Surface Engineering

Understand basic process and mechanism of PVD coating Able to differentiate the PVD coating process with other methods (ex: CVD, electroplating, etc.) Know the application of PVD

 Vaporization coating process. Coating material is physically removed from a source by evaporation or sputtering. Removal of coating material is at atomic level. It is atom by atom transfer of material from the solid phase to the vapor phase and back to the solid phase. The coating material is condensed as a film on the substrate surface. The depositing material reacts with a gaseous environment of co-deposited material to form a film of compound material, such as a nitride, oxide, carbide or carbonitride.

 Sequence in PVD process; 1. the material to be deposited is converted into vapor by physical means; 2. the vapor is transported across a region of low pressure from its source to the substrate; and 3. the vapor undergoes condensation on the substrate to form the thin film.

Evaporation based on the concept that there is exist a finite vapor pressure above any materials It can be sublimes (solid vapor) or evaporation (liquid vapor)

Evaporation system

 Sputtering is a mechanism by which atoms are dislodged from the surface of a material as a result of collision with high-energy particles. PVD by Sputtering is a term used to refer to a physical vapor deposition (PVD) technique wherein atoms or molecules are ejected from a target material by high-energy particle bombardment so that the ejected atoms or molecules can condense on a substrate as a thin film. Sputtering has become one of the most widely used techniques for depositing various metallic films on wafers, including aluminum, aluminum alloys, platinum, gold, TiW, and tungsten.

 A substrate (the item to be coated) is placed in a vacuum chamber opposite a target (made of the coating material being sputtered). The chamber is evacuated and then backfilled with a process gas (Argon). The gas is ionized with a positive charge, which creates plasma. Resulting ions are strongly attracted to the target, which carries a negative charge. The effect is a physical process similar to the interaction of billiard balls in a confined space. As the relatively large argon ions impact the target, atoms/molecules of target material are physically removed from the target. Due to it's close proximity, majority of sputtered atoms/molecules land on the substrate. The intent is for this material to arrive at the substrate with enough energy to form a thin, strongly attached film, one monolayer at a time

Thermal evaporation

Electron beam evaporation

Cathodic arc evaporation

Magnetron sputtering

Direct current (DC) sputtering

Radio frequency magnetron sputtering

 The type of material to be deposited Rate of deposition Limitations imposed by the substrate, such as, the maximum deposition temperature, size and shape Adhesion of the deposition to the substrate Throwing power (rate and thickness distribution of the deposition process, i.e., the higher the throwing power, the better the process ability to coat irregularly-shaped objects with uniform thickness) Purity of coating materials Equipment requirements and their availability Cost Ecological considerations Abundance of deposition material

improved surface properties inorganic material can be used as well as some kinds of organic materials more environmentally friendly

 It is a line of sight technique meaning that it is extremely difficult to coat undercuts and similar surface features High capital cost Some processes operate at high vacuums and temperatures requiring skilled operators Processes requiring large amounts of heat require appropriate cooling systems Deposition rate relatively slow

PVD coatings are generally used to improve hardness, wear resistance and oxidation resistance. Thus, such coatings use in a wide range of applications such as: Aerospace Automotive Surgical/Medical Dies and molds for all manner of material processing Cutting tools Fire arms