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Document T pe: T ia NI Supported: Ye Publish Date: Dec 20, 2011

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Overview

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aea d a ai de ac ac e e P i ed Ci c i B a d (PCB). The defi ed che a ic b hich

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Table of Contents 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. I d ci S e 1: E e I i ia C e I f ai S e 2: E e F i a d Pac age I f ai S e 3: E e S b I f ai S e 4: Se Pi Pa a e e S e 5: Se Ma i g I f a i be ee S b S e 6: Se ec he Si a i M de S e 7: Ma S b Pi he M de N de S e 8: Sa e C e i he Da aba e Te i g he Ne C e i M i i Addi i a Re ce

a d La

Introduction Thi ia i he fi i a e ie f a ic e c e c ea i i NI M i i a d NI U ib a d.

The e f hi ia i e ai h ca c ea e c e f i a i a d/ P i ed Ci c i B a d (PCB) a f i hi M i i . Y i c ea e he c e a d he e if i e a i . The Component Wi ard i he i a ed c ea e c c e i M i i ,a di a h gh a f he e e i ed c ea e a e c e .C e de ai i c de b a d i a i , de , a d f i i f a i . S e i he c ea i ce i c de: E e i gc Se ec i g a f Se ec i g a d/ Se i g i Ma Ma i g he i g he e i i f ai . e e i de i i . c fig a i b . . .

a d he c

edi i g he c b ai b i i he f de . he

a a ee .

Se ec i g he i Sa i g he a i The c

he da aba e. h gh he ce f c ea i g a i a i a d PCB a c a ib e c e i M i i . I he i e e i ea h c ea e a ad a ced c e ih ec i .Y i c ea e a a ih che a ic ,b ef i . Ma c e a e ea ie c ea e a d a e i ed a e e i ed de i a a e c ea e i ai a c e . f

ia e ee e , b , de ci c a ce . M i

Pa 2 f he c e c ea i a ic e , e i ed C ea i g a C C e i NI U ib a d, i e h c ea e a c U ib a d a d a e f a . Thi a d a e i c ea ed a a a eci e defi e he ha e, i e, a d di e i S face M De ice (SMD). Thi f i ca be added he M i i da aba e defi e a c c e . Single Section versus Multi-section Components

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A single-section component is any component that has a single device per chip. A multi-section component is a component that has multiple gates or devices per chip. Examples of multi-section devices include logic gates or operational amplifiers. Letters, increasing from A-Z, enumerate the devices within multi-section components. Simulation-only Components Simulation-only components are designed to help verify designs; they are not transferred to board layout. There is no footprint information associated with them, and their symbols are colored black by default in the Multisim environment to easily identify them. An example of a simulation-only component is an ideal voltage source. Layout-only Components Layout-only components do not contribute to a simulation. They have no associated SPICE or behavior model. When connected parallel to the circuit, they will have no impact on the simulation. When connected in series, they will create an open circuit. Layout-only components are green on the Multisim environment. An example of a Layout-only component is a connector. Creating a Texas Instruments THS7001 Component in NI Multisim The Texas Instruments THS7001 is an example of a multi-section component. This component has a programmable gain amplifier (PGA) with a separate pre-amplification stage presented in a single integrated circuit (IC) package. In this package, both sections share power and reference voltage connections. The programmable gain is digitally controlled via three TTL-compatible inputs. For more details about this component refer to the file d a h e _ h 7 0 . d located in the Downloads section. a e 01pf In the next steps, you will learn to use the Component Wizard to create the THS7001 in Multisim. Step 1: Enter Initial Component Information 1. Select Tools Component Wizard from the Multisim main menu. The Component Wizard window opens. 2. Configure this window as shown in the following figure.

Figure 1. THS7001 component information. 3. Click Next to continue. S ep 2: En er Foo prin and Package Informa ion In this step you will enter the footprint information. According to the datasheet, this component uses the HTSSOP-20 PowerPAD (PWP) footprint. You will select this footprint from the Multisim Master Database. 1. Click on the Select a footprint button. The Select a Footprint window opens.

2. 3. 4. 5.

Select the Master Database in the Database name listbo . Click Filter. This helps ou do a quick search ithin the thousands of footprints. Click the Add ro button. Configure the Filter indo as sho n in Figure 2.

Figure 2. Filtering footprints. 6. Click OK. The Select a Footprint indo displa s a list of footprints as sho n in the follo ing figure.

Figure 3. Selecting the HTSSOP-20(PWP) footprint. 7. Highlight the footprint HTSSOP-20(PWP) and click Select. Note: To learn ho to create a custom footprint in NI Ultiboard take a look at the Creating a Custom Component in NI Ultiboard tutorial.

Now you need to define the number of sections and pins in the component. In this case there are two sections: A is the pre-amplifier section, it contains 7 pins; and B is the programmable gain amplifier section, it contains 12 pins. 8. Configure the multi-section parameters as shown in Figures 4a and 4b.

(a)

(b) Fig re 4. Multi-section parameters. No e: When creating multi-section components, the number of pins must match the number of pins that will be used for that section s symbol not the number of pins of the footprint. In the case of the THS7001, you will add the ground pin and the power-saving shut-down

pin o he

mbol fo bo h ec ion .

9. Click Next o con in e. Step 3: Enter S mbol Information Af e defining he ec ion and elec ing gene a e a defa l mbol, ho e e , o To a e ime hen c ea ing c om pa po ible. Yo can al o load mbol file he foo p in , a ign he mbol info ma ion fo each ec ion. The Component Wizard can edi hi mbol in he Symbol Editor o cop an e i ing one f om he Master Database. , i i ecommended ha o cop e i ing mbol f om he M l i im da aba e he e e in o he Symbol Editor.

1. Click he Edit b on. The Symbol Editor open . 2. Selec File Open and elec he file p e a p s m hi file can be fo nd in he Do nload r_m. , mbol fo he p e-amplifie a ho in he follo ing fig e:

ec ion. The Symbol Editor load

he

Figure 5. S mbol Edi o . 3. Selec File Exit o clo e he Symbol Editor, if a ked o a e change choo e Yes. The p e-amplifie in he p e ie bo (Fig e 6). mbol ill no be di pla ed

If o plan o ha e hi componen i h colleag e a o nd he o ld, i i a good idea o c ea e bo h ANSI and DIN de ice. In hi ca e, impl click on he Copy to b on, hen elec Section A (DIN).

mbol fo he

Figure 6. P e-amplifie A ign a 4. 5. 6. 7. mbol fo he p og ammable gain amplifie ec ion:

mbol.

Selec B in he Section field. Click on Edit o open he Symbol Editor. Open he file p _ m . mloca ed in he Do nload ec ion. gaps Selec File Exit o clo e he Symbol Editor, if a ked o a e change choo e Yes. The p e-amplifie in he p e ie bo a ho n belo :

mbol

ill no

be di pla ed

Figure 7. P og ammable gain amplifie 8. Click Next o con in e.

mbol.

Step 4: Set Pin Parameters I hi e ca e ec he i de e (i , ,a d ) f each i i he i c de e c de ha i f E ec ica R e Chec (ERC). If eeded, ca add hidde i ae i ha d a ea he b b a be ed b he de a d/ he f 1. C fig e he Section a d T pe c a h i he f i g fig e: b . Y ca a c fig e he he i c e i hi e . Hidde i .

Figure 8. Pi 2. C ic Ne t c i e.

a a ee .

Step 5: Set Mapping Information between S mbol and La out Footprint Ma i f i ib e ai . ai b i a d hidde i he PCB f i . E e ha he a i g i acc a e b c a i gi he da a hee

Note: Si

i e hi

e . each a da ig a i be . The c fig ed i d i i e Fig e 9.

1. C ic he c e di g Footprint pins ce f N e ha i 1 a d 17 ha ed i .

Figure 9. M 2. C Ne t .

S ep 6: Selec he Sim la ion Model W : D M U O M M M M M F THS7001, M , M .T A Section . Load from file. h70_ em.i 01p apc A , M M M M . SPICE , . SPICE D .T . 6 7. . , , , .F . SPICE . . , .Y

Note: I 1. S 2. C 3. O

D :

.T

SPICE

Figure 10. SPICE model fo he p e-amplifie 4. Selec he B ab in he Section field. 5. Click on Load from file. 6. Open he file h 7 0 _ g . i loca ed in he Do nload 01pac loaded. 7. Click Ne t o con in e. Step 7: Map S mbol Pins to the Model Nodes

ec ion.

ec ion. The SPICE model fo he p og ammable gain amplifie

ill be

Yo m map he mbol pin o he SPICE model node in o de fo M l i im o co ec l im la e he componen . Fo all bci c i o mac o model , he model node a e picall doc men ed in he heade e of he SPICE model. The e i al o a line ha decla e ha he model i a bci c i model and li he model name follo ed b he model node ha ill connec o e e nal ci c i . Fo he THS7001, he model node of he p e-amplifie and he p og ammable gain amplifie a e li ed in he file and h 7 0 _ g . i , e pec i el . Yo can open he e file in a e edi o . 01pac Le e amine he heade and bci c i (SUBCKT) line fo he p e-amplifie : h70_g.i 01pac

The . U C Tline decla e ha he model i a bci c i model, li SBK he name of he model, and di pla commen line (S U D W , O T U , and o on) de c ibe he o de and ope a ion of he model node . HTON UPT 1. Comple e he pin mapping able fo he p e-amplifie ( ec ion A) a on he o de in hich he appea in he SUBCKT line. ho n in Fig e 11. Yo m

he e e nal node . The

elec he Model nodes ba ed

Figure 11. Section A pin mapping table. 2. Select Section B and complete the pin mapping table according to the follo ing figure:

Figure 12. Section B pin mapping table. 3. Click Ne t to continue.

S ep 8: Sa e Componen in o he Da aba e Once all he p e io 1. 2. 3. 4. 5. ep a e comple e, a e he componen o he User o Corporate Database.

E pand he User Database. Selec he Analog g o p. Click Add Famil and pe Amplifie a he ne famil name. Click OK. Highligh he ne Amplifiers famil a ho n belo :

Figure 13. Sa ing he componen o he da aba e. 6. Click Finish and place o c om componen (Sec ion A and B) on he M l i im o k pace a ea.

Figure 14. THS7001 Sec ion A and B. Te ing he Ne Componen in M l i im

Af e c ea ing and a ing he c om componen , i i a ailable fo e in M l i im. To e hi componen , e he e _ i c i . 1 file loca ed in he Do nload ec ion. Replace U2A i h ec ion A of o ne componen and eplace U2B i h c m 1 ec ion B. To eplace a componen , do ble-click on he componen and hen elec Replace. Then na iga e o he da aba e and loca ion ha o a ed o componen and elec i . Fig e 15 ill ae he e pec ed e pon e of he e ci c i .

Figure 15. Time domain response of the PGA with Gain set to 111. Addi ional Re o ce Creating a Custom Component in NI Ultiboard

Multisim for free for 30 da s

Multisim with an Interactive Demo

Free Courseware for Circuits Do nloads pre_amp.s m datasheet_ths7001.pdf test_circuit.ms11 ths7001_preamp.cir ths7001_pga.cir pg_amp.s m

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