DISCRETE SEMICONDUCTORS

DATA SHEET
handbook, halfpage

M3D168

PSMA8.5A to PSMA78A Transient voltage suppressor diodes

Product specication Supersedes data of 1998 Dec 04 1999 Jan 26

Philips Semiconductors

Product specication

Transient voltage suppressor diodes

FEATURES Glass passivated High maximum operating temperature Low leakage current Excellent stability UL 94V-O classified plastic package Transient suppressor stand-off voltage range: 8.5 to 78 V for 26 types Supplied in 12 mm embossed tape.
handbook, 4 columns

PSMA8.5A to PSMA78A
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

DESCRIPTION DO-214AC surface mountable package with glass passivated chip.

Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.

,, ,, ,,
k

cathode band a

Top view

Side view

MSA473

LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PRSM PARAMETER non-repetitive peak reverse power dissipation CONDITIONS 10/1000 s exponential pulse; Tj = 25 C prior to surge; see Figs.3 and 5 VALUE 400 W UNIT

1999 Jan 26

Philips Semiconductors

Product specication

Transient voltage suppressor diodes

ELECTRICAL CHARACTERISTICS Total series Tj = 25 C unless otherwise specified. SYMBOL VF Tstg Tj PARAMETER forward voltage storage temperature junction temperature CONDITIONS IF = 0.5 A

PSMA8.5A to PSMA78A

MIN. 65 65

MAX. 1.2 +175 +175 V C C

UNIT

Per type Tj = 25 C unless otherwise specified. REVERSE VOLTAGE (max) @ IRSM (CLAMPING VOLTAGE) VRSM (V) 14.4 15.4 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 REVERSE SURGE CURRENT (max) REVERSE LEAKAGE CURRENT (max) @ VRWM

REVERSE STAND-OFF VOLTAGE DEVICE (note 1) VRWM (V) PSMA8.5A PSMA9.0A PSMA10A PSMA11A PSMA12A PSMA13A PSMA14A PSMA15A PSMA16A PSMA17A PSMA18A PSMA20A PSMA22A PSMA24A PSMA26A PSMA28A PSMA30A PSMA33A 8.5 9.0 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33

BREAKDOWN VOLTAGE

VBR min. (V) 9.44 10.0 11.1 12.2 13.3 14.4 15.6 16.7 17.8 18.9 20.0 22.2 24.4 26.7 28.9 31.1 33.3 36.7

IT (mA) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

IRSM (A) 27.8 26.0 23.5 22.0 20.1 18.6 17.2 16.4 15.4 14.5 13.7 12.3 11.3 10.3 9.5 8.8 8.3 7.5

IR (A) 5.0 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5

1999 Jan 26

Philips Semiconductors

Product specication

Transient voltage suppressor diodes

PSMA8.5A to PSMA78A

REVERSE STAND-OFF VOLTAGE DEVICE (note 1) VRWM (V) PSMA36A PSMA40A PSMA43A PSMA45A PSMA48A PSMA51A PSMA54A PSMA58A PSMA60A PSMA64A PSMA70A PSMA75A PSMA78A Note 36 40 43 45 48 51 54 58 60 64 70 75 78

BREAKDOWN VOLTAGE

REVERSE VOLTAGE (max) @ IRSM (CLAMPING VOLTAGE) VRSM (V) 58.1 64.5 69.4 72.2 77.4 82.4 87.1 93.6 96.8 103.0 113.0 121.0 126.0

REVERSE SURGE CURRENT (max)

REVERSE LEAKAGE CURRENT (max) @ VRWM

VBR min. (V) 40.0 44.4 47.8 50.0 53.3 56.7 60.0 64.4 66.7 71.1 77.8 83.3 86.7

IT (mA) 1 1 1 1 1 1 1 1 1 1 1 1 1

IRSM (A) 6.9 6.2 5.8 5.5 5.2 4.9 4.6 4.3 4.1 3.9 3.5 3.3 3.2

IR (A) 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5

1. Tolerance and Voltage Designation: Tolerance designation - The type number listed indicates a tolerance of .5% THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 note 2 Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer 35 m, see Fig.4. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.4. For more information please refer to the General part of the associated handbook. CONDITIONS VALUE 25 100 150 UNIT K/W K/W K/W

1999 Jan 26

Philips Semiconductors

Product specication

Transient voltage suppressor diodes

GRAPHICAL DATA

PSMA8.5A to PSMA78A

handbook, halfpage

MGR463

104 handbook, halfpage

MGR465

Ptot (W) 3 PRSM (W)

103

0 0 100 T (C) 200

102 102

101

t2 (ms)

10

Solid line: tie-point temperature. Dotted line: ambient temperature; device mounted on an Al2O3 printed-circuit board as shown in Fig.4.

Tj = 25 C prior to surge.

Fig.3 Fig.2 Maximum total power dissipation as a function of temperature.

Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (exponential pulse).

50

IRSM handbook, halfpage (%) 100 90

4.5 50 2.5

50

10 1.25
MSB213

t t1 t2 In accordance with IEC 60-1, Section 8. t1 = 10 s. t2 = 1000 s.

MGD521

Dimensions in mm.

Fig.5 Fig.4 Printed-circuit board for surface mounting.

Non-repetitive peak reverse current pulse definition.

1999 Jan 26

Philips Semiconductors

Product specication

Transient voltage suppressor diodes

PACKAGE OUTLINE

PSMA8.5A to PSMA78A

Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors

SOD106

H D

A A1 c Q

(1)

2.5 scale

5 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 2.3 2.0 A1 0.05 b 1.6 1.4 c 0.2 D 4.5 4.3 E 2.8 2.4 H 5.5 5.1 Q 3.3 2.7

Note 1. The marking band indicates the cathode. OUTLINE VERSION SOD106 REFERENCES IEC JEDEC DO-214AC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-09

1999 Jan 26

Philips Semiconductors

Product specication

Transient voltage suppressor diodes

DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values

PSMA8.5A to PSMA78A

This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1999 Jan 26

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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1999

SCA61

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Printed in The Netherlands

135002/00/02/pp8

Date of release: 1999 Jan 26

Document order number:

9397 750 05028