Beruflich Dokumente
Kultur Dokumente
by
Reema Agarwal
ID 0663834
AUTOMATIC REFINEMENT OF
ESL MODEL ABSTRACTIONS
Submitted in partial fulfillment of requirements for the degree of
MASTER OF TECHNOLOGY
by
Reema Agarwal
ID 0663834
ACKNOWLEDGEMENT
One of the most pleasant parts of writing a thesis is the opportunity to thank those who
have contributed to it. Unfortunately the list of expression of thanks, no matter how extensive, is
always incomplete and inadequate. These acknowledgements are no exceptions.
I am greatly indebted to my supervisor Professor Anshul Kumar, Department of
Computer Science & Engineering, Indian Institute of Technology, Delhi for giving me the
privilege to work under his esteemed guidance. I am grateful for his invaluable technical
guidance and moral support during the project work. I would like to owe my deep rooted
heartiest thanks to Dr. Preeti Ranjan Panda for his precious guidance and support during my
learning period in IIT, Delhi.
Thimmapuram at NXP semiconductor, Bangalore for his valuable guidance and deep in sight
into the problems.
I take this opportunity to offer my sincere and whole hearted gratitude to my guide Mrs.
Ritu Sharma, Malaviya National Institute of Technology, Jaipur for her kind and invaluable
guidance throughout the period of my M. Tech. dissertation. I would like to extend my gratitude
to Dr. Vineet Sahula for his guidance and constructive encouragement.
Last but not the least; I would like to thank all my friends and colleagues for their direct
and indirect support and also making my stay in IIT Delhi and MNIT enjoyable and memorable.
Reema Agarwal
ID 0663834
M.Tech. (VLSI)
MNIT, Jaipur
ABSTRACT
ESL can model a system at different abstraction levels such as programmers view (PV),
Architects View (PV+T) and Verification View (VV) and they are needed to serve different use
cases (Software development, architectural exploration). The modeling at different abstraction
level is possible by using SystemC based Transaction Level Modeling (TLM). For development
of any peripheral we have used features of COWARE SystemC modeling library and TLM
peripheral modeling library. Manual development of all these abstraction levels is effort
consuming and error prone activity. This project aims to develop an automatic methodology for
refinement of abstraction levels with some additional inputs preserving the original functionality.
CONTENTS
ACKNOWLEDGEMENT ........................................................................... I
ABSTRACT ............................................................................................... III
CONTENTS ............................................................................................... V
LIST OF FIGURES ................................................................................. VII
Objective ............................................................................................................... 1
Motivation ............................................................................................................. 2
Related Work ......................................................................................................... 2
Methodology .......................................................................................................... 3
Thesis Organization ............................................................................................... 3
SystemC ................................................................................................................. 5
2.1.1 SystemC 2.0 Language Architecture ................................................................... 5
2.1.2 Overview Of SystemC Components .................................................................. 6
2.1.3 SystemC Simulation Kernel ................................................................................ 7
2.2
Transaction Level Modeling ................................................................................... 8
2.2.1 What Is A Transaction? ...................................................................................... 8
2.2.2 TLM Use Cases And Abstraction Levels ............................................................ 9
4.1
4.2
PV Model of IP.................................................................................................... 25
PV+T Model of IP .............................................................................................. 28
Test Bench ........................................................................................................... 32
APPENDIX B ................................................................. 51
Case study of methodology................................................................................................. 51
LIST OF FIGURES
Fig 1.1
Fig 2.1
Fig 2.2
Fig 2.3
Fig 2.4
Fig 2.5
Fig 3.1
Fig 3.2
Fig 3.3
Fig 4.1
Fig 4.2
Architecture of IP .............................................................................................................. 22
Fig 5.1
PV model of IP .................................................................................................................. 25
Fig 5.2
Fig 5.3
Fig 5.4
PV + T model of IP .......................................................................................................... 28
Fig 5.5
Fig 5.6
Fig 5.7
Fig 5.8
Fig 5.9
Fig 6.2
CHAPTER 1
INTRODUCTION
1.1 Objective
1.2 Motivation
1.3 Related works (write about the works in market presently)
1.4 Methodology
1.5 Report organization
This report includes the following:
Chapter 2:--------------------(one line descriptions for each)
Chapter 3: -------------------Chapter 4: ----------------------
CHAPTER 2
BACKGROUND
2.1 MSP430 (Basic Introduction)
2.1.1
Architecture
2.1.2
2.1.3
Pin description
2.2 ADC
2.3 Comparator
2.4 Any other components of MSP used in your project
(eg timer/interrupts)
2.5 Sensors of MSP430 used (eg. Temp sensor)
2.6 Launchpad ( Diagram + description)
Note: in the topics 2.2, 2.3, 2.4, 2.5 etcwrite only about those components of MSP430
that you have used in your project. After including all components used, write about
Launchpad and number the headings accordingly.
CHAPTER 3
PROJECT DETAILS
3.1 Block Diagram
3.2 Description- working of project
3.3 Schematic Diagram
CHAPTER 4
HARDWARE
4.1 ICs used in the Project
4.1.1 Pin diagram
4.1.2 Pin description
4.1.3 Utilisation
4.2 Other components used
(4.2: Resistors (with ratings)
4.3 Capacitors (with ratings)
4.4 Transistors (with ratings)
4.5 Motors etc)
CHAPTER 5
SOFTWARE
5.1 CCS Studio ( description using screen snapshots)
5.1.1
5.1.2
instructions, write only about the main and complex to understand instructions)
5.3.1
instruction 1 + explanation
5.3.2
instruction 2+ explanation
5.3.3
instruction 3+ explanation
CHAPTER 6
RESULTS
6.1 Prototype (Basic Explanation)
6.1.1
6.1.2
CHAPTER 7
CONCLUSIONS
AND
WORKS
7.1 Innovation
7.2 Commercial Aspect
7.3 Applications of the Project
7.4 Future Enhancements
FUTURE
BIBLIOGRAPHY
Write about all the papers used in the proper IEEE
format
Write about the websites with their particular pages
and links that were used in the course of the project.
APPENDIX A
(Datasheets of ICs used)
Important Notes:
1. There will be a total of 4 reports from one group making a project.
One spiral bound report for Reema maam. This will be a
combined report from both members of a group.
Second will be a hard bound report for submission to the
department. This will be a combined report from both
members of a group.
Third will be a hard bound report for submission during the
time of submission during external viva. This will be an
individual file. This will be from the first member of the
group.
Fourth will be a hard bound report for submission during
the time of submission during external viva. This will be an
individual file. This will be from the second member of the
group.
2. All pages starting from chapter 1 must contain a header and footer.
Header must be the title of the project on the top right
corner of every page.
Footer must be the page number in the bottom centre of
every page.
3. New chapters should always begin from the odd numbered page.
4. The headings will be exactly in the same format and font size as given
and explained in the previous pages for every chapter. They are
Garamond, B, 28. The chapter subheading will be in Garamond, B,
18.
The
chapter
subheadings
will
be
in
Garamond , B, 14. The normal text will be in Times new Roman, 12,
Justified.
5. Each paragraph must begin after giving one tab.
6. References of papers used must be given in IEEE format including
square brackets. [ ]
7. A CD also has to be submitted along with the report. The contents of
the CD will be:
Video of the working prototype
Code in the .c file
Entire report
8. After completing the report send a mail to Reema Maam for final
approval before taking the print and binding.
The mail id to be used is: reemaagarwal.ece@jecrc.ac.in
The subject line of the mail must be: project report_roll no1,roll
no2
9. Binding details are as given below:
Black hard bound cover as front page with embossed text
Butter paper of good quality
Print of the inner page on a glossy sheet of paper. (color print)
Acknowledgement
Blank
Abstract
Blank
Contents
The footer of all the initial pages will be page numbers in
roman numbers on the bottom right corner of every page.
The footer for the inner page will be:
Jaipur Engineering College and Research Centre, Jaipur,2012
All Rights Reserved
(Details of the contents on these pages is already given as samples)