Printed Sensors in Packaging

Oliver Brand
School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta, GA 30332-0250 E-mail: oliver.brand@ece.gatech.edu

Outline

Introduction to Sensors Sensors & Electronics in Packaging

Time-Temperature Indicators Chemical Sensors RFID Tags Micro/Nanofabrication and MEMS Sensor, Circuitry and RFID Capabilities

Georgia Tech Capabilities for Smart Packaging

Summary

IPST Executive Conference, March 9-10, 2011, Atlanta, GA

Sensors are NOT new .

Paper-Ribbon Hygrometer Vincenzo Viviani Second half 17th century

Anemometer First half 19th century Hair Hygrometer Horace-Benedict de Saussure Late 18th century Magnetic Compass Michael Butterfield 17th century

Source: Institute and Museum of the History of Science, Florence, Italy

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. but they have changed!

Tissot T-touch

Apple iPhone 4

Oregon Scientific Weather Station

LEGO MindStorm

Victorinox Altimeter

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Smart/Intelligent Packaging
Benefits of Smart Packaging Brand protection & anti-counterfeiting Quality & safety Brand enhancement Display and stick out StoraEnso Pharma DDSi Package Communicate Track & trace Supply chain efficiencies Tamper evidence & resistance
Source: VTT Center for Printed Intelligence
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To-Genkyo Freshness Label

How to Manufacture? Printed Intelligence

Source: Dimatix

Use of large substrate (roll-to-roll) printing techniques Solution-printable materials include conductive/semi-conductive polymers, nano-particle materials & chem/bio-active materials Hot embossing, lamination, laser processing, thermal processing, etc., can be added as needed Incorporation of classical siliconbased electronics (e.g. RFID tags) into packaging is possible
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Source: www.PolyIC.com

Time-Temperature Indicators (TTI)

TTI monitor temperature history by providing signal proportional to temperature integral over time Output signal is color change Labels are activated at desired time point Combination with RFID allows to log temperature history Examples include OnVu TTI (BASF), CheckPoint (VITSAB), Food Sentinel System (SIRA), and MonitorMark (3M)

CheckPoint Label

Food Sentinel System Label

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OnVu TTI

Based on organic pigments that change color with time with rate affected by temperature Activation by UV light (UV filter is added afterwards) TTI can be applied as label or printed directly on package

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RFID-Enabled TTI
KSW Microtec VarioSens Data Logger

RFID tag with temperature logging capabilities Monitoring temperaturesensitive goods, e.g. pharmaceuticals and other medical products Logging capability requires Si-based circuitry with memory (8kBit EEPROM), antenna and battery (MnO2-Zn printed battery) Can such a system be fully printed in the future?
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RFID-Enabled Tamper Protection

SecurePak by CYPAK

Printed resistive loops on package to detect damage to package Printed sealing sensor (open/close) Tamper events stored in ASIC with timestamp CYPAK RFID technology to retrieve data
Source: CYPAK, http://www.cypak.com/

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From TT-Indicators to (Bio)Chemical Sensors

Time-temperature indicators and T-loggers can provide valuable information on the cold chain of perishables However, temperature sensors still provide no direct indication on the status of perishables This requires sensors beyond temperature sensors, in particular bio(chemical) sensors to monitor e.g. O2 content in package or chemical/biological food spoilage markers (or food freshness, ripeness)
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ripeSense Label

(Bio)Chemical Sensors in Packaging

What can be sensed besides oxygen penetration into package?

Ammonia release by meat (e.g. Freshness Label by To-Genkyo) Printed biosensors (based on chimeric avidin) targeting detection of small molecules or even bacteria/viruses (e.g. VTT BioFace project)

Many more analytes can be targeted with proper surface functionalization

To-Genkyo Freshness Label

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So, where do we stand today?

We have in Smart Packaging

Printed barcodes Printed time-temperature indicators Chemical sensor labels (a few) RFID technology (capable but still expensive) More applications of micro/nanotechnology in packaging to increase functionality without adding much cost

What is missing?

Mechanical structures (drop/shock sensors), (bio)chemical sensor arrays

Interdisciplinary research efforts to apply above technologies to packaging Move from devices to SYSTEMS

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How can Georgia Tech Innovate in Smart Packaging Development?

In addition to IPST, Georgia Tech has widely acknowledged core strengths in

Micro & Nanoelectronics (Nanotechnology Research Center, www.nrc.gatech.edu) MEMS (Center for MEMS and Microsystem Technologies, www.cmmt.gatech.edu) Organic Electronics/Photonics (Center for Organic Photonics and Electronics, www.cope.gatech.edu)

Georgia Tech Marcus Nanotechnology Building

Georgia Tech actively promotes interdisciplinary research activities

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What are MEMS?

MEMS Micro Electro Mechanical Systems

Use integrated circuit (IC) fabrication steps in combination with micromachining steps to fabricate miniaturized electromechanical components Applied to batch fabricate microsensors, acting as senses of electronic systems Current key applications:

Hard disk read/write heads Inkjet nozzles Pressure sensors Accelerometers & Gyroscopes

Advantage: High volume & low cost, added functionality, circuitry integration MEMS Market: $ 7 Billion in 2009 (Source: Yole Development)

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Accelerometers

Simple spring/mass systems with inertial mass suspended by spring system; sensed is mass deflection upon acceleration Applications

Analog Devices ADXL 202

Automotive, e.g. air bag triggering Consumer, e.g. cell phone, game controllers Medical, e.g. pace makers
Nintendo Wii Remote

Cost in high-volume applications: <$1 per sensor

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Bio(Chemical) Sensors

Miniaturized bio(chemical) sensors are widely investigated using MEMS (microelectromechanical systems) and nanotechnology processes Microsensors based on electrochemical, thermal, mechanical and optical techniques probe chemical (in gas and liquid) and biological analytes Polymers and printing techniques play an ever increasing role

Source: A. Majumdar, UC Berkeley

Source: K. Suslick, UIUC

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Mass-Sensitive VOC Sensors

400 m

Resonant micro-scale weighing analyte molecules absorbed into polymer coating Sub-pg mass resolution enables gas-phase detection of volatile organics in low ppm range

f0 = 368 kHz fmin 0.1 Hz

PIB + Toluene

K.S. Demirci, O. Brand et al., Transducers 2011

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How are MEMS related to Smart/Intelligent Packaging?

While traditionally mainly applied to silicon, MEMS technologies using polymers (or paper) and based on printing have been demonstrated MEMS technologies applied to paper and polymers enable new functionalities through use of mechanical elements and microchannels

Polymer-based biosensors A. Boisen et al., DTU, Denmark

Paper-based sensors & microfluidics G. Whitesides et al., Harvard University

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Polymer Micromachining
Prof. Paul Kohl, ChBE, Georgia Tech Polymer-MEMS requires formation of micromechanical structures with polymers Example: Thermal decomposition of sacrificial polymer (Unity) through polymer overcoat (Avatrel) Application: encapsulation/protection, channels/air-gaps, microstructure release
P. Monajemi, P.J. Joseph, P.A. Kohl, F. Ayazi, J. Micromech. Microeng. 16 (2006) 742-750
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Piezoresistive Polymers
Prof. Oliver Brand, ECE, Georgia Tech

Fundamental investigation of piezoresistivity in conducting polymer films Example: PEDOT:PSS

poly(3,4-ethylenedioxythiophene): poly(4-styrenesulfonate)

Baytron P (128 nm)

PEDOT:PSS shows small negative piezoresistive effect

T. Schweizer, MS Thesis, Georgia Tech

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RFID/Sensor Module Integration

Prof. M. Tentzeris, ECE, Georgia Tech
Resistive stub Resistive + inductive stub

Feed loop

Terminals for IC Radiating body

Radiating bodies

Operation modes Goal: All printed RFID tag (antenna, IC, battery, and sensor) on paper or polymers Operating frequency: UHF (900 MHz), RF (2.45 GHz), potentially up to 60 GHz
Passive Tags System uses RF/EM power from reader Semi-Passive Tags IC uses RF/EM power, sensor uses battery Increased node lifetime & data range ( 30 ft) Active tag IC and sensor utilize battery Increased S/N & data range (>100 ft)

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RFID Printed on Paper: Conductive Ink

Prof. M. Tentzeris, ECE, Georgia Tech
PAPER
Environmental friendly and low cost; Large reel to reel processing

Compatible for printing circuitry by direct write methodologies Can be made hydrophobic and can host nano-scale additives (e.g. fire retardant textiles) Dielectric constant r (~2) close to airs

INK
Consisting of nano-spheres melting and sintering at low temperatures (100

C) After melting a good percolation channel is created for electrons flow Provides a better result than traditional polymer thick film material approach

SEM images of printed silver nano-particle ink, after 15 minutes of curing at 100C and 150C

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Outlook: Smart Packaging Research at Georgia Tech

Combining paper S&T, micro/nanofabrication, MEMS, and organic electronics expertise to Move beyond optical indicators and embed printed electronic capabilities Include mechanical features such as e.g. drop/shock sensors Move from devices to complete systems including sensor, circuitry, power source (e.g., printed battery or solar cell), and communication (e.g., RFID)

Source: Harry Potter, The Daily Prophet

IPST Executive Conference, March 9-10, 2011, Atlanta, GA