G3610 Maintenance Material

G3610 Maintenance Manual
Confidentiality level

For internal use only
2010-11-30
Confidential, diffusion is forbidden without permission
0102,92.yluJ
0102,92.yluJ
etaD
etaD
etaD etaD etaD etaD
00.1V
yb devorppA yb devorppA yb devorppA yb devorppA
yb deraperP yb deweiveR
Page1, Total37
Revision record
July.29,2010
V1.01
2010-11-30
retpahC retpahC retpahC retpahC noisiveR
Date
Revision Revision Version Reason
Revision Description
l evel ytilaitnedifnoC
Author
Page2, Total 37
Content
Charter 1 General .......................................................................5
1.1 1.2 Mobile Profile..................................................................................................... 5 Hardware Character and Index........................................................................ 5
Charter 2 Product Introduction ....................................................7

2.1 2.2 Functional Diagram .......................................................................................... 7 Functional Module Circuit................................................................................ 8 2.2.1 2.2.2 2.2.3 2.2.4 2.2.5 Startup Procedure................................................................................ 8 Baseband Part ...................................................................................... 8 Power, reset, clock, charge management Module ......................... 10 Radio Frequency (RF) Module .......................................................... 12 Peripheral Circuits ............................................................................. 13
Chapter 3 Introduction to Functional Chips ...............................18

3.1 Baseband Part .................................................................................................... 18 3.1.1 3.1.2 3.1.3 Digital Processing Chip ........................................................................ 18 Memory Chip....................................................................................... 18 FM Chip ............................................................................................... 19
3.2 RF Part ..................................................................................19

3.2.1 3.2.2 RF Chip................................................................................................ 19 Power Amplifier Chip......................................................................... 20
3.3 Clock .....................................................................................20

3.3.1 3.3.2 26MHz Clock Oscillator ..................................................................... 20 32.768KHz Sleeping Clock ................................................................ 21
Chapter 4 Engineering & Test Mode .........................................22

4.1 Engineering Mode.............................................................................................. 22 4.1.1 4.1.2 Enter/Escape Mode ............................................................................ 22 Commands of Engineering Mode..................................................... 22
4.2 Test Mode ........................................................................................................... 22 4.2.1 Enter/Escape Mode ................................................................................. 22 4.2.2 Command of Test Mode.......................................................................... 22
Chapter 5 Maintenance Introduction .........................................22

5.1 5.2 Maintenance introduction for Failure to power on...................................... 23 Maintenance Procedure for Failure to Charge ............................................ 24 Confidential, diffusion is forbidden without permission Page 3,Total 37
2010-11-30
G3610 Maintenance Manual 5.3 5.4 5.5 5.6 5.7 5.8 5.9
Maintenance Procedure for Display Failure................................................. 25 Maintenance Procedures of Failure of MIC Soundlessness ...................... 26 Maintenance Procedures of Failure of no Vibration Ring .......................... 26 Maintenance Procedures of Failure of Receiver mute ............................... 27 Maintenance Procedures of Failure of Headphone..................................... 27 Maintenance Procedures of No Vibration .................................................... 29 Maintenance Procedures of Failure of Key pressing detection ................ 30
5.10 Maintenance Procedures of Failure of SIM Card Recognition .................. 31 5.11 Maintenance Procedures of Failure of Camera ........................................... 31 5.12 Maintenance Procedures of FM Failure........................................................ 32 5.13 Maintenance Procedures of Failure of Incapable of Network Accessing 32 5.14 Maintenance Procedures of Failure of Abnormal RF Transmitting .......... 32 5.15 Maintenance Procedures of Failure of Abnormal RF Receiving ............... 33
Chapter 6 Appendix ..................................................................34

6.1 6.2 6.3 List of Wearing Parts ...................................................................................... 34 Position Diagram of Components................................................................. 35 Acronyms......................................................................................................... 37
2010-11-30
Page 4,Total 37
Charter 1
1.1 Mobile Profile
General
the HUAWEI G3610 is a multi-functional, and bar qwerty type mobile phone that supports the Global System for Mobile Communications (GSM) ,the General Packet Radio Service (GPRS) . With an exquisite and attractive appearance, the G3610 provides various functions By using the G3610, you can enjoy the fun of viewing images and videos anywhere and anytime. The G3610 brings wonderfulness to your life and is your ideal choice. G3610 functions: Basic function: Communication, Message; Tools: Alarm Clock, Notebook, Universal Time, Agenda, Calculator; Entertainment: Camera, FM, Game; Support GPRS, WAP/MMS. 1.2 Hardware Character and Index
Hardware Character Items

Form Dimension LxWxH Standards bar
Description
mm2.41*mm64*mm601 79R& 99R PPG3 :MSG
Confidential, diffusion is forbidden without permission Page 5,Total 37
2010-11-30
Data Service Connectors
LCD
Type: TFT Dimension: 1.8 inch Color: 65K Resolution: 128X160 Color of background light: White Support Build - in
FM Antennas Maximum Transmit Power Statistic Sensitivity Charger Ambient temperature
2010-11-30
FIC
Camera
Maximum resolution
hR %59 ot %5
Ambient Humidity
07+ ot 0206+ ot 0255+ ot 01-
Operating: Transportation: Storage:
V06.5V57.4 zH06/zH05 ,CAV042 ot V001
Input Output
zHK002/mBd 001- naht retteb :zHM0081 SCD zHK002/mBd 201- naht retteb :zHM009 MSG
)mBd2-/+( mBd03 :0081SCD )mBd2-/+( mBd33 :009MSG
zHM0081/009MSG
noI-iL noI-iL noI-iL noI-iL
Battery/ Charger
tibM23+821
Memory
zHM5871~zHM0171 :knilpU :zHM0081 SCD zHM 069~zHM529 :knilnwoD zHM519~zHM088 :knilpU :zHM009 MSG
Support GPRS SIM interface Charger interface Battery interface Earphone interface
Operation band
Downlink: 1805MHz~ 1880MHz
Type: Capacity: 800mAh Stand-by Time: about 300 hours Talk Time: about 220 minutes
Page 6,Total 37
Charter 2
2.1 Functional Diagram
Product Introduction
PA SW
SAW
REC+SPK
MIC
CAMERA Memory
I/O connector
G3610 hardware consists of Baseband and RF (Radio Frequency) two parts. Regarding the baseband parts, the baseband chipset acts as the central control module. Peripherals include Audio input/output device, memory device, display module, SIM card, keyboard, FM, and camera etc.. The baseband chipset can achieve the program operation, communicate with other devices and control the other parts. Baseband chip has IQ channel input and output and it also can control RF part transmitting and receiving. Audio input/output devices comprise Receiver MIC which can achieve voice conversion .
Receiver and MIC are voice interface for user. MIC realizes transferring uplink voice into electrical signals and headphone realizes transferring downlink electrical signals into voice. Display part includes a TFT LCD. It can display various images for user and it has a parallel data interface controlled by baseband. FM part fulfills the Frequency Modulation broadcasting receiving. FM chipset will receive FM signal , then demodulate RF signal to voice signal and output it to baseband. Camera adopts 100 thousand pixels sensor. It can capture image and Video data and transfer the image data to baseband chipset. Then baseband will accomplish the compression and storage of images. Memory part includes Flash memory and RAM. Flash will store the software and customer data; RAM will be responsible as data cache for software running.
2010-11-30 Confidential, diffusion is forbidden without permission Page 7/37
RF chip
Keyboard
LCD Baseband chip Mot FM
SIM
SIM card interface will be connected to customer SIM card which archieves the customer identification, stores the customer information. IO connector is the mobile interface for external devices such as charger, data cable &.charging, and updating software. RF part mainly includes RF Transceiver and RF PA Module. BB I/Q differential signals from BB chip are modulated and transmitted to RF PA by transceiver. And then the transmitting signals, amplified by RF PA, are fed into the RF Rx/Tx switch before being radiated by antenna. The RF signals, received by antenna, are fed into RF Transceiver via RF Rx/Tx switch and SAW filter. Finally the receiving signals are demodulated into I/Q signals for BB chip by Transceiver. 2.2 Functional Module Circuit 2.2.1 Startup Procedure
Startup procedure is shown as above: press power button, PWRKEY will detect low level, after 30ms delay, internal PMU will turn on LDOs providing to baseband; after 200ms delay, the RESET pin of PMIC will output reset signal to baseband chip. Then baseband chip will run the program for turn-on, the procedure is ended.
2.2.2
Baseband Part
Baseband part mainly consists of baseband chipset and storage chipset. Baseband chipset integrates digital baseband and analog baseband and can make smaller PCB size. Digital baseband is based on 32bit ARM7 processor, with memory chipsets external (includes program memory and data memory) accomplishing the software operation. The digital baseband will complete audio encoding/decoding, channel encoding/decoding, modulation-demodulation function and controlling the RF parts (AFC, AGC, APC). It has abundant functional interface: LCD interface, camera interface, I2C interface, audio interface, keyboard interface, ADC interface and interruption etc.. Analog baseband can provide the power supply, startup logic, charge management, SIM interface, back light driving, motor driving etc..
Baseband chipset U301 function as followed: LCD interface
LCD interface includes 4 wires serial data bus, reset signal, SCLK, SDA, chip select, and command/data select signal. Camera interface Camera interface includes SPI serial bus Sclk,SDA,CSB ,I2C bus (SCL,SDA,SSN) ,and include Main clock, reset signal,overflow and ready singals.
Audio Interface
2010-11-30
Page 9/37
Audio interface consists of output signals of receiver, two path MIC input signals (main MIC, earphone MIC), FM audio input signals, ringtone output signals. Keyboard interface
G3610 Keyboard matrix is 45,supporting 21 keys, including the function keys, number keys.
ADC interface
There are five ADC channels used. ADC0 is used to detect ID of various LCM; ADC2 is delicated to detection of the press of talk-key on earphone. Interruption
Only one interruption signals. INT0 is used to detect earphones plug-in. 2.2.3 Power, reset, clock, charge management Module Baseband chipset U301 Analog Parts function and power management unit as followed:
Power circuit
PMU of MT6223D has 7 LDOs built in, providing power for every function modules. VTCXO for Crystal Oscillator power supply: 2.8V; VCORE for digital baseband power supply: 1.8V; VIO for IOs power supply: 2.8V; VA for analog section in baseband power supply: 2.8V; VM for Memory power supply: 2.8V; VSIM for SIM power supply: 1.8V or 3.0V based on different card type. Reset circuit
PWRKEY is connected to power key of PMU .When power key is pressed, low level voltage will be detected on PWRKEY. Internal logical circuit will output reset signal and feed it to /SYSRST of digital baseband. Supplied with power from various LDOs, the phone will be turned on. Clock Circuit
Above is 32Khz clock circuit. It includes 32K crystal and coupling capacitors. 32 KHz clock will supply the slow clock which is necessary for baseband working.
2010-11-30
Page 11/37
2.2.4 Radio Frequency (RF) Module RF module comprises of RF Transceiver and RF PA. Transceiver includes LO, receiver and transmitter. Transmitter BB I/Q differential signals from the BB chip are fed into the one-pole RC low-pass filter first. Two double balanced mixers (modulators) are responsible for translating the filtered I/Q signals to the transmitting frequencies. The transmitting signals are amplified by RF PA and radiated by antenna finally. Receiver The RF signals, received by antenna, are filtered through RF Rx/Tx switch and SAW filter and fed into transceiver. Then the receiving RF signals are down-converted to I/Q signals by demodulator. The I/Q signals are then filtered and amplified through a low-pass filter and a PGA to BB chip. Local Oscillator The frequency synthesizer system provides the Local oscillator (LO) signals for both receiver and transmitter. It includes PLL Calibration, RF Multi-Modulus Divider and Delta-Sigma Modulator. Power Supply The operation voltage of Transceiver is 2.8V. It is supplied by built-in power management . Showing as followed: module circuit of
Reference clock
8456DA
26 MHz clock signal is provided by 26MHz crystal. After entering Transceiver, the 26MHz clock signal is amplified and divided into two parts. One as a reference frequency signal for transceiver LO, and another as a reference clock signal for BB chip via the 22nd pin of transceiver.
2.2.5
Peripheral Circuits Display Circuit
2010-11-30
Page 13/37
Above is the partial circuit for LCD connector. LCD connector is located on main board, The definition of interface is shown above . LCD interface is serial interface including 4 wire SPI interface: clock,data, chip selection, data/command select and reset singal. VDD will supply power to LCD module. LCD_BL+ LCD_BL- are positive and negative end of back light driving. Receiver Circuit
Receiver Circuit as showed as above: REC signals output from baseband chip. Microphone Circuit
and REC
represents receiver downlink
The circuit is shown as above, MIC audio input is differential signal connecting to MIC channel 0 of baseband chip. MICBIASP and MICBIASN represent positive/negative bias voltage. Back Light Circuit
2010-11-30
Page 14/37
As shown as above, the circuit adopts 6 backlight LEDs. Positive end is connectted to battery voltage VBAT, and drive signal KP_LED is supplied by PMU. Charge Circuit
Above is the charge circuit including power PMOS and diodes. WPM2005-8/TR has built-in PMOS and diodes; R306 is for measuring rechargeable current. R302 R304 makes up the voltage divider circuit. Video Circuit
2010-11-30
Page 15/37
Above figure is the camera connector circuit. Camera interface comprises SPI data bus SDA SCLK CSB , main clock, I2C signal (SDA VDD(2.8V) are power supply for camera module. SIM Card Circuit SCL
As shown as above, J501 and J502 is the SIM card connectors. Interface signal comprises data SIMIO, clock SIMCLK, and reset SIMRST, power supply VSIM. 1.8V or 3.0V SIM card can identified automatically. FM Circuit
2010-11-30
SSN) ,reset and overflow sinal.
Page 16/37
As shown as above, FM receiving chipset is RDA5802E controlled by I2C interface (GPIO47_FM_SCL GPIO48_FM_SDA). Baseband chipset provides 32Khz working clock FM_CLK32, FM chip needs 2.8V power supply, which supplied by VDD of PMU; Earphone can be used as FM antenna. FM_ANT will be connected to audio signal of IO connector. After FM demodulation, FM audio signal (FM_OUTL, FM_OUTR) will output to baseband . Audio Amplifying Circuit
As shown as above, the amplifying circuit adopts type AB Audio amplifier. Input of amplifier is single-end audio signal and output is Differential-end. Input signal MP3_OUTR is audio output from baseband chip and it may be voice or ringtone or FM. Power supply of Audio amplifier is VBAT of battery.
2010-11-30
Page 17/37
Chapter 3
3.1 Baseband Part 3.1.1 Digital Processing Chip
Introduction to Functional Chips
MT6223D is an entry level chipset solution with class 12 GPRS/GSM modem. It integrates
analog baseband and digital baseband into one chip and can greatly reduce the component count and make smaller PCB size. Besides, MT6223D is capable of SAIC(Single Antenna Interference Cancellation) and AMR speech. Based on 32 bit ARM7EJ-STM RISC processor, MT6223D provides an unprecedented platform for high quality modem performance. MT6223D have powerful multimedia feature: MP3 decoding; Wavetable synthesis with up to 64 tones; FM Radio Recording; Analog multiplexer for Stereo Audio. The MT6223D device is offered in TFBGA 9x9mm 244 BALL.. Block diagram of MT6223D is as follows:

3.1.2 Memory Chip The memory chip applies MCP memory TV00570002CDGB of Toshiba, including 128Mbit NORflash and 32Mbit pSRAM. Operation Voltage: 2.8v package: TFBGA 81pin. Block diagram of memory chip is as follows:
2010-11-30
Page 18/37
3.1.3 FM Chip FM chip uses 5802E of RDA, which is able to fulfill receiving of FM frequency modulation broadcast with frequency band of 70 108Mhz ; Supports digital interface of I2C; Supports stereo output and station searching automatically or manually; Supports external single-end headphone antenna receiving with high sensitivity; the package is QFN 24pin. Block diagram of FM chip is as follows:
3.2 RF Part 3.2.1 RF Chip AD6548 is a highly-integrated RF transceiver IC for GSM850, GSM900, DCS1800 and PCS1900. It includes receiver, transmitter LO and on-chip LDO.AD6548 have 32 pins, apply LFCSF PACKING.
2010-11-30 Confidential, diffusion is forbidden without permission
Page 19/37
3.2.2 Power Amplifier Chip RF power amplifier chip is RFMD RF7168/9, which is a transmit and receive front-end module (FEM). The module consists of a GSM900 PA block and a DCS1800 PA block, impedance-matching circuitry for input and output impedances, Tx harmonics filtering, high linearity and low insertion loss PHEMT RF switches, diplexer and a Power Amplifier Control(PAC) block
3.3 Clock 3.3.1 26MHz Clock Oscillator The 26MHz clock oscillator is TXC of 7M26000018, which has frequency stability of +/-10ppm and load capacitor of 11pF.
3.3.2 32.768KHz Sleeping Clock 32.768K clock crystal is SSP-T7-F of SII, which has frequency stability of +/-20ppm and load capacitor of 12.5pF.
2010-11-30
Page 21/37
Chapter 4
4.1 Engineering Mode 4.1.1 Enter/Escape Mode
Engineering & Test Mode
Enter Mode Input #*888# on the stand-by screen and enter into engineering mode menu View version no., sequence no., network locked status, error records, hardware component test and network parameters Escape Mode In engineering mode, push backspace button or End button for escape. In case network parameters is activated, close the parameters first before escape 4.1.2 Commands of Engineering Mode Version No.: view version of software S/N No.: sequence number of main board Error record: display type, module and time of the latest error. Hardware component test: carry out hardware tests for regular components Network parameters: activate output of network parameters, which should be displayed in stand-by screen. Uart setting set IO port to Uart 4.2 Test Mode 4.2.1 Enter/Escape Mode Input *#7910# on the stand-by screen and enter into test mode Escape mode continuously push End button in test mode for escape 4.2.2 Command of Test Mode Test in turn the following components of the mobile-phone Display Screen, Led, receiver, Headphone, Button, Vibration Microphone, Sperk,Radio, Camera, Charge, Alarm ring
2010-11-30
Page 22/37
Chapter 5
5.1
Maintenance Introduction
Maintenance introduction for Failure to power on
Procedure of power on : ensure powering the phone correctly and Battery voltage Vbat can be ajusted to 4.0v; Press poweron key,the signal KEY_POWER_ON/OFF is pulled low ; As soon as PMU detects the poweron signal, will open all LDO and supply power to baseband circuit and RF Transceiver; Main clock circuit inside RF Transceiver starts to work and provides 26Mhz clock;Then slow clock of 32.768Khz starts to work; When power and clock being stable, PMU outputs reset signal SYSRST to CPU after delay; CPU hence reads program from external memory into internal RAM and program starts to be executed; The procedure of poweron is fulfilled. Maintenance Procedures of Failure to power on: For examination of failure , first take off the battery, use external power supply for the phone, observe the change of current during poweron process; In case the phone can be powered on with external power supply, it should be concluded that power supply of battery has something abnormal. Hence, check the battery connector J602 or battery itself for any damage; Take out the main board of failure phone, connect power on signal (test point TP301) to GND and observe the current : 1 In case the current is high (normally more than 1A), it shows that short-circuit exists on main board. Then remove U301 or U101 and continue the test; 2 In case the current is less than 20mA, check whether all power supply are ok. Most possible problem is on 26M clock circuit or baseband chip U301. Measure 26M clock signal on 21pin of U101 to make sure. 3 In case the current is between 20 to 25mA, it is common that software has error or no software has been downloaded. Hence, re-download the software; 4 In case the current is between 30 to 90mA, check 26M clock, 32K clock (X201), especially check U301(baseband chip) and U501(memory) for weld defect.
1 103U
2010-11-30
Page 23/37
5.2 Maintenance Procedure for Failure to Charge Failure 1: insertion of charger can't be detected. Maintenance procedures: insert charger and check if there is charge voltage at U302 3pin. In case the result is no, it shows that IO connector J601 has weld defect; In case of yes, it shows that charging voltage can not be provided to baseband chip U302, then change or weld U302 again.
Failure 2: Insertion of charger is detected, however, no charging current is detected and prompt bad connecting of the charger" Maintenance procedure: check if U302 is well welded; during charging, check U302 4pin, check
whether voltage on the grid of PMOS is low level; check whether resistances of R302 and R304 are correct;
5.3
Maintenance Procedure for Display Failure
Failure 1: LCD display has white screen, colored dots, tearing effect; Maintenance procedure: check welding of LCD; change or weld baseband chip U301;
2010-11-30
Page 25/37
Abnormal LCD display
Check the weiding of LCD
Y
Welding LCD
Y
If LCD damaged change LCD OK
Y
If MCU damaged
Welding or change U301
Failure 2: LCD display is dark, no background light; Maintenance procedure: check whether output of u301 is proper, which provides power for LCD backlight; check welding of LCD; 5.4 Maintenance Procedures of Failure of MIC Soundlessness Failure: The phoning partner can't hear you. Maintenance Procedure: Check welding of Mic, change Mic for test; During normal talking, test whether there is 2.0v bias voltage on R401 (for signal MICBIASP ); check whether there is any device unmounted in Mic circuit; weld baseband chip U301; 5.5 Maintenance Procedures of Failure of no Vibration Ring Failure: no ring during incoming phone call, power on/off phone, no ring when playing ringtone. Maintenance Procedure: Check whether there is any damage with audio PA U401; When playing ringtone, check whether there is any audio signal on C428 beside U401 , in case no, it's concluded that baseband chip U301 has something wrong.
2010-11-30
Page 26/37
N O SOUND
Check weiding condition of speaker
Change or weld speaker
Check if U401is good or not
Change or weld speaker U401
OK
Check if input signal of U603 is normal
Welding or change U301
5.6 Maintenance Procedures of Failure of Receiver mute Failure: no voice can be heard through receiver during phone call Maintenance procedures: Check welding of receiver ,check welding or damaged of electronic components besides receiver; in case of both are ok, it's concluded that welding of baseband chip U301 is not ok.
5.7
Maintenance Procedures of Failure of Headphone
Failure 1: When insert headphone, no prompt and no headphone insertion is detected. Maintenance procedures: insert the headphone and measure whether EINT0_HEADSET signal is at low level; in case of no, then test further whether there is false welding with diode D403 bead B601 or IO connector.
Failure 2: Display that headphone inserted, unable to detect plug out of headphone Maintenance procedures: check whether EINT0_HEADSET signal is still low level, in case of yes, check respectively short circuit with C413 C415 C602 (remove C413 C415 C602 in turn and check if EINT0_HEADSET signal is set to high after headphone is plugged out).

Failure 3: After inserting headphone, theres prompt, however no sound in the headphone Maintenance procedure: insert headphone and play ringtone, measure signal MP3_OUTR/L
output from baseband chip, check in turn the signals of R408 and R409, C413 and C414, XMP3_R/L, B601 and B602.
Failure 4: the Mic on headphone is failed. Maintenance procedures: insert headphone, Speak to MIC during phone call and check whether the voltage of MICBIASP signal is 2V. In case of 2V, check whether theres any signal at XMICP, in case of yes, it shows that baseband chip U301 has weld defect. 5.8 Maintenance Procedures of No Vibration Maintenance procedures Set phone into vibration mode, measure the motor driving signal VIB(on R310), check whether the signal is square wave; In case of no, it shows that baseband chip U301 has weld defect; in case of yes, continue to check whether L801,C807 and D811 is broken or weld defect. in case of both are ok,it shows that motor is broken.
2010-11-30
Page 29/37
5.9 Maintenance Procedures of Failure of Key pressing detection Failure 1 Failure of key pressing detection on main board Maintenance procedures: first check it is single button failure or failure of a row or a column of keys; in case of single button failure, check whether there is any foreign material on the surface of failure keypad, then check the key Dome ; in case of failure of multiple key, check the key scanning signal of failure keys(row or column line), the varistors to protect key sanning line may be damaged; in case of failure of all keys, check whether any key scanning line is shorted to GND, varistors or baseband chip U301 may have defect.
2010-11-30
Page 30/37
5.10 Maintenance Procedures of Failure of SIM Card Recognition Maintenance procedures: insert SIM card and power on the phone, measure the voltage output of VSIM (1.8v or 3v), VSIM may be 1.8v or 3.0v according different type of SIM card. If VSIM is normal, then check signal SIMCLK SIMRST SIMIO to see whether there is output when phone is powered on; in case of no output, the baseband chip U301or dual sim card controller U503 should have weld defect. 5.11 Maintenance Procedures of Failure of Camera Maintenance procedures: first change Camera FPC to see if theres any problem with camera module; enter into Camera previewing mode, check power supply of camera (VDD), If power supply of camera is ok and camera cant work, the baseband chip U301 should have weld defect.
2010-11-30
Page 31/37
5.12 Maintenance Procedures of FM Failure Failure 1: FM doesn't work; Maintenance procedures: with FM function being activated, measure wether power supply of VDD is normal, in case of no, it shows U301 has weld defect or damage; in case of being normal, continue to check signal FM_CLK32, if FM_CLK32 has no output from baseband chip, it also indicates that U301 has problem; finally check FM chip U901 to find weld defect. Failure 2: no sound can be heard from speaker or earphone when FM works; Maintenance procedures: with FM function being activated, check audio output signal FM_OUTL/R from FM chip U901, if the output is normal ,it indicates baseband chip U301 may has weld defect;if signal FM_OUTL/R is abnormal , FM chip U901 may have problem, change or weld U901. 5.13 Maintenance Procedures of Failure of Incapable of Network Accessing Maintenance procedures: 1. Change current position of the mobile phone to an area with stronger signals, open the machine again to see if the network is detected to eliminate problem of weak network signal; 2. disassemble the mobile phone, check if spring plate of the antenna has good connection; 3. Connect the mobile phone to integrated measuring instrument to check if the RF indicators are normal under conduction; 4. In case the RF indicators under conduction are abnormal, calibration to the mobile phone should be done until it is ok. 5.14 Maintenance Procedures of Failure of Abnormal RF Transmitting Failure: it is determined that RF transmitting is abnormal during calibration of the mobile phone. Maintenance procedures: 1. Check if theres any miss paste, movement or false welding with the components; 2. Check if working voltages of Transceiver and RF PA are normal, the working
voltage of Transceiver should be 2.8v (measure VDD) and that of RF PA is the battery voltage (measure VBAT); 3. Measure if voltage of VAPC of RF PA is normal, which is about 1.4v at maximum transmitting power; 4. Measure TX_Enable of RF PA, which should be high level (typical voltage should be 2.8v); 5. In case all the above four procedures are normal, the problem must be with the chip, then change in turn the RF PA, Transceiver. 5.15 Maintenance Procedures of Failure of Abnormal RF Receiving Failure: it is determined that RF receiving is abnormal during calibration of the mobile phone Maintenance procedures: 1. Check if theres any miss paste, movement or false welding with the components; 2. Check if working voltage of Transceiver is normal, which should be 2.8v (measure VDD); 3. Measure TX_Enable of RF PA, TX_Enable be low level at the moment; 4. In case the above three procedures are normal, the chip should have problems. Then change in turn the receiving filter, RF PA, Transceiver
2010-11-30
Page 33/37
keTaideM abihsoT keTaideM
305U 105U 101U 104U 403U
1 1 1 1 1
rellortnoC draC MIS lauD )mn07( )MARSP bM23 + hsalF RON bM8211 ni 2 PCM oidar MSG pihc elgniS
2036TM BGDC20007500VT LR-ZPCB8456DA 0994NS RT/8-5002MPW
32005004111QH 43007302111QH 32005300111QH 91106106111QH 89208103211QH
6.1
No.
List of Wearing Parts
Material no.
Type
Chapter 6
baseband chip
keTaideM
103U
Mosfet(Combo Diode)
lliw
L-D3226TM
32001100111QH
2010-11-30
6 5 4 3 2 1

Audio amplifier
Material Description
Appendix
Order
no.
Position
no.
SI-EN
Manufacturer
Page 34/37
6.2
Position Diagram of Components
2010-11-30
Page 35/37
2010-11-30
Page 36/37
6.3
Acronyms

GSM Global System For Mobile Communication GPRS General Packet Radio Service TFT ThinFilmTransistor
AFC
AGC APC ADC LDO
MCU Micro Controller Unit
2010-11-30
SIM
Subscriber Identity Module Automatic Frequency Control Automatic Gain Control Automatic Power Control Analog-to-Digital Converter Low Dropout Regulator
Page 37/37

G3610 Maintenance Material

Hochgeladen von

Dokumentinformationen

Originalbeschreibung:

Copyright

Verfügbare Formate

Dieses Dokument teilen

Dokument teilen oder einbetten

Freigabeoptionen

Stufen Sie dieses Dokument als nützlich ein?

Sind diese Inhalte unangemessen?

Copyright:

Verfügbare Formate

G3610 Maintenance Material

Hochgeladen von

Copyright:

Verfügbare Formate

G3610 Maintenance Manual

G3610 Maintenance Manual

Confidential, diffusion is forbidden without permission

etaD etaD etaD etaD

yb devorppA yb devorppA yb devorppA yb devorppA

Confidential, diffusion is forbidden without permission

retpahC retpahC retpahC retpahC noisiveR

Revision Revision Version Reason

G3610 Maintenance Manual

G3610 Maintenance Manual

Charter 2 Product Introduction ....................................................7

Chapter 3 Introduction to Functional Chips ...............................18

3.2 RF Part ..................................................................................19

3.3 Clock .....................................................................................20

Chapter 4 Engineering & Test Mode .........................................22

Chapter 5 Maintenance Introduction .........................................22

Chapter 6 Appendix ..................................................................34

Confidential, diffusion is forbidden without permission

G3610 Maintenance Manual

Hardware Character Items

G3610 Maintenance Manual

Data Service Connectors

FM Antennas Maximum Transmit Power Statistic Sensitivity Charger Ambient temperature

Confidential, diffusion is forbidden without permission

07+ ot 0206+ ot 0255+ ot 01-

Operating: Transportation: Storage:

V06.5V57.4 zH06/zH05 ,CAV042 ot V001

)mBd2-/+( mBd03 :0081SCD )mBd2-/+( mBd33 :009MSG

noI-iL noI-iL noI-iL noI-iL

Downlink: 1805MHz~ 1880MHz

G3610 Maintenance Manual

LCD Baseband chip Mot FM

G3610 Maintenance Manual

G3610 Maintenance Manual

Baseband chipset U301 function as followed: LCD interface

Confidential, diffusion is forbidden without permission

G3610 Maintenance Manual

G3610 Maintenance Manual

Confidential, diffusion is forbidden without permission

G3610 Maintenance Manual

G3610 Maintenance Manual

Peripheral Circuits Display Circuit

Confidential, diffusion is forbidden without permission

G3610 Maintenance Manual

represents receiver downlink

Confidential, diffusion is forbidden without permission

G3610 Maintenance Manual

Confidential, diffusion is forbidden without permission

G3610 Maintenance Manual

Confidential, diffusion is forbidden without permission

SSN) ,reset and overflow sinal.

G3610 Maintenance Manual

Confidential, diffusion is forbidden without permission

G3610 Maintenance Manual

Introduction to Functional Chips

Confidential, diffusion is forbidden without permission

G3610 Maintenance Manual

G3610 Maintenance Manual

G3610 Maintenance Manual

Confidential, diffusion is forbidden without permission

G3610 Maintenance Manual

Engineering & Test Mode

Confidential, diffusion is forbidden without permission