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Colloidal Processes
The tape casting (doctor blade process) is p g( p ) -a shape forming technique, which produces thin flat sheets. -a doctor blade to conrol a moving ceramic slurry. -a bi d system offer enough ' binder t ff h 'green strength strength' t th' th Punching and Printing on Tapes Lamination Binder-burn-out (BBO) steps Sintered.
http://drm.kist.re.kr/cerapedia/ process/jgl003.html
Powder + solution (water or organic solvent) + binder di bi d + dispersant + de-foamer + plasticizer +homogenizer t d f l ti i +h i
B. Bitterlich and J. G. Heinrich, J. Euro. Ceram. Soc. 22(2002) 2427~2434 C.A. Gutierrez and R. Moreno, J. Euro. Ceram. Soc. 20(2000) 1527~1537
0,2 m Alumna powder with BET area: 11.2 m2/gm, in MEK/toluene Plateau coverage: PVB = 3.46 MFO = 2.31
mg m2
mg
m2
Binders: PVB(B79 and B76) M W B79 = 65000, B76 = 105000 M.W 65000 Dispersants: Mahatan Fish Oil (MFO) M.W=2000-3000
Y. T. Chou, Fluid flow model for ceramic tape casting, J. Am. Ceram. Soc., 70 [10] C-280-C-282 (1987)
critical casting rate is 5mm/s below C.C.R. the shearing is very low, and the viscosity of slurry is , y y high.
Casting Speed (mm/s) Fig. Plot of the green tape thickness obtained at different casting speeds for three different blade gaps.
Ref: A.I.Y. Tok et al., Tape casting of high dielectric ceramic composite substrates for microelectronics application, Journal of Materials Processing Technology 89-90 (1999) 508-512
Blade Gap (mm) Fig. Plot of the green tape thickness obtained at different blade gaps for g p three different casting speeds.
Binder burn-out
Sintered tape
(0,Y)
Organic: bottom
surface 3 m
10 m
Cross-Sectional Microstructures
Laminated Sintered
1mm Laminated by compression at room temperature y p p Green tape sintered at 1800C/60min No single layer can be distinguished after laminated and sintered
Summary
Multi-layer structure and tape process are most popular and important process for electronic l di f l i components (e.g. L-C-R); Processing parameters are extremely complex; g p The manufacturing has faced the competition from the field of silicon industry (system on chip, SOC). Adapt several technologies from thin film processes and inject-printing.