data sheet

SSOP
Features:

LEADFRAME

Amkors SSOP package portfolio provides: 14 to 56 lead counts 150, 209 and 300 mil body sizes JEDEC and EIAJ package outline standard compliance High-conductivity copper leadframes Wide selection of die pad sizes Broad open-tooled portfolio Solder plate lead finish (Pb-Sn, Sn-Bi, Matte Sn available)

Shrink Small Outline (SSOP) Packages: How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with our standard SOPs. The use of proven, reliable materials coupled with statistically controlled processes, assures long term, worry-free operation of your IC chips. Applications: These packages enable end-products (pagers, portable audio/video, disc drives, radio, RF devices/components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon/GaAs technologies are well addressed by Amkors SSOP product family.

Thermal Resistance:

Multi-Layer PCB
Theta JA (C/W) by Velocity (LFPM)

Pkg 20 ld 28 ld

Body Size 3.9 x 8.7 5.3 x 10.2

Pad Size 2.4 x 3.6 3.84 x 8.10

0 80.8 49.0

200 73.2 36.0

500 69.2 30.0

JEDEC Standard Test Boards

Electrical:

20 ld

5.3 x 7.2 3.9 x 5.4 Longest Shortest 28 ld 3.9 x 9.9 2.4 x 4.8 Longest Shortest 28 ld 5.3 x 10.2 3.9 x 5.1 Longest Shortest 56 ld 7.5 x 18.4 2.5 x 5.6 Longest Shortest

Pkg

Body Size

Pad Size

Lead

Self Inductance

2.260 0.958 1.590 0.757 2.510 0.928 6.410 2.490

(nH)

Bulk Capacitance

0.395 0.209 0.376 0.198 0.463 0.206 0.941 0.497

(pF)

Self Resistance (m)

19.0 9.1 14.1 7.53 21.5 9.57 47.4 23.1

Simulated Results @ 100 MHz

Reliability:

Package reliability is assured for worry-free operation HAST @ 130 C/85% RH, no bias, 96hours T / C @ -65 C / 150'C, 500 cycles HTS @ 150 C, 1000 hours

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION .

www.amkor.com

DS360I Rev Date: 207

data sheet
SSOP
Cross-section SSOP

LEADFRAME

Process Highlights
Die thickness (max) 3.9 mm (150 mil) 16 mil 5.3 mm (209 mil) 17 mil 7.5 mm (300 mil) 25 mil Bond pad pitch 90 micron Strip solder plating 85/15 Sn/Pb Marking Laser/pad ink Lead inspection Optical Pack/ship options Bar code, tube/box, TNR Coplanarity (max) 0.003 inch (0.08 mm)

Standard Material
Standard Leadframe Alloy Die attach material Gold wire Mold compound Lead finish Pb-Free / Green C194 C194 84-1 LMISR4 8290 0.8-1.2 mil diameter 0.8-1.2 mil diameter Nitto MP8000AN Sumitomo G600 85/15 Solder (Sn/Pb) 100% Sn or NiPdAu PPF

Test Services
Program generation/conversion Product engineering Wafer sort Ambient to +165 C test available Burn-in Tape and reel services

Shipping Configuration Options:

Clear antistatic tube 20 inch

SSOP Nominal Package Dimensions

Body Size 150 mil (3.9 mm) 150 mil (3.9 mm) 150 mil (3.9 mm) 150 mil (3.9 mm) 5.3 mm (209 mil) 5.3 mm (209 mil) 5.3 mm (209 mil) 5.3 mm (209 mil) 300 mil (7.5 mm) 300 mil (7.5 mm) 300 mil (7.5 mm) Lead Count 16 20 24 28 14/16 20 24 28 36 48 56 Body Length .194" .342" .342" .391" 6.2 mm 7.2 mm 8.2 mm 10.2 mm .607" .625" .725" Lead Length .040" .040" .040" .040" 1.25 mm 1.25 mm 1.25 mm 1.25 mm .055" .055" .055" Tip To Tip .236" .236" .236" .236" 7.80 mm 7.80 mm 7.80 mm 7.80 mm .406" .406" .406" Body Thkns .058" .058" .058" .058" 1.73 mm 1.73 mm 1.73 mm 1.73 mm .092" .090" .090" Standoff .006" .006" .006" .006" 0.13 mm 0.13 mm 0.13 mm 0.13 mm .009" 0.12" 0.12" Overall Height 0.64" 0.64" 0.64" 0.64" 1.86 mm 1.86 mm 1.86 mm 1.86 mm .101" .102" .102" JEDEC MO-137 MO-137 MO-137 MO-137 MO-150 MO-150 MO-150 MO-150 N/A MO-118 MO-118 Units Per Tube 97 55 55 48 77 66 59 47 31 30 26

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With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkors warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.