BLACKSTAR™

SOLAR PANEL DICING & SCRIBING SYSTEM

The BlackStar™ is a Wafer Dicing System utilizing Fantom Wafer Dicing Technology™
(FWDT™) invented and patented by parent company Fonon Technology
International.

Solar panels have the highest value at the dicing stage which is a direct function
of the BlackStar™. The BlackStar™ increases the yield per panel and maximizes
throughput while minimizing the heat affected zone (HAZ) specifically for solar
cells and low-K substrates. This system is used for dicing many semiconductor
materials and silicon composites in solar panel production.

The BlackStar™ is the alternative to mechanical saws which may damage thin and
complex solar cell materials and substrates while cutting.
Fantom Wafer Dicing Technology (FWDT™)
now available for silicon panel processing
BlackStar™ Series Benefits
• Combination of FWDT™ and proprietary laser source results in a 50% cost
reduction per chip from processed wafers
• Fastest trimming, scribing and dicing speed available in the industry
• Smallest footprint in the industry with no external components
• Virtually no maintenance, 24/7/365 reliability
• Over 50,000 hrs. MTBF on proprietary solid-state laser source
• More yield per wafer
• Smallest HAZ (Heat Affected Zone)

Process Capabilities
• Scribing speed approximately 100 mm/sec.
• Maximum stroke 320 x 320 mm.
• Capable of dicing wafers in frames up to 12”.
• Frame: Standard frame types (5”, 6”, 8” or 12”)
• Holding tape: standard low tack, thermal, or UV. (Tape-less option available
for some substrates)
• Generates no chips or wafer particles
• Does not overheat the wafer surface; no long term edge micro fracturing
• Ability to handle the miniature substrates and micro displays
• Wafer Material thickness - 500-micron max.

Advantages for Users

• The BlackStar™ can process twice as many wafers as conventional dicing
systems
• Dual-station systems can double production output with marginal increase in
footprint
• Produces wafers 3 to 5 times mechanically stronger without additional edge
processing
• Reduced training level requirements for operators
• Small footprint: Reduced space for wafer processing
• Built-in modular (easy to replace) power supply, amplifiers, PC control, and
high voltage electronics
• Modular design utilizes standard components for easier service
• “Plug-n-play” characteristics give the system ease of installation and a quick
start-up time
• Service: No laser service needed; no optics service required
• Cost of Ownership: No gas consumption, no special requirements on quality
of industrial space
• Plug & Play Capabilities
• Internet-ready
• Easy of installation allows for quick start-up

400 Rinehart Road • Lake Mary, FL 32746 USA

www.advancedsolarphotonics.com • info@advancedsolarphotonics.com
Tel: 407.829.2613 • Fax: 407.804.1002