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Philips Semiconductors
Preliminary specication
TDA8511J
The device is primarily developed for multi-media applications and active speaker systems.
The TDA8511J is an integrated class-B output amplifier in a 17-lead DIL-bent-SIL power package. It contains 4 13 W single-ended amplifiers.
MAX. 18 4 100
UNIT V A mA A W W dB V k
ORDERING INFORMATION TYPE NUMBER TDA8511J PACKAGE NAME DBS17P DESCRIPTION plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) VERSION SOT243-1
2000 Mar 10
Philips Semiconductors
Preliminary specication
TDA8511J
V P1
VP2 13
TDA8511J
6 output 1
Cm
output 2
14 stand-by switch VA 15 k x1 supply voltage ripple rejection 4 15 k mute reference voltage Cm mute switch 60 k VA 2 k 18 k mute switch 60 k VA 2 k 18 k power stage 12 power stage 10 PROTECTIONS thermal short-circuit stand-by reference voltage mute switch 16
diagnostic output
input 3
15
output 3
Cm
input 4
17
output 4
7 GND1
ground (signal)
not connected
2000 Mar 10
Philips Semiconductors
Preliminary specication
TDA8511J
IN1 1 SGND 2 IN2 3 RR 4 VP1 5 OUT1 6 GND1 7 OUT2 8 n.c. 9 OUT3 10 GND2 11 OUT4 12 VP2 13 MODE 14 IN3 15 VDIAG 16 IN4 17
MGL498
TDA8511J
FUNCTIONAL DESCRIPTION The TDA8511J contains four identical amplifiers and can be used for single-ended applications. The gain of each amplifier is fixed at 20 dB. Special features of the device are: Mode select switch (pin 14) Diagnostic output (pin 16). Mode select switch (pin 14) Low standby current (<100 A) Low switching current (low cost supply switch) Mute facility. To avoid switch-on plops, it is advised to keep the amplifier in the mute mode during 100 ms (charging of the input capacitors at pin 1, 3, 15 and pin 17).
This can be achieved by: Microprocessor control External timing circuit (see Fig.7). Diagnostic output (pin 16) DYNAMIC DISTORTION DETECTOR (DDD) At the onset of clipping of one or more output stages, the dynamic distortion detector becomes active and pin 16 goes LOW. This information can be used to drive a sound processor or DC volume control to attenuate the input signal and thus limit the distortion. The output level of pin 16 is independent of the number of channels that are clipping (see Fig.3).
2000 Mar 10
Philips Semiconductors
Preliminary specication
TDA8511J
handbook, halfpage VO
MGA706
V16 VP 0 t
Pin 16 is an open collector output, which allows that more devices can be connected together (pins 16).
in output stage
MGL508
V16 VP
t 50 s
2000 Mar 10
Philips Semiconductors
Preliminary specication
TDA8511J
UNIT
C C C
THERMAL CHARACTERISTICS In accordance with IEC 747-1. SYMBOL Rth(j-a) Rth(j-c) PARAMETER thermal resistance from junction to case CONDITIONS see Fig.5 VALUE 40 1.3 UNIT K/W K/W
handbook, halfpage
output 1
3.0 K/W
3.0 K/W
0.7 K/W
0.7 K/W
MEA860 - 2
0.2 K/W
case
2000 Mar 10
Philips Semiconductors
Preliminary specication
TDA8511J
TYP.
MAX.
UNIT
18 160 6.4 2
V mA V
V mV
2 100 40
V A A V
2000 Mar 10
Philips Semiconductors
Preliminary specication
TDA8511J
TYP.
MAX. 21 75 100 1
UNIT W W % W W Hz kHz dB dB dB dB k V V V dB dB
on; Rs = 10 k; note 4
3. Ripple rejection measured at the output with a source-impedance of 0 , maximum ripple amplitude of 2 V (p-p) and at a frequency between 100 Hz and 10 kHz. 4. Noise measured in a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage independent of Rs (Vi = 0 V).
2000 Mar 10
Philips Semiconductors
Preliminary specication
TDA8511J
VP 10 k 16 5 13 100 nF 2200 F
14
TDA8511J
220 nF input 1 1 6 1000 F 60 k 220 nF input 2 ground (signal) supply voltage ripple rejection input 3 220 nF 60 k 220 nF input 4 12 17 1000 F RL 7 11
MGL499
RL 8
3 2 60 k
1000 F RL
4 100 F V p /2 60 k 15
reference voltage 9
not connected
10 1000 F RL
2000 Mar 10
Philips Semiconductors
Preliminary specication
TDA8511J
handbook, halfpage
VP
10 k
100
47 F
MGA708
2000 Mar 10
10
Philips Semiconductors
Preliminary specication
TDA8511J
SOT243-1
non-concave D x Dh
Eh
A2
B j E A
L3
Q c v M
1 Z e e1 bp w M
17 m e2
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
1.27 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
2000 Mar 10
11
Philips Semiconductors
Preliminary specication
TDA8511J
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications. suitable suitable(1) WAVE
2000 Mar 10
12
Philips Semiconductors
Preliminary specication
TDA8511J
2000 Mar 10
13
Philips Semiconductors
Preliminary specication
TDA8511J
2000 Mar 10
14
Philips Semiconductors
Preliminary specication
TDA8511J
2000 Mar 10
15
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
753503/03/pp16
Mar 10
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