Advantages

of SEMIKRON products

Index
SEMIPACK ................................................................................................................................................ 1 SEMIPONT ............................................................................................................................................... 1 SEMITRANS .............................................................................................................................................. 2 SEMiX ....................................................................................................................................................... 2 MiniSKiiP .................................................................................................................................................. 2 MiniSKiiP IPM .......................................................................................................................................... 3 SEMITOP .................................................................................................................................................. 3 SEMISTART .............................................................................................................................................. 3 Stud screw diodes & thyristors................................................................................................................ 4 Drivers ..................................................................................................................................................... 4 Modules for 3-level circuit topology ....................................................................................................... 4 LPR (Low Power Rectifier) diodes for solar applications ......................................................................... 5

SEMIPACK
World-wide standard packaging Accessories and fan for easy mounting on P3 heat sink available (e.g. SEMISTACK KIT)

SEMIPONT
High integration 1x SEMIPONT can replace several (2 or 3) SEMIPACK modules

SEMIPONT 5 (newer) Higher overload withstand (higher i2t and Ifsm) Better thermal performance (lower Rth_js) Easier PCB layout Higher power cycling capability Higher reliability 1

SEMITRANS
Standard case types (world-wide standard) SEMIKRON has lower stray inductance (about 30%) than competitors with the same case, due to o Centre point connection for all paralleled chips o Parallel DC terminals This allows higher di/dt for a given max. voltage spike, or lower voltage spikes for a given max. di/dt value. High isolation voltage (Vac=4.8kV, 1sec) is standard in most modules

SEMiX
Fast and easy assembly Separation of AC, DC and Control unit Expandable by easy paralleling of modules Spring contacts used as electrical contact to control unit o no solder joints no solder fatigue higher reliability Directly mounted driver (through adapter board) o Direct access to the IGBTs o No risk of noise on the gate wires o No loose wires or connectors o Compact design of the inverter

MiniSKiiP
Fast and easy assembly of the module on the heat sink Spring contacts o High thermal- and power cycling capability Vibration ruggedness Increased reliability and product life time Pressure contact technology o Easy one/two screw mounting o Low cost assembly o Easy replacement Centre screw assembly o Homogeneous pressure distribution optimal thermal resistance

MiniSKiiP IPM
HVIC (High Voltage Integrated Circuit) gate driver included o Saving costs by short development cycles o Optimized switching behavior o Input interface logic for 3V up to 15V Higher degree of integration / Higher power density o Reduced inverter volume Open low-side emitter outputs for individual current sensing Integrated temperature sensor (+ advantages of normal MiniSKiiPs)

SEMITOP
Alternative solution to TO discrete devices for all the applications that require high integration, insulation and reliability. Lower thermal resistance (30% less Rth_js) than TOs Reduced stray inductance Lower mounting cost (easy one-screw mounting) No insulation material required Improved reliability Reduced overall dimensions

SEMISTART
Traditional soft start solutions consist of either power modules (e.g. SKKT) or capsule thyristors (e.g. SKT) mounted on separate heat sinks The solution based on SEMISTART has: o Same surge current capability (Ifsm) due to the same chip size o High reliability due to pressure contact technology o 2x better thermal resistance higher overload for short form possible o Compact design o Integrated heat sink Lower logistics cost due to only one part number 3

Stud screw diodes & thyristors

Convenient for both natural convection and forced cooling Easy assembly - no additional hardware necessary Diodes available in standard, fast and avalanche versions Thyristors available in standard version Can be selected for parallel operation Low thermal resistance Sealed cases

Drivers
Full insulation between controller and IGBT Gate resistor for turn-on and turn-off separately adjustable Variable interlock mode and desaturation monitoring Undervoltage control Fault memory and fault feedback to the control system

SKYPER Simple o Just driving and basic protection Adaptable o For different power modules platforms (with or w/o adapter boards) Expandable o Driving half-bridges, six-packs, and more o Connecting external boost capacitors o Connecting external monitoring circuits Short time to market o Simple interface (control with only 3 signals possible) o Ready to use drivers

Modules for 3-level circuit topology

Improved spectral performance compared to half bridge topologies o Reduction of size and filter of the inverter o Increase of switching frequency without major impact to losses o 60% less losses compared to 2-level inverter Reduced stress to machine windings and bearings Mainly used in transformerless UPS systems and PV inverters Cost-efcient: one module replaces two, easy to control, low commutation inductivity

LPR (Low Power Rectifier) diodes for solar applications

Standard rectifiers o Reverse voltage up to 1200 V + more rugged against over voltage spikes o Forward voltage below 0,87 V @ 5A - higher losses in bypass mode than Low VF and schottky diodes o Low leakage current < 0,1 uA + more reduced losses in normal mode than schottky diodes o High junction temperature 175 C @ 80%VRRM Schottky rectifiers (SB) o Reverse voltage up to 100 V - lower rugged against over voltage than standard and Low VF rectifiers o Forward voltage below 0,37 V @ 5A + lower losses in bypass mode than standard o Higher leakage current 500 uA - higher losses in normal mode o High junction temperature 150 C @ 80%VRRM High temperature schottky rectifiers (SBH) o Reverse voltage up to 100 V - lower rugged against over voltage than standard and Low VF rectifiers o Forward voltage below 0,42 V @ 5A + lower losses in bypass mode than standard o Low leakage current 10 uA + lower losses in normal mode than schottky diodes o High junction temperature 200 C @ 80%VRRM o TL diodes minimizing Rth_jl compared to the competition products o SBH diodes extending the power by 30% due to the safe operation up to Tj=200C