Vishay Diodes Division

8D Report
Customer Complaint Information: Samples Received: Fab Location : Customer: Customer Location: Country: Application: Customer Ref # : Customer Part # : Sales Contact : DISCIPLINE 1: ESTABLISH TEAMS TEAM CHAMPION: 400015246 0019766A0 2011-08-04 VSG Continental Silao Gto MEXICO Sales Ref # : Assembly Location: Vishay Part # : Product : Product Code : Package : Analysis Code: ASPAS Contact na VSS BZT55C5V1-GS 18 Zener ZENER Quadromelf ZQG

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N110804002S 1 of 11 2011-08-18

REPORT STATUS:

8D CLOSED

CUSTOMER INPUT:
FAILURE RATE: FAILURE MODE: soldering failure DETECTED AT : FUNCTIONAL TEST Bad solder ability on terminal D0600

NA

Li Jing
QUALITY ASSURANCE: Quality Engineer: Quality Manager: TECHNICAL MARKETING: Sales Region: Technical Mktg: PRODUCTION: Production Engineer: Production Manager:

Ouyang Li Di Lifeng

NA Stephen Eaton

Yu Zhaosheng Albert Chiang

DISCIPLINE 2: DESCRIBE PROBLEM

Solder ability test on the returned diode was negative. Date code provided by the customer is 1050, which means the diode was produced in week50 of year 2010.
DISCIPLINE 3: INITIAL CONTAINMENT ACTIONS/ INITIAL CONCLUSIONS Will a Containment Action be implemented? Yes No Date implemented : From Date Code:

Containment ActionVishay Process / Warehouse / Consignment locations / Vishay Sample Service Center/Other inventory:

We checked our stock and did not find diodes with the same date code in our stock. We checked 2000 pieces of minimelf diodes in the production line under microscope and did not found any abnormal diodes. Then we selected 20pcs for solder ability test. No diodes were found with similar problem, the soldering of the diodes was normal.
Containment Action Verification Data (table, graph, etc) and/or Plan:

Implemented date: August 5, 2011.

Result: Zero defect

Product/Package Identification for Contained Material:

NA
Additional Information required from customer? Yes No Date D1 to D3 Completed:

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Vishay Diodes Division

8D Report

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DISCIPLINE 4: ROOT CAUSE/RESULTS Describe Failure Mode and Mechanism:

One piece of diode mounted on PCBA was returned for analysis. Please see picture 1 on it:

Picture 1 Visual inspected the diode on the PCBA, found the terminal of the anode side had poor soldering and the cathode terminal was soldered well. Please see picture 2 on them:

Cathode terminal Picture 2

Anode terminal

Removed the diode from the PCBA and performed dip test, the anode side of the diode had poor soldering performance. Dip test: We checked solder ability performance of the diode with dipping test according to the standard J-STD-002. In addition decrease the test temperature for solder bath from 245 to 235, which will provide stricter test condition for solder ability test. Test conditions: Immerse in the soldering flux for 3 seconds and then immerse in the soldering bath for 5 seconds. Soldering flux: 25wt.% colophony + 75wt.% isopropylcarbinol. Soldering bath: 235+/-5 .
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Vishay Diodes Division

8D Report
Solder: 96.5% Sn + 3% Ag. + 0.5% Cu Please see picture 3 on the anode terminal surface after dipping test:

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Picture 3 The area that could not be tinned on the plug was checked with EDX. Please refer to picture 4 on details:

Picture 4

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Vishay Diodes Division

8D Report

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Process Root Cause:

Please refer to below fish-bone diagram on this problem:

Decision table:
Issues 1. Tinning operators skill is not enough Date August 17, 2011 Evaluation According to date code provided by the customer, we checked the related operator at tinning station. The operator had worked at this station for more than 3 months before week 50 of year 2010. So this issue can be excluded. 2.Gas pressure too low August 17, 2011 During our tinning process, the container with diodes, tinning powder and quartz sands need to be heated with gas to melt tinning powder. Please picture 5 on it. If the gas pressure were too low, it would need more time on melting tinning powder and plate on diodes surface would be oxidized. 3.Container of the tinning machine was damaged August 17, 2011 Inner of the container is coated with ceramic to make sure no diodes sticking on it. During our normal production, the coating will be peeled off after the container has been used for a period of time. So we will replace the old container with new one every 25 days. We checked the related records, and found the container had
Vishay Diodes Division Company Confidential Page 4 of 11

Influence No

Yes

No

Vishay Diodes Division

8D Report

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been used for two days only when it was used for this lot. Comparing the container life and the used time, we can exclude this issue. 4. Quartz sands grain is too small August 17, 2011 During our hot tinning process, we need mix diodes, tinning powder and quartz sands together and heat them in a rotating oven. Here quartz sands are needed to make sure the diodes surface to be heated evenly and to remove diffused copper with friction between sands and diodes. If quartz sands are too fine, the friction will not be enough to remove diffused copper completely and some sands residues would be found on diodes tinning surface. From the diode EDX analysis, No Si and Ca were found on diodes tinning surface, so this factor could be excluded. 5. Flux has problem August 17, 2011 Before used, all flux need to be checked with functional test. We checked the related records and did not found problem on functional test. 6. Composition on tinning powder 7. No copper coating on plug August 17, 2011 August 17, 2011 We checked tinning powder composition records from supplier and did not found any problem. If tinning powder composition had problem, many diodes would be found with solder ability problem. All plugs are coated with copper. If there is not copper coating on plug, tinning could not be plated on diodes terminals. From EDX analysis on the returned diodes, Cu was found, so this issue can be excluded. 8. Light is not enough August 17, 2011 During our tinning process, our operator needs to observe the diodes status. If light is not enough, the operator might not find abnormality and many lots of diodes would escape. In case this problem occurs, many lots of diodes would be found with solder ability problem. We check the IR reflow soldering tests records, no abnormality found. This factor is excluded. 9. Process condition was set wrongly August 17, 2011 Check the parameters setting of the tinning process record, no abnormality found. This factor is excluded. . No No No No No No

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Vishay Diodes Division

8D Report

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Picture 5: Diodes tinning in the container Process Root Cause:

Date code provided by the customer is 1050. We checked our delivery records and found the lot number on it was 6410505A75, which means the diode was produced on Friday in week 50 of year 2010. Checking the production record according to the date code information, we did not find any problem. We also found we used one old gas pressure gauge that was different from the other type of gas gauges for the square-minimelf diodes tinning machines before week17 of year 2011. When operators check the gas gauge, it would make the operator confused and not easy to detect the problem when the gas pressure was out of control. Please refer to picture 6 and picture 7 for the two types of gas gauges.

Picture 6: The old gas pressure gauge

Picture 7: The normal gas pressure gauge

We assumed the root cause for such case was that: the gas pressure of the tinning machine for square-minimelf diodes was too low occasionally, and the operator didn't detect it by careless, so that it spent more time on melting tinning powder, which led to plate surface on some diodes oxidized and solder ability problem.
Process System Root Cause:

We didnt realize this problem and the gas pressure gauges were not robust enough to prevent them from being read wrongly before week27 of 2011.
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Vishay Diodes Division

8D Report
Escape Root Cause Analysis:

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During our normal process, we will perform visual check and solder ability dipping test for every lot to detect diodes with solder ability problem. These diodes escaped our normal checking with below reasons: Please refer to below analysis information on it:

Issues 1. Operator has no experience to detect this problem. 2.Solder bath temperature 3. Solder composition on the bath 4. This diode was not selected for solder ability test 5.Surroundings temperature and humidity Escape Root Cause:

Date Aug.17, 2011 Aug.17, 2011 Aug.17, 2011 Aug.17, 2011 Aug.17, 2011

Evaluation We have never found similar problem before this lot of diode produced, so our operators have not been informed of this kind of problem. Solder path temperature for dipping test is 235C +/-5C. Its temperature is calibrated regularly. We checked calibration records and not problem was found. Solder in the bath was changed regularly and controlled by appointed engineer. After tinning process, IPQC will selected 2000pcs to do visual inspection and 13pcs to perform dip test for every lot. This lot of diode escaped our test because the poor diodes were not selected. Surroundings temperature and humidity are controlled. Till now, we have not found that surrounding temperature and humidity would affect solder ability test result.

Influence Yes

No

No

Yes

No

1. Our IPQC operators had no experience to detect this problem because they had never seen such kind of failure symptom before.
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Vishay Diodes Division

8D Report

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2. Our IR reflow test was performed by sampling test. We tested 200pcs minimelf diodes every day to performed IR reflow test, if the poor soldering diodes impact only one lot of production, we cant detected it by the IR reflow test. Escape System Root Cause Such kind of failure symptom was not introduced in our IPQC working instruction. Risk assessment: We checked related production records and did not find any abnormality. According to our delivery information, total 100k pieces of BZT55C5V1-GS18 diodes were sent to different customers and only this diode was complained with solder ability problem, so was assumed only a few of diodes with such problem.

Current Conclusion on Problem Ownership : Vishay Diodes Division - Corrective Action required Customer - any further information the customer has that conflicts with this should be fed back for consideration. Not Determined - see any request for further information on failure event. Send additional samples for analysis DISCIPLINE 5: CORRECTIVE ACTIONS Corrective Action Status(if required) : CA pending CA determined

Process Root Cause Corrective Action: 1. Used the same type of gas pressure gauges for all tinning machines, and require operator to check them every shift before production. 2. Remark upper limit and lower limit on the gas pressure gauges to prevent from them being read wrongly. 3. Evaluate to add a warning system for each gas pressure gauge, once the gas pressure is out of the control limit, it will alarm and stop production. Escape Root Cause Corrective Action: 4. Train and verify all the IPQC operators with such samples to insure all the IPQC operators have ability to detect such kind of failure during dip test. Process/Escape System Root Cause Corrective Action: 5. Add this failure symptom pictures into our IPQC document.

DISCIPLINE 6: IMPLEMENT CORRECTIVE ACTIONS Corrective Action Projected Completion Dates: Corrective Action effective from Date Code:

Corrective Action Verification Data (table, graph, etc) and/or Plan:

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Vishay Diodes Division

8D Report
Action 1: WW17/2011 Action 2: WW27/2011 Action 3: Schedule to be completed in WW40/2011 Action 4: WW27/2011 Action 5: Schedule to be completed in WW38/2011
DISCIPLINE 7: Document Revision details: PREVENT RECURRENCE ECN#:

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Date completed:

Update Standards

Document Type Control Plan FMEA PM Plan Procedure(s) Test Program Drawings BOM Other

Required (Yes/No)

Document #

Who

When

No No No Yes No No No No FC:05002 Yu Zhaosheng WW38/2011

Look Across (Corrective Actions applied to other areas to prevent recurrence) Type Required (Yes/No) Product Families Manufacturing Lines Equipment Other Locations Who When Details (e.g. family, equipment, location names)

No No Yes No
DISCIPLINE 8: CONGRATULATE TEAM

Jiang Guoping

2011-10-10

For all hot tinning machine

Revised by: Approved by:

Li Jing Di Lifeng Luo Chengzhi Albert. Chiang

Rev.: Date:

Original 2011-08-18 2011-08-18 2011-08-18

Date:

2011-08-18

Approved by:

Date:

Approved by:

Date:

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Vishay Diodes Division

8D Report
Approved by:

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Jiang. Guoping
JT Lo

Date:

2011-08-18
2011-08-18

Date Closed:

2011-08-18

Management Approval:

Date:

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Vishay Diodes Division

8D Report

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N110804002S 11 of 11 2011-08-18

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