ATTENTION

OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES

HK-TH10R-B

Features
10 LAMP LED LOW POWER CONSUMPTION. CABINED VIEWING ANGLE. IDEAL FOR BACKLIGHT AND INDICATOR. PACKAGE: 200PCS / BAG.

Package Dimensions

Description
This devices are made with TS InGaN.
9 . 8

1 0 . 0

1 0 . 8

2 . 0 0 . 5
1 1 A N O D E 2 C A T H O D E 1 2

1 . 5 2 . 5 4
2

Torlerance Grade Medium(m) Chip Material InGaN

Dimension Torlerance (UNIT:mm) 0.5~3 0.1 Emitting Color Blue 3~6 0.1 6~30 0.2 Lens Color Water Clear 30~120 0.3

2 5 . 0 M I N

1 3 . 6 5

Absolute Maximum Rating Item Forward Current Peak Forward Current* Reverse Voltage Power Dissipation Electrostatic discharge Operation Temperature Storage Temperature Lead Soldering Temperature* Symbol IF IFP VR PD ESD Topr Tstg Tsol
Absolute Maximum Rating 20 100 5 80 800 -25+80 -5+45

Unit mA mA V mW V

Max. 260 for 5sec Max.

*IFP ConditionsPulse Width10msec *Tsol Conditions3mm from the base of the epoxy bulb

Typical Optical/ Electrical Characteristics Item Forward Voltage 50% Power Angle Luminous Intensity Prcp Wavelength Symbol VF 2 1/2 Iv D IF=20mA Condition Min.
2.8 -5000 470

Typ.
3.2 20 7500 --

Max.
3.6 --475 20 10

Unit V deg mcd nm mA uA

Recommend Forward ---IF(rec) Current --Reverse Current IR Vr=5V Notes: 1.Absolute maximum ratings Ta=25. 2.Tolerance of measurement of forward voltage0.1V. 3.Tolerance of measurement of peak Wavelength2.0nm. 4.Tolerance of measurement of luminous intensity15%. 5.Tolerance of measurement of angle intensity15%.

 Reliability Performance Test Items And Result

Test Classification Life Test Test Item Test Conditions Test Duration 1000 hrs 50 cycles 50 cycles 1000 hrs 1000 hrs 1000 hrs 5sec. 3times Sample Size 22 pcs 22 pcs 22 pcs 22 pcs 22 pcs 22 pcs 22 pcs 22 pcs AC/RE 0/1 0/1 0/1 0/1 0/1 0/1 0/1 0/1

Room Temperature DC Operating Life Test Thermal Shock Test Temperature Cycle Test

Ta=255IF=20mA -105+1005 5min. 10sec. 5min. -405+855 30min. 5min. 30min. Ta=855 RH =85%5 %RH Ta=1005 Ta=-555 Ta=2305 Load 2.5N(0.25kgf) 0 ~ 90 ~0

Environment Test

High Temperature High Humidity Test High Temperature Storage Low Temperature Storage

Mechanical Test

Resistance to Soldering Heat Lead Integrity

Forward Current vs. Ambient Temperature

6 0 5 0

Relative Intensity vs. Ambient Temperature

Relative Intensity IV%(mcd)
1 . 6 1 . 4 1 . 2 1 . 0 0 . 8 0 . 6

Forward Current If(mA)

4 0 3 0 2 0 1 0 4 0 6 0 8 0 1 0 0 1 2 0

20

0.4 -25

2 5

5 0

7 5

1 0 0

1 2 5

Ambient Temperature Ta()

Ambient Temperature Ta()

Forward Current vs.Forward Voltage

50

Forward Voltage vs. Ambient Temperature

4 . 0 3 . 8
1 0 0

Luminous Spertrum(Ta=25)

SPECTRAL RADIANCE

Forward Current If(mA)

Forward Voltage VF(V)

40 30 20

8 0

RELATIVE RESPONSE 100%=1.642e-G01

0 2 5 5 0 7 5 1 0 0 1 2 5

3 . 6 3 . 4 3 . 2 3 . 0

6 0

4 0

10 0 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5 5 . 0

2 0

2.0

2.8 -25

Forward Voltage VF(V)

Ambient Temperature Ta()

0
400

5 0 0

6 0 0

7 0 0

8 0 0

nm

Soldering:
1. Manual Of Soldering The temperature of the iron tip should not be higher than 260(500) and Soldering within 3 seconds per solder-land is to be observed. 2. DIP soldering (Wave Soldering): Preheating:120~150,within 120~180 sec. Operation heating:2455 within 5 sec.260(Max) Gradual Cooling (Avoid quenching).

Handling:
Care must be taken not to cause to the epoxy resin portion of LED while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of LED with hard or sharp article such as the sand blast and the metal hook. Care must be taken there should be more than 3mm from jointing point to the epoxy resin.

Notes for designing:

Care must be taken to provide the current limiting resistor in the circuit so as to drive the LED within the rated figures .Also caution should be taken not to overload LED with exorbitant voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures .Also the circuit should be designed so as be subjected to reverse voltage when turning off the LED.

Storage:
In order to avoid the absorption of moisture . it is recommended to solder LED as soon as possible after unpacking the sealed envelope. If the envelope is still packed to store it in the environment as following: Temperature:-5~45(23~113)Humidity : RH 60% Max.