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Contents
1 2 Introduction ............................................................................. 2 Test equipment ......................................................................... 3 System ................................................................................ 3 Backplane............................................................................. 4 Shock absorber ..................................................................... 4 Load Board ........................................................................... 5 Mechanical Load Board ........................................................... 6 MCH .................................................................................... 7 Power Module........................................................................ 7 Module Fixing........................................................................ 7 Testing machines................................................................... 8
2.9.1 Shaker ....................................................................... 8 2.9.2 Shock test machine ...................................................... 9 Test procedure........................................................................ 10 Sine Vibration (AC1 IED 61587-1) ........................................10 Random Vibration (AC2 VITA 47) .........................................10 Shock (AC1 IEC 61587-1) ...................................................11 Shock (AC2 VITA 47)..........................................................11
Test results ............................................................................. 12 Sine Vibration ......................................................................12 Random Vibration .................................................................12 Shock test (AC1 IEC 61587-1) .............................................14 Shock Test (AC2 VITA 47) ...................................................14
Conclusion .............................................................................. 15 Vibration profile (sinusoidal)................................. 16 Vibration profile (random) .................................... 18 Shock profile (AC1 IEC 61587-1) ........................ 20 Shock profile (AC2 VITA 47) ............................... 21 MCH Log ................................................................ 22
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1 Introduction
The MicroTCA system architecture is not only dedicated for the telecom market, but also for industrial and even for rugged applications like transportation and MIL/AERO applications. The following tests should show the capabilities that the ELMA MicroTCA systems can withstand shock and vibration tests that are required. To meet these requirements, the system and daughter cards have to be prepared. The system that was used is a specially adapted ATR system with a MicroTCA card cage. The AMCs have to be modified with special screwable front panels, so that they could be fixed with captive screws to the extrusions. Other cards, like MCH and PM are fixed with screws and washers.
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2 Test equipment
2.1 System
The device under test is the ELMA Ruggedized MicroTCA system. The system is an ARINC 404A full size ATR long. It includes a MicroTCA card cage. The mechanic was designed according to meet the following MIL standards: MIL-STD 810 E for shock and vibration MIL-STD 461 for EMI
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2.2 Backplane
The backplane that was included into the system is the ELMA MicroTCA Cube backplane for rugged environments. To withstand higher shock and vibration values, the AMCs can be fixed on the extrusions. The backplane can contain up to six AMC cards, one MCH and one Power Module.
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2.6 MCH
The MCH that was used in the system was the NAT-MCH-GbE (one tongue). This MCH was prepared by fixing the ribbon cable with silicon material.
(CEN-MPWR-4840). It was also prepared by fixing higher devices like aluminum electrolyte capacitors with silicon.
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2.9.1 Shaker Inv.-nr: 612 Shaker RMS SW 6005 Charge Amplifier Bruel&Kjaer 2626 Accelerometer S/N 848930
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2.9.2 Shock test machine Inv.-nr: 610 Shock Test Machine AVCO SM 110-3 Charge Amplifier Bruel&Kjaer 2626 Accelerometer S/N 848928
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3 Test procedure
After each test period, the system was completely checked for mechanical and electrical damage. An electrical test was performed to ensure the functionality of the system. For this reason, the system was switched on with all slots populated with cards. The activation of any card should show that the system was not damaged at any position.
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4 Test results
4.1 Sine Vibration
Mechanical: No issues during this test Electrical: All slots booted up without errors.
Y-axis: Test was performed without shock absorbers Mechanical: Some load resistors disassembled during tests. Electrical: All slots booted up without errors.
Z-axis: Test was performed without shock absorbers Mechanical: Some load resistors disassembled during tests. Electrical: Two slots didnt boot up. After extraction and reinsertion they booted up without errors.
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Ruggedized MicroTCA Shock and vibration tests by ELMA Trenew Electronic X-axis: Test was performed with shock absorbers System was booted up during this test Test duration: 30min Mechanical: No issues during this test Electrical: The MCH showed some error messages:
pm_processEvent(50): Power Channel Notification Event, Sensor=0x0, Dir=0x6f, Data=0xa1 0x1b 0x01
Despite of this, the system worked fine, after the vibration test. All cards were hot-swappable.
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Y-axis: After 6 shocks (3 shocks +Y-axis, 3 shocks Y-axis) Mechanical: No issues during this test Electrical: All slots booted up without errors
Z-axis: After 6 shocks (3 shocks +Z-axis, 3 shocks Z-axis) Mechanical: No issues during this test Electrical: All slots booted up without errors
Y-axis: After 6 shocks (3 shocks +Y-axis, 3 shocks Y-axis) Mechanical: No issues during this test Electrical: All slots booted up without errors
Z-axis: After 6 shocks (3 shocks +Z-axis, 3 shocks Z-axis) Mechanical: No issues during this test Electrical: All slots booted up without errors
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5 Conclusion
By screwing the front panels of the AMCs to the extrusions, there were no mechanical problems. Even weight loaded boards (264g) were held correctly in the card cage. The electrical tests after the shock and vibration tests showed that the boards were not damaged during the tests and were functioning well.
Further research is required to check the plating of the AMC boards and the backplane connectors.
could
also be
used
for
rugged
environments for transportation and MIL/AERO applications. Only little modification is needed on the standard AMC boards.
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Appendix A
STATUS INFORMATION FREQUENCY: 19.30 Hz REFERENCE: 2.97 g pk CONTROL ACCELERATION: 2.95 g pk CONTROL VELOCITY: 0.24 m/s pk CONTROL DISPLACEMENT: 3.94 mm pp
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Ruggedized MicroTCA Shock and vibration tests by ELMA Trenew Electronic CONTROL PARAMETERS CONTROL CHANNEL(S): 1 CONTROL TYPE: SINGLE SWEEP TIME: 6 min, 38 sec SWEEP TYPE: LOG STARTING SWEEP DIRECTION: UP STARTING FREQUENCY: 2.00 Hz LOWER FREQUENCY: 2.00 Hz UPPER FREQUENCY: 200.00 Hz SERVO SPEED: 1K dB/s
INPUT CHANNEL PARAMETERS Chan (#) 1 2 3 4 5 6 7 8 Sensitivity (mV/g) 100.00 10.00 10.00 10.00 10.00 10.00 10.00 10.00 Coupling (AC/DC) AC AC AC AC AC AC AC AC Max.Range (g pk) 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00
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Appendix B
TEST LEVEL: 0.0 dB
STATUS INFORMATION
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Ruggedized MicroTCA Shock and vibration tests by ELMA Trenew Electronic CONTROL PARAMETERS CONTROL CHANNEL(S): 1 CONTROL TYPE: SINGLE FREQUENCY RANGE: 2000 Hz NUMBER OF PSD LINES: 2000 FREQUENCY RESOLUTION: 1.000 Hz DOF: 130 SIGMA DRIVE LIMITING: 2.00
INPUT CHANNEL PARAMETERS Chan (#) 1 2 3 4 5 6 7 8 Sensitivity (mV/g) 100.00 100.00 100.00 100.00 10.00 10.00 10.00 10.00 Coupling (AC/DC) AC AC AC AC AC AC AC AC Max.Range (g rms) 10.00 10.00 10.00 10.00 50.00 50.00 50.00 50.00
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Appendix C
X-axis:
Y-axis:
Z-axis:
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Appendix D
X-axis:
Y-axis:
Z-axis:
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Appendix E
MCH Log
************************************************** **** Welcome to OK1 V2.0 for NAT-MCH **** ****------------------------------------------**** **** Core Release: V1.13 **** **** BSP Release: V1.0 Beta **** **** Build : Jun 25 2007 15:04:37 **** ************************************************** initializing ... >H>sysMemInit: ram_addr=1400ec, ram_end=2000000 M>I>mbinit() MB>T>C>S < isdnSupInit: c_pool=0x1fcbfd0 pool size=65536 for 2048 container Board Configuration Information: -------------------------------Board Identifier: 0b0311-0020 Serial Number : 20 Manufacturer ID : 01 Board Code : 0b03 Layout Version : 1.1 Revison Code : 070507 CPU : Coldfire / 162 MHz DRAM : 1 MB SRAM : none EEPROM : 512 KB IEEE Address : 00-40-42-0b-00-14 -------------------------------TCP/IP Configuration: IP Address : 132.147.160.134 IP Net Mask : 255.255.255.0 IP Broadcast : 132.147.160.255 Boot String : 0xf0100008 -------------------------------tcpip_start: forked L2 intialization (NO_NIF_REQUIRED) with PID 2 tcpip_start: forked TCP/IP intialization with PID 3 *** NMCH V1.7K Beta (15:04:27 Jun 25 2007) *** PCB V1.1 FPGA V1.4 BSP V1.0 Beta (15:04:41 Jun 25 2007) TFTP V1.2 Beta (15:04:36 Jun 25 2007) compiled with GCC 2.95 instruction cache enabled data cache enabled Bootloader TCPIP support DRAM size: 32 MB Press 'x' to abort TFTP application.......... appInit: booting Target Application from Flash at 0xf0100008 ************************************************** **** Welcome to OK1 V2.0 for NAT-MCH **** ****------------------------------------------**** **** Core Release: V1.13 **** **** BSP Release: V1.0 Beta **** **** Build : Jun 8 2007 16:01:51 **** **************************************************
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2007
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SDR_REP initialized: max entry num: sizeof entry: default operations: current reservation id:
IPMI DB: pre-initialization done - 24 entries VPGA V1.4 *** N.A.T. BCM5396 driver V1.1 Engineering (16:01:33 Jun hpid_cm_server: starting task msgTaskIpmi: Message Handler started ! Ruggedized MicroTCA - 24 8 2007) ***
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forwarded to Sensor=0x0, forwarded to Sensor=0x0, forwarded to Sensor=0x0, forwarded to Sensor=0x0, forwarded to Sensor=0x0, forwarded to Sensor=0x0, forwarded to Sensor=0x0, forwarded to Sensor=0x0, forwarded to Sensor=0x0,
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