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Hardware Guide
Issue Date
01 2010-11-12
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Notice
Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and may not be activated or may be limited by local network operators or network service providers, thus the descriptions herein may not exactly match the product or its accessories you purchase. Huawei Technologies Co., Ltd reserves the right to change or modify any information or specifications contained in this manual without prior notice or obligation.
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Date
2010-11-12
Chapter
Descriptions
Creation
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Contents
Contents
1 Introduction....................................................................................................................................1
1.1 Overview .......................................................................................................................................... 1
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Contents
3.7.3 ESD Protection for the SIM Card Interface ........................................................................... 32 3.8 Audio Interface ............................................................................................................................... 33 3.8.1 Analogue Audio...................................................................................................................... 33 3.8.2 Digital Audio........................................................................................................................... 35
4 RF Specifications.........................................................................................................................37
4.1 About This Chapter......................................................................................................................... 37 4.2 Operating Frequencies................................................................................................................... 37 4.3 Conducted RF Measurement ......................................................................................................... 38 4.3.1 Test Environment................................................................................................................... 38 4.3.2 Test Standards....................................................................................................................... 38 4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 38 4.4.1 Conducted Receive Sensitivity.............................................................................................. 38 4.4.2 Conducted Transmit Power ................................................................................................... 39 4.5 Antenna Design Requirements ...................................................................................................... 40 4.5.1 Antenna Design Indicators .................................................................................................... 40 4.5.2 Interference ........................................................................................................................... 41 4.5.3 GSM/WCDMA Antenna Requirements.................................................................................. 41 4.5.4 Radio Test Environment ........................................................................................................ 42
6 Mechanical Specifications.........................................................................................................53
6.1 About This Chapter......................................................................................................................... 53 6.2 Dimensions and interfaces............................................................................................................. 53 6.2.1 Dimensions and interfaces of MU509 ................................................................................... 53 6.2.2 Dimensions of the LGA Connector ........................................................................................ 54 6.3 Nameplate ...................................................................................................................................... 54
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Tables
Tables
Table 2-1 Feature................................................................................................................................... 2 Table 3-1 Definitions of pins on the LGA interface ................................................................................ 7 Table 3-2 Definitions of the pins on the power supply interface .......................................................... 15 Table 3-3 Power on timing ................................................................................................................... 16 Table 3-4 Power off timing ................................................................................................................... 17 Table 3-5 Keep-alive capacitor values vs. SMPL timer settings .......................................................... 18 Table 3-6 Coin cell characteristics ....................................................................................................... 19 Table 3-7 Definitions of pins of the power-on/power-off and reset interfaces ..................................... 20 Table 3-8 Pins on the signal control interface...................................................................................... 23 Table 3-9 List of the LED_STATUS pin and LED_MODE pin .............................................................. 24 Table 3-10 Definition of the WAKEUP_IN signal ................................................................................. 27 Table 3-11 Definition of the WAKEUP_OUT signal ............................................................................. 28 Table 3-12 UART interface signals ...................................................................................................... 29 Table 3-13 SIM card interface signals ................................................................................................. 31 Table 3-14 Signals on the audio interface ........................................................................................... 33 Table 3-15 Signals on the digital audio interface ................................................................................. 35 Table 4-1 RF bands ............................................................................................................................. 37 Table 4-2 MU509 conducted Rx sensitivity (Unit: dBm) ...................................................................... 38 Table 4-3 MU509 conducted Tx power (Unit: dBm)............................................................................. 39 Table 5-1 Extreme working conditions for the MU509 module ............................................................ 44 Table 5-2 Working and storage temperatures and humidity for the MU509 module ........................... 45 Table 5-3 Electrical features of application interfaces ......................................................................... 45 Table 5-4 Requirements for input power of the MU509 module .......................................................... 46 Table 5-5 Requirements for input current of the MU509 module......................................................... 46 Table 5-6 Averaged standby DC power consumption.......................................................................... 47 Table 5-7 DC power consumption (HSPA/WCDMA) ........................................................................... 47
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Tables
Table 5-8 DC power consumption (GSM/GPRS/EDGE) ..................................................................... 48 Table 5-9 Test conditions and results of the mechanical reliability of the MU509 module .................. 50
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Figures
Figures
Figure 2-1 Circuit block diagram of the MU509 module........................................................................ 4 Figure 2-2 Application block diagram of the MU509 module ................................................................ 5 Figure 3-1 Bottom view of sequence of LGA interface pins ................................................................ 14 Figure 3-2 Power on timing sequence................................................................................................. 16 Figure 3-3 Power off timing ................................................................................................................. 17 Figure 3-4 VCOIN interface circuit ...................................................................................................... 19 Figure 3-5 Power-on time sequence ................................................................................................... 21 Figure 3-6 Power-off time sequence ................................................................................................... 22 Figure 3-7 Connections of the POWER_ON_OFF and RESET pins .................................................. 24 Figure 3-8 Status when the indictor blinks once each time ................................................................. 25 Figure 3-9 Status when the indictor blinks fast.................................................................................... 25 Figure 3-10 Status when the indictor blinks twice each time............................................................... 25 Figure 3-11 Driving circuit.................................................................................................................... 26 Figure 3-12 LED Typical Electro-Optical Characteristics Curves........................................................ 27 Figure 3-13 Connections of the WAKEUP_IN and WAKEUP_OUT pins ............................................ 28 Figure 3-14 Connection of the UART interface in the MU509 module (DCE) with the host (DTE)..... 30 Figure 3-15 Circuit of the SIM card interface ...................................................................................... 31 Figure 3-16 Pin definition of SIM Socket ............................................................................................. 32 Figure 3-17 ESD protection circuit on the SIM card............................................................................ 33 Figure 3-18 Circuit diagram of the interface of the first audio channel ............................................... 34 Figure 3-19 Circuit diagram of the interface of the second audio channel.......................................... 35 Figure 3-20 Circuit diagram of the interface of the PCM..................................................................... 36 Figure 4-1 SATIMO microwave testing chamber................................................................................. 43 Figure 5-1 Power Supply During Burst Emission ................................................................................ 46 Figure 6-1 Dimensions of MU509........................................................................................................ 53
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Introduction
1
1.1 Overview
MU509 module is related to the following products:
Introduction
This document describes the hardware application interfaces and air interfaces that are provided when the Huawei MU509 LGA Module (hereinafter referred to as the MU509 module) is used. This document helps you to understand the interface specifications, electrical features, and related product information of the MU509 module. To facilitate its use in different fields, relevant development guide documents are also provided with the module, which can be obtained from the Huawei website.
UMTS2100/900 MHz GSM850/900/1800/1900 MHzData only or Telematics UMTS1900/850 MHz GSM850/900/1800/1900 MHzData only or Telematics Each product has two editions: Data only or Telematics. Data only does not support the voice function.
Data only Analog voice input function Analog voice output function PCM voice function Telematics
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Overall Description
2
2.1 About This Chapter
Function Overview Circuit Block Diagram Application Block Diagram
Overall Description
This chapter gives a general description of the MU509 module and provides:
Description
UMTS2100/900 MHz GSM850/900/1800/1900 MHz (Data only or Telematics) UMTS1900/850 MHz GSM850/900/1800/1900 MHz (Data only or Telematics) For detailed information about the working bands supported, see Overview.
Working temperature
Normal working temperature: 20C to +70C Extreme working temperatures: 30C to 20C and +70C to +75C 40C to 85C
3.34.2 V (3.8 V is recommended.) See the HUAWEI MU509 LGA Module AT Command Interface Specification. UART (supporting 8-wire UART)
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Overall Description
Feature
interface (116pin LGA interface)
Description
One standard Subscriber Identity Module (SIM) card interface (3 V or 1.8 V) Audio (OPTION) : (only telematics version supports this function) For detailed information about the working bands supported, see Overview. 2Micphone in 1Handset out 1Speaker out 1PCM USB 2.0(full speed) Power on/off Interface Reset In Interface Wakeup In/Out Interface Network status and mode light-emitting diode (LED) control interface Configurable GPIO Interface Antenna Interface Power Interface
SMS
New message alert, text message receiving, and text message sending Management of text messages: read messages, delete messages, storage status, and message list Support for the protocol data unit (PDU) mode GSM CS: UL 9.6kbps/DL 9.6kbps GPRS/EDGE: Multi-slot Class 12, Class B
data services
WCDMA CS: UL 64kbps/DL 64kbps WCDMA PS: UL 384kbps/DL 384kbps HSDPADL 3.6Mbps
Dimensions (L W H): 30 mm 30 mm 2.6 mm Weight: <7.0 g Restriction of the use of certain Hazardous Substances (RoHS), European Conformity (CE), Federal Communications Commission (FCC)
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Overall Description
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Overall Description
USIM interface: The USIM interface provides the interface for a USIM card. The USIM card can be inserted into the host side. USB interface: The USB interface supports USB 2.0 full speed standard. UART interface: The module supports 3-line or 5-line or full serial port interface. Voice interface: The module supports one speaker output, two microphone input, one earpiece output and one PCM interface (only telematics version supports the audio function). Power sources: DC 3.8V recommended.
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The details about the description, functions and usage methods of each pin are listed in Table 3-1. The NC (Not Connected) pins are internally connected to the module. Therefore, these pins should not be used, otherwise they may cause problems. Please contact us for more details about this information.
You need to define the rear part on user board according to the pin sequence of MU509 Module. Table 3-1 shows the definitions of pins on the 116-pin signal interface of the MU509 module.
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Table 3-1 Definitions of pins on the LGA interface PIN# Pin Name Normal
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 NC NC NC NC PCM_SYNC1 PCM_DIN1 PCM_DOUT1 PCM_CLK1 NC NC WAKEUP_IN VBAT VBAT NC GPIO GPIO GPIO GPIO GPIO GPIO
Description MUX
Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open PCM interface sync PCM I/F data in PCM I/F data out PCM interface clock Not connected, please keep this pin open Not connected, please keep this pin open External system to wake up Module Power supply input Power supply input Reserve General I/O pins. The function of these pins has not been defined. Not connected, please keep this pin open Not connected, please keep open Not connected, please keep this pin open Not connected, please keep this pin open
Direction
Max
2.9 2.9 2.9 2.9 2.9 4.2 4.2 2.9
16 17 18 19
NC NC NC NC
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PIN#
Description
Direction
Max
2.1
20 21 22 23 24 25 26 27 28
NC NC NC NC NC NC NC NC GPIO
Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open General I/O pins. The function of these pins has not been defined. General I/O pins. The function of these pins has not been defined. Not connected, please keep this pin open 2.6V POWER output 1.8V POWER output Not connected, please keep this pin open Power supply for SIM card Coin cell input No connect, please keep this pin open Not connected, please keep this pin open
-0.3
29
GPIO
-0.3
1.8
2.1
30 31 32 33 34 35 36 37
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PIN#
Description
Direction
Max
-
38
MIC2_P2
(Only telematics version supports audio function, Data only version does not support this function) Positive pole of the input of audio interface 2 (Only telematics version supports audio function, Data only version does not support this function) Negative pole of the input of audio interface 2 (Only telematics version supports audio function , Data only version does not support this function) Positive pole of the input of audio interface 1 (Only telematics version supports audio function , Data only version does not support this function) Negative pole of the input of audio interface 1 Not connected, please keep this pin open General I/O pins. The function of these pins has not been defined. General I/O pin. The function of these pins has not been defined. General I/O pins. The function of these pins has not been defined. General I/O pins. The function of these pins has not been defined. Not connected, please keep this pin open GND GND
Input
39
MIC2_N2
Input
40
MIC1_P2
Input
41
MIC1_N2
Input
42 43
NC GPIO
-0.3
2.6
2.9
44
GPIO
-0.3
2.6
2.9
45
GPIO
-0.3
2.6
2.9
46
GPIO
-0.3
2.6
2.9
47 48 49
NC GND GND
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PIN#
Description
Direction
Max
2.9
50 51
GND GPIO
GND General I/O pins. The function of these pins has not been defined. GND GND GND General I/O pins. The function of these pins has not been defined. GND GND GND GND Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open GPIO SIM insert or remove detect
Input/Outp ut Input/Outp ut -
-0.3
52 53 54 55
-0.3
2.6
2.9
56 57 58 59 60 61 62 63 64 65 66 67 68 69 70
-0.3
2.6
2.9
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PIN#
Description
Direction
Max
2.9 2.9 2.9 2.9 2.9 2.9 2.9 2.9 2.9 2.9 2.1/3. 15 2.1/3. 15 2.1/3. 15 -
71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91
WAKEUP_OU T NC UART_DSR UART_RTS UART_DCD UART_TX UART_RING UART_RX UART_DTR UART_CTS POWER_ON_ OFF NC NC NC USB_DM USB_DP NC SIM_RESET SIM_DATA SIM_CLK LED_STATUS
Module to wake up the external system. Not connected, please keep this pin open UART Data Set Ready UART Ready for receive UART Data Carrier Detect UART transmit output UART Ring Indicator UART receive data input Data Terminal Ready UART Clear to Send System power-on or poweroff Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Full-speed USB DFull-speed USB D+ Not connected, please keep this pin open SIM reset SIM Data SIM Clock Status indicator SINK current source Driver current: 10 mA
Output Output Output Output Output Input Input Input Input Input/Outp ut Input/Outp ut Output Input/Outp ut Output Input
-0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -
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PIN#
Description
Direction
Max
-
92 93 94 95 96
NC NC NC NC EAR_OUT_N3
Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open (Only telematics version supports audio function , Data only version does not support this function) Negative pole of the output of Earphone interface (Only telematics version supports audio function , Data only version does not support this function) Positive pole of the output of Earphone interface (Only telematics version supports audio function, Data only version does not support this function) Positive pole of the output of speaker interface (Only telematics version supports audio function, Data only version does not support this function) Negative pole of the output of speaker interface Reset module. Mode indicator SINK current source Driver current: 10 mA
Output
97
EAR_OUT_P3
Output
98
SPKR_OUT_P
3
Output
99
SPKR_OUT_N
3
Output
100 101
RESIN_N LED_MODE
Input Input
-0.3 -
1.8 -
2.1 -
102 103
NC NC
Not connected, please keep this pin open Not connected, please keep this pin open
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PIN#
Description
Direction
Max
2.9
104 105
NC GPIO
Not connected, please keep this pin open General I/O pins. The function of these pins has not been defined. GND RF main antenna interface GND General I/O pins. The function of these pins has not been defined. GND Not connected, please keep this pin open GND General I/O pins. The function of these pins has not been defined.F GND Not connected, please keep this pin open GND
-0.3
-0.3
2.6
2.9
-0.3
2.6
2.9
GND NC GND
When the MU509 module works on master mode, PCM_CLK and PCM_SYNC pins are in the output status; when the MU509 module works on slave mode, PCM_CLK and PCM_SYNC pins are in the input status
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Figure 3-1 shows the sequence of pins on the 116-pin signal interface of the MU509 module. Figure 3-1 Bottom view of sequence of LGA interface pins
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Signal Name
VBAT GND
I/O
P -
Description
Pins for power voltage input GND
P P P
Pin for standby power input of the RTC Pin for external power output Pin for external power output
P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input; AO indicates pins for analog signal output
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A low-dropout (LDO) regulator or switch power with current output of more than 2 A is recommended for external power supply. Furthermore, a 2 mF or above energy storage capacitor is connected in parallel at the power interface of the MU509 module. As for the energy storage capacitor, a 2.2 mF or above electrolytic capacitor is recommended. In addition, to reduce the impact of channel impedance on voltage drop, you are recommended to try to shorten the power supply circuit of the VBAT interface. After VBAT has been applied and is stable, the module will generate an on board power on reset signal and will remain in reset condition until RST is de-asserted. After de-assertion of RST, the module will boot up. USB D+ becomes high when booting is completed; simultaneously the module starts to communicate with host via USB or UART. Figure 3-2 shows power on timing sequence. During power on timing, it is better recommended that you keep VBAT available to avoid startup delays that will occur when powering down the module. Figure 3-2 Power on timing sequence
Comments
POWER_ON_OFF Valid to USB D+ high POWER_ON_OFF Valid to WAKEUP_SLEEP_OUT high
Time(Nominal values)
4 0.8
Units
sec sec
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Parameter
TPD TPRI TPRT
Comments
POWER_ON_OFF Valid to UART_DCD high POWER_ON_OFF Valid to UART_RING high POWER_ON_OFF Valid to UART_RTS de-assert
Time(Nominal values)
0.8 0.8 6.0
Units
sec sec sec
If the PC needs to detect the PID/VID of module during the BIOS phase, the detection time should exceed the TPD+ time. Figure 3-3 Power off timing
Comments
POWER_ON_OFF Valid to USB D+ high POWER_ON_OFF Valid to WAKEUP_SLEEP_OUT high POWER_ON_OFF Valid to UART_DCD high
Time(Nominal values)
0.720 0.023 0.030
Units
sec sec sec
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Parameter
TPRI TPRT
Comments
POWER_ON_OFF Valid to UART_RING high POWER_ON_OFF Valid to UART_RTS de-assert
Time(Nominal values)
0.268 0.013
Units
sec sec
For detailed information about power supply design and printed circuit board (PCB) design, see the HUAWEI LGA Module Power Supply Design Guide and the HUAWEI MU509 HSDPA LGA Module PCB Interconnection Design Guide.
Capacitor value
1.5 uF 3.3 uF 4.7 uF 6.8 uF
If the SMPL counter expires without VBAT returning to its valid range, the MU509 must undergo the normal power-on sequence whenever the VBAT is detected. Real-time clock If RTC is used, a manganese-lithium rechargeable battery is recommended, for example, the SII Micro Parts HB-414 and the Panasonic ML-series. Two sets of coin cell specifications are compared in Table 3-6. When the MU509 is off, the real-time clock (RTC) and its oscillator source are still active, provided by a coin cell battery
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which is installed. This allows continued monitoring of RTC alarms programmed via software. Table 3-6 Coin cell characteristics Parameter Specifications HB-414
Nominal voltage Nominal capacity Continuous standard load Operating temperature Diameter Height Weight 3V 0.3 mAh 5 mA -20 to +60 4.8 mm 1.4 mm 0.07 g
ML-series
3V 3.4 mAh 10 mA -20 to +60 6.8 mm 1.45 mm 0.17 g
An interrupt is generated if the coin cell voltage drops too low (and the main battery is not present). If this interrupt occurs, the RTC might be corrupted. A different interrupt is generated if the crystal oscillator stops; this signifies that handset timing is no longer accurate. Again, the RTC is corrupted. When the VBAT power supply of the MU509 is normal, the coin cell charging is powered from VBAT. The MU509 reads the coin cell voltage and monitors the charging. During normal operation, the VCOIN pin voltage will stay above 2.2V, even when the coin cell charger is turned off. Figure 3-4 shows the reference RTC circuit. Figure 3-4 VCOIN interface circuit
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Signal Name
POWER_ON_OFF RESIN_N
I/O
I I
Description
Pin for controlling power-on and power-off Pin for resetting the hardware
Make sure that the MU509 module is powered on at the recommended voltage and working temperature range. Otherwise, the module may get damaged or work improperly. External application interfaces must be powered on after the module is powered on. You can power on the MU509 module through the POWER_ON_OFF interface. The software will report relevant information according to the actual settings after the module is powered on. For example, the AT command automatically reports ^SYSSTART[1].
[1] For specific settings information about the power-on/power-off software, see the HUAWEI MU509 HSDPA LGA Module AT Command Interface Specification.
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Figure 3-5 shows the power-on time sequence. Figure 3-5 Power-on time sequence
When the wireless module is working, the wireless module is powered off if the power-on key is pulled down for more than 0.5s and then released. To ensure the normal power-off of the wireless module, you must ensure that the power-on key is pulled down for more than 0.5s and then released to the OPEN state.
Fetch Ext Code in the figure is a file system in the MU509 module. When powering on the wireless module, do not pull down the power-on key constantly. Otherwise, the wireless module may start abnormally or fail to be powered off normally.
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The processing of the power-off event depends on the normal stop time of the file system in the MU509 module. The processing varies with the capacity of the file system. When powering off the wireless module, do not pull down the power-on key constantly. Otherwise, the wireless module may start abnormally or fail to be powered off normally.
3.4.4 RESIN_N
The MU509 module supports hardware reset function. If the software of the MU509 module stops responding, you can reset the hardware through the RESIN_N signal. After the hardware is reset, the software starts powering on the module and reports relevant information according to the actual settings. For example, the AT command automatically reports ^SYSSTART.
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Signal Name
POWER_ON_OF F RESIN_N LED_STATUS LED_MODE
I/O
I I I I
Description
Pin for controlling power-on and power-off Pin for resetting the hardware Pin for network status LED Pin for network mode LED
As the RESET and POWER_ON_OFF signals are relatively sensitive, it is recommended that you install a 10 nF capacitor near the RESET and POWER_ON_OFF pins of the interface for filtering. In addition, when you design a circuit on the PCB of the interface board, it is recommended that the circuit length not exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, you need to wrap the area adjacent to the signal wire with a ground wire. Otherwise, the module may be reset due to interference.
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Figure 3-7 shows the connections of the POWER_ON_OFF and RESET pins. Figure 3-7 Connections of the POWER_ON_OFF and RESET pins
Operating Status
The 3G network is successfully registered. The dial-up connection is set up for accessing 3G data services. The software is being downloaded or upgraded. The network is being searched for or no network is detected. The 2G network is successfully registered.
LED_STATUS
The indicator blinks once each time. Light on
LED_MODE
Light off Light off
3 4
The indicator blinks fast. The indicator blinks twice each time. The indicator blinks once each time.
Light off
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No.
6
Operating Status
The dial-up connection is set up for accessing 2G data services.
LED_STATUS
Light off
LED_MODE
Light on
Blinking Once Each Time Figure 3-8 Status when the indictor blinks once each time
Blinking Fast Figure 3-9 Status when the indictor blinks fast
Blinking Twice Each Time Figure 3-10 Status when the indictor blinks twice each time
External Circuits Figure 3-11 shows the recommended circuits of the LED_MODE and LED_STATUS pins. According to LED feature, you can adjust the LED brightness by adjusting the impedance of resistor R.
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For resistance of R placed on user board, choose the value such that it satisfies the following equation: IF *R+VF = VBAT VF: Forward Voltage IF: Forward current Take the LED 19-213/GVC-AMNB/3T as an example (its manufacturer is Everlight Electronics., Ltd. and the website is http://www.everlight.com). Figure 3-11shows its IF-VF curves. If VBAT is 3.8V and the desired current through the LED IF is 3mA, then the voltage of the LED VF is 1.5V according to IF-VF curves, and the corresponding value for resistance of R is (3.8-1.5)/0.003=767 . The brightness of the LED depends on the current value, and for most of the indicator lights the current from 2mA to 5mA is already enough.
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11
WAKEUP_IN
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Table 3-11 Definition of the WAKEUP_OUT signal Pin Name Description Direction to Module
Output
71
WAKEUP _OUT
H: Module is in wakeup mode and module serial/USB is available. L: Module is in sleep mode and serial/USB is not available.
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Direct memory access (DMA) transmission Baud rate ranging from 600 bps to 230400 bit/s (115200 bps by default) Self-adapted baud rate ranging from 1200 bps to 115200bps Table 3-12 lists the UART interface signals. Table 3-12 UART interface signals Pin
76
Name
UART_TX
Description
Data sending on the wireless module Data receive end of the module Ringing indication on the wireless module Data sending request on the wireless module Data terminal ready on the wireless module Clearing to send on the wireless module Data carrier detection on the wireless module Data ready on the wireless module
Feature
The DTE receives serial data. The DTE transmits serial data. The DTE is notified of a remote call. The DTE notifies the DCE of sending requests. The DTE is ready. The DCE switches to the receiving mode. Data links are connected. The DCE is ready.
Direction
Output
78
UART_RX
Input
77
UART_RIN G UART_RTS
Output
74
Output
79
UART_DTR
Input
80
UART_CTS
Input
75
UART_DCD
Output
73
UART_DSR
Output
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The RS-232 chip can be used to connect the MU509 module to the RS-232-C interface. In this connection, the transistor-transistor logic (TTL) level and the Electronic Industries Association (EIA) level are converted mutually. For example, it is recommended that you use the MAX3232 chip with a 2-wire serial port and the SP3238 or MAX3238 chip with an 8-wire serial port.
For detailed application of the MU509 UART interface, see the HUAWEI LGA Module UART Design Guide.
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Pins
34 89 90 88 70
Description
Power source for the external UIM/SIM. External UIM/SIM data signal. External UIM/SIM clock signal. External UIM/SIM reset signal. SIM insert or remove detection
Direction to Module
Output Input/Output Output Output Input
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To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the SIM card socket should be placed near the LGA interface (it is recommended that the PCB circuit connecting the LGA interface and the SIM card socket not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality. It is recommended that you wrap the area adjacent to the SIM_CLK and SIM_DATA signal wires with a ground wire. The GND pin of the SIM card socket and the GND pin of the SIM card must be well connected to the power GND pin supplying power to the MU509 module. A 0.1 uF capacitor or a 0.22 uF capacitor is placed between the VSIM and GND pins in a parallel manner. Three 33 pF capacitors are placed between the SIM_DATA and GND pins, the SIM_RST and GND pins, and the SIM_CLK and GND pins in parallel to filter interference from RF signals. You do not need to pull the SIM_DATA pin up during design as a 15000-ohm resistor is used to connect the SIM_DATA pin to the VSIM pin.
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Name
MIC1_N MIC1_P EAR_OUT_N EAR_OUT_P MIC2_N MIC2_P SPKR_OUT_N SPKR_OUT_P
Description
Negative pole of the audio input signal of the first channel Positive pole of the audio input signal of the first channel Negative pole of the audio output signal of the first channel Positive pole of the audio output signal of the first channel Negative pole of the audio input signal of the second channel Positive pole of the audio input signal of the second channel Negative pole of the audio output signal of the second channel Positive pole of the audio output signal of the second channel
The two audio I/O channels are completely different and thus have good performance of resisting RF interferences. The routes on the printed circuit board (PCB) should be placed in parallel with each other and should be short. The filter circuit on the two sides should be symmetric. The differential signals should be close to each other. The audio output signals in differential pairs and the audio input signals in differential pairs should be separated effectively through ground. In addition, the audio signals should be located away from the circuits of the power supply, RF, and antenna.
Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd.
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The first audio channel can be used for the handset without requiring any audio amplifier. The output power for the differential ear output is typically 350 mW for a full-scale +3 dBm sine wave into a 32-ohm speaker. The second audio channel can be used for the hands-free without requiring any audio amplifier. The output pins are configured differently, with a rated output of 500 mW into an 8 speaker. Considerable current flows between the audio output pins and the speaker, and thus wide PCB traces are recommended (20 mils). MU509 provides 2.2V and 1.8V power source and 1mA of bias current internally for the microphones of both audio channels. Figure 3-18 Circuit diagram of the interface of the first audio channel
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Figure 3-19 Circuit diagram of the interface of the second audio channel
It is recommended that a TVS be used on the related interface, to prevent electrostatic discharge and protect integrated circuit (IC) components. Data only does not support the voice function.
Name
PCM_SYNC PCM_DIN PCM_DOUT PCM_CLK
Description
PCM interface sync PCM I/F data in PCM I/F data out PCM interface clock
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The MU509 PCM interface enables communication with an external codec to support hands-free applications; linear, -law, and a-law codecs are supported. The auxiliary codec port operates with standard long-synchronization timing and a 128 kHz clock. The PCM_SYNC runs at 8 kHz with a 50% duty cycle. Most -law and a-law codecs support the 128 kHz PCM_CLK bit clock. Hands-free applications Standard long-synchronization timing; 128 kHz clock Supports linear, -law, and a-law codecs AUX_PCM_SYNC runs at 8 kHz with 50% duty cycle Figure 3-20 Circuit diagram of the interface of the PCM
It is recommended that a TVS be used on the related interface, to prevent electrostatic discharge and protect integrated circuit (IC) components. Data only edition does not support the voice function.
Primary Mode
On Primary mode MU509 provides a 16-bit linear or 8-bit A-law or -law, with shortsync and 2.048MHz clock (on the PCM_CLOCK pin). Both Master and Slave mode are allowed.
Auxiliary Mode
On Auxiliary mode MU509 provides only 8-bit A-law or -law with padding, with long-sync and 128KHz clock (on the PCM_CLOCK pin). Only Master mode is allowed.
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RF Specifications
4
4.1 About This Chapter
Operating Frequencies Conducted RF Measurement Conducted Rx Sensitivity and Tx Power Antenna Design Requirements
RF Specifications
Tx
19201980 MHz 18501910 MHz 880915 MHz 824849MHz 824849 MHz 880915 MHz 17101785 MHz 18501910 MHz
Rx
21102170 MHz 19301990 MHz 925960 MHz 869894 MHz 869894 MHz 925960 MHz 18051880 MHz 19301990 MHz
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RF Specifications
The compensation for different frequency bands relates to the cable and the test environment. The instrument compensation needs to be set according to the actual cable conditions.
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RF Specifications
Item
GSM1900 (2.43%) W2100 (0.1%) W1900 (0.1%) W900 (0.1%) W850 (0.1%)
1. % = Bit Error Rate or Block Error Rate. 2. The test values are the average of some test samples.
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RF Specifications
S11 or VSWR
S11 (return loss) indicates the degree to which the input impedance of an antenna matches the reference impedance (50 ohm). S11 shows the resonance feature and impedance bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector analyzer. The following S11 values are recommended for the antenna of MU509: S11 of the master antenna < 6 dB
Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation. The linear polarization is recommended for the antenna of MU509.
Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in the remote field region. The radiation pattern of an antenna commonly describes the power or field strength of the radiated electromagnetic waves in various directions from the antenna. The power or field strength varies with the angular coordinates ( and ), but is independent of the radial coordinates. The radiation pattern of half wave dipole antennas is the best for wireless terminals. The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal plane, and the incident waves of base stations are often in the horizontal plane. For this reason, the receiving performance is optimal. The following radiation patterns are recommended for the antenna of MU509: Master antenna: omnidirectional
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RF Specifications
The antenna consists of the antenna body and the relevant RF transmission cable. Take the RF transmission cable into account when measuring any of the preceding antenna indicators. Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, Pulse, etc.
4.5.2 Interference
Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module. To guarantee high performance of the module, the interference sources on the user board must be properly controlled. On the user board, there are various interference sources, such as the LCD, CPU, audio circuits, and power supply. All the interference sources emit interference signals that affect the normal operation of the module. For example, the module sensitivity can be decreased due to interference signals. Therefore, during the design, you need to consider how to reduce the effects of interference sources on the module. You can take the following measures: Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module.
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RF Specifications
Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC requirements: This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the UC864-E/G/WD /WDU module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations.
Passive Tests
Antenna efficiency Gain Pattern shape Envelope correlation coefficient
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RF Specifications
Active Tests
TRP: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems TIS: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems Figure 4-1 shows the SATIMO microwave testing chamber. Figure 4-1 SATIMO microwave testing chamber
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Table 5-1 lists the extreme working conditions for the MU509 module. Using the MU509 module beyond these conditions may result in permanent damage to the module. Table 5-1 Extreme working conditions for the MU509 module Symbol
VBAT VCOIN VI
Specification
External power voltage Input voltage of standby power for the RTC Data pin voltage
Minimum Value
0.4 2.0 0.4
Maximum Value
5.0 3.15 3.3
Unit
V V V
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Minimum Value
20 30 to 20 40 5
Maximum Value
+70 +70 to +75 +80 95
Unit
C C C %
[1]: When the MU509 module works at this temperature, all its RF indexes comply with the 3GPP TS 45.005 specifications. [2]: When the MU509 module works at this temperature, certain RF indexes do not comply with the 3GPP TS 45.005 specifications.
Description
High-level input voltage Low-level input voltage Input leakage current High-level output voltage Low-level output voltage High-level output current
Minimum Value
0.65*VDD_PX 0.3 0.2 VDD_PX 0.45 0 1.5
Maximum Value
VDD_PX +0.3 0.35* VDD_PX 0.2 VDD_PX 0.45
Unit
V V uA V V mA
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Parameter
IOL
Description
Low-level output current
Minimum Value
Maximum Value
1.5
Unit
mA
Minimum Value
3.3
Typical Value
3.8
Maximum Value
4.2
Ripple
< 50 mVp-p (0 Hz to 2.5 GHz)
Unit
V
VCOIN
1.5
3.0
3.25
< 30 mVpp
Figure 5-1 lists the Power Supply During Burst Emission Figure 5-1 Power Supply During Burst Emission
The VBAT Minimum Value must be guaranteed during the burst (with 2.75A Peak in GSM, GPRS or EGPRS mode).
Table 5-5 Requirements for input current of the MU509 module Power
3.8 V
Peak (Maximum)
2750 mA1
Normal (Maximum)
1100 mA
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Standby current consumption with Sleep mode activate d- Suspend (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA GSM/ GPRS / EDGE HSDPA / WCDMA UMTS bands GSM bands UMTS bands GSM bands 4 4 75 mA mA mA DRX cycle = 8 (2.56 s) MFRM = 5 (1.175 s) Module power up and idle DRX cycle = 8 (2.56 s) 75 mA Module power up and idle MFRM = 5 (1.175 s)
Low Power Mode (LPM) / Offline Mode RF disabled but module is operational Not supported mA State is entered when Watcher shuts down / turns off the radio. LPM is the lowest possible (rock bottom) state in Sleep mode.
Standby current consumption with Sleep mode deactivated-Idle (assumes USB bus is fully suspended during measurements)
Band
Band I (IMT2100)
Test Value
295 320 535
Units
mA
Power (dBm)
1 dBm Tx Power 10 dBm Tx Power 24 dBm Tx Power
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Description
Band
Band II (PCS 1900)
Test Value
300 330 555
Units
mA
Power (dBm)
1 dBm Tx Power 10 dBm Tx Power 24 dBm Tx Power
Band V (850M)
mA
mA
HSDPA
Band I (IMT2100)
mA
mA
Band V (850M)
mA
mA
Test Value
310 470 690 165 250 410
Units
mA
PCL
5
Configuration
1 Up/1 Down 2 Up/1 Down 4 Up/1 Down
mA
10
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Description
GPRS900
Test Value
290 440 625 155 235 380
Units
mA
PCL
5
Configuration
1 Up/1 Down 2 Up/1 Down 4 Up/1 Down
mA
10
GPRS1800
mA
mA
10
GPRS1900
mA
mA
EDGE850
mA
mA
15
EDGE900
mA
mA
15
EDGE1800
175
mA
1 Up/1 Down
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Description
Test Value
265 345 110 145 185
Units
PCL
Configuration
2 Up/1 Down 4 Up/1 Down
mA
10
EDGE1900
mA
mA
10
In idle mode, the module is registered to the network, USB bus is active, and no voice or data call connection is ongoing. The above values are the average of some test samples.
Test Condition
Temperature: 402C Test duration: 24 h Temperature: 852C Test duration: 24 h Temperature: 302C Test duration: 24 h Temperature: 752C Test duration: 24 h
Standard
IEC60068
IEC60068
IEC60068
IEC60068
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Item
Damp heat cycling
Test Condition
High temperature: 552C Low temperature: 252C Humidity: 95% Repetition times: 4 Test duration: 12 h + 12 h
Standard
IEC60068
Temperature shock
Low temperature: 402C High temperature: 852C Temperature change interval: < 30s Test duration: 15 min Repetition times: 100
IEC60068
Temperature: 35C Density of the NaCl solution: 51% Spraying interval: 8 h Duration of exposing the module to the temperature of 35C: 16 h
IEC60068
Sine vibration
Frequency range: 5 Hz to 200 Hz Acceleration: 10 m/s2 Frequency scan rate: 1 oct/min Test period: 3 axial directions. Five circles for each axial direction.
IEC60068
Shock test
Half-sine wave shock Peak acceleration: 300 m/s2 Shock duration: 11 ms Test period: 6 axial directions. One shock for each axial direction.
IEC60068
Clash test
Half-sine wave Peak acceleration: 180 m/s2 Pulse duration: 6 ms Repetition time: 6 directions. 1000 times for each direction.
IEC60068
Drop test
First case: 0.3 m in height. Drop the MU509 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested. Second case: 0.8 m in height. Drop the MU509 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested.
IEC60068
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Length of the SIM interface lines (preferably <10cm). EMC protection on audio input/output (filters against 900MHz emissions). Biasing of the microphone inputs. Ground plane: HUAWEI Wireless recommends a common ground plane for analog/digital/RF grounds. A metallic case or plastic casing with conductive paint is recommended, except for the area around the antenna.
The HUAWEI MU509 Embedded Module does not include any protection against over voltage.
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Mechanical Specifications
6
6.1 About This Chapter
Nameplate
Mechanical Specifications
This chapter describes the following aspects of the MU509 module: Dimensions and interfaces
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Mechanical Specifications
6.3 Nameplate
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Mechanical Specifications
The picture mentioned above is only for reference. Please contact us for more details about the nameplate. Make the film according to the drawing. The silk-screen should be clear, without burrs, and dimension should be accurate. This nameplate shouldnt be covered by film. The material and surface finishing and coatings which used have to make satisfied with the EU WEEE and RoHS directives. The label must be heated up for 20-40s and able to endure the high temperature of 260 degree. And the color of the material of the nameplate cant change.
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Expansion
Wideband CODE division multiple access European Conformity Coding Scheme Circuit Switched Data Direct Current Data Circuit-terminating Equipment direct memory access Data terminal Equipment Electronic Industries Association Electromagnetic Compatibility Electrostatic Discharge European Union Federal Commnications Commission Frequency Division Duplexingtime Division Multiple Access Gaussian MinimumSshift Keying General Packet Radio Service International Standards Organization Liquid Crystal Polyester Low-Dropout Light-Emitting Diode Multi-chip Package
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Acronym or Abbreviation
NTC PBCCH PCB PDU RF RoHS RTC SIM TTL TVS UART VSWR
Expansion
Negative Temperature Coefficient Packet Broadcast Control Channel Printed Circuit Board Protocol Data Unit Radio Frequency Restriction of the Use of Certain Hazardous Substances Real-time Clock Subscriber Identity Module Transistor-transistor Logic Transient Voltage Suppressor Universal Asynchronous Receiver-Transmitter Voltage Standing Wave Ratio
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