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BTA24, BTB24, BTA25 BTA26, BTB26, T25

25 A standard and Snubberless triacs


Features

A2

High current triac Low thermal resistance with clip bonding High commutation (4 quadrant) or very high commutation (3 quadrant) capability BTA series UL1557 certified (File ref: 81734) Packages are RoHS (2002/95/EC) compliant

G A1

A2

A1 A2 G

A1 A2 G

Applications
Applications include the ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits, etc., or for phase control operation in light dimmers, motor speed controllers, and silmilar. The snubberless versions (BTA/BTB...W and T25 series) are especially recommended for use on inductive loads, due to their high commutation performances. The BTA series provides an insulated tab (rated at 2500 VRMS).

TO-220AB Insulated (BTA24)


A1 G A2

TO-220AB (BTB24)

A1 A2 G

RD91 (BTA25)
A2

TOP3 Insulated (BTA26)


A2

Description
Available either in through-hole or surface-mount packages, the BTA24, BTB24, BTA25, BTA26, BTB26 and T25 triac series is suitable for general purpose mains power AC switching. Table 1.
Symbol IT(RMS) VDRM/VRRM IGT (Snubberless) IGT (Standard)

A1 A2 G
A1 A2 G

D2PAK (T25)

TOP3 (BTB26)

Device summary
Parameter RMS on-state current Repetitive peak off-state voltage Triggering gate current Triggering gate current BTA24(1) 25 BTB24 25 BTA25(1) 25 BTA26(1) 25 BTB26 25 600 50 T25 25 600 / 800 35 Unit A V mA mA

600 / 800 600 / 800 600 / 800 600(2) / 800 35 / 50 35 / 50 50 50 50 35 / 50 50

1. Insulated packages 2. 600 V version available only with IGT = 50 mA (Snubberless and Standard) TM: Snubberless is a trademark of STMicroelectronics

July 2007

Rev 10

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www.st.com 12

Characteristics

BTA24, BTB24, BTA25, BTA26, BTB26, T25

1
Table 2.
Symbol

Characteristics
Absolute maximum ratings
Parameter TOP3 PAK / TO-220AB IT(RMS) RMS on-state current (full sine wave) RD91 Ins/ TOP3 Ins. TO-220AB Ins. ITSM It dI/dt Non repetitive surge peak on-state current (full cycle, Tj initial = 25 C) It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Non repetitive surge peak off-state voltage Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range F = 50 Hz F = 60 Hz tp = 10 ms F = 120 Hz tp = 10 ms tp = 20 s Tj = 125 C Tj = 25 C Tj = 125 C Tj = 125 C Tc = 100 C Tc = 75 C t = 20 ms t = 16.7 ms 250 A 260 340 50 VDRM/VRRM + 100 4 1 - 40 to + 150 - 40 to + 125 As A/s V A W C D2 Tc = 105 C Tc = 100 C 25 A Value Unit

VDSM/VRSM IGM PG(AV) Tstg Tj

Table 3.

Electrical characteristics (Tj = 25 C, unless otherwise specified), Snubberless and logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W
T25 BTA/BTB Unit T2535 CW 35 1.3 0.2 50 70 MAX. II Tj = 125 C Tj = 125 C MIN. MIN. 80 500 13 80 500 13 100 1000 22 V/s A/ms 50 70 75 80 mA BW 50 mA V V mA MAX. MAX. MIN. MAX. I - III 35 Test Conditions Quadrant I - II - III I - II - III I - II - III

Symbol IGT(1) VGT VGD IH(2) IL dV/dt (2) (dI/dt)c


(2)

VD = 12 V RL = 33 VD = VDRM RL = 3.3 k Tj = 125 C IT = 500 mA IG = 1.2 IGT VD = 67 %VDRM gate open Without snubber

1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1.

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BTA24, BTB24, BTA25, BTA26, BTB26, T25 Table 4.


Symbol IGT (1) VGT VGD IH(2)) IL dV/dt(2) (dV/dt)c
(2)

Characteristics

Electrical characteristics (Tj = 25 C, unless otherwise specified), standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B
Test Conditions Quadrant I - II - III VD = 12 V RL = 33 MAX. IV ALL VD = VDRM RL = 3.3 k Tj = 125 C IT = 500 mA I - III - IV IG = 1.2 IGT VD = 67 %VDRM gate open (dI/dt)c = 13.3 A/ms MAX. II Tj = 125 C Tj = 125 C MIN. MIN. 160 500 10 V/s V/s ALL MAX. MIN. MAX. 100 1.3 0.2 80 70 mA V V mA Value 50 mA Unit

1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1.

Table 5.
Symbol VTM (1) Vt0
(1)

Static characteristics
Test Conditions ITM = 35 A tp = 380 s Tj = 25 C Tj = 125 C Tj = 125 C Tj = 25 C Tj = 125 C MAX. MAX. MAX. MAX. 3 mA Value 1.55 0.85 16 5 Unit V V m A

Threshold voltage Dynamic resistance VDRM = VRRM

Rd (1) IDRM IRRM

1. for both polarities of A2 referenced to A1.

Table 6.
Symbol

Thermal resistance
Parameter TOP 3 D2PAK / TO-220AB Value 0.6 0.8 C/W RD91 Insulated / TOP3 Insulated TO-220AB Insulated
(1)

Unit

Rth(j-c)

Junction to case (AC) 0.9 1.7 45 50 60

S = 1 cm

D PAK TOP3 / TOP3 Insulated TO-220AB / TO-220AB Insulated

Rth(j-a)

Junction to ambient

C/W

1. S = Copper surface under tab.

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Characteristics

BTA24, BTB24, BTA25, BTA26, BTB26, T25

Figure 1.

Maximum power dissipation versus Figure 2. RMS on-state current (full cycle)
30

RMS on-state current versus case temperature (full cycle)

P(W)
30 25 20 15 10 5

IT(RMS)(A)
BTB26

25
BTA24

20

15

BTB24 / T25xx / BTA25 / BTA26

10

IT(RMS)(A)
0 0 5 10 15 20 25
0 0 25 50

TC(C)
75 100 125

Figure 3.

D2PAK RMS on-state current versus Figure 4. ambient temperature (printed circuit board FR4, copper thickness: 35m) (full cycle)
1E+0
D2PAK (S=1cm2)

Relative variation of thermal impedance versus pulse duration

IT(RMS)(A)
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 50 75 100 125
1E-2 1E-1

K=[Zth/Rth]
Zth(j-c)

Zth(j-a) BTA / BTB24 / T25

Zth(j-a) BTA26

Tamb(C)

tp(s)
1E-3 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

Figure 5.

On-state characteristics (maximum values)

Figure 6.

Surge peak on-state current versus number of cycles

ITM(A)
300
Tj max. Vto = 0.85V Rd = 16 m Tj = Tj max.

ITSM(A)
300 250
t=20ms

100

200
Non repetitive Tj initial=25C

One cycle

150
10
Tj = 25C.

100 50
1 0.5 1.0 1.5 2.0

Repetitive TC=75C

VTM(V)
2.5 3.0 3.5 4.0 4.5

Number of cycles
0 1 10 100 1000

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BTA24, BTB24, BTA25, BTA26, BTB26, T25

Characteristics

Figure 7.

Non-repetitive surge peak on-state Figure 8. current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t
2.5
Tj initial=25C

Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values)

ITSM(A), I2t (A2s)


3000
dI/dt limitation: 50A/s

IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C]

2.0
IGT ITSM

1000
1.5
IH & IL

I2t

1.0

0.5

tp(ms)
100 0.01 0.10 1.00 10.00
0.0 -40 -20 0 20

Tj(C)
40 60 80 100 120 140

Figure 9.

Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values)

Figure 10. Relative variation of critical rate of decrease of main current versus Tj

(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c


2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.1 1.0 10.0 100.0
T2535/CW/BW B

(dI/dt)c [Tj] / (dI/dt)c [Tj specified]


6 5 4 3 2 1

(dV/dt)c (V/s)
0 0 25 50

Tj(C)
75 100 125

Figure 11. D2PAK thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 m)
Rth(j-a)(C/W)
80 70 60 50 40 30 20 10 0 0 4 8 12 16 20 24 28 32 36 40
D2PAK

S(cm)

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Ordering information scheme

BTA24, BTB24, BTA25, BTA26, BTB26, T25

Ordering information scheme


Figure 12. BTA and BTB series

BT A 24 - 600 BW RG Triac series Insulation A = insulated B = non insulated Current 24 = 25 A in TO-220AB 25 = 25 A in RD91 26 = 25 A in TOP3 Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 mA Standard BW = 50 mA Snubberless CW = 35 mA Snubberless Packing mode RG = Tube

Figure 13. T25 series

T 25 35 - 600 G (-TR) Triac series Current 25 = 25 A Sensitivity 35 = 35 mA Voltage 600 = 600 V 800 = 800 V Package G = D2PAK Packing mode Blank = Tube -TR = Tape and Reel

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BTA24, BTB24, BTA25, BTA26, BTB26, T25

Package information

Package information

Epoxy meets UL94,V0 Cooling method: C Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91) Maximum torque value for BTB24 is 0.5 Nm D2PAK dimensions
DIMENSIONS REF. Millimeters Min.
A E L2 C2

Table 7.

Inches Min. 0.169 0.098 0.001 0.027 0.048 0.055 Typ. Max. 0.181 0.106 0.009 0.037

Typ.

Max. 4.60 2.69 0.23 0.93

A A1 A2
D

4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.40 0 1.40

B B2

L L3 A1 B2 B R

C
C

0.60 1.36 9.35

0.017 0.047 0.352

0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016

C2 D

E
A2 2mm min. FLAT ZONE

10.28 0.393 5.28 0.192

G L
V2

15.85 0.590 1.40 1.75 0.050 0.055

L2 L3 R V2

Figure 14. D2PAK footprint dimensions (in millimeters)


16.90

10.30 1.30

5.08

8.90

3.70

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Package information Table 8. RD91 dimensions

BTA24, BTB24, BTA25, BTA26, BTB26, T25

DIMENSIONS REF. Millimeters Min.


A2 L2 L1

Inches Min. Max. 1.575 1.177 1.193 0.867 1.063 0.531 0.650 0.945 0.551 0.138 0.077 0.027 0.157 0.441 0.122 0.067 33 28 0.118 0.035 0.177 0.535 0.138 0.075 43 38

Max. 40.00

A A1 A2 29.90

30.30 22.00 27.00

B2 C B1

B B1
C2 A1 C1

13.50

16.50 24.00 14.00 3.50

B2 C

N2

N1 B F

C1 C2 E3 F I L1 L2 N1 N2 1.95 0.70 4.00 11.20 3.10 1.70 33 28

3.00 0.90 4.50 13.60 3.50 1.90 43 38

E3 I A

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BTA24, BTB24, BTA25, BTA26, BTB26, T25 Table 9. TOP3 (insulated and non_insulated) dimensions

Package information

DIMENSIONS REF. Millimeters Min.


H R B A

Inches Min. 0.173 Typ. Max. 0.181 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.222 0.144 0.164 0.055 0.181

Typ.

Max. 4.6

A B C

4.4 1.45 14.35 0.5 2.7 15.8 20.4 15.1 5.4 3.4 4.08 1.20 4.60

1.55 0.057 15.60 0.565 0.7 2.9 0.020 0.106

D
F G

E F
P

16.5 0.622 21.1 0.815 15.5 0.594 5.65 0.213 3.65 0.134 4.17 0.161 1.40 0.047

G
C

H
J J D E

J K L P R

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Package information Table 10.

BTA24, BTB24, BTA25, BTA26, BTB26, T25 TO-220AB (insulated and non-insulated) dimensions
DIMENSIONS REF. Millimeters Min. A a1
B I L F A b2 C

Inches Min. Typ. Max. 0.625 0.147

Typ.

Max.

15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75

15.90 0.598

a2 B b1 b2 C

14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 2.70 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.094 0.244 0.147

0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151

I4 l3 a1 l2 c2

c1 c2 e

a2

M b1 e c1

F I I4 L l2 l3 M

15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 1.70 1.70 0.104 0.044 0.044 0.102 0.116 0.066 0.066

In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

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BTA24, BTB24, BTA25, BTA26, BTB26, T25

Ordering information

Ordering information
Table 11. Ordering information
Marking BTA/BTB24 xxxyz BTA25xxxyz BTA26xxxyz BTB26600B T2535 xxxG T2535 xxxG Package TO-220AB RD91 TOP3 Ins. TOP3 D2PAK Weight 2.3 g 20 g 4.5 g 4.5 g 1.5 g 1000 Tape and reel Base qty Delivery mode 50 25 30 30 50 Tube Bulk Tube Tube Tube

Ordering type BTA/BTB24-xxxyzRG BTA25-xxxyz BTA26-xxxyRG BTB26-600BRG T2535-xxxG T2535-xxxG-TR

Note: xxx = voltage, y = sensitivity, z = type

Revision history
Table 12.
Date Oct-2002 13-Feb-2006 31-May-2006 31-Jul-2006

Revision history
Revision 6A 7 8 9 Previous update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Reformatted to current standard. Tc in figure 3 changed to Tamb Typing error corrected on page 1 (BTB124 instead of BTB24) Added BTB26-600BRG. Restructured cover page and section 2: Ordering information scheme on page 6 to simplify product selection. Thermal resistance values updated in Table 6 and Figure 2. Graphic for I2t updated in Figure 7. Description of changes

05-Jul-2007

10

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BTA24, BTB24, BTA25, BTA26, BTB26, T25

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