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MB2S thru MB6S

Vishay Semiconductors
formerly General Semiconductor

Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier Reverse Voltage
TO-269AA (MBS)
0.029 (0.74) 0.017 (0.43)

200 to 600V Forward Current 0.5A

Mounting Pad Layout


0.023 MIN. (0.58 MIN.)

0.161 (4.10) 0.144 (3.65)

0.272 (6.90) 0.252 (6.40)

Dimensions in inches and (millimeters)


0.272 MAX. (6.91 MAX.)

0.105 (2.67) 0.095 (2.41) 0.195 (4.95) 0.179 (4.55) 0-8 o 0.106 (2.70) 0.090 (2.30)

0.030 MIN. (0.76 MIN.)

0.205 (5.21) 0.195 (4.95) 0.049 (1.24) 0.039 (0.99) 0.062 (1.57) 0.058 (1.47)
0.105(2.67) 0.095(2.41)

0.114 (2.90) 0.094 (2.40)

0.0075 (0.19) 0.0065 (0.16) 0.038 (0.96) 0.019 (0.48)

Mechanical Data

0.008 (0.20) 0.004 (0.10) 0.114 (2.90) 0.110 (2.80) 0.058 (1.47) 0.054 (1.37)

0.016 (0.41) 0.006 (0.15) 0.018 (0.46) 0.014 (0.36)

Features
Plastic package has Underwriters Laboratory Flammability Classification 94V-0 This series is UL recognized under Component Index, file number E54214 Glass passivated chip junctions High surge overload rating: 35A peak Saves space on printed circuit boards High temperature soldering guaranteed: 260C/10 seconds.
A

Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Mounting Position: Any Weight: 0.078 oz., 0.22 g Packaging codes-options: 80-3K per 13" Paper Reel, 36K/carton

Maximum Ratings and Thermal Characteristics (T


Parameter Device marking code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward output rectified current (see Fig. 1) on glass-epoxy P.C.B. on aluminum substrate Peak forward surge current 8.3msec single half sine-wave superimposed on rated load (JEDEC Method) Rating for fusing (t < 8.3ms) Typical thermal resistance per leg Operating junction and storage temperature range Symbol VRRM VRMS VDC IF(AV) IFSM I2t RJA RJA RJL TJ, TSTG

= 25C unless otherwise noted)

MB2S 2 200 140 200

MB4S 4 400 280 400 0.5(1) 0.8(2) 35 5.0 85(1) 70(2) 20(1) 55 to +150

MB6S 6 600 420 600

Unit V V V A A A2sec C/W C

Electrical Characteristics (T

= 25C unless otherwise noted)

Max. instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current at TA = 25C rated DC blocking voltage per leg TA = 125C Typical junction capacitance per leg at 4.0V, 1 MHz

VF IR CJ

1.0 5.0 100 13

V A pF

Notes: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads (2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad

Document Number 88661 26-Mar-02

www.vishay.com 1

MB2S thru MB6S


Vishay Semiconductors
formerly General Semiconductor

Ratings and Characteristic Curves (TA = 25C unless otherwise noted)


Fig. 1 - Derating Curve for Output Rectified Current
0.8 35

Average Forward Rectified Current (A)

Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current Per Leg


Peak Forward Surge Current (A)
30 25 20 15 10 5.0 0
1 Cycle f = 50 Hz TA = 40C Single Half Sine-Wave (JEDEC Method) f = 60 Hz

0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40


Glass Epoxy P.C.B.

Aluminum Substrate

Resistive or Inductive Load

60

80

100

120 140

160

10

100

Ambient Temperature (C)

Number of Cycles

Fig. 3 - Typical Forward Voltage Characteristics Per Leg


Instantaneous Forward Current (A)
10
100

Fig. 4 - Typical Reverse Leakage Characteristics Per Leg


Instantaneous Reverse Leakage Current (A)

TJ = 150C

10

TJ = 125C

1
TJ = 25C

0.1
Pulse Width = 300s 1% Duty Cycle

0.1

TJ = 25C
0.01 0 20 40 60 80 100

0.01 0.2 0.4 0.6 0.8 1.0 1.2 1.4

Instantaneous Forward Voltage (V)

Percent of Rated Peak Reverse Voltage (%)

Fig. 5 - Typical Junction Capactitance Per Leg


30

Junction Capacitance (pF)

25 20 15 10 5.0 0 0.1 1 10

TJ = 25C f = 1 MHz Vsig = 50mVp-p

100 200

Reverse Voltage (V)


www.vishay.com 2 Document Number 88661 26-Mar-02

This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.

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