LED Packaging Materials

Honeywell Solutions for HB/UHB LED Devices

Materials to Meet the Packaging Challenges of Next-Generation LEDs

As LED technology evolves to fulfill ever more demanding applications, the materials used in device packaging play an increasingly important role. Color consistency, output performance, life expectancy and manufacturing cost-effectiveness are all impacted by the choices made in electrical interconnect and thermal management materials.
Honeywells 45-plus years of expertise in advanced electronic materials for the semiconductor industry is now being leveraged to provide superior materials for key components of LED device packaging. Our materials fit into both the thermal management and electrical interconnect segments of the LED manufacturing process.

LED technology is taking over the worlds lighting and display applications, due to its high efficiency and flexibility in a variety of form factors. typical hB/UhB lED Packaging Scheme
Denotes Material Provided by Honeywell

Honeywell provides a wide range of material solutions for todays LED device packaging.

ElEctrical intErconnEct
Junction Temperature (T1) LED Die Backside Metallization Die attach interconnect Wire Package Emitter

Backside Metallization
Evaporation SlugsAu, Ag, Ni, Al Plating Anodes Pure Metals

heat Spreader/Slug Solder Dielectric Case Temperature (T2) Board Temperature (T3) tiM

Die Bonding
WireProprietary Pb-free Alloys PreformEutectic Alloys or Specialty Materials EpoxyElectrically Conductive Adhesive (ECA)

Board (MCPCB)

Base Plate

interconnect Wire
Al, Au, Cu

External Heat Sink/ Cooling System

thErMal ManagEMEnt thermal interface Material

LTM6300-SP

Ambient Temperature (T4)

custom heat Spreaders

Made to design or design for application

Electrical Interconnect: Materials for Improved Reliability in HB/UHB LEDs

The intense heat inherent in LEDs (as much as 75% of the power) presents challenges to electrical interconnect materials. Traditional solutions rely on high-cost precious metalsHoneywell is pioneering interconnect solutions of comparable performance using lower cost materials. Backside Metallization Materials available from honeywell
MEtal / alloy Au Al Ag Cu Cu + 500 ppm P Ni W10Ti Sn Pb Sn37Pb Pb5Sn Low alpha solder PUrity (n=9) 4N, 5N, 5N5 4N, 5N, 5N5 4N, 5N 4N, 5N, 5N5 3N, 4N, 5N 3N7, 4N 4N5 4N 4N 4N 4N <0.01 cts/cm2/hr coMMon forMS Evaporation slugs, sputtering targets, anodes Sputtering targets, evaporation slugs Evaporation slugs Evaporation slugs, sputtering targets, anodes Anodes Evaporation slugs Sputtering targets Evaporation slugs, anodes Evaporation slugs Anodes, slab for solder paste manufacturing Anodes, slab for solder paste manufacturing Anodes, evaporation slugs, slab for solder paste manufacturing

BackSiDE MEtallization Evaporation Slugs

Metal evaporation is one of the most common methods of applying die back metallization for LED substrates. This technology is well established for LED wafers from 1to 4-inch and also allows for higher throughput. Honeywell Electronic Materials manufactures a wide variety of evaporation materials. Au, Au alloys, Ag, Ni, Al, Al Alloys, Pb, Sn, Ti, and Zn are available as wire, rods, slugs, pellets, or supercharges.

BEnEfitS
Consistent quality for more than 40 years Full line of reliable metals from which to choose Next-generation development of backside metal integrated with new die attach materials

The standard Honeywell list of elements is: Ag, Al, As, Au, B, Ba, Be, Bi, Ca, Cd, Co, Cr, Cu, Fe, Ga, Ge, Hg, In, Mg, Mn, Mo, Ni, Pb, Pd, Pt, Sb, Si, Sn, Sr, Te, Ti, Tl, V, Zn, and Zr. If one or more these elements are major constituents in the material then they will be reported as major constituents rather than as impurities. Cutting is only used for very hard materials that cannot be sheared effectively.

traditional Pure Metals

5n to 7n Purity te, cd, Bi, zn and Sb
tEllUriUM High-purity tellurium is an essential component in the manufacturing of cadmium telluride (CdTe). caDMiUM Cadmium is used in solar and LED applications. BiSMUth Bismuth is used in the manufacturing of thermoelectric devices. zinc High-purity zinc is used to synthesize certain semiconductors such as CdZnTe. antiMony Antimony combined with other materials is used in the manufacturing of LEDs.

typical lED Die Package View

LED Die Backside Metal (Ag, Au, Ni, Ti) Die Attach Ag Reflective Layer Cu Spreader

tyPical high-PUrity ProDUctS

BaSE ElEMEntS (te, cd, Bi, zn, Sb) in Purities ranging from 99.999% to 99.99999%

Plating anodes
Plating is a primary method for applying flip chip metals due to its higher efficiency. Honeywell supplies Cu, Sn and Sn alloys. All materials are available in various purities and forms.

Electrical Interconnect: Materials for Improved Reliability in HB/UHB LEDs

DiE BonDing MatErialS Wire and Preform
Honeywell is an industry leader in the production of a wide range of die attach products including eutectic and soft solder in a variety of forms. Honeywells next generation of Pb-free die attach materials offers performance comparable to current Au-based solutions at a fraction of the cost.

Preforms are punched from a thin strip of either soft solder or Au

eutectic solder that can range in thickness from as little as 0.001 (25.4mm) to as much as 0.040 (1.016mm) depending upon the alloy. Over 1200 tools are available in disks, squares, rectangles, washers, and windows. Preforms are typically packaged in jars that are backfilled with argon, but special packing can be developed to meet customer requirements.

Electrically conductive adhesive (Eca)

Honeywells proprietary Electrically Conductive Adhesive is either epoxy or silicone based, depending on customer need. Applied between the die and the leadframe, ECA offers superior thermal conductivity when compared to standard silver pastes.
LED Die Eca Die attach

BEnEfitS
Full range of Au and Au-free/Pb-free alloys Open tool list and custom capability Multiple format capability (preform, wire) Industry leader in solder systems Honeywell can manufacture numerous binary through quaternary systems as specified by the customer. Although thousands of alloy compositions can be made, a relatively small number of alloys provide all the characteristics usually required in electronic applications. Eutectic gold systems include pure Au, Au-Sn, Au-Si, and Au-Ge alloys. Where a gold system is not required, soft solder compositions are preferred due to the much lower cost.
Gold Wire LED Die Silver Reflective Layer Die attach Solder (au, auSn, Eca) Cu Heat Slug Solder (Snag, Eca, BiSn)

Polymer Matrix

Filler

Solder

Die

Die

Before Cure

After Cure
Polymer Matrix Filler Solder

Developing and Sampling now:

forMS
Wire is the most common and economical form of soft solder for
die attach. It normally ranges from 0.010 (0.254mm) to 0.050 (1.27mm) in diameter. Wire is coiled on either 6 (15.24cm) or 4 (10.16cm) diameter spools in lengths ranging from 50 (15.2m) to 450 (137m) depending upon the spool size, wire size, and alloy.

Epoxy ECA for shielded HB/UHB LED applications Silicone ECA for blue light sensitive applications

Die

After Cure Microstructure

DIE ATTACH SoLUTIoNS

Strengths & Weaknesses

MEthoD

Minimum contamithickness nation 0.01m 0.25m 2.5m low

Deposition Equipment Evaporation chamber Plating line Screen Printer

Strengths - high Deposition rate - high Purity - low cost tool - good Purity - Deposition on conductive Surfaces - Very low cost tool - rapid Deposition - high Purity - Manual or auto load - Pre form Shaped

Weaknesses - Wide area Deposition - requires Diffusion Step - Expensive tools - Difficult to control - low Deposition rate - high level of impurities - thick layers only - requires Diffusion and cleaning Steps - thick layers only - high cost for automated tools - Difficulties for Placement

EVaPoration Plating ScrEEn Printing

Honeywell offers a variety of solutions to fit customers needs and installed equipment base

Medium

12m

high

PrEforM

25m

low

Pick and Place

intErconnEct WirE
Interconnect wire is produced of aluminum, copper or gold of up to 99.999% purity. Suited for manual or automatic bonding, wire diameters from 1.25 to 0.75mils are routinely produced. Structural homogeneity, surface cleanliness, tensile strength and other mechanical parameters are closely controlled to meet the demands of industry bonding techniques. Strict adherence to customer specification is maintained by documented process control and inspection. In conjunction with an extensive in-house analytical laboratory, manufacturing techniques assure the highest lot-to-lot consistency and yields.

Material Preparation
Carefully controlled amounts of doping or alloying elements are added to Honeywell-refined high-purity gold or aluminum to produce a starting casting. Typically one inch in diameter by one foot long, a starting billet can yield over one million feet (190 miles) of bonding wire. Specially developed casting techniques are employed to control grain size and assure homogeneity within the billet. Once established, these characteristics will be retained through the final manufacturing steps. Emission spectrographic and atomic absorption analytical techniques are utilized to ensure both purity and alloy composition.

Wire Drawing
au/al Wire LED Die

Exact control of wire drawing conditions is required to provide necessary surface finish smoothness. Wire manufacturing is accomplished by first mechanically forming the starting billet wire of a diameter suitable for further size reduction. This strand is then drawn through progressively small diamond dies until the final diameter is reached. Since wire drawing is a cold forming process, the wire is not cut or shaved. A scanning electron microscope is used for routine inspection of both drawing die and in-process wire to assure optimum surface finish of the final product. Process inspection documents provide complete histories on each lot of material throughout the drawing process.

Honeywell is Ready for Your LED Packaging Applications

Our key strengths in chemistry and metallurgy, and expertise in the processes that bring them together for new solutions, has resulted in our long-standing reputation for innovation in electronic material solutions. Whether adapted from our extensive portfolio of proven semiconductor materials, or developed specifically for the LED industry, all Honeywell products undergo rigorous research, testing and quality control protocols. With tried-and-true basic materials such as pure metals or formulated polymers, the same Honeywell standards of excellence are brought to bear.
Our Spokane, WA site is a major R&D and manufacturing facility for electronics packaging materials.

finD oUt MorE

For in-depth technical information about our current Electrical Interconnect and Thermal Management materials for LEDs, contact Honeywell today. www.honeywell.com/sm/em

analytical capabilities
regional r&D (Spokane, Shanghai) to support customer development projects. State-of-the-art Electrical interconnect and thermal Management Development lab rapid prototyping meeting customer needs

Thermal Management: Critical to Color Consistency and Long Life

LED technology is increasingly employed for illumination in addition to information display. The high power output brings significant challenges in the form of heat, which must be managed to prevent device degradation.
Saddle Evaporator

Thermal Interface Material Between PCB/Heat Sink

ltM6300-SP Printable thermal interface Material

Honeywell LTM6300-SP thermal interface material is a new product specifically formulated for LED/LCD applications. The patented* material was designed for application by screen or stencil printing. It has a tailored filler size that provides exceptional performance. LTM6300-SP thermal interface material changes phase at 45C to ensure maximum surface conformance and hence minimal contact resistance. Use of LTM6300 material provides longer life, brighter lights and more stable color in LED/LCD devices.
Street lighting, widely being converted to LED illumination, is an example of the need for reliable thermal management under challenging conditions.

LED Lamp Conducting Block Fixture Housing Condenser

MatErial charactEriSticS1 Physical Properties

(2 mil shim @ 40 PSI) Thermal Conductivity Thermal Impedance Volume Resistivity Viscosity Specific Gravity ltM6300 2.03 0.40 3.0x1015 <150,000 1.8

1 Data shown is based

BEnEfitS
High Thermal Conductivity Ease of application Superior handling and reworkability Application: Screen/Stencil Printable More applications per kilogram due to lower specific gravity Superior reliability performance Coming Soon from Honeywell: New LTM3000 Series which optimizes thermal and dielectric performance for LED devices

W/mC C cm2/W cm cps g/cm3 ltM6300

on preliminary study of the product. Further engineering data will be collected during development to reflect performance in production batch modes.

thermal impedance Post reliability

(Bond Line Thickness of 2mil) End of Line 1000 cycles T/C B 1000 hrs @ 85C & 85%RH 96 hrs HAST 1000 hrs @ 150C 0.25C 0.17C 0.23C 0.23C 0.18C cm2/W cm2/W cm2/W cm2/W cm2/W

thermal impedance vs. Pressure

0.18 0.16 Impedence (Ccm2/W) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 5 10 15 20 25 30 Pressure (PSI) 35 40 45

thermal impedance vs. Bond line thickness

0.70 0.60 Impedence (Ccm2/W) 0.50 0.40 0.30 0.20 0.10 0.00 0 1 2 3 4 Bond Line Thickness (mils) 5 6

*Honeywell U.S. Patents 6,451,422/6,673,434/6,797,382

custom heat Spreaders/heat Slugs

Honeywell is a premier manufacturer of metal components used for thermal transfer in the electronics industry. Our capabilities include complex metal forming, machining, stamping, coining/ forging and reel-to-reel manufacture of these metal components. We are experienced in custom manufacturing of heat spreaders from several materials, including Cu, Al, Kovar, AlSiC, and Stainless Steel. Surface finishing options include: Ni, Au, Ag, Bi, AuSn, Tin, In, and Cu. We also have the capability to plate these metals

on Aluminum which is unique to the industry. Another option offered only by Honeywell is the pre-application of solder onto heat spreaders, which heat Spreader simplifies our customers production processes and supply chain.

BEnEfitS
Quick-turn prototyping Expertise in metal forming and finishing Ability to optimize surface finish for performance Integrated material solutions

Honeywell Electronic Materials: Providing Advanced Solutions for Nearly 50 Years

Honeywell Electronic Materials is a global leader in the supply of critical materials to the semiconductor industry, enabling our customers to develop innovative technologies and overcome manufacturing challenges. Our research and development expertise, global reach, corporate stability and commitment are unmatched. Honeywells expertise in both chemistry and metallurgy and commitment to disciplined quality processes result in the development of superior, cutting-edge technologies that are now being introduced to the LED, flat panel display (FPD), photovoltaic and printable electronics marketplaces.

Honeywells leadership position in electronic materials is based on continuous investment in advanced research, global strategic partnerships and dedication to working closely with our customers. Todays LED manufacturers can count on the same qualities that have supported the worlds top semiconductor houses for decades.

Honeywell Electronic Materials research and development facility in Sunnyvale, CA.

BENEFITS ACRoSS oUR BUSINESS Safety

We are committed to health, safety, and the environment

Customer Service
Worldwide technical support, with dedicated Key Account Managers and Regional Customer Service Support Our Points of Contact coupled with Advanced Manufacturing Management Systems are dedicated to satisfying our customers

Established and Reliable Supplier to the Industry

50 years experience working with technology leaders, backed by a Fortune 100 company We understand your present needs and have the long-term viability to support your future

Materials Research and Application Testing

Global Centers of Excellence for R&Dfacilities in Spokane, WA, Sunnyvale, CA, and Shanghai, China, and 12 manufacturing sites throughout the world The Asia Tech center, our Shanghai R&D facility built in 2004, has been expanded to include over 2100 square meters of space with over 30 state-of-the-art labs Recent results include innovations for the flat panel display (FPD), photovoltaic and printable electronics marketplaces

Quality
ISO9001:2000 and TS16949:2002 certifications

Supply Chain Reliability

World-class supply chain with consistent sourcing and long-term material supply

Technology Focused
Our technology portfolio meets current industry requirements and we are always evolving and innovating to meet the next generation of requirements

Worldwide development, manufacturing and support

United States
Santa Clara, California Sunnyvale, California Spokane, Washington Chandler, Arizona Salt Lake City, Utah Golden, Colorado Bryan, Texas Mansfield, Texas Fombell, Pennsylvania

EE

Europe
Seelze, Germany

asia
Shanghai, China Jincheon, Korea Yaita, Japan Chonburi, Thailand Research & Development Site Manufacturing Site

Honeywell Electronic Materials Customer & Technical Support Hotline: 509-252-2102 Fax: 509-252-8617 www.honeywell.com/sm/em

Although all statements and information contained herein are believed to be accurate and reliable, they are presented without guarantee or warranty of any kind, express or implied. Information provided herein does not relieve the user from the responsibility of carrying out its own tests and experiments, and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concerning the use of materials and processes are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required. GC1540910Rev2 2010 Honeywell International Inc.