HI-SINCERITY

Spec. No. : HE6110

Issued Date : 1992.09.30
Revised Date : 2001.07.18
Page No. : 1/4

MICROELECTRONICS CORP.

HE8050S
NPN EPITAXIAL PLANAR TRANSISTOR

Description
The HE8050S is designed for general purpose amplifier applications.

Absolute Maximum Ratings

Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 C
Junction Temperature ................................................................................... +150 C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25C) ............................................................................... 625 mW
Maximum Voltages and Currents (Ta=25C)
VCBO Collector to Base Voltage ........................................................................................ 25 V
VCEO Collector to Emitter Voltage ..................................................................................... 20 V
VEBO Emitter to Base Voltage ............................................................................................. 5 V
IC Collector Current ....................................................................................................... 700 mA

Characteristics (Ta=25C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
VBE(on)
*hFE1
*hFE2
fT
Cob

Min.
25
20
5
100
150
-

Typ.
140
-

Max.
1
100
0.5
1
500
10

Unit
V
V
V
uA
nA
V
V

MHz
pF

Test Conditions
IC=10uA, IE=0
IC=1mA, IB=0
IE=10uA, IC=0
VCB=20V, IE=0
VEB=5V, IC=0
IC=0.5A, IB=50mA
VCE=1V, IC=150mA
VCE=1V, IC=150mA
VCE=1V, IC=500mA
VCE=10V, IC=20mA, f=100MHz
VCB=10V, f=1MHz, IE=0

*Pulse Test : Pulse Width 380us, Duty Cycle2%

Classifications of hFE
Rank
hFE1
hFE2

HE8050S

C
100-180
-

C1
100-180
>50

D
160-300
-

D1
160-300
>50

E
250-500
-

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6110

Issued Date : 1992.09.30
Revised Date : 2001.07.18
Page No. : 2/4

MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current

Saturation Voltage & Collector Current

1000

Saturation Voltage (mV)

hFE

1000

VCE=1V

100

100

VCE(sat) @ IC=10IB

10

10
0.1

10

100

0.1

1000

Collector Current (mA)

100

1000

Cutoff Frequency & Collector Current

On Voltage & Collector Current

1000

Cutoff Frequency (MHz)

10000

On Voltage (mV)

10

Collector Current (mA)

1000
VBE(on) @ VCE=1V

VCE=10V

100

10

100
0.1

10

100

1000

10

100

1000

Collector Current (mA)

Collector Current (mA)

Capacitance & Reverse-Biased Voltage

Safe Operating Area

100

10000
PT=1ms

Collector Current-IC (mA)

Capacitance (pF)

PT=100ms

10

Cob

1000
PT=1s
100

10

1
0.1

10

Reverse Biased Voltage (V)

HE8050S

100

10

100

Forward Voltage-VCE (V)

HSMC Product Specification

HI-SINCERITY
MICROELECTRONICS CORP.

Spec. No. : HE6110

Issued Date : 1992.09.30
Revised Date : 2001.07.18
Page No. : 3/4

PD-Ta
700

Power Dissipation-PD(mW)

600
500
400
300
200
100
0
0

20

40

60

80

100

120

140

160

Ambient Temperature-Ta( C)

HE8050S

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6110

Issued Date : 1992.09.30
Revised Date : 2001.07.18
Page No. : 4/4

MICROELECTRONICS CORP.
TO-92 Dimension
2

Marking :
HSMC Logo

B
1 2

Product Series

Part Number

Date Code

Rank

Laser Mark
HSMC Logo
Product Series

D
Part Number

H
I

Ink Mark

Style : Pin 1.Emitter 2.Collector 3.Base

E
F

3-Lead TO-92 Plastic Package

HSMC Package Code : A
*:Typical

Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480

DIM
A
B
C
D
E
F

Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76

DIM
G
H
I
1
2
3

Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5
*2
*2

Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5
*2
*2

Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory :

Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931

HE8050S

HSMC Product Specification

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