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2SK2225

Silicon N Channel MOS FET


REJ03G1005-0200 (Previous: ADE-208-140) Rev.2.00 Sep 07, 2005

Application
High speed power switching

Features
High breakdown voltage (VDSS = 1500 V) High speed switching Low drive current No Secondary breakdown Suitable for switching regulator, DC-DC converter

Outline
RENESAS Package code: PRSS0003ZA-A (Package name: TO-3PFM)
D 1. Gate 2. Drain 3. Source

Rev.2.00 Sep 07, 2005 page 1 of 6

2SK2225

Absolute Maximum Ratings


(Ta = 25C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes: 1. PW 10 s, duty cycle 1 % 2. Value at Tc = 25C Symbol VDSS VGSS ID ID(pulse)*1 IDR Pch*2 Tch Tstg Ratings 1500 20 2 7 2 50 150 55 to +150 Unit V V A A A W C C

Electrical Characteristics
(Ta = 25C)
Item Drain to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note: 3. Pulse Test Symbol V(BR)DSS IGSS IDSS VGS(off) RDS(on) |yfs| Ciss Coss Crss td(on) tr td(off) tf VDF trr Min 1500 2.0 0.45 Typ 9 0.75 990 125 60 17 50 150 50 0.9 1750 Max 1 500 4.0 12 Unit V A A V S pF pF pF ns ns ns ns V ns Test conditions ID = 10 mA, VGS = 0 VGS = 20 V, VDS = 0 VDS =1200 V, VGS = 0 ID = 1 mA, VDS = 10 V ID = 1 A, VGS = 15 V*3 ID = 1 A, VDS = 20 V*3 VDS = 10 V, VGS = 0, f = 1 MHz ID = 1 A, VGS = 10 V, RL = 30

IF = 2 A, VGS = 0 IF = 20 A, VGS = 0, diF / dt = 100 A / s

Rev.2.00 Sep 07, 2005 page 2 of 6

2SK2225

Main Characteristics
Power vs. Temperature Derating
80 10 3 60
0 10

Maximum Safe Operation Area


10
PW

Channel Dissipation Pch (W)

Drain Current ID (A)

1 0.3 0.1 0.03

1
10 m s

m
(1

C D r pe O

40

sh

ot

20

Operation in this area is limited by RDS(on)

Ta = 25C 0 50 100 150 200 0.01 10 30 100 300 1000 3000 10000

n io at (T c =

) C 25

Case Temperature TC (C)

Drain to Source Voltage VDS (V)

Typical Output Characteristics


5 Pulse Test 7V 3 6V 15 V 2.0 10 V 8V

Typical Transfer Characteristics

Drain Current ID (A)

Drain Current ID (A)

1.6

VDS = 25 V Pulse Test

1.2

0.8 Tc = 75C 25C 25C

5V
VGS = 4 V

0.4

20

40

60

80

100

10

Drain to Source Voltage VDS (V) Drain to Source Saturation Voltage vs. Gate to Source Voltage
50 Pulse Test 40 ID = 3 A 30 2A 1A 0.5 A 0 4 8 12 16 20

Gate to Source Voltage VGS (V) Static Drain to Source on State Resistance vs. Drain Current
50 20 10 5

Drain to Source Saturation Voltage VDS (on) (V)

Static Drain to Source on State Resistance RDS (on) ()

VGS = 10 V

15 V

20

2 Pulse Test 1 0.5 0.1

10

0.2

0.5

10

Gate to Source Voltage VGS (V)

Drain Current ID (A)

Rev.2.00 Sep 07, 2005 page 3 of 6

2SK2225
Static Drain to Source on State Resistance vs. Temperature
Forward Transfer Admittance yfs (S)
20 ID = 2 A 10 5 2 1 0.5
VDS = 25 V Pulse Test

Static Drain to Source on State Resistance RDS (on) ()

Forward Transfer Admittance vs. Drain Current

16

12

0.5 A, 1 A

Tc = 25C 25C 75C

4 0 40

VGS = 15 V Pulse Test

0.2 0.1 0.05

40

80

120

160

0.1

0.2

0.5

Case Temperature TC (C) Body to Drain Diode Reverse Recovery Time


5000 10000

Drain Current ID (A) Typical Capacitance vs. Drain to Source Voltage


VGS = 0 f = 1 MHz

Reverse Recovery Time trr (ns)

Capacitance C (pF)

2000 1000 500

1000

Ciss

200 100 50

di / dt = 100 A / s, Ta = 25C VGS = 0, Pulse Test

100

Coss Crss

10

0.05 0.1

0.2

0.5

10

20

30

40

50

Reverse Drain Current IDR (A)

Drain to Source Voltage VDS (V)

Dynamic Input Characteristics


Drain to Source Voltage VDS (V)
1000

Switching Characteristics
20
1000

Gate to Source Voltage VGS (V)

Switching Time t (ns)

800

VDD = 250 V 400 V 600 V VDS

500

16
VGS

td(off)
200 100

VGS = 10 V PW = 2 s duty < 1 %

600

12

400

8
VDD = 250 V 400 V 600 V

tf
50

tr td(on)

200

ID = 2.5 A 60 80

20 10

20

40

0 100

0.05 0.1

0.2

0.5

Gate Charge Qg (nc)

Drain Current ID (A)

Rev.2.00 Sep 07, 2005 page 4 of 6

2SK2225
Reverse Drain Current vs. Source to Drain Voltage
5

Reverse Drain Current IDR (A)

Pulse Test 4

10 V, 15 V
VGS = 0, 5 V

0.4

0.8

1.2

1.6

2.0

Source to Drain Voltage VSD (V) Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance S (t)
3 Tc = 25C

D=1 0.5

0.3

0.2

0.1

0.1
0.05

ch c(t) = s (t) ch c ch c = 2.50C/W, Tc = 25C


PDM

0.03

0.02 0.01
1 sh p ot

D=
PW T

PW T

uls

0.01 10

100

1m

10 m

100 m

10

Pulse Width PW (s)

Switching Time Test Circuit Vin Monitor D.U.T. RL VDD = 30 V Vout Monitor Vin Vout Vin 10 V 50 10% 10%

Waveforms 90%

10%

90% td(on)

90% td(off) tf

tr

Rev.2.00 Sep 07, 2005 page 5 of 6

2SK2225

Package Dimensions
JEITA Package Code
SC-93

RENESAS Code
PRSS0003ZA-A

Package Name TO-3PFM / TO-3PFMV

MASS[Typ.] 5.2g

Unit: mm
5.0 0.3
5.5 0.3

15.6 0.3 3.2


+ 0.4 0.2

5.0 0.3 19.9 0.3

2.0 0.3

2.7 0.3

0.66 5.45 0.5

+ 0.2 0.1

21.0 0.5

4.0 0.3 2.6 0.86

3.2 0.3 1.6 0.86

0.2 0.9 + 0.1

5.45 0.5

Ordering Information
Part Name 2SK2225-E Quantity 360 pcs Box (Tube) Shipping Container

Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.

Rev.2.00 Sep 07, 2005 page 6 of 6

Sales Strategic Planning Div.


Keep safety first in your circuit designs!

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.

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