Beruflich Dokumente
Kultur Dokumente
SPRAY DRYING
SLIP
TAPE CASTING
ROLL COMPACTION
DRY PRESSING
EXTRUSION
STAMPING
FIRING
DRYING
MACHINING
CUTTING
SINTERING
SINTERING
GLAZING
FIRING
LASER SCRIBING
INSPECTION
INSPECTION
INSPECTION
GLAZING
INSPECTION
GLAZED SUBSTRATE
We are producing 96% alumina substrates (A-476) and 93% alumina substrates (A-473T) which have excellent thick film reliability and consistency.
sFeatures Our substrates have excellent thick film reliability and precise dimensional tolerance control (Super premium: 0.25%). They are cost effective for through-hole processes with small diameter holes (Min. 0.2mm) allowing densification of precision circuitry.
sApplication Hybrid lntegrated Circuit Resistor Network Chip Resistor Potentiometer Focus Substrate, etc
sCharacteristics of Material
Item Material Code Appearance Color Alumina Content Bulk Density Water Absorption Vickers Hardness (Hv 1.0) Flexural Strength Young's Modulus Coefficient of Linear Thermal Expansion Thermal Conductivity (20C) Dielectric Strenght Volume Resistivity Dielectric Constant (1MHz) Dielectric Loss Angle (1MHz) Surface Roughness % kg/m3 % GPa MPa GPa 40-400C 40-800C W/(m K) V/m cm (20C) (300C) (500C) 10-4 Ra m 96 3.7 103 0 13.7 350 320 7.2 10-6/C 7.9 10-6/C 24 12 10-6 >1014 1010 108 9.4 4 0.2-0.80 Material Alumina (Al2O3) A-476 (Tape) Dense White 92 3.6 103 0 12.3 310 280 6.9 10-6/C 7.8 10-6/C 22 12 10-6 >1014 1011 109 8.8 6 0.2-0.80 A-473T (Tape)
sDesign Guideline
Tape Manufacturing Method As Fired Camber Thickness Availability Thickness Tolerance Size Availability Standard:0.8%NLT.004 (0.10) Premium:0.5%NLT.003 (0.08) Length & Width Tolerance Super Premium: 0.25%NLT.002 (0.05) Scribing Tolerance Parallelism Perpendicularity Corner R Hole Size Spacing Between Holes or Edge to Holes Surface Roughness Standard:0.8%NLT.004 (0.10) Premium:0.5%NLT.003 (0.08) Super Premium: 0.25%NLT.002 (0.05) Standard:0.5% of outside dim. Premium:0.3% of outside dim. .020 (0.51) .008 (0.20) Dia. Min. .015 (0.38) Square Min. Minimum equal to thickness of substrate NLT.020 (0.51) * * * Punched/Greenscored
Surface Roughness
Laser Scored
+.008 (0.20) .002 (0.05) Edge to Scoreline: +.008 (0.20) .002 (0.05) Scoreline to Scoreline: .002 (0.05) .002 (0.05)
A-476: 8 to 30 inch CLA (Ra 0.2-0.75 m) A-473T: 8 to 30 inch CLA (Ra 0.2-0.75 m)
sFeatures
q Uniform
grain size and small voids to A-476 for thick film characteristics
q Focus
q Equivalent q Less
camber and edge-curl size can be produced (Max. 8" 10") Premium: 0.25% tolerance:Standard: 0.5%
q Larger
SEM (A-473T)
q Tight
q Same
5.00 m
As a leader in ceramic developement and one of the largest manufacturers of advanced ceramics in the world, Kyocera offers a complete line of ceramics with features such as; excellent electrical insulation at high frequency, high mechanical strength, high heat resistance, high wear resistance, extremely low thermal expansion and excellent chemical resistance. Kyocera's advanced dry pressing and extrusion technology can provide complicated designs and precise dimensional tolerances.
sCharacteristics of Material
Material Item Material Code Appearance Color Alumina Content Russet Dark brown A-459 A-445 A-473 ALUMINA (Al2O3) A-476 Dense White Ivory A-479 A-479SS A-480S
Al2O3 90% Al2O3 91% Al2O3 92% Al2O3 96% Al2O3 99% Al2O3 99.5% Al2O3 99.7% High Mechanical Strength, High Temperature Resistance, High Frequency Insulation, High Chemical Resistance Good for Light Good for Good Surface Hard and Hard and Metallizing Intercepting, Metallizing, Smoothness Chemically Chemically High Heat Mechanically Stable Stable, Dissipation Strong Fine Grain Strong and Smooth High Purity, High Chemical Resistance, Good Anti-Plasma, Wear Resistance 3.7 x 103 0 16.2 350 380 0.23 7.2 8.0 32 0.75 x 103 12 x 106 >1014 1013 1010 9.9 1 10
Main Characteristics
Bulk Density Water Absorption Vickers Hardness (HV1.0) Flexural Strength Compressive Strength Young's Modulus Poisson's Ratio Fracture Toughness
JIS C2141 JIS C2141 JIS R1610 JIS R1601 JIS R1602 JIS R1607 JIS R1618 JIS R1611 JIS R1611
40~400C Coefficient of Linear Thermal Expansion 10 -6/C 40~800C Thermal Conductivity W/m K Specific Heat J/kg K Heat Shock Resistance (Put in water) C V/m Dielectric Strength 20C cm Volume Resistivity 300C 500C Dielectric Constant (1MHz) (10 -4) Dielectric Loss Angle (1MHz) Loss Factor (10 -4)
JIS C2141
3.6 x 103 0 11.8 310 280 0.23 7.0 7.9 14 0.75 x 103 12 x 106 >1014 1011 109 8.8 6 53
3.8 x 103 0 12.7 290 320 0.24 7.3 8.1 12 0.75 x 103 12 x 106 >1011 107 106 9.8 25 245
3.6 x 103 0 12.3 310 2,300 280 0.23 6.9 7.8 18 0.75 x 103 200 12 x 106 >1014 1012 1010 9.0 6 54
3.7 x 103 0 13.7 350 320 0.23 7.2 7.9 24 0.75 x 103 200 12 x 106 >1014 1010 108 9.4 4 38
3.8 x 103 0 15.2 270 2,160 360 0.23 4.6 7.2 8.0 29 0.75 x 103 200 12 x 106 >1014 1010 108 9.9 2 20
3.8 x 103 0 15.2 340 2,350 370 0.23 4.2 7.2 8.0 32 0.75 x 103 250 12 x 106 >1014 1013 1010 9.9 1 10
Electrical Characteristics
MULLITE (3Al2O3 2SiO 2) K-690 Porous White Excellent Thermal Shock Resistance Very low Thermal Expansion Very low Thermal Expansion Dark brown White ML-652 S-210
STEATITE (MgO SiO 2) S-211 Dense Dark brown Good Light Shield F-1120
Milky white High Mechanical Strength, Excellent Wear Resistance, Good Surface Finish, High Fracture Toughness
Thermal Insulator
3.2 x 103 0 10.8 280 210 5.0 5.8 5 0.75 x 103 12 x 106 >10 14 1012 109 7.4 20 148
2.8 x 103 0 5.4 180 120 0.24 7.4 8.0 2.2 0.71 x 103 13 x 106 >10 14 1010 107 6 18 1kgf/mm 2=9.807MPa
3.1 x 103 0 6.4 180 130 0.22 9.2 10.4 2 0.71 x 103 13 x 106 >10 14 107 107 8 750
3.0 x 103 0 6.9 160 150 0.24 9.7 5 0.75 x 103 13 x 106 >10 14 1010 1010 6.5 5
3.0 x 103 0 5.9 160 150 0.24 10.1 5 0.75 x 103 13 x 106 >10 14 109 109 6.5 5
6.0 x 103 0 12.3 980 5,690 210 0.31 4.5 10.5 11.0 3 0.46 x 103 300
For thin film deposition, we have 99.6% alumina substrates (A-493, A-494) which offer excellent surface smoothness.
sCharacteristics of Material
Item Surface Roughness Bulk Density Grain Size Average Alumina Content Color Water Absorption Dielectric Constant Dielectric Loss Angle Volume Resistivity Thermal Conductivity 25C 300C 500C Side B: Unit
Side A: CLA inch (Ra m) kg/m3 m Wt% 1MHz 1MHz cm Wm/ k perC
3.86 103 < 1.5 < 1.0 99.6 White Nil 9.9.2 2 10-4 > 1014 (25C) 33 30 25 7.2 10-6 7.4 10-6 8.2 10-6 550
SEM A-493
6.0 m
6.0 m
Length, Width
Item Max Size Green Score Standard: 0.8% NIL.004" Premium: 0.5% NIL.003" Laser Score (0.10) Standard: +.008"/-.002" (+0.2/-0.05) Premium: (Thickness:0.020"orLESS) (0.08) .004"/-.002" (+0.1/-0.05) Straightness
L
Surface Roughness
Tolerance
A-493
Perpendicularity
100 m
a
A-494
1 m
L b
.002"
sFeatures
q Excellent q Tight
sMaterial
q Kyocera
q Available q .002" q8
sVisual Defects
q Scratches: q Voids:
.0008"dia max.
q Contamination:
A-493 Premium
sSurface Roughness
Standard Premium
A-494 Standard
sThickness Tolerance
Size Standard Premium Less than 3" .0008 (0.02) .0004 (0.01) 3" or more .0020 (0.05) .0008 (0.02)
A-494 Premium
sFlatness
Size (inch) 2 2 .010 2 2 .015 2 2 .025 3 3 .010 3 3 .015 3 3 .025 4 4 .010 4 4 .015 4 4 .025 4.5 4.5 .015 4.5 4.5 .025 Standard One side polished .0020 (0.05) .0016 (0.04) .0008 (0.02) .0036 (0.09) .0032 (0.08) .0024 (0.06) .0200 (0.50) .0100 (0.25) .0032 (0.08) .0200 (0.50) .0080 (0.20) max. Both sides polished .0016 (0.04) .0012 (0.03) .0006 (0.015) .0030 (0.075) .0024 (0.06) .0016 (0.04) .0120 (0.30) .0060 (0.15) .0024 (0.06) .0140 (0.35) .0060 (0.15) max. One side polished .0014 (0.035) .0010 (0.025) .0005 (0.013) .0020 (0.05) .0016 (0.04) .0012 (0.03) .0100 (0.25) .0050 (0.13) .0020 (0.05) .0120 (0.30) .0050 (0.13) max. Premium
Both sides polished .0010 (0.025) .0006 (0.015) .0004 (0.01) .0016 (0.04) .0012 (0.03) .0008 (0.02) .0050 (0.13) .0032 (0.08) .0016 (0.04) .0080 (0.20) .0040 (0.10) max.
sFeatures
Kyocera glazed substrates consist of 96% alumina with a glass overcoat. They have superior flatness and fewer surface defects so it is very applicable for thermal printheads used in advanced and downsized facsimile machines. Kyocera can provide various types of glazed substrates for each application such as partial glazed, full glazed and serial glazed substrates.
Glazed Substrates
1.Partial Glazed Substrates Used in both thin and thick film types of thermal printheads for high speed G3 and G4 type facsimiles and color printers. Heater elements are put on a 1 to 3 mm narrow glazed portion to allow thermal printheads to closely fit a sheet of thermal paper and provide very clear and crisp printing.
Glazed Part
2.Full Glazed Substrates Used in thick film type of thermal printheads for regular type of facsimiles. The glazed surface is quite flat and the meniscus at the edges are low, so the full glazed substrates allow thermal printheads print very clear words.
Glazed Part
3.Serial Glazed Substrates Used in thermal printheads for wordprocessors and bar code printers. The dimensional tolerances of glaze pitch are very tight allowing the distance between the substrate edge and the glazed portion for heater elements to be short and the width of the glazed portion to be narrow so high speed printing is possible.
Glazed Part
GS-71 680 870 6.8 10-6 0.75 >1014 >1014 2.1 1010 8.7 10.0 10-4 <0.02
Premium Tolerance .0016 (0.04) .0024 (0.06) .0032 (0.08) .040 (0.10) .040 (0.10) .020 max. (0.5 max.) .016 max. (0.4 max.) .016 max. (0.4 max.) .012 max. (0.3 max.)
.0004 (10m)
Glaze thickness of partial glazed substrate with width of less than .035" is .002" max.
Miniaturization of circuit size is possible due to the ceramic's high dielectric constant. Q values even at high frequencies.
q High q
high Q value.
q Stable
Stable circuit operation can be obtained due to the low temperature coefficient of the dielectric constant. Because of a wide range of dielectric values, circuit design can be tailored to fit the application more easily. Surface finish can be selected to allow use with thin film or thick film technologies. Numerous custom designs such as holes, complicated 3 dimensional shapes, and snaplines are available due to Kyocera's advanced dry press technology.
electrical characteristics
sCharacteristics of Material
Material Code Dielectric Constant Q value Temperature Coefficient ( or f) Coefficient of Linear Thermal Expansion (40~400C) Thermal Conductivity Bulk Density Flexural Strength Water Absorption Application (GHz) ppm/C 1/C W/m k kg/m3 MPa % SM200 201 >8000 (6) -2530 9.2 10-6 7.5 3.7 103 190 0 SM210 211 >8000 (6) -2530 9.2 10-6 7.5 3.7 103 190 0 SH790 791 >1500 (2.6) -3530 SH890 891 >1800 (2.6) -3530 SH110 1103 >1200 (2.3) -7030 10.1 10-6 2.1 5.7 103 180 0 SB350 35~37 4500 (10) f 01~81 9.0 10-6 2.9 4.6 103 180 0 SL390 39~42 6500 (10) f -31~81 SV430 43~46 4400 (10) f -71~81
10.1 10-6 10.1 10-6 2.1 5.7 103 180 0 2.1 5.7 103 180 0
10.3 10-6 10.2 10-6 2.9 5.6 103 100 0 DR 2.9 4.8 103 290 0
MIC Filter/Isolator/MIC
sShapes
q Snaplines
process.
q Products
sFeatures
q High
thermal conductivity (7 to 8 times as much as Al2O3) expansion is close to Silicon wafer. mechanical strength and high density. chemical durability.
sCharacteristics of Material
Item Color Bulk Density Thermal Conductivity Thermal Characteristics Coefficient of Linear Thermal Expansion Dielectric Strength Volume Resistivity Dielectric Constant Materials g/cm
3
AN215 Black
Electrical Characteristics
Dielectric Loss Angle 1MHz (10-4) Hardness (Hv1.0) Mechanical Characteristics Flexural Strength Young's Modulus GPa MPa GPa
100 200 300 400 500 5 2.5 Dielectric Loss Angle 1MHz (10-4) 5max
AIN Al2O3
sThermal Characteristics
300 250 200 ALN 150 100 Si 50 0 1 2 3 4 5 6 Thermal Expansion (10-6/C) 7 8 9 BN GaAs Al2O3 SiC BeO
AN217 AN215
Al2O3
Multiform Glass
sFeatures
q High
q High q High
q Excellent q Sealing
sCharacteristics of Material
Item Material Code Coefficient of Linear Thermal Expansion Annealing Temperature Softening Temperature Strain Point Bulk Density Flexural Strength 1/C Unit Characteristics G901 30~380C 24.01.5 (10-7) G902 27.51.5 (10-7)
C C C kg/m
3
MPa 20C
Volume Resistivity
cm 300C 500C
Viscosity-Temperature Curve
-6
Dielectric Strength
V/m
Cathode-Ray Tube
10 Log Viscosity (poise)
Softtening point
Working-point
400
600
800
1400
1600
Ferrite
sFeatures
q Manufactured
in the world.
q Many
standard materials to fit your application. shapes, high precision are no problem with Kyocera
q Complex
industry's best selection for magnetic shielding for SMT is also available.
sCharacteristics of Material
Code No. 100kHz Initial Permeability 1MHz 10MHz 100kHz (10-6) Relative loss factor (tan / ) 1MHz (10-6) 10MHz (10-6) 25~20C Relative Temperature Coefficient ( r) (10-6) 20~80C (10-6) Saturated Magnetic Flux Density Bs (mT) Residual Magnetic Flux Density Br (mT) Electrical Resistivity ( cm) 108 NZ001A NZ021A NZ112A NZ131A NZ221A NZ241A NZ273B NZ311A NZ312B NZ341A NZ411A NZ411B NZ511A NZ511G 1 1 1 7 7 7 26,000 3,600 1,300 35 35 80 20 108 65 65 65 200 130 180 0 0 380 230 108 160 160 160 150 80 280 50 35 370 160 108 370 370 220 30 60 3,000 4 2 290 110 108 480 480 300 15 30 2,700 15 7 350 120 108 150 150 160 120 50 80 15 10 250 90 108 650 650 270 20 55 4,500 20 10 390 210 108 490 500 260 15 60 3,200 0 1 290 110 108 900 950 330 15 65 4,400 20 9 360 160 108 800 800 200 50 80 4,700 25 15 380 190 108 1,100 1,200 250 15 120 5,300 15 6 380 170 108 2,000 1,500 240 15 360 9,600 7 2 320 100 108 450 430 220 80 210 4,400 8 2 230 130 108
sDESIGN GUIDELINE
DR CORE
q Both q d,
SQUARE CORE
q Both
alumina and ferrite are available. shape, high precision are no problem with
q Complicated
d 1.5 0.4
PUSHPIN CORE
q Suitable q Using
CAP CORE
q Suitable q Square q Using B 2.5 A 10.0, 1.0 C 5.0 B 0.3 atA 4.0 B 0.5 at4.0 A 6.0 B 0.8 at6.0 A A A B
1.2
METALIZATION
q Both
figure
0.1-0.35 0.3-0.8
D 0.3 D 0.5 atC 3.0 at3.0 C 5.0 Minimum dimension of B&D in round pot cores as follows B 0.4 D 0.3 NOTE:B&D depends on A&C
C
0.1
0.1MAX. 0.1MAX.
Ag(AgPd)+Ni+Sn/Pb
good point
alumina ferrite
sSapphire sFeatures
q Perfect q Mirror q Low q High
polished surface.
q Excellent
(Silicon On Sapphire) structure. circuit miniaturization. (Fig.2) for high speed circuits. radiation hardness.
q Enable
Comparsion in structure and individual chip size of SOS and bulk silicon