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BASIC WIREBONDING
Engr. Deorex David Navaja MSE101
Basics of Wirebonding
What is Wirebonding
Wirebonding is a process of providing electrical connection between the chip and the external leads of the device using very fine bonding wires and a combination of heat, pressure and/or ultrasonic energy at specified time. Wirebonding is a solid phase welding process, where the two metallic materials (wire and pad surface) are brought into intimate contact. Once the surfaces are in intimate contact, electron sharing or inter-atomic diffusion takes place, resulting in the formation of wirebond.
Wirebonding Processes
Wirebonding Thermocompression Ultrasonic Thermosonic Pressure High Low Low Temperature 300 500C 25C 100 150C
Engr. Deorex David Navaja
Wire Au Au, Al Au
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Basics of Wirebonding
Wirebond Forms
Ballbond
Wedge bond
Wire Au Au, Al
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LEAD/POST
HEAT
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Ultrasonic Scrub
* The gold FAB is attached to the chips bonding pad using a vertical force and horizontal ultrasonic scrubbing
Force
HEAT
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* The capillary is lifted while the clamp is open allowing a free movement along the wire
* The capillary is lifted while the clamp is open allowing a free movement along the wire
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* After the desired exit height is reached, the capillary motion would change
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REVERSE HEIGHT
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The capillary compresses the wire and attaches it to the post using ultrasonic scrubbing
It is important that the post be flat so that the scrubbing to form the wedge will be uniform
Ultrasonic Scrub
Force
HEAT
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* The wedge must completely stick to the surface, otherwise, it will be easily lifted.
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* The clamp is closed to pull the remaining wire while the wiretail remains exposed
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Integrated Circuits
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Wirebond Machine
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THE END
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