Beruflich Dokumente
Kultur Dokumente
DATA SHEET
TDA1557Q 2 x 22 W BTL stereo car radio power amplifier with speaker protection
Product specication File under Integrated Circuits, IC01 May 1992
Philips Semiconductors
Product specication
TDA1557Q
Protected against electrostatic discharge
The TDA1557Q is a monolithic integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package. The device contains 2 22 W amplifiers in BTL configuration and has been primarily developed for car radio applications.
TYP.
UNIT V V V A mA A A k C
Stereo application output power supply voltage ripple rejection DC output offset voltage channel separation channel unbalance closed loop voltage gain 22 46 W dB mV dB dB dB
ORDERING INFORMATION EXTENDED TYPE NUMBER TDA1557Q Note 1. SOT141-6; 1996 August 23. PACKAGE PINS 13 PIN POSITION DIL MATERIAL plastic CODE SOT141R
May 1992
Philips Semiconductors
Product specication
TDA1557Q
input 1
mute switch
POWER STAGE CM
10 VP
VA
output 1A
VA
output 1B
183
18.1 k
TDA1557Q
VP 11 input reference voltage stand-by switch 12 VA stand-by reference voltage mute switch loudspeaker protection 15 k mute reference voltage input 2 13 mute switch CM POWER STAGE mute/stand-by
15 k x1
VA
output 2B
VA
output 2A
183 2
18.1 k 5 8
MCD324 - 1
signal ground
power ground
May 1992
Philips Semiconductors
Product specication
TDA1557Q
The TDA1557Q contains two identical amplifiers with differential input stages, and can be used for bridge applications. The gain of each amplifier is fixed at 46 dB. Special features of this device are: a. mute/stand-by switch low stand-by current low mute/stand-by switching current (low cost supply switch) mute facility b. loudspeaker protection when a short circuit to ground is made, which forces a DC voltage of 1 V across the loudspeaker, a built-in protection circuit becomes active and limits the DC voltage across the loudspeaker to 1 V c. the harmonic distortion at low frequencies can be decreased by connecting two diodes to ground at pin 12.
handbook, halfpage
1 2 3 4 5 6 7 8 9
TDA1557Q
P2 10
M / SS 11 Vref 12 INP2 13
MCD322 - 1
May 1992
Philips Semiconductors
Product specication
TDA1557Q
UNIT V V V V V mJ A A W C C
THERMAL RESISTANCE SYMBOL Rth vj-a Rth vj-c PARAMETER from virtual junction to ambient in free air from virtual junction to case (see Fig.3) THERMAL RESISTANCE 40 K/W 1.5 K/W
handbook, halfpage
output 1
output 2
0.1 K/W
case
MLA382
May 1992
Philips Semiconductors
Product specication
TDA1557Q
TYP.
MAX.
UNIT
V mA V mV
MUTE CONDITION mute voltage output signal in mute position DC output offset voltage VI = 1 V max; f = 1 kHz 3.3 0 V11 0.5 V 0.5 < V11 2 V Isw IP switch-on current positive supply current short-circuit to GND; note 4 Loudspeaker protection V4-6, 7-9 DC voltage across RL 1.0 V V mV mV
STAND-BY CONDITION stand-by voltage DC current in stand-by condition 100 500 60 A A A mA 2.0 V
May 1992
Philips Semiconductors
Product specication
TDA1557Q
TYP.
MAX. 47 36 500 1
UNIT W W W W % Hz Hz kHz dB dB dB dB dB dB k V V V dB dB
15 000 25 46
Notes to the characteristics 1. All characteristics are measured using the circuit shown in Fig.4 2. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V 3. At 18 V < VP < 30 V, the DC output voltage VP/2 4. Conditions: V11 = 0; short-circuit output to GND; switch V11 to MUTE or ON condition (rise time V11 > 10 s). 5. Frequency response externally fixed. 6. Ripple rejection measured at the output with a source-impedance of 0 (max. ripple amplitude of 2 V) and a frequency of 100 Hz. 7. Ripple rejection measured at the output with a source-impedance of 0 (max. ripple amplitude of 2 V) and a frequency between 1 and 10 kHz. 8. Ripple rejection measured at the output with a source-impedance of 0 (max. ripple amplitude of 2 V) and a frequency between 100 Hz and 10 kHz. Pin 12 is decoupled with two diodes to ground. 9. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 10. Noise output voltage independent of RS (Vin = 0).
May 1992
Philips Semiconductors
Product specication
TDA1557Q
mute / stand-by
handbook, full pagewidth
+V 100 nF 11 3 10 2200 F
270 nF input 1
1 4
30 k 6 ground (signal) 2
R L= 4
30 k 7
R L= 4
TDA1557Q
5 8
MCD323 - 1
May 1992
Philips Semiconductors
Product specication
TDA1557Q
SOT141-6
non-concave x D Dh
Eh
A2
B j E A
L3
Q c
1 Z e e1 bp w M
13 m e2 v M
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-6 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
May 1992
Philips Semiconductors
Product specication
TDA1557Q
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
May 1992
10
This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.