BAT30

Small signal Schottky diodes

Features

Very low conduction losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode
SOD-923 SOD-523 SOD-323

BAT30JFILM (Single)

BAT30KFILM (Single)

BAT30LFILM (Single)

Description
The BAT30 series uses 30 V Schottky barrier diodes encapsulated in a wide range of packages such as SOD-323, SOD-523, SOD-923, SOT-23, SOT-323, or SOT-666. This device is specially suited for switching mode applications needing low forward voltage drop diodes.

BAT30FILM (Single) SOT-23 BAT30AFILM (Common anode) BAT30SFILM (Series) BAT30CFILM (Common cathode)

BAT30WFILM (Single) BAT30CWFILM (Common cathode) BAT30AWFILM (Common anode) BAT30SWFILM (Series)

SOT-323

Table 1.

Device summary
Symbol IF VRRM C(typ) Tj (max) Value 300 mA 30 V 14 pF 150 C

BAT30-07P6FILM (2 parallel diodes) SOT-666 BAT30-09P6FILM (2 opposite diodes)

Configurations in top view

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Characteristics

BAT30

Characteristics
Table 2.
Symbol VRRM IF IFSM Tstg Tj TL

Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified)

Parameter Repetitive peak reverse voltage Continuous forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Maximum soldering temperature
(1)

Value 30 300 tp = 10 ms Sinusoidal 1 -65 to +150 150 260

Unit V mA A C C C

1. Pulse test: tp = 5 ms, < 2 %

Table 3.
Symbol

Thermal parameters
Parameter SOT-23 Value 500 550 C/W SOD-523, SOT-666 SOD-923 600 900 Unit

Rth(j-a)

Junction to ambient(1)

SOT-323, SOD-323,

1. On epoxy printed circuit board with recommended pad layout

Table 4.
Symbol

Static electrical characteristics

Parameter Test conditions VR = 5 V Tj = 25 C VR = 10 V VR = 25 V VR = 30 V Tj = 70 C Tj = 85 C VR = 10 V IF = 0.1 mA IF = 1 mA IF = 10 mA Min. Typ. 0.65 7 18 530 Max. 0.5 1 3 A 5 20 50 240 300 375 430 500 580 mV Unit

IR(1)

Reverse leakage current

VF(2)

Forward voltage drop

Tj = 25 C IF = 30 mA IF = 100 mA IF = 200 mA IF = 300 mA

1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %

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BAT30 Table 5.
Symbol

Characteristics Dynamic characteristics

Parameter Test conditions VR = 0 V, F = 1 MHz Min. Typ 22 14 6 Max. pF Unit

Diode capacitance

VR = 1 V, F = 1 MHz VR = 10 V, F = 1 MHz

Figure 1.

Power dissipation versus average forward current

Figure 2.
IF(AV) (A)

Average forward current versus ambient temperature ( = 1)

P (W)
0.175 0.150 0.125 0.100 0.075 0.050 0.025 0.000 0.00
=0.05 =0.1 =0.2 =0.5 =1

0.35 0.30 0.25 0.20 0.15 0.10 0.05

tp

IF(AV) (A)

=tp/T
0.25 0.30

=tp/T
0.00
0.35

tp

Tamb ( C)

0.05

0.10

0.15

0.20

25

50

75

100

125

150

Figure 3.

Relative variation of thermal impedance junction to ambient versus pulse duration

Figure 4.

Relative variation of thermal impedance junction to ambient versus pulse duration

Zth(j-a) /Rth(j-a)
1.E+00
Single pulse SOT-23

Zth(j-a) /Rth(j-a)
1.E+00
Single pulse SOT-323/SOD-323

Epoxy printed board FR4 Copper surface = 2.25 mm2 Coppr thickness = 35 m

1.E-01
1.E-01

1.E-02
Alumine substrate 10 x 8 x 0.5 mm

1.E-02 1.E-03

tP(s)
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02

tP(s)
1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

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Characteristics

BAT30

Figure 5.

Relative variation of thermal impedance junction to ambient versus pulse duration

Figure 6.

Relative variation of thermal impedance junction to ambient versus pulse duration

Zth(j-a) /Rth(j-a)
1.E+00
Single pulse SOT-666

Zth(j-a) /Rth(j-a)
1.E+00
Single pulse SOD-923

Epoxy printed board FR4 Coppr thickness = 35 m

1.E-01

1.E-01

tP(s)

tP(s)
1.E-02 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
1.E-02 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Figure 7.

Relative variation of thermal impedance junction to ambient versus pulse duration

Figure 8.

Thermal resistance junction to ambient versus copper surface under each lead (SOD-923)

Zth(j-a) /Rth(j-a)

1.E+00
Single pulse SOD-523

Rth(j-a) (C/W)
900 800
Epoxy printed board FR4 Coppr thickness = 35 m
Epoxy printed board FR4 Copper thichness = 35 m

700 600 500 400

1.E-01

1.E-02

300 200

tP(s)

100 0

SCU(cm)
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

Figure 9.

Thermal resistance junction to ambient versus copper surface under each lead (SOD-323)

Figure 10. Leakage current versus reverse applied voltage (typical values)
IR (A)

Rth(j-a) (C/W)
600
Epoxy printed board FR4 Copper thichness = 35 m

1.E+04

1.E+03

Tj=150C Tj=125C

500

1.E+02
Tj=85C

400

1.E+01

1.E+00
300

Tj=25C

1.E-01
200 0 5 10 15 SCU(mm)

VR (V)

1.E-02
20 25 30 35 40 45 50

10

15

20

25

30

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BAT30

Characteristics

Figure 11. Relative variation of reverse leakage current versus junction temperature (typical values)
IR[T j] / IR[T j=25C]

Figure 12. Junction capacitance versus reverse applied voltage (typical values)
C(pF)

1.E+04
VR=30 V

100
F=1 MHz VOSC=30 mVRMS Tj=25 C

1.E+03

1.E+02

1.E+01

10

1.E+00

1.E-01
Tj(C)
VR(V)

1.E-02 -40 -20 0 20 40 60 80 100 120 140 160

1 1 10 100

Figure 13. Forward voltage drop versus forward current (typical values)
1.E+01
IFM(A)

Figure 14. Forward voltage drop versus forward current (typical values)
IFM(A)

1.E+01

1.E+00
Tj=150 C

1.E+00

1.E-01

1.E-01
Tj=125 C Tj=25 C

1.E-02

Tj=85 C

1.E-02
Tj=-40 C

1.E-03

1.E-03
VFM(V)
VFM(V)

1.E-04 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3

1.E-04 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3

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Ordering information scheme

BAT30

Ordering information scheme

Figure 15. Ordering information scheme

BAT30 Signal Schottky diodes VRRM = 30 V Configuration Blank = Single diode A = Common anode C = Common cathode S = Series diodes 07 = Parallel diodes 09 = Opposite diodes Package Blank = SOT-23 J = SOD-323 K = SOD-523 L = SOD-923 P6 = SOT-666 W = SOT-323 Packing FILM = Tape and reel

xx

xx

FILM

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BAT30

Package information

Package information

Epoxy meets UL94, V0 Lead-free packages

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 6. SOD-323 dimensions
Dimensions Ref.
H b E A1

Millimeters Min. Max. 1.17 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41

Inches Min. 0 0.01 0.004 0.06 0.044 0.09 0.004 0.004 Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016

A A1
D A

0 0.25 0.1 1.52 1.11 2.3 0.1 0.1

b c

Q1

D E

H L Q1

Figure 16. SOD-323 footprint (dimensions in mm)

3.20

0.30

1.06

1.08

1.06

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Package information Table 7. SOD-523 dimensions

Dimensions
E 0.15 M C A B E1 B

BAT30

Ref.

Millimeters Min. Typ. 0.60 1.60 1.20 0.80 0.20 Max. 0.70 1.70 1.30 0.90 0.35 0.20 0.25 0.20 Min. 0.020 0.059 0.043 0.028 0.010 0.003 0.006 0.002

Inches Typ. 0.024 0.063 0.047 0.031 0.008 Max. 0.028 0.067 0.051 0.035 0.014 0.008 0.010 0.008

2xb

A E
8

0.50 1.50 1.10 0.70 0.25 0.07 0.15 0.05

0.20 M C A B A R0.1

E1
A
SEATING PLANE

c C L 7

D b c

L1

L L1

Figure 17. SOD-523 footprint (dimensions in mm)

0.7

0.3

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BAT30 Table 8.
L

Package information SOD-923 dimensions

Dimensions Ref. Millimeters Min. A
C A

Inches Min. Typ. Max. 0.016 0.010 0.003 0.022 0.037 0.030 0.012 0.006 0.024 0.039 0.032 0.014 0.008 0.026 0.041 0.035 0.008

Typ.

Max. 0.40

b c D

0.25 0.08 0.55 0.95 0.75 -

0.30 0.145 0.60 1.00 0.825 -

0.35 0.21 0.65 1.05 0.90 0.20

E
E1 E

E1 L

Figure 18. SOD-923 footprint (dimensions in mm)

0.37

0.34

0.58 1.32

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Package information Table 9. SOT-23 dimensions

Dimensions Ref.
A
E

BAT30

Millimeters Min. Max. 1.4 0.1 0.51 0.18 3.04 1.05 2.1 1.6 2.75 0.6 typ. 0.35 0.65

Inches Min. 0.035 0 0.012 0.003 0.108 0.033 0.067 0.047 0.083 Max. 0.055 0.004 0.02 0.007 0.12 0.041 0.083 0.063 0.108

A A1
e B e1
D

0.89 0 0.3 0.085 2.75 0.85 1.7 1.2 2.1

B c

S A1

D e e1

L
H

E H L S

0.024 typ. 0.014 0.026

Figure 19. SOT-23 footprint (dimensions in mm)

0.95

0.61

1.26

0.73

3.25

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BAT30 Table 10. SOT-323 dimensions

Package information

Dimensions
A
E

Ref.

Millimeters Min. Typ. 2.0 1.25 0.65 2.1 0.2 Max. 1.1 0.1 0.4 0.26 2.2 1.35 2.4 0.3 30 Min. 0.031 0.0 0.010 0.004 0.071 0.045 0.071 0.004 0

Inches Typ. 0.079 0.049 0.026 0.083 0.008 Max. 0.043 0.004 0.016 0.010 0.086 0.053 0.094 0.012 30

A
e b
D

0.8 0.0 0.25 0.1 1.8 1.15 1.8 0.1 0

A1 b c
A1

D E e
c H

H L q

Figure 20. SOT-323 footprint (dimensions in mm)

0.95

1.0

2.9

0.8

0.50

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Package information Table 11. SOT-666 dimensions

Dimensions
b1 L1

BAT30

Ref.

Millimeters Min. Typ. 0.27 0.50 0.19 Max. Min.

Inches Typ. Max. 0.024 0.007 0.013

L3 b

A A3 b
D E1

0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.10 -

0.60 0.018 0.18 0.003 0.34 0.007

b1 D

0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043
-

0.020 0.007

0.067 0.067 0.051

-

E
L2 E A3

E1 e L1 L2

0.012

0.30 0.004 0.10 0.004

L3

Figure 21. SOT-666 footprint (dimensions in mm)

0.50

0.62

2.60

0.99

0.30

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BAT30

Ordering information

Ordering information
Table 12. Ordering information
Marking P3 Q3 A30 A30 C30 C30 B30 30 30 31 S30 S30 B30 Package SOT-666 Parallel SOT-666 Opposite SOT-23 Common anode SOT-323 Common anode SOT-23 Common cathode SOT-323 Common cathode SOT-23 Single SOD-323 Single SOD-523 Single SOD-923 Single SOT-23 Serial SOT-323 Serial SOT-323 Single Weight 2.9 mg 2.9 mg 10 mg 6 mg 10 mg 6 mg 10 mg 5 mg 1.4 mg 0.56 mg 10 mg 6 mg 6 mg Base qty 5000 5000 3000 3000 3000 3000 3000 3000 3000 10000 3000 3000 3000 Packing mode Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel

Order code BAT30-07P6FILM BAT30-09P6FILM BAT30AFILM BAT30AWFILM BAT30CFILM BAT30CWFILM BAT30FILM BAT30JFILM BAT30KFILM BAT30LFILM BAT30SFILM BAT30SWFILM BAT30WFILM

Revision history
Table 13.
Date 24-Jul-2006 08-Jul-2009 13-Oct-2009

Document revision history

Revision 1 2 3 First issue Added SOD-923 package. Table 12 sorted on alphabetic sequence of order code. Updated ECOPACK statement. Updated Table 7 quote L1 from 0.10 to 0.05. Changes

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BAT30

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