [ACK] After ACK is transmitted, the vacuum of Aligner chuck is stopped. (Aligner) The vacuum of Aligner chuck is turned off.

(8)ALG Sum mary Exam ple Rema rks Alignment is executed. (After it samples it, move to a specified position and a specified angle. ) (host) [STX]ALG,*[ETX] [ACK] After ACK is transmitted, alignment is executed. RST" After the command is executed, the command is accepted. * :Specified number(1 8) (Aligner)

(9)OCH Sum mary Exam ple Rema rks (host) [STX]OCH,*[ETX] [ACK] After ACK is transmitted, the wafer is rotated to a specified angle. ALG" After the command is executed, the command is accepted. * :Specified number(1 8) (Aligner) The wafer is moved to a specified position and a specified angle.

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(10)DEF Sum mary Exam ple Rema rks (host) [STX]DEF[ETX] [ACK] After ACK is transmitted, it sets it to the default data. The stop position data, the speed data, and the axis rotation correction data are initialized. (Aligner) Each parameter is set to the default data.

(11)ERF Sum mary Exam ple Rema rks (12)STS Sum mary Exam ple Rema rks (13)WCH Sum mary Exam ple Rema rks WCH[ENQ] [STX]WCH,*[ETX] *:Wafer existence information(1: wafer having 0: There is no wafer. ) The electromagnetic valve operation is accompanied. (host) (Aligner) The presence of the wafer is read. (Electromagnetic valve operation and exist. ) STS[ENQ] [STX]STS,***[ETX] ***:The state of operation and refer to the status following table. (host) (Aligner) The status of Aligner is read. (host) [STX]ERF[ETX] [ACK] After ACK is transmitted, Aligner error is released. (Aligner) Aligner error is released.

(14)VCH Sum mary Exam ple Rema VCH[ENQ] [STX]VCH,*[ETX] *:Wafer existence information(1: wafer having 0: There is no wafer. ) The electromagnetic valve operation is not accompanied. The presence of the wafer is read. (There is no electromagnetic valve operation. ) (host) (Aligner)

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rks

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(15)RWF Sum mary Exam ple Rema rks RWF[ENQ] [STX]RWF,*[ETX] *:Wafer kind(09) (0)300mm NOTCHE (1)200mmFLATTED (2)200mmNOTCHE (3)150mmFLATTED(SEMI) (4)150mmFLATTED(JEIDA) (5)150mmNOTCHE (6)125mmFLATTED (7)100mmFLATTED (8) 76mmFLATTED (9)Uncertainty ALG" The wafer type is undecided before it executes it. (host) (Aligner) The wafer size is read.

SEMI/JEIDA is identified based on the following numerical values with main orientation flat. SEMI: Main orientation flat length 57.52.5 (mm) JEIDA: Main orientation flat length 47.52.5 (mm) The identification of SEMI/JEIDA does only six-inch wafer.
(16)VER Sum mary Exam ple Rema rks VER[ENQ] [STX]VER,***[ETX] ***:The version of Aligner software is shown. Ver1.23 is shown for VER,123". (host) (Aligner) The version of Aligner software is read.

(17)RRG Sum mary Exam ple Rema (host) RRG,*,#,$[ENQ] [STX]RRG,*,#,$,%%%%[ETX] *:LSI number is specified. (12) # :The axis number is specified. (1 4) rks $ :Specification of register number(0 5) %%%% :Register information(0000 FFFF) Refer to the content of the motor control register of the postscript for the content of each register. Reading each register is done in two bytes, and replies after it converts it into ASCII code. (18)DWL Sum Each parameter is set. (Aligner) Reading of lead register of motor control IC

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mary Exam ple Rema rks (host) [STX]DWL,*,####,$$$[ETX] [ACK] *:Specification and position numbers #### :Every 1/10 degrees in the angle(0000 3599) $$$ :1/10mm at position(000 550) After ACK is transmitted, the parameter is set. (Aligner)

(19)UPL Sum mary Exam ple Rema rks UPL,*[ENQ] [STX]UPL,*,####,$$$[ETX] *:Specification and position numbers #### :Every 1/10 degrees in the angle(0000 3599) $$$ :1/10mm at position(000 550) (host) (Aligner) A set value of each parameter is read.

(20)RER Sum mary Exam ple Rema rks (host) RER,****[ENQ] [STX]RER,****,##[ETX] ****:History number(00001000) ## :Error code(00 FF) It becomes the latest error as the figure of the history number grows (1-1000). When the error code exceeds 1000, it is deleted from the oldest one. The latest error can be referred to by specifying history number 0. Refer to the error following code table for the error code. (Aligner) The error log is read.

(21)CER Sum mary Exam ple Rema rks (host) [STX]CER[ETX] [ACK] After ACK is transmitted, the error log is cleared. (Aligner) The error log is cleared.

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(22)REV Sum mary Exam ple Rema rks (host) [STX]REV,****[ETX] [ACK] ****:Aligner correction value 1/10 degrees(00003599) On Aligner, it corrects it in the direction of CW (clockwise). Each stop position and each wafer size is common to the correction value. After ACK is transmitted, the axis rotation correction value is set. (Aligner) The axis rotation correction value (offset value) is set.

(23)RRE Sum mary Exam ple Rema rks RRE[ENQ] [STX]RRE,****[ETX] ****:Aligner correction value 1/10 degrees(00003599) Each stop position and each wafer size is common to the correction value. (host) (Aligner) The axis rotation correction value (offset value) is read.

(24)PNO Sum mary Exam ple Rema rks PNO[ENQ] [STX]PNO,*********[ETX] *********: Product No.(000000000 999999999) (host) (Aligner) Aligner software product No. is read.

(25)TRN Sum mary Exam ple Rema rks (host) [STX]TRN[ETX] [ACK] After ACK is transmitted, one wafer low-speed gyration is executed. RST" After the command is executed, the command is accepted. (note)360 is rotated around the chuck. (Aligner) The wafer is made by low speed one rotation.

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(26)ADM Sum mary Exam ple Rema rks (27)ALS Sum mary Exam ple Rema rks Alignment is executed. (It is movement, and vacuum OFF in vacuum ON, sampling, and a specified position and a specified angle. ) (host) [STX]ALS,*[ETX] [ACK] After ACK is transmitted, alignment is executed. RST" After the command is executed, the command is accepted. * :Specified number(1 8) (Aligner) ADM[ENQ] [STX]ADM,**********[ETX] **********:Alignment execution frequency (host) (Aligner) The alignment execution frequency is read.

(28)RXY Sum mary Exam ple Rema rks RXY[ENQ] [STX]RXY,*****,#####[ETX] *****:Chuck X position(1/100mm unit) ##### :Chuck Y position(1/100mm unit) Chuck position based on initialization position (host) (Aligner) XY positional reading of the chuck is done.

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(29)SLM Sum mary Exam ple Rema rks (host) [STX]SLM,****,####,$$$$[ETX] [ACK] ****:Eccentric amount limit (0000-0700)1/100mm unit #### :Eccentric amount X element axially limit (0000-0700)1/100mm unit $$$$ :Eccentric amount Y element axially limit (0000-0700)1/100mm unit After ACK is transmitted, the parameter is set. Limit setting according to amount of wafer of calculating eccentric. It is invalid by 0000 settings. (Aligner) The wafer eccentric amount limit value is set.

(30)RLM Sum mary Exam ple Rema rks RLM[ENQ] [STX]RLM,****,####,$$$$[ETX] ****:Eccentric amount limit (0000-0700)1/100mm unit #### :Eccentric amount X element axially limit (0000-0700)1/100mm unit $$$$ :Eccentric amount Y element axially limit (0000-0700)1/100mm unit (host) (Aligner) A set value of the wafer eccentric amount limit value is read.

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B.RS-232C communication command content explanation

1.Link communication specification (1)Interface RS-232C (2)Communication connection method Full duplex serial communications(crossing cable connection) (3)Synchronize system Asynchronous (Step synchronization) method (4)Transmission rate 9600bps 19200bps 38400bps 57600bps (5)Data form One start bit Eight data bit No parity One stop bit (6)Communication code ASCII 7 bit code 2.Transmission control character (1)ENQ Telecommunication line confirmation(05H) (2)ACK Positive response(06H) (3)NAK Negative response(15H) (4)BUSY It is operating. (11H) 3.Error generation report
Sum mary Exam ple (host) Operation command CR [ACK] when is operating ERR,***[CR] [ACK] Rema rks ***When the error occurs, status is returned. (Aligner) When the error occurs, the error-reporting is compulsorily done.

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

3.Command No. Com mand 1 CPI 2 RST 3 PAU 4 CNT 5 VVN 6 VVF 7 NYG 8 ALG 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
F

list Summary Reset of CPU Initialization of Aligner Temporary stop Temporary stop release Aligner chuck vacuum ON Aligner chuck vacuum OFF It moves to the wafer specification position. Alignment execution (After it samples it, move to a specified position and a specified angle.) The wafer is moved to a specified position and a specified angle. (It is effective only after alignment is executed.) Set of default data value Release of error Demand of status Reading of wafer existence (Electromagnetic valve operation and exist.) Reading of vacuum valve existence (There is no electromagnetic valve operation.) Reading of wafer size (It is effective only after the ALG command is executed.) Reading of soft version Reading of motor control IC and lead register Setting of parameter setting value Reading of parameter setting value Reading of error log Clearing of error log Setting of alignment correction value (offset value) Reading of alignment correction value (offset value) Reading of Aligner software product No. Low speed one-wafer rotation Reading of alignment execution frequency Alignment execution (It is movement, and vacuum OFF in vacuum ON, sampling, and a specified position and a specified angle. ) Chuck XY positional reading Setting of wafer eccentric amount limit value Reading of wafer eccentric amount limit value

OCH DEF ERF STS WCH VCH RWF VER RRG DWL UPL RER CER REV RRE PNO TRN ADM ALS RXY SLM RLM

4.Command details explanation (1)CPI Sum mary Exam ple Rema rks (2)RST Sum mary Aligner is initialized. CPI[CR] [ACK] After ACK is transmitted, CPI is reset. Please do not transmit the command within 1(sec) after receiving ACK. (host) (Aligner) CPU is reset.

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Exam ple RST[CR]

(host)

(Aligner) [ACK] when is operating RST[CR](operation completion response)

[ACK] Rema rks After ACK is transmitted, Aligner is initialized. After operation is completed, the completion response is transmitted.

(3)PAU Sum mary Exam ple Rema rks (4)CNT Sum mary Exam ple Rema rks (5)VVN Sum mary Exam ple VVN[CR] [ACK] when is operating VVN[CR](operation completion response) [ACK] Rema rks After ACK is transmitted, the vacuum of Aligner chuck is pulled. After operation is completed, the completion response is transmitted. (host) (Aligner) The vacuum of Aligner chuck is turned on. CNT[CR] [ACK] After ACK is transmitted, the temporary stop is released. (host) (Aligner) The temporary stop of Aligner is released. PAU[CR] [ACK] It enters the state of the temporary stop after ACK is transmitted. (host) (Aligner) Aligner is put into the state of the temporary stop.

(6)VVF Sum mary Exam (host) (Aligner) The vacuum of Aligner chuck is turned off.

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ple

VVF[CR] [ACK] when is operating VVF[CR](operation completion response) [ACK]

Rema rks

After ACK is transmitted, the vacuum of Aligner chuck is stopped. After operation is completed, the completion response is transmitted.

(7)NYG Sum mary Exam ple NYG,*[CR] [ACK] when is operating NYG[CR](operation completion response) [ACK] Rema rks *:Specified number(18) After the command RST" is executed, the command is accepted. After ACK is transmitted, Aligner chuck is moved to a specified position. After operation is completed, the completion response is transmitted. (host) (Aligner) Aligner chuck is moved to a specified position.

(8)ALG Sum mary Exam ple ALG,*[CR] [ACK] when is operating ALG[CR](operation completion response) [ACK] Rema rks *:Specified number(18) After the commandRST" is executed, the command is accepted. After ACK is transmitted, alignment is executed. After operation is completed, the completion response is transmitted. Alignment is executed. (After it samples it, move to a specified position and a specified angle.) have to turn on and off vacuum valve manually (host) (Aligner)

(9)OCH Sum mary Exam ple OCH,*[CR] [ACK] when is operating OCH[CR](operation completion response) [ACK] Rema rks *:Specified number(18) Only after the commandALG" is executed, it accepts. After ACK is transmitted, the wafer is rotated to a specified angle. After operation is completed, the completion response is transmitted. (host) (Aligner) It is moved to a wafer specification position and a specified angle.

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(10)DEF Sum mary Exam ple DEF[CR] [ACK] when is being set DEF[CR](completion response) [ACK] Rema rks After ACK is transmitted, it sets it to the default data. After the setting is completed, the completion response is transmitted. (host) (Aligner) Each parameter is set to the default data.

(11)ERF Sum mary Exam ple Rema rks (12)STS Sum mary Exam ple Rema rks (13)WCH Sum mary Exam ple Rema rks WCH[CR] WCH,*[CR] *:Wafer existence information(1: wafer having 0: There is no wafer. ) Vacuum ON OFF operation is accompanied. (host) (Aligner) The presence of the wafer is read. STS[CR] STS,***[CR] ***:The state of operation and refer to the postscript status table. (host) (Aligner) The status of Aligner is read. ERF[CR] [ACK] After ACK is transmitted, Aligner error is released. (host) (Aligner) Aligner error is released.

(14)VCH Sum mary Exam (host) (Aligner) The presence of the vacuum sensor is read.

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ple Rema rks (15)RWF Sum mary Exam ple Rema rks

VCH[CR] VCH,*[CR] * vacuum sensor existence information(1: wafer having 0: There is no wafer. : ) Vacuum ON OFF operation is not accompanied.

The wafer size is read.

(host) RWF[CR] RWF,*[CR] *:Wafer kind(09) (0)300mm NOTCHE (1)200mmFLATTED (2)200mmNOTCHE (3)150mmFLATTED(SEMI) (4)150mmFLATTED(JEIDA) (5)150mmNOTCHE (6)125mmFLATTED (7)100mmFLATTED (8) 76mmFLATTED (9)Uncertainty

(Aligner)

ALG" The wafer type is undecided before it executes it. SEMI/JEIDA is identified based on the following numerical values with main orientation flat. SEMI: Main orientation flat length 57.52.5 (mm) JEIDA: Main orientation flat length 47.52.5 (mm)
The identification of SEMI/JEIDA does only six-inch wafer. (16)VER Sum mary Exam ple Rema rks VER[CR] VER,***[CR] ***:The version of Aligner software is shown. Ver1.23 is shown for VER,123". (host) (Aligner) The version of Aligner software is read.

(17)RRG Sum mary Exam ple Rema rks (host) RRG,*,#,$[CR] RRG,*,#,$,%%%%[CR] *:LSI number is specified. (12) # :The axis number is specified. (1 4) $ :Specification of register number(0 5) %%%% :Register information(0000 FFFF) (Aligner) Reading of lead register of motor control IC

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Refer to the content of the motor control register of the postscript for the content of each register. Reading each register is done in two bytes, and replies after it converts it into ASCII code.

(18)DWL Sum mary Exam ple Rema rks (host) DWL,*,####,$$$[CR] [ACK] *:Specification and position numbers #### :Every 1/10 degrees in the angle(0000 3599) $$$ :1/10mm at position(000 550) After ACK is transmitted, the parameter is set. (Aligner) Each parameter is set.

(19)UPL Sum mary Exam ple Rema rks UPL,*[CR] UPL,*,####,$$$[CR] *:Specification and position numbers #### :Every 1/10 degrees in the angle(0000 3599) $$$ :1/10mm at position(000 550) (host) (Aligner) A set value of each parameter is read.

(20)RER Sum mary Exam ple Rema rks (host) RER,****[CR] RER,****,##[CR] ****:History number(00001000) ## :Error code(00 FF) It is the latest error (1-1000). grow the figure of the history number When the error code exceeds 1000, it is deleted from the oldest one. The latest error can be referred to by specifying history number 0. Refer to the postscript error code for the error code. (Aligner) The error log is read.

(21)CER Sum mary Exam (host) (Aligner) The error log is cleared.

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ple Rema rks

CER[CR] [ACK] After ACK is transmitted, the error log is cleared.

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(22)REV Sum mary Exam ple Rema rks (host) REV,****[CR] [ACK] ****:Aligner correction value 1/10 degrees(00003599) On Aligner, it corrects it in the direction of CW (clockwise). Each stop position and each wafer size is common to the correction value. After ACK is transmitted, the axis rotation correction value is set. (Aligner) The axis rotation correction value (offset value) is set.

(23)RRE Sum mary Exam ple Rema rks RRE[CR] RRE,****[CR] ****:Aligner correction value 1/10 degrees(00003599) Each stop position and each wafer size is common to the correction value. (host) (Aligner) The axis rotation correction value (offset value) is read.

(24)PNO Sum mary Exam ple Rema rks PNO[CR] PNO,*********[CR] *********: Product No.(000000000 999999999) (host) (Aligner) Reading of Aligner software product No.

(25)TRN Sum mary Exam ple TRN[CR] [ACK] when is operating TRN[CR](operation completion response) [ACK] Rema rks After ACK is transmitted, one wafer low-speed gyration is executed. After the command ALG" is executed, the command is accepted. After operation is completed, the completion response is transmitted. (note)360 is rotated around the chuck. (host) (Aligner) The wafer is made by low speed one rotation.

26)ADM Sum The alignment execution frequency of operation is read.

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mary Exam ple ADM[CR] ADM,**********[CR] Rema rks (27)ALS Sum mary Alignment is executed. (It is movement, and vacuum OFF in vacuum ON, sampling, and a specified position and a specified angle.). Vacuum valve is turn on/off automatically. Exam ple ALS,*[CR] [ACK] when is operating ALS[CR](operation completion response) [ACK] Rema rks *:Specified number(18) After the command RST" is executed, the command is accepted. After ACK is transmitted, alignment is executed. After operation is completed, the completion response is transmitted. ALS = VVN + ALG + VVF (host) (Aligner) **********:Alignment effect frequency (host) (Aligner)

(28)RXY Sum mary Exam ple Rema rks RXY[CR] RXY,*****,#####[CR] *****:Chuck X position(1/100mm unit) ##### :Chuck Y position(1/100mm unit) Chuck position based on initialization position (host) (Aligner) XY positional reading of the chuck is done.

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(29)SLM Sum mary Exam ple Rema rks (host) SLM,****,####,$$$$[CR] [ACK] ****:Eccentric amount limit (0000-0700)1/100mm unit #### :Eccentric amount X element axially limit (0000-0700)1/100mm unit $$$$ :Eccentric amount Y element axially limit (0000-0700)1/100mm unit After ACK is transmitted, the parameter is set. Limit setting according to amount of wafer of calculating eccentric. It is invalid by 0000 settings. (Aligner) The wafer eccentric amount limit value is set.

(30)RLM Sum mary Exam ple Rema rks RLM[CR] RLM,****,####,$$$$[CR] ****:Eccentric amount limit (0000-0700)1/100mm unit #### :Eccentric amount X element axially limit (0000-0700)1/100mm unit $$$$ :Eccentric amount Y element axially limit (0000-0700)1/100mm unit (host) (Aligner) A set value of the wafer eccentric amount limit value is read.

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

C. Parallel signal command content explanation

1.Input signal table - Command input <1 Nu 1 2 4 8 16 mbe r 0 0 0 0 0 0 1 1 0 0 0 0 2 0 1 0 0 0 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 4 8 16 32>(input) 32 Content of operation

0 0 CPU reset 0 Initialization operation(The power supply is turned on or the error occurs. ) 0 Chuck vacuum ON 0 Chuck vacuum OFF 0 (laser sensor ON) 0 (laser sensor OFF) 0 0 Wafer rotation position fine-tuning value clearing 0 Error release 0 Temporary stop 0 Temporary stop release 0 Wafer rotation position fine-tuning value set +0.1 0 Wafer rotation position fine-tuning value set 0.1 0 Start of calibration 0 Default set of parameter value and speed value 0 After alignment is executed, it moves a specified position and angling. (..setting.. 1) 0 (..setting.. 2) 0 (..setting.. 3) 0 (..setting.. 4) 0 (..setting.. 5) 0 (..setting.. 6) 0 (..setting.. 7) 0 (..setting.. 8) 0 The wafer or the chuck is moved a specified position and angling. (..setting.. 1) 0 (..setting.. 2) 0 (..setting.. 3) 0 (..setting.. 4) 0 (..setting.. 5) 0 (..setting.. 6) 0 (..setting.. 7) 0 (..setting.. 8)

- When the vacuum sensor is turning off, note 24-31 moves the chuck. - The note operation beginning strobe signal is input with 20mS or more and turned off at once. The following command cannot be received the repetition of reset as it is turning on.

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

2.Output signal table - Command reception lady <1>(output) Numb 1 Content of operation er 0 0 It is operating. 1 1 The command can be received. - Error generation report <1>(output) Numb 1 Content of operation er 0 0 It is operating normally. 1 1 Error generation stop - Wafer existence <1>(output) Numb 1 Content of operation er 0 0 There is no wafer. 1 1 Wafer having - Size of wafer <1 2 4>(output) Numb 1 2 4 Content of operation er 0 0 0 0 1 1 0 0 76mm 2 0 1 0 100mm 3 1 1 0 125mm 4 0 0 1 150mm 5 1 0 1 200mm 6 0 1 1 300mm 7 1 1 1 - Notch identification orientation flat/<1>(output) Numb 1 Content of operation er 0 0 Flat 1 1 Notch - SEMI/JEIDA identification <1>(output) Numb 1 Content of operation er 0 0 SEMI 1 1 JEIDA Note SEMI/JEIDA is identified based on the following numerical values with main orientation flat. SEMI :Main orientation flat length 57.52.5 (mm) JEIDA :Main orientation flat length 47.52.5 (mm) The identification of SEMI/JEIDA does only six-inch wafer.

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

- Error Numb er 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

signal <1 2 4 8>(output) 1 2 4 8 Content of operation 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1

The wafer disappeared in alignment. Alignment is not completed exaggeratedly at time. The size of the wafer cannot be judged. The wafer is not set in Aligner.
It exceeded it to the range of detection of the line sensor.

The sampling operation unprocesses it. It is impracticability as for alignment. (It is not possible to judge with Kiz etc.) Execution command reception of initialization of Aligner while unprocessed Reception error of D-I/O command Command execution error(other error) The input value of the line sensor is abnormal. Aligner cannot be initialized. Operation stops to interlock.

The note error signal is cleared by executing the reset command.

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

D. Status list
Code 100 101 102 103 104 105 106 107 108 109 10A 10B 10C 10D 10E 10F 110 111 112 It is standing by by the initialization not processed. The wafer disappeared while alignment was operating. The alignment operation is not completed exaggeratedly at time. 113 114 115 116 117 118 119 11A 11B 11C 11D 11E 11F It is a command execution error (other errors). The input value of the line sensor is abnormal. The initialization operation of Aligner cannot be normally done. Operation stopped to interlock. Error Error Error It exceeded it to the range of detection of the line sensor. The sampling operation is not processed. Alignment cannot be executed. Aligner has not been initialized. It is a reception of D-I/O command error. Error Error Error Error Error The wafer size cannot be judged. The wafer is not set in Aligner. Error Error Error Error The calibration is being executed. It is stopping temporarily. It is interlocking. Initialization is operating. It is standing by. It is standing by. The alignment normality ended. Aligner is operating. Content Remarks

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

E. Error code list

Code 00 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F It is a command execution error (other errors). The input value of the line sensor is abnormal. The initialization operation of Aligner cannot be normally done. Operation stopped to interlock. It exceeded it to the range of detection of the line sensor. The sampling operation is not processed. Alignment cannot be executed. Aligner has not been initialized. It is a reception of D-I/O command error. The wafer size cannot be judged. The wafer is not set in Aligner. There is no error. The wafer disappeared while alignment was operating. The alignment operation is not completed exaggeratedly at time. Content of error

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

F. Motor control IC lead register allocation It is done with the following cracks by each LSI and axis, register (RG), and bit (BIT) of MA Aligner. LSI 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Axis 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 RG 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 BIT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 I/O control and command 1(0" at HI level) I/O control and command 2(0" at HI level) I/O control and command 4(0" at HI level) I/O control and command 8(0" at HI level) I/O control and command 32(0" at HI level) I/O control and command 16(0" at HI level) I/O control and start signal(0" at HI level) Laser comparison output(0" at HI level) Laser power supply ON(0" at HI level) Driving power supply ON(0" at HI level) Aligner vacuum pressure(0" at HI level) Y axis and sensor of ..-.. limit(0" at HI level) Y axis and starting point positional sensor(0" at HI level) Y axis and + limit sensor(0" at HI level) X axis and starting point sensor(0" at HI level) X axis and limit sensor(0" at HI level) With crack

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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.

G. Default fact sheet - Rotation angle and Y bearing delivery position of alignment end

No.

angle(unit: 1/10 degrees) Rotation angle when alignment ends

Y bearing delivery position(unit: 1/10mm)

Distance from starting point position

1 2 3 4 5 6 7 8

0000 0450 0900 1350 1800 2250 2700 3150

0000 0000 0000 0000 0000 0000 0000 0000

- The line sensor position can be angling specified up to 359.9 clockwise by 0. - Y bearing delivery position is specified by the number of movement millis of chucks from the starting point position. Setting of amount of orientation flat angle fine-tuning correction (offset value) fine-tuning(unit:

Amount of angle 1/10 degrees)

0000

Eccentric amount 1/100mm) X eccentric axially 1/100mm) Y eccentric axially 1/100mm)

Setting of eccentric amount limit value limit(unit: limit(unit: limit(unit:

0500 0000 0000

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