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Specifications

Essentials Status Launch Date Processor Number # of Cores # of Threads Clock Speed Intel Smart Cache Bus/Core Ratio DMI Instruction Set Instruction Set Extensions Embedded Options Available Lithography Max TDP Recommended Customer Price Memory Specifications Max Memory Size (dependent on memory type) Memory Types # of Memory Channels Max Memory Bandwidth Physical Address Extensions ECC Memory Supported Graphics Specifications Integrated Graphics Graphics Base Frequency Graphics Max Dynamic Frequency Intel Flexible Display Interface (Intel FDI) Intel Clear Video HD Technology Dual Display Capable Macrovision* License Required # of Displays Supported Expansion Options PCI Express Revision PCI Express Configurations # of PCI Express Ports Package Specifications Max CPU Configuration TJUNCTION Package Size Processing Die Size Launched Q3'10 i3-380M 2 4 2.53 GHz 3 MB 19 2.5 GT/s 64-bit SSE4.1, SSE4.2 No 32 nm 35 W $225 8 GB DDR3800/1066 2 17.1 GB/s 36-bit No Yes 500 MHz 667 MHz Yes Yes Yes No 2 2.0 1x16 1 1 90C for rPGA, 105C for BGA rPGA 37.5mmx 37.5mm, BGA 34mmx28mm 81 mm2

Specifications
Essentials Status Launch Date Processor Number # of Cores # of Threads Clock Speed Intel Smart Cache Bus/Core Ratio DMI Instruction Set Instruction Set Extensions Embedded Options Available Lithography Max TDP Recommended Customer Price Memory Specifications Max Memory Size (dependent on memory type) Memory Types # of Memory Channels Max Memory Bandwidth ECC Memory Supported Launched Q1'11 i3-2310M 2 4 2.1 GHz 3 MB 21 5 GT/s 64-bit AVX No 32 nm 35 W $225 16 GB DDR3-1066/1333 2 21.3 GB/s No

Graphics Specifications Processor Graphics Intel HD Graphics 3000 Graphics Base Frequency Graphics Max Dynamic Frequency Graphics Output Intel Quick Sync Video Intel InTru 3D Technology Intel Insider Intel Wireless Display Intel Flexible Display Interface (Intel FDI) Intel Clear Video HD Technology Dual Display Capable Macrovision* License Required # of Displays Supported Expansion Options PCI Express Revision 650 MHz 1.1 GHz eDP/DP/HDMI/SDVO/CRT Yes Yes Yes Yes Yes Yes Yes No 2 2.0

# of Processing Die Transistors Graphics and IMC Lithography Graphics and IMC Die Size # of Graphics and IMC Die Transistors Sockets Supported Low Halogen Options Available Advanced Technologies Intel Turbo Boost Technology Intel vPro Technology Intel Hyper-Threading Technology Intel Virtualization Technology (VT-x)

382 million 45 nm 114 mm2 177 million PGA988 See MDDS No No Yes Yes

PCI Express Configurations

1x16, 2x8, 1x8+2x4

# of PCI Express Ports 1 Package Specifications Max CPU Configuration TJUNCTION

Package Size Graphics and IMC Lithography Sockets Supported

Intel Virtualization Technology for No Directed I/O (VT-d) Intel Trusted Execution Technology No AES New Instructions Intel 64 Idle States Enhanced Intel SpeedStep Technology Thermal Monitoring Technologies Intel Fast Memory Access Intel Flex Memory Access Execute Disable Bit No Yes Yes Yes Yes Yes Yes Yes

Low Halogen Options Available Advanced Technologies Intel Turbo Boost Technology No Intel vPro Technology No Intel Hyper-Threading Technology Yes Intel Virtualization Technology (VT-x) Yes

1 85C (PGA); 100C (BGA) 37.5mm x 37.5mm *rPGA988B); 31mm x 24mm (BGA1023) 32 nm FCBGA1023, PPGA988 See MDDS

Intel Virtualization Technology for No Directed I/O (VT-d) Intel Trusted Execution Technology No AES New Instructions Intel 64 Intel Anti-Theft Technology Intel My WiFi Technology 4G WiMAX Wireless Technology Idle States Enhanced Intel SpeedStep Technology Intel Demand Based Switching Thermal Monitoring Technologies Intel Fast Memory Access Intel Flex Memory Access Execute Disable Bit No Yes Yes Yes Yes Yes Yes No Yes Yes Yes Yes