VLSI

SATHYABAMA UNIVERSITY
(Established under section 3 of UGC Act, 1956)
Jeppiaar Nagar, Rajiv Gandhi Salai, Chennai - 119.
SYLLABUS MASTER OF TECHNOLOGY PROGRAMME IN VLSI DESIGN (4 SEMESTERS) REGULATIONS 2010
FACULTY OF ELECTRONICS ENGINEERING
SATHYABAMA UNIVERSITY REGULATIONS 2010

Effective from the academic year 2010-2011 and applicable to the students admitted to the Master of Engineering / Technology / Architecture /Science (Four Semesters) 1. Structure of Programme 1.1 Every Programme will have a curriculum with syllabi consisting of theory and practical such as: (i) (ii) (iii) (iv) 1.2 General core courses like Mathematics Core course of Engineering / Technology/Architecture / Science Elective course for specialization in related fields Workshop practice, Computer Practice, laboratory Work, Industrial Training, Seminar Presentation, Project Work, Educational Tours, Camps etc.
Each semester curriculum shall normally have a blend of lecture course not exceeding 7 and practical course not exceeding 4.
2.
1.3 The medium of instruction, examinations and project report will be English. Duration of the Programme A student is normally expected to complete the M.E/M.Tech./M.Arch/M.Sc Programme in 4 semesters but in any case not more than 8 consecutive semesters from the time of commencement of the course. The Head of the Department shall ensure that every teacher imparts instruction as per the number of hours specified in the syllabus and that the teacher teaches the full content of the specified syllabus for the course being taught.
3.
Requirements for Completion of a Semester A candidate who has fulfilled the following conditions shall be deemed to have satisfied the requirement for completion of a semester. 3.1 3.2 He/She secures not less than 90% of overall attendance in that semester. Candidates who do not have the requisite attendance for the semester will not be permitted to write the University Exams.
4.
Examinations The examinations shall normally be conducted between October and December during the odd semesters and between March and May in the even semesters. The maximum marks for each theory and practical course (including the project work and Viva Voce examination in the Fourth Semester) shall be 100 with the following breakup. (i) Theory Courses
Internal Assessment : University Exams : 20 Marks 80 Marks
(ii)
Practical courses
Internal Assessment : University Exams : - 100 Marks
M.Tech (VLSI DESIGN)
REGULATIONS 2010
5.
Passing requirements (i) A candidate who secures not less than 50% of total marks prescribed for the course (For all courses including Theory, Practicals and Project work) with a minimum of 40 marks out of 80 in the University Theory Examinations, shall be declared to have passed in the Examination. If a candidate fails to secure a Pass in a particular course, it is mandatory that he/she shall reappear for the examination in that course during the next semester when examination is conducted in that course. However the Internal Assessment marks obtained by the candidate in the first attempt shall be retained and considered valid for all subsequent attempts.
(ii)
6.
Eligibility for the Award of Degree A student shall be declared to be eligible for the award of the M.E/M.Tech./M.Arch./M.Sc degree provided the student has successfully completed the course requirements and has passed all the prescribed examinations in all the 4 semesters within the maximum period specified in clause 2.
7.
Award of Credits and Grades All assessments of a course will be done on absolute marks basis. However, for the purpose of reporting the performance of a candidate, Letter Grades will be awarded as per the range of total marks (out of 100) obtained by the candidate as given below:
RANGE OF MARKS FOR GRADES

Range of Marks 90-100 80-89 70-79 60-69 50-59 00-49 ABSENT Grade A++ A+ B++ B+ C F W Grade Points (GP) 10 9 8 7 6 0 0
CUMULATIVE GRADE POINT AVERAGE CALCULATION

The CGPA calculation on a 10 scale basis is used to describe the overall performance of a student in all courses from first semester to the last semester. F and W grades will be excluded for calculating GPA and CGPA.
CGPA = i C i GP i i Ci
where Ci - Credits for the subject

GP i - Grade Point for the subject
i - Sum of all subjects successfully cleared during all the semesters

M.Tech (VLSI DESIGN) ii REGULATIONS 2010
8.
Classification of the Degree Awarded 1 A candidate who qualifies for the award of the Degree having passed the examination in all the courses of all the semesters in his/her first appearance within a maximum period of 4 consecutive semesters after commencement of study securing a CGPA not less than 9.0 shall be declared to have passed the examination in First Class Exemplary. A candidate who qualifies for the award of the Degree having passed the examination in all the courses of all the semesters in his/her first appearance within a maximum period of 4 consecutive semesters after commencement of study, securing a CGPA not less than 7.5 shall be declared to have passed the examination in First Class with Distinction. A candidate who qualifies for the award of the Degree having passed the examination in all the courses of all the semesters within a maximum period of 4 consecutive semesters after commencement of study securing a CGPA not less than 6.0 shall be declared to have passed the examination in First Class. All other candidates who qualify for the award of the Degree having passed the examination in all the courses of all the 4 semesters within a maximum period of 8 consecutive semesters after his/her commencement of study securing a CGPA not less than 5.0 shall be declared to have passed the examination in Second Class. A candidate who is absent in semester examination in a course/project work after having registered for the same, shall be considered to have appeared in that examination for the purpose of classification of degree. For all the above mentioned classification of Degree, the break of study during the programme, will be counted for the purpose of classification of degree. A candidate can apply for revaluation of his/her semester examination answer paper in a theory course, within 1 week from the declaration of results, on payment of a prescribed fee along with prescribed application to the Controller of Examinations through the Head of Department. The Controller of Examination will arrange for the revaluation and the result will be intimated to the candidate concerned through the Head of the Department. Revaluation is not permitted for practical courses and for project work.
2.
3.
Final Degree is awarded based on the following :

CGPA 9.0 CGPA 7.50 < 9.0 CGPA 6.00 < 7.50 CGPA 5.00 < 6.00 First Class - Exemplary First Class with Distinction First Class Second Class
Minimum CGPA requirements for award of Degree is 5.0 CGPA. 9. Discipline Every student is required to observe disciplined and decorous behaviour both inside and outside the University and not to indulge in any activity which will tend to bring down the prestige of the University. If a student indulges in malpractice in any of the University theory / practical examination, he/she shall be liable for punitive action as prescribed by the University from time to time. 10. Revision of Regulations and Curriculum The University may revise, amend or change the regulations, scheme of examinations and syllabi from time to time, if found necessary.
iii
REGULATIONS 2010
M.Tech VLSI DESIGN REGULATIONS 2010 CURRICULUM SEMESTER I

Sl.No. SUBJECT CODE THEORY 1. 2. 3. 4. 5. 6. SECX5016 SECX5017 SECX5018 SECX5019 SECX5020 PRACTICAL SECX6503 EDA Tools Laboratory 0 0 4 2 18 12 Total Credits: Transforms & Probability for Electronics Engineering Advanced Digital System Design VLSI Design MOS Device Modeling VLSI Technology 3 3 3 3 3 1 0 0 0 0 0 0 0 0 0 4 3 3 3 3 1 2 3 4 5 SUBJECT TITLE L T P C Page No.
SEMESTER II
Sl.No. SUBJECT CODE THEORY 1. 2. 3. 4. 5. PRACTICAL 6. SECX6504 VLSI Design Laboratory 0 0 4 2 18 13 Total Credits: SECX5021 SECX5022 SECX5023 Advanced Digital Signal And Image Processing Analog and Mixed Signal Integrated Circuits CAD for VLSI Circuits Elective - I Elective - II 3 3 3 3 3 0 1 0 0 0 0 0 0 0 0 3 4 3 3 3 6 7 8 SUBJECT TITLE L T P C Page No.
SEMESTER III
Sl.No. SUBJECT CODE THEORY 1. 2. 3. 4. 5. SECX5024 SECX5025 SECX5026 VLSI Signal Processing Low Power VLSI Design Testing of VLSI Circuits Elective - III Elective - IV PRACTICAL 6. SECX6505 Design Project Laboratory 0 0 4 2 19 13 3 3 3 3 3 0 1 1 0 0 0 0 0 0 0 3 4 4 3 3 9 10 11 SUBJECT TITLE L T P C Page No.
Total Credits:
iv
REGULATIONS 2010
SEMESTER IV
Sl.No. SUBJECT CODE 1. S82XPROJ Project Vivavoce SUBJECT TITLE L 0 T 0 P 30 C 15 15 70
Total Credits: Total Credits For the Course:
LIST OF ELECTIVE SUBJECTS

Sl.No. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. SUBJECT CODE SECX5027 SECX5005 SECX5028 SECX5084 SECX5029 SECX5030 SECX5031 SECX5032 SECX5085 SECX5033 SCSX5031 SECX5034 SECX5035 SECX5036 SECX5037 SECX5038 SECX5039 SECX5040 SECX5041 SECX5042 SECX5043 SECX5083 SECX5051 SUBJECT TITLE Advanced Programming in HDL Embedded System Design Semiconductor Devices and Simulation tools Fuzzy logic & Neural Networks ASIC Design AMS Hardware Description And Verification Languages Electromagnetic Interference & Compatibility Digital Signal Processors Architectures and Applications Bluetooth Technology Design of Semiconductor Memories Cryptography & Network Security VLSI For Wireless Communication RF IC Design Computer architecture and parallel processing Mixed signal processing High speed VLSI design Basics of Nanotechnology Nano Sensors and Applications Digital Design With CPLD Application Algorithms For VLSI Design Automation High-Level Synthesis Of Digital Circuits Programming In PERL RF MEMS and its Applications L 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 T 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 P 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Page No. 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
L - Lecture Hours; T - Tutorial Hours; P - Practical Hours; C - Credits
REGULATIONS 2010
SECX5016
TRANSFORMS & PROBABILITY FOR ELECTRONICS ENGINEERING (Common to VLSI, NanoTech, Embedded)
L 3
T 1
P 0
Credits 4
Total Marks 100
UNIT I ID TRANSFORMS
10 hrs.
Review of Fourier analysis - Analysis of different periodic & non periodic waveforms Sampling Theorem DFS - DTFT - DFT - inverse DFT- properties - FFT radix r algorithm DIT FFT & DIF FFT - Convolution review of Z transform- Hilbert transform
UNIT II 2D TRANSFORMS
10 hrs.
Need for transform 2D Orthogonal and Unitary transform and its properties 2D DFT Properties FFT Statement , proof and properties of Separable transforms Walsh , Hadamard , Haar , Discrete Sine , DCT , Slant, SVD & KL transforms
UNIT III WAVELET TRANSFORMS
10 hrs.
Wavelet transforms - 1D & 2D Wavelet transform - Time and frequency decompositions - STFT - Continues and discrete - CWT, DWT , Harr wavelet and Shannon wavelet Fast Wavelet transform Wavelet Packets.
UNIT IV PROBABILITY & RANDOM VARIABLES
10 hrs.
Probability concepts- Random variable - moment generating function - discrete types, continues types -2D variable random variables marginal , conditional , joint probability distribution - Binomial, Poisson , uniform , normal and Exponential distributions
UNIT V RANDOM PROCESS
10 hrs.
Notion of stochastic processes , Auto Correlation Cross Correlation WSS Ergodicity - power spectral density function properties - Discrete random process expectations variance , co variance scalar product energy of discrete signals parsevals theorem Wiener Khintchine relation - Discrete random signal processing by linear systems - response of linear discrete systems to white noise - Two dimensional random variables - transformation of random variables - regression system - simulation of white noise low pass filtering of white noise.
TEXT BOOK:
1. Ronald W. Schafer, Alan V. Oppenheim, Discrete Time Signal Processing", Prentice Hall 3rd Edition, 2009.
REFERENCE BOOKS:
1. 2. 3. 4. 5. Gonzalez, Woods and Eddins, Digital Image Processin Prentice Hall, 3rd Edition, 2008. Raghuveer M. Rao, Ajith S. Bopardikar, Wavelet Transform: Introduction to theory & Applications; Prentice Hall 1 st Edition, 1998. Yaglon.A.M Probability and information, Springer Publication- 1983 W. John Wodds Probability and random process with application to signal processes Prentice Hall-2001 Atkinson.F.V Discrete and continuous boundary problems, Academic Press Inc -volume 8 -1998
UNIVERSITY EXAM QUESTION PAPER PATTERN

Max. Marks: 80 Part A: 6 Questions of 5 marks each No choice Part B: 2 Questions from each unit of internal choice, each carrying 10 marks (Distribution may be 40% Theory & 60% Problem)
M.Tech (VLSI DESIGN) 1
Exam Duration : 3 hrs. 30 marks 50 marks
REGULATIONS 2010
SECX5017
ADVANCED DIGITAL SYSTEM DESIGN (Common to VLSI, Embedded, Appl. Elec.)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I SEQUENTIAL LOGIC CIRCUITS
10 hrs.
Mealy machine, Moore machine, Trivial/Reversible/Isomorphic sequential machines, State diagrams, State table minimization, Incompletely specified sequential machines, State assignments, Design of synchronous and asynchronous sequential logic circuits working in fundamental and pulse mode.
UNIT II SYNCHRONOUS SEQUENTIAL CIRCUIT DESIGN
10 hrs.
Analysis of clocked synchronous sequential Networks (CSSN), Modeling of CSSN-State table assignment and reduction Design of CSSN-Design of iterative circuits- ASM Chart- ASM Realization.
UNIT III ASYNCHRONOUS SEQUENTIAL CIRCUIT DESIGN
10 hrs.
Analysis of Asynchronous sequential Circuits (ASC)-Flow table reduction -Races in ASC State assignmentProblem and the Transition table-Design of ASC-Static and Dynamic hazards-Data synchronizers-Designing of Vending machine controller-Mixed operating mode Asynchronous circuits.
UNIT IV PROGRAMMABLE LOGIC DEVICES
10 hrs.
Basic concepts, programming technologies, Programmable Logic Element(PLE),Programmable Logic Array(PLA),Programmable Array Logic(PAL),Structure of standard PLDs, Complex PLDs(CPLD)-System design using PLDs-Design of combinational and sequential circuits using PLDs, Programmable PAL device using PALASM, Design of state machine using Algorithmic State Machines(ASM) chart as design tool.
UNIT V STUDY OF FPGA AND XILINX
10 hrs.
Introduction to Field Programmable Gate Arrays-Types of FPGA Xilinx XC3000 series, Logic Cell Array(LCA),Configurable Logic Blocks(CLB),Input/Output Block(IOB)-Programmable Interconnect Point(PIP),Introduction to ACT2 family and Xilinx XC4000 families, Design examples.
TEXT BOOK:
1. Donald G.Givone Digital Principles and Design, Tata Mc graw hill 2002.
REFERENCE BOOKS:
1. John M Yarbrough Digital Logic Applications and Design, Thomson Learning 2001 2. Nripendra N Biswas Logic Design Theory, Prentice Hall of India, 2001 3. Charles H Roth Jr Fundamentals of Logic Design, Thomson Learing 2004

REGULATIONS 2010
SECX5018
VLSI DESIGN (Common to VLSI, Embedded)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I
10 hrs.
Review of MOS electrical properties Expression for threshold voltage and drain current - Energy band structure and band bending in the different region of operation - Secondary effects of MOSFET-review of CMOS and bipolar technologies.
UNIT II
10 hrs.
Basic inverter - Inverter Device sizing - Enhancement load and Depletion load inverters CMOS inverter CMOS inverter logic levels Inverter device sizing combinational logic implementation using NMOS and CMOS inverters - NMOS and CMOS design rules stick diagram and layout.
UNIT III
10 hrs.
Steering logic design programmable logic arrays Folded PLAs structured gate arrays Dynamic MOS storage circuits performance of Dynamic logic clocked CMOS logic
UNIT IV
10 hrs.
CMOS static flip flops - dynamic sequential circuits CMOS Logic NORA CMOS - True single phase clocked logic Capacitors and performance in CMOS driving large capacitance - Resistance and performance
UNIT V
10 hrs.
Design of addres: Static, Dynamic, Manchester carry chain, Carry bypass adder, CSA, Carry look ahead adder Multipliers : Baugh wooley, Booth Multiplier Barrel shifter NOR and NAND ROMs operations in CMOS SRAM Sence amplifiers
TEXT BOOK:
1. Jan M . Rabaey Digital Integrated Circuits, Pearson Education Ltd-2003
REFERENCE BOOKS:
1. 2. 3. 4. 5. Randall L, Geigar and Allence VLSI Design for Analog and Digital circuits, McGraw Hill Co-1990 Fabricius E Introduction to VLSI Design, McGraw Hill 1990. Douglas A. Pucknell Basic VLSI Design, Prentice Hall of India, 1994 Franco Maloberti Analog design for CMOS VLSI systems, Kluwer Academic Publishers-2001 Abdellatif Bellaouar Low-Power Digital VLSI Design: Circuits and Systems, Kluwer Academic Publishers-2000

Max. Marks: 80 Part A: 6 Questions of 5 marks each No choice. Part B: 2 Questions from each unit of internal choice, each carrying 10 marks (Distribution may be 75% Theory & 25% Problem)
REGULATIONS 2010
SECX5019
MOS DEVICE MODELING (Common to VLSI, NanoTech)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I
10 hrs.
Overview of MOS: Characteristics of a MOS transistor-Surface properties of Silicon : Energy band diagram for the ideal case-Calculation of the threshold voltage(vt) Non ideal effects- CV plots: importance Ideal case High frequency CV plots low Frequency CV plots Equations to CV plots Deep depletion Deviations from the Ideal CV plots - interface traps, Effect of AC signal on the interface states Techniques to measure Cit, computation of Cs and Ps Limitation in high frequency techniques Comparison of measurements at high and low frequency techniques.
UNIT II
10 hrs.
Sources of oxide trapped charge radiation created oxide trapped charge Experimental results How oxide Trapped charge can be annealed out models to explain the technique Shifts in threshold voltage in P-channel and N-channel MOSFET Disadvantages Shifts at dynamic bias radiation hardening Other alternatives dielectrics gate metallization
UNIT III
10 hrs.
MOSFET- Parameters of importance Qualitative analysis of MOSFET Mathematical model of IV characteristics SPICE level1,level2, level3 models Change in velocity with electric field Expression for Id in the sub threshold region of operation.
UNIT IV
10 hrs.
Non uniform doping and effect on threshold voltage short channel effect Narrow width effect Small geometry effects Shrink and Scaling. Small signal analysis of MOSFET Derivation of the different parameters associated with the small signal model Cutoff frequency Hot carrier effects 1988 model Monte Carlo analysis
UNIT V
10 hrs.
MOSFET devices HMOS, DMOS, DIMOS, UMOS, VMOS, Sy MOSFET, SOS, Si MOX, BESOI, SEU, FAMOS, MCOS Comparison with the conventional CMOS. MOS Device application : Depletion mode device MOSFET connected as load devices - MOSFET as resistors, Static protection.
TEXT BOOK:
1. Dewitt G. Ong Modern MOS technology: processes, Devices and Design, Mcgraw Hill, 1984.
REFERENCE BOOKS:
1. 2. 3. 4. Yannis Tsividis Operation and Modeling of MOS Transistors, Mcgraw Hill, 1999 Shoji.M CMOS Digital circuit Technology, Prentice Hall, 1988. Sorab K.Ghandhi Semiconductor device principle, John wiley and sons, 1983. Amar Mukerjee. Introduction to Nmos and Cmos VLSI Systems design, Prentice Hall, 1986

Max. Marks: 80 Part A: 6 Questions of 5 marks each No choice Part B: 2 Questions from each unit of internal choice, each carrying 10 marks

REGULATIONS 2010
SECX5020
VLSI TECHNOLOGY (Common to VLSI, NanoTech)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I CRYSTAL GROWTH, WAFER PREPARATION, EPITARY AND OXIDATION.
10 hrs.
Electronic grade silicon Basic steps in IC fabrication-crystal plane and orientation Defects in the lattice Czochralski crystal growing silicon shaping Processing consideration Vapour phase epitaxy Liquid phase epitaxy-selective epitaxy- Molecular beam epitaxy - Epitaxial Evaluation Growth mechanism and kinetics Thin oxides Oxidation Techniques and systems Oxide properties Redistribution of dopants at interface Oxidation of polysilicon Oxidation induced effects.
UNIT II LITHOGRAPHY AND RELATIVE PLASMA ETCHING
10 hrs.
Mask Making Optical lithography Electron lithography X-ray lithography Ion lithography Plasma properties Feature size control and Anisotropie Etch mechanism Lift off Techniques Plasma reactor Fl2 &Cl2 based etching Relative plasma etching Techniques and Equipments.
UNIT III DEPOSITION, DIFFUSION , ION IMPLANTATION AND METALIZATION
10 hrs.
Deposition process polisilicon - plasma assisted deposition models of diffusion in solids Ficks one dimensional diffusion equation Atomic diffusion mechanism measurement techniques Range theory Carrier recovery due to annealing - Implantation equipment Annealing Shalloe junction high energy implantation Physical vapour deposition patterning.
UNIT IV METALLIZATION
10 hrs.
Metallization applications metallization choices Patterning Metallization problems New role of metallizationmetallization systems sputtering problems associated with Al Cu interconnect Comparison of RC delay of Polysilicon, Al.
UNIT V ANALYTICAL , ASSEMBLY TECHNIQUES & PACKAGING OF VLSI DEVICES
10 hrs.
Analytical beams Beams specimen interaction Chemical methods package types baking design considerations VLSI assembly technology Package Fabrication Technology.
TEXT BOOK:
1. S.M.Sze VLSI Technology, Tata Mcgraw Hill, 2003.
REFERENCES BOOKS:
1. 2. 3. 4. Sorab. K. Gandhi VLSI Fabrication and Principles, John wiley and sons, 1983. Amar Mukherjee Introduction to NMOS & CMOS VLSI system Design, Prentice Hall, 1986. Mccanny and J.C.White VLSI Technology and design, Academic Press, 1987. Dasgupta VLSI Technology, Pearson Education Pvt Ltd 2001


REGULATIONS 2010
SECX5021
ADVANCED DIGITAL SIGNAL AND IMAGE PROCESSING (Common to VLSI, NanoTech, Embedded, E&C)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I SPECTRUM ESTIMATION & PREDICTION
10 hrs.
Review of FIR , IIR, filters-Signal analysis using Fourier Transform - Periodogram- sample auto correlation- sum decomposition theorem- spectral factorization theorem- non parametric method- correlation method- co variance estimator- unbiased, consistant estimator- periodogram estimator- Bartlett spectrum estimation- Welch estimation- model based approach- AR- MA- ARMA signal modeling- parameter estimation using yule walker method- least mean square error criterion- Wiener filter-linear prediction- forward backward prediction- levinson recursion algorithm for solving toeplitz system of equations
UNIT II ADAPTIVE FILTERS
10 hrs.
FIR adaptive filter- Newton steepest descent method widrow hoff LMS adaptive algorithm- adaptive channel equalization- adaptive echo cancellor- adaptive noise cancellasion- RLS adaptive filter- simplified IIR LMS adaptive filter.
UNIT III MULTI RATE SIGNAL PROCESSING
10 hrs.
Mathematical description of change of sampling rate- interpolation- decimation- continuous time model- direct digtal domain approach- decimation by an integer factor- interpolation by an integer factor- single and multi stage realization-poly phase realision- filteer bank implementation- application to sub band coding .
UNIT IV IMAGE ENHANCEMENT AND RESTORATION
10 hrs.
Elements of digital image processing systems- elements of visual perception- structure of human eyeMonochrome vision model- image enhancement and restoration-Spatial domain method- histogram processing- spatial filtering- edge crispening- interpolation- homomorphic filtering degradation model- diaginalization of Circulant and Block Circulant Matrices-Algebraic Approach to restoration- constrained and unconstrained restoration- inverse filtering and wiener filter-Image morphology.
UNIT V IMAGE DATA COMPRESSION
10 hrs.
Fundamentals of coding- image compression model- fundamental coding theorem shannons coding, Huffman coding- pixel coding- predictive techniques- lossy and loseless predictive coding- variable length coding, bit plain codingtransform coding, zonal and threshold coding, image compression standard- CCITT and JPEG standards.
TEXT BOOK:
1. Monson H.Hayes Statistical digtal signal processing and modeling, John Wiley & Sons, 2002.
REFERENCE BOOKS:
1. 2. 3. 4. John G Proakis Digtal signal processing, Pearson Prentice Hall, 2007. Simon Haykin Adaptive filter theory, Prentice Hall, 2002. Anil K Jain Fundamental of Digtal image processing, Prentice Hall, 1989. R.C. Gonzalez Digtal image processing, Pearson Prentice Hall, 2008.

Max. Marks: 80 Part A: 6 Questions of 5 marks each No choice Part B: 2 Questions from each unit of internal choice, each carrying 10 marks. (Distribution may be 70% Theory & 30% Problem)
REGULATIONS 2010
SECX5022
ANALOG AND MIXED SIGNAL INTEGRATED CIRCUITS (Common to VLSI, NanoTech)
L 3
T 1
P 0
Credits 4
Total Marks 100
UNIT I SINGLE STAGE AMPLIFIERS AND CURRENT MIRRORS
10 hrs.
Basics of CMOS Analog model of MOSFET low and high frequency models Simple CMOS current mirror - source degenerated current mirrors high output impedance current mirrors All NMOS Operational Amplifier Design Bipolar current mirrors Bipolar gain stages gain enhancement techniques Frequency response.
UNIT II OP AMP DESIGN AND ADVANCED CURRENT MIRRORS
10 hrs.
Two stage CMOS op amp op amp as a comparator Charge injection errors, Latched Comparators Advanced current mirrors folded cascade and current mirror op amp Linear settling time revisited, fully differential op amp - Analysis of Differential Amplifier with active load, supply and temperature independent biasing techniques.
UNIT III VOLTAGE REFERENCE, SAMPLE AND HOLD CIRCUITS
10 hrs.
Sample and hold circuits MOS sample and hold basics examples of CMOS S/H circuits Bipolar and BiCMOS S/H circuits Bandgap reference basics translinear gain cell Translinear multiplier- Basics of OTA Amplifiers Design.
UNIT IV DATA CONVERTERS AND NEURAL INFORMATION PROCESSING
10 hrs.
High speed A/D and D/A converters High resolution converters Sigma delta A/D converter Interpolative Modulators - Testing of converters Biologically Inspired Neural Networks Low Power Neural Networks Analog cell Layout Mixed Analog Digital Layout.
UNIT V SWITCHED CAPACITOR CIRCUITS AND PLL
10 hrs.
Basic building blocks of switched capacitor circuits Basic operation and Analysis Switched capacitor amplifier Switched capacitor integrators Z Domain Model Representation of Switched Capacitor Circuits Switched Capacitor filter Design Charge injection. Basic loop architecture of PLL Linearized PLL model Phase detectors Sequential phase detector PLL with charge pump phase comparator VCO.
TEXT BOOKS:
1. David A Johns and Ken Martin Analog Integrated circuit design, John wiley & Sons,2004. 2. Gray & Mayer Analysis and Design of Analog Integrated Circuits, John wiley and Sons, 4th edition, 2005.
REFERENCE BOOKS:
1. 2. 3. 4. 5. Behzad Razavi Design of Analog CMOS Integrated circuits, Tata Mcgraw Hill India Pvt.Ltd, 2008. Franco Maloberti Analog Design for CMOS VLSI Systems, Kluwer Academic Publisher, 2001. Roger T.Howe and Charles G.Sodini Micro Electronics an Integrated Approach, Pearson Education Pvt Ltd 2004. Roubik Gregorian Analog MOS Integrated Circuits for Signal Processing, John wiley and sons, 2004 Rudy Van de Plassche CMOS Integrated A/D and D/A converters, Kluwer Academic Publisher, 2003.


REGULATIONS 2010
SECX5023
CAD FOR VLSI CIRCUITS
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION
10 hrs.
Basic terminologies in data structures Complexity issues anNP hardness. Basic data structures Atomic operations, Linked list of blocks, Bin-based method, Corner Stitching, Layout Specification languages. Clock routing, clocking schemes, Design considerations problem formulation clock routing algorithm power and ground routing.
UNIT II LOGIC OPTIMIZATION
10 hrs.
Logic level synthesis and optimization, two level combinational logic optimization Introduction Logic optimization principles- operations on two level logic covers Algorithms for logic minimization Symbolic minimization and encoding problems Minimization of Boolean relations Models and transformations for combinational networks The algebraic model The Boolean model Synthesis of networks Algorithms for delay evaluation and optimization .
UNIT III OVERVIEW ON TOOLS FOR LAYOUT
10 hrs.
Partitioning : Objectives Kernighan Lin algorithm Pseudo code Fiduccia Matheyses Heuristic Ladder network Partitioning Simulated annealing, Wirelength estimator : Steiner Tree Spanning tree algorithm.
UNIT IV FLOOR PLANNING AND PLACEMENT TECHNIQUES
10 hrs.
Constraints involved including rotation changing the aspect ratio. Force Directed placement technique Pseudo code Min cut placement Placement by the generic algorithm Placement based on steepest descent GASP Linear programming method Branch and Bound algorithm Routing algorithms. Global and Detailed routing Linear searching Channel intersection graph - Maze routing algorithm Greedy channel router.
UNIT V VERIFICATION AND CIRCUIT EXTRACTION
10 hrs.
Ordered binary decision diagram : Operation, synthesis OBDDs. Paradigmatic application of OBDDs. Optimization of variable ordering Compaction : Problem formulation, Classification, One dimensional compaction, Hierarchical Compaction, Recent trends Applications of VLSI circuits.
TEXT BOOK:
1. Sherwani Algorithms for VLSI Physical Design Automation, Kluwer Academic Publisher, 1995.
REFERENCE BOOKS:
1. Soha Hassoun and Tsutomu Sasao Logic Synthesis and verification, Kluwer Academic Publisher, 2003. 2. Giovanni De Michele Synthesis and optimization of digital circuits, Mc Graw Hill, 1994. 3. Sherwani An Introduction to Physical VLSI Design, Prentice Hall of India, 2004.

Max. Marks: 80 Part A: 6 Questions of 5 marks each No choice Part B: 2 Questions from each unit of internal choice, each carrying 10 marks each. (Distribution may be 90% Theory & 10% Problem)
REGULATIONS 2010
SECX5024
VLSI SIGNAL PROCESSING (Common to VLSI, NanoTech)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I
10 hrs.
Introduction to DSP systems Typical DSP algorithms, DSP application demands representation of DSP algorithms Iteration bound data flow graph representation, loop bound and iteration bound, Algorithms for computing Iteration bound, Iteration bound of multi rate data flow graphs- pipelining and parallel processing pipelining of FIR digital filter , parallel processing, pipelining and parallel processing for low power.
UNIT II
10 hrs.
Retiming definition and properties, solving systems of inequalities, Retiming techniques Unfolding Properties and algorithm for unfolding, critical path and applications of unfolding folding transformation, register minimization technique, register minimization in folded architectures - folding of multi rate systems
UNIT III
10 hrs.
Systolic architecture design methodology, FIR systolic array, selection of scheduling vector , matrix to matrix multiplication , 2D systolic array design, systolic design for space representation containing delays fast convolution algorithms Redundant arithmetic - carry free radix 2 addition and subtraction - Radix 2 hybrid redundant multiplication architectures - data format conversion - Redundant to non-redundant converter -Numerical strength reduction.
UNIT IV
10 hrs.
Bit level arithmetic structures- parallel multipliers - interleaved floor plan and bit plan based digital filters - Bit serial multipliers. Bit serial filter design and implementation - Canonic signed digit arithmetic - Distributed arithmeticSynchronous pipelining and clocking styles - clock skew and clock distribution in bit level pipelined VLSI designs Wave pipelining - constraint space diagram and degree of wave pipelining - Implementation of wave-pipelined systems - Asynchronous pipelining Schur algorithm .
UNIT V
10 hrs.
Design of VLSI Architectures for Digital Signal Processing- Architectural Design at Register Transfer Level Design of Datapath elements Control structures Testable and self-reconfigurable fault-tolerant structures Speed-Area-Power tradeoff Issues related to mixed signal design and SoC - CORDIC algorithm and multiplier less architectures - Scaling versus power consumption.
TEXT BOOK:
1. Keshab K.Parhi VLSI Digital Signal Processing systems, John wiley & Sons, 1999.
REFERENCE BOOKS:
1. Mohammed Isamail and Terri fiez Analog VLSI Signal and information processing, Mc Graw Hill,New Delhi, 1994. 2. S.Y.Kung , H.J.White House VLSI and Modern Signal Processing, Prentice Hall, 1985. 3. Jose E.France, Yannis Tsvidis Design of Analog Digital VLSI Circutis for Telecommunication and Signal Processing, Prentice Hall 1994.

M.Tech (VLSI DESIGN) 9 REGULATIONS 2010
SECX5025
LOW POWER VLSI DESIGN (Common to VLSI, NanoTech)
L 3
T 1
P 0
Credits 4
Total Marks 100
UNIT I
10 hrs.
Introduction- Need for Low power VLSI design Charging and Discharging Capacitance- Short circuit current in CMOS CMOS leakage current- Static current- Principles of Low power design- Low power figure of Merits.
UNIT II
10 hrs.
Simulation power analysis- SPICE circuit analysis- Discrete Transistor Modeling and analysis - Gate Level Logic simulation - Architecture level analysis - Data Correlation analysis in DSP systems - Monte Carlo Simulation - Random Logic signal- Probability Power analysis techniques- Signal entropy.
UNIT III
10 hrs.
Transistor and gate sizing-Network Restructuring and Reorganization- special latches and Flip flops-Low power digital cell library - Gate Reorganization- Signal Gating Logic Encoding -State Machine encoding- Precomputation Logic.
UNIT IV
10 hrs.
Special Techniques- Power reduction in clock networks- CMOS floating node -Low power Bus -Delay BalancingLow power techniques for SRAM- Architecture and system- Power and performance management -Switching activity reduction -Parallel Architecture Flow graph transformation.
UNIT V
10 hrs.
Advanced techniques- Adiabatic Computation- Pass transistor Logic synthesis -Asynchronous circuits - Software Design for Low power-Sources of software power dissipation- Software power optimization.
TEXT BOOK:
1. Gary Yeap "Practical Low Power Digital VLSI design", Kluwer Academic Publishers - 1997 Edition
REFERENCE BOOKS:
1. Sharat Prasad and Koushik Roy "Low power CMOS VLSI Circuit design, John Wiley Publications", 2000 Edition 2. Kiat Seng Yeo &Kaushik Roy Low voltage, Low power VLSI subsystems, McGraw-Hill 2009. 3. Meloberti Franco Analog design for CMOS VLSI systems, Kluwer Academic Publishers-2001 4. Abdellatif Bellaouar Low-Power Digital VLSI Design: Circuits and Systems, kluwer Academic Publishers - 1995 5. Saraju P. Mohanty- Nagarajan Ranganathan, Elias Kougianos, Priyardarsan Patra Low-Power High-Level Synthesis for Nanoscale CMOS Circuits, Springer-2008.


REGULATIONS 2010
SECX5026
TESTING OF VLSI CIRCUITS
L 3
T 1
P 0
Credits 4
Total Marks 100
UNIT I INTRODUCTION
10 hrs.
Validation and testing of manufactured circuits Test procedures Issues in design for Testability - Observability and Controllability Adhoc Testing Scan based Testing Boundary scan Design Design for Testability.
UNIT II FAILURES AND FAULTS
10 hrs.
Modeling of faults - Stuck at faults- Fault diagnosis of Digital circuits. Test generation techniques for combinational circuits Boolean difference D- Algorithm Detection of multiple faults in combinational circuits.
UNIT III TESTING OF SEQUENTIAL CIRCUITS
10 hrs.
Test generation for sequential circuits State table verification - functional fault model Equivalence Checking - Level sensitive scan design Clocked Hazard free latches Arithmetic and Reed Muller Coefficients - Software and Hardware Fault Tolerance.
UNIT IV BUILT-IN SELF-TEST (BIST)
10 hrs.
Test pattern generation for built in self test. Exhaustive pattern generation and deterministic testing - Output response Analysis Transition count syndrome checking Signature Analysis Circular BIST.
UNIT V TESTABLE MEMORY DESIGN
10 hrs.
RAM fault model Test algorithm for RAMs. GALPAT March Test Detection of pattern sensitive faultsbuilt in self test techniques for RAM chips. Self testable SRAM architecture. Test generation and BIST for Embedded RAMs Case study:- Online testing approach for very deep submicron ICs.
TEXT BOOK:
1. Michael L.Bushnell & Vishwani. D.Aggarwal Kulwer Essentials of Electronic testing for digital, memory and mixed signal VLSI circuit, Kluwer academic Publishers 2000.
REFERENCE BOOKS:
1. 2. 3. 4. Parag.K.lala Digital circuit Testing and Testability, Academic press-2007 Alfred L.Crouch Design for test for Digital ICs and Embedded core systems, Prentice Hall, 1999. Giovanni De Michele Synthesis and optimization of digital circuits, Mcgraw Hill Higher Education, 1994. Meloberti Franco "Analog design for CMOS VLSI systems", Kluwer Academic Publishers-2001

SECX6503
EDA TOOLS LABORATORY (Common to VLSI, NanoTech)
L 0
T 0
P 4
Credits 2
Total Marks 100
Analog Experiments I. To acquire the knowledge of designing and simulation of basic analog circuits using Pspice
1. Analog amplifiers. 2. Oscillators 3. BJT biasing circuits 4. FET characteristics 5. Multivibrators 6. RLC circuits 7. Passive filters 8. Attenuators 9. Electrical circuit theorems 1. Superposition Theorem 2. Maximum power transfer theorem 3. Nortons Theorem 4. Reciprocity Theorem 10. Waveform Generation Circuits 1. Schmitt Trigger 2. Square wave Generator 3. Switch mode power supply (SMPS) 4. Schmitt Trigger 11. Diode Experiments 12. Modulation Circuits 13. Op- amps
Digital Experiments
14. Combinational Circuits 15. Sequential Circuits 16. Inverters with various types of load 17. Scaling of MOS devices
II. Preparation of Layouts using MAGIC.

For all experiments shown above , the VLSI layout would be prepared by using the tool MAGIC.
SECX6504
VLSI DESIGN LABORATORY LIST OF EXPERIMENTS
L 0
T 0
P 4
Credits 2
Total Marks 100
I. Verilog / VHDL Simulation, Synthesis & FGPA implementation of

1. 4 bit Adders & Subtractors (CLA, CSA, CMA, Parallel adders) 2. Design of FF (SR, D, T, JK, Master Slave with delays) 3. Design of code converters & Comparator 4. Design of Encoder, Decoder, Multiplexer, and De multiplexer 5. Design of registers using latches and flip-flops 6. Design of 8 bit Shift registers 7. Design of Asynchronous & Synchronous Counters 8. Modeling of Moore & Mealy FSM 9. Static & Rolling Display 10. Frequency Multipliers & Dividers 11. Design of ALU 12. Barrel Shifters 13. Key Scan 14. 4 bit Microprocessor 15. RISC CPU 16. Traffic light controller 17. Design of memories 18. Design of MAC unit 19. Design of Sorting Circuit 20. Design of FSM
SECX6505
DESIGN PROJECT LABORATORY LIST OF EXPERIMENTS
L 0
T 0
P 4
Credits 2
Total Marks 100
To get a basic knowledge about the FPGA and ASIC flow

1. 2. 3. 4. 5. Layout Preparation for basic gates, adders, MUX and Flip flops Layout Preparation for the combinational circuits using MUX Layout Preparation for sequential circuits using Flip flops (Counters & registers) Architecture development and layout preparation for Sine Wave generation FPGA implementation and layout preparation for a. Two stage Op Amp. b. Voltage controlled Oscillator c. A/D and D/A converters d. 8 bit Microprocessor e. Traffic light Controller f. Peripheral Devices g. Low noise Amplifier h. Filter Design
13 REGULATIONS 2010
SECX5027
ADVANCED PROGRAMMING IN HDL
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I BASIC CONCEPTS IN VHDL
10 hrs.
Digital system design process - Hardware simulation Introduction to VHDL - Language elements of VHDL Data objects Data types Operators Variable assignment Concurrent and sequential assignments.
UNIT II MODELING AND FEATURES IN VHDL
10 hrs.
Data flow modeling Structural modeling Behavioral modeling - Modeling a test bench Generics and configurations- Sub programs - Hardware modeling examples : Moore FSM, Mealy FSM.
UNIT III VERILOG HDL
10 hrs.
Basic concepts Module Delays - Language elements Compiler directives, value set, data types, Parameters Expressions - Operands & operators - Gate level modeling User defined Primitives Combination UDP, Sequential UDP.
UNIT IV MODELING AND FEATURES IN VERILOG HDL
10 hrs.
Data flow modeling Structural modeling - Behavioral modeling tasks and functions System task and functions verification Modeling a test bench - timing and delays Switching level modeling.
UNIT V SYSTEM VERILOG
10 hrs.
Introduction to system verilog - Data types, Arrays, operators & Expressions - procedural & control flow statements - process, tasks & functions - Random constraints - Interprocess synchronization and communication - clocking blocks & program blocks - Interfaces & Mod ports
TEXT BOOKS:
1. J.Bhasker VHDL Primer , Prentice Hall, 1999 2. J.Bhasker Verilog HDL, Prentice Hall, 2000
REFERENCE BOOKS:
1. 2. 3. 4. Douglas L. Perry "VHDL", McGraw Hill, 2002. Stphen Brown "Foundamental of Digital logic with VHDL Design", Tata McGraw Hill, 2008. Stphen Brown "Foundamental of Digital logic with Verilog Design", Tata McGraw Hill, 2008. Simon Davidmann & Stuart Sutherland System Verilog For Design, Springs Science Business Media, 2006.


REGULATIONS 2010
SECX5005
EMBEDDED SYSTEM DESIGN

(Common to VLSI, Embedded, E&C, Appl. Elec.)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION
10 hrs.
Embedded system- characteristics of embedded system- categories of embedded system- requirements of embedded systems- challenges and design issues of embedded system- trends in embedded system- system integration- hardware and software partition- applications of embedded system- control system and industrial automationbiomedical-data communication system-network information appliances- IVR systems- GPS systems.
UNIT II DEVELOPMENT OF SOFTWARE ARCHITECTURE
10 hrs.
Development of software architecture simple round robin architecture- design and implementation of digital multimeter- round robin with interrupt architecture- implementation of communication bridge- function queue scheduling architecture- RTOS architectur.
UNIT III HARDWARE ARCHITECTURE
10 hrs.
Hardware architecture- block schematic of a typical hardware architecture- CPU-memeory-I/O Devices- design with microprocesors development-ADC- DAC interfacing LED/LCD interfacing. Case study of processor- 16 bit and 32 bit processor-DSP processor.
UNIT IV EMBEDDED SYSTEM PLATFORM AND DEVELOPMENT TOOLS
10 hrs.
Inter process communication- UART-IEEE 1394-IRDA-USB-PCI development tools- EPROM ERASER-signature validator- accelerated design for video accelerator.
UNIT V OVERVIEW OF DESIGN TECHNOLOGIES
10 hrs.
Design methodologies and tools- designing hardware and software components- system analysis and architecture design- system integration- structural and behavioral description smart cards.
TEXT BOOK:
1. Wayne wolf "Computers as components", morgan Kaufmann publishers, 2nd Edition, 2008.
REFERENCE BOOKS:
1. Jean.J. Labrosse Embedded system building blocks, CMB books, 2nd Edition, 1999. 2. Arnold Berger Embedded system design, CMB books, 1st Edition, 1999. 3. Narayan and Gong Specifications and design of Embedded systems, pearson education, 2nd Edition, 1999.

Max. Marks: 80 Part A: 6 Questions of 5 marks each No choice. Part B: 2 Questions from each unit of internal choice, each carrying 10 marks

REGULATIONS 2010
SECX5028
SEMICONDUCTOR DEVICES AND SIMULATION TOOLS
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I IMPORTANT PARAMETERS GOVERNING THE HIGH SPEED PERFORMANCE OF DEVICES AND CIRCUITS 10 hrs. Transit time of charge carriers, junction capacitances, ON-resistances and their dependence on the device geometry and size, carrier mobility, doping concentration and temperature. Contact resistance and interconnection/interlayer capacitances in the Integrated Electronics Circuits.
Materials for high speed devices and circuits : Merits of III V binary and ternary compound semiconductors (GaAs, InP, InGaAs, AlGaAs ETC.), silicon-germanium alloys and silicon carbide for high speed devices, as compared to silicon based devices. Brief outline of the crystal structure, dopants and electrical properties such as carrier mobility, velocity versus electric field characteristics of these materials. Material and device process technique with these III-V and IV IV semiconductors.
UNIT II METAL SEMICONDUCTOR CONTACTS AND METAL INSULATOR SEMICONDUCTOR AND MOS DEVICES 10 hrs. Native oxides of Compound semiconductors for MOS devices and the interface state density related issues. Metal semiconductor contacts, Schottky barrier diode. Thermionic Emission model for current transport and current-voltage (I-V) characteristics. Effect of interface states and interfacial thin electric layer on the Schottky barrier height and the I-V characteristics.
Metal semiconductor Field Effect Transistors (MESFETs): Pinch off voltage and threshold voltage of MESFETs. D.C. characteristics and analysis of drain current. Velocity overshoot effects and the related advantages of GaAs, InP and GaN based devices for high speed operation. Sub threshold characteristics, short channel effects and the performance of scaled down devices.
UNIT III HIGH ELECTRON MOBILITY TRANSISTORS (HEMT) 10 hrs. Hetero-junction devices. The generic Modulation Doped FET(MODFET) structure for high electron mobility realization. Principle of operation and the unique features of HEMT. InGaAs/InP HEMT structures.
Hetero junction Bipolar transistors (HBTs): Principle of operation and the benefits of hetero junction BJT for high speed applications. GaAs and InP based HBT device structure and the surface passivation for stable high gain high frequency performance. SiGe HBTs and the concept of strained layer devices.
UNIT IV INTRODUCTION TO MATLAB 10 hrs. Menus and the toolbar , Computing with Matlab ,Script files and the Editor Debugger ,. Matlab Help System Matlab as {best} calculator , Standard Matlab windows, Operations with variables a) Namingb) Checking existence c) Clearing d) Operations .Relational and logical operators Control statements IF-END, IF-ELSE-END, ELSE IF- SWITCH CASE FOR Loop While loop- Debugging-Miscellaneous MAT lab functions and variables. UNIT V ARRAYS, FUNCTIONS & FILES AND PLOTTING 10 hrs. Columns and rows: creation and indexing , Size & length , Multiplication, division, power , Operations Writing script files: Logical variables and operators, Flow control,Loop operators, Writing functions: Input/output arguments, Function visibility, path. Example: Matlab startup. Basic 2D plots, XY- plotting functions , Subplots and Overlay plots , Special Plot types , Interactive plotting , Function Discovery , Regression, 3-D plots . TEXT BOOKS:
1. S. M. Sze and K. K. Ng Physics of Semiconductor Devices, John Wiley and Sons, 2007. 2. W. Liu "Fundamentals of III-V Devices: HBTs, MESFETs, and HFETs/HEMTs", John Wiley and Sons, 1999. 3. William J.Palm Introduction to MATLAB 6.0 for Engineers Mc Graw Hill, 2001.
REFERENCE BOOKS:
1. 2. 3. 4. S. M. Sze, High Speed Semiconductor Devices, John Wiley and Sons, 1990. J. S. Yuan, SiGe, GaAs, and InP Heterojunction Bipolar Transistors, John Wiley and Sons,1999. J. D. Cressler and G. Niu, "Silicon-Germanium Heterojunction Bipolar Transistors", Artech House, 2003. M.Herniter Programming in MATLAB, Thomson Learning, 2001.


REGULATIONS 2010
SECX5084
FUZZY LOGIC & NEURAL NETWORKS (Common to VLSI, Embedded, Appl. Elec.)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I FUNDAMENTALS OF ANN
10 hrs.
Introduction Neuron Physiology Specification of the brain Eye neuron model - Fundamentals of ANN Biological neurons and their artificial models Learning processes different learning rules types of activation functions training of ANN Perceptron model ( both single & multi layer ) training algorithm problems solving using learning rules and algorithms Linear seperability limitation and its over comings
UNIT II ANN ALGORITHM
10 hrs.
Back propagation training algorithm Counter propagation network structure & operation training applications of BPN & CPN -Statistical method Boltzmann training Cauchy training Hop field network and Boltzmann machine Travelling sales man problem - BAM Structure types encoding and retrieving Adaptive resonance theory Introduction to optical neural network Cognitron & Neocognitron
UNIT III APPLICATION OF ANN
10 hrs.
Hand written and character recognition Visual Image recognition - Communication systems call processing Switching Traffic control routing and scheduling Articulation Controller - Neural Acceleration Chip ( NAC )
UNIT IV INTRODUCTION TO FUZZY LOGIC
10 hrs.
Introduction to fuzzy set theory membership function - basic concepts of fuzzy sets Operations on fuzzy sets and relations, classical set Vs fuzzy set properties of fuzzy set fuzzy logic control principles fuzzy relations fuzzy rules Defuzzification Time dependent logic Temporal Fuzzy logic (TFC) Fuzzy Neural Network ( FANN ) - Fuzzy logic controller Fuzzification & defuzzification interface .
UNIT V APPLICATION OF FUZZY LOGIC
10 hrs.
Application of fuzzy logic to washing machine Vaccum cleaner Water level controller temperature controller - Adaptive fuzzy systems Fuzzy filters Sub band coding Adaptive fuzzy frequency hoping.
TEXT BOOK:
1. Freeman & Skapura Neural Networks, Addison - Wesley, 1991.
REFERENCE BOOKS:
1.J.M .Zurada Introduction to Artificial Neural Systems, West, 1992. 2.Simons Haykin Neural Networks, Macmillan, 1994. 3.B.Yagnanarayana Artificial Neural Networks, Prentice Hall of India, 2006.

SECX5029
ASIC DESIGN
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION TO ASICS, CMOS LOGIC
10 hrs.
Introduction Types of ASIC Design flow - CMOS logic CMOS Design rules Combinational & Sequential logic cells Data path Programmable ASIC logic cells and i/o cells. Programmable interconnects- Transitor Parasitic capacitance-Logical effort.
UNIT II ASIC TECHNOLOGY
10 hrs.
ASIC library design - Cell design - Architecture - Gate array design - PLDs and FPGAs - ASIC families. CAD for ASIC design - Design entry - VHDL/Verilog - Netlist extraction
UNIT III PROGRAMMABLE ASICS
10 hrs.
Anti fuse static RAM EPROM and EEPROM technology- PREP benchmarks-Actel ACT- Xilinx LCA Altera MAX DC & AC inputs and outputs-Clock & Power inputs- Xilinx i/o blocks.
UNIT IV DESIGN AUTOMATION TOOLS & ALGORITHMS
10 hrs.
Functional simulation - Synthesis - Layout, Placement, Floor planning Routing Techniques for Simulation, Synthesis, Layout, Placement, Positioning, Floor planning, Routing.
UNIT V TESTING
10 hrs.
Design for testability Application Examples for ASICs: Low noise audio circuit, DC-DC converter - Case study: ARM Processor.
TEXT BOOK:
1. M.J.S .Smith "Application - Specific Integrated Circuits", Addison -Wesley Longman Inc., 1997.
REFERENCE BOOKS:
1. S.H.Gerez, Algorithms for VLSI Design Automation, John Wiley, 1998. 2. Alfred L.Grouch, Design for Test, Prentice Hall - Professional Technical Reference, 1999. 3. Mohammed Ismail and Terri Fiez" Analog VLSI Signal and Information Processing", Mc Graw Hill, 1994. 4. S. Y. Kung, H. J. Whilo House, T. Kailath "VLSI and Modern Signal Processing", Prentice Hall, 1984. 5. Jose E. France, Yannis Tsividis " Design of Analog - Digital VLSI Circuits for Telecommunication and Signal Processing Prentice Hall, 1994.


REGULATIONS 2010
SECX5030
AMS HARDWARE DESCRIPTION AND VERIFICATION LANGUAGES
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I FUNDAMENTAL CONCEPTS AND MODELING IN VHDL-AMS
10 hrs.
Modeling systems Domains and levels of modeling Digital modeling, Analog modeling and Mixed signal modeling example Modeling languages Modeling concepts- Test benches- Constant and Variables -Scalar types Type Declaration Integer, Floating point, Physical and Enumeration types Type classification subtype Type Qualification and conversion Scalar Natures Attributes of Scalar types and natures Expressions and Operators.
UNIT II DIGITAL MODELING CONSTRUCTS IN VHDL-AMS
10 hrs.
Entity Declarations- Architecture bodies- Concurrent statements- Signal declarations- Digital Behavioral Descriptions-Signal assignment signal attributes wait statement Delta delays- Transport and inertial Delay Mechanisms- process statements- Concurrent signal assignment and assertion statements Digital structural descriptions-Component instantiation and port maps.
UNIT III ANALOG MODELING CONSTRUCTS IN VHDL-AMS
10 hrs.
Free Quantities Quantity ports Terminals and branch Quantities- Attributes of terminals and Quantities Simultaneous Statements Simultaneous If, Case, Null statement- Analog structural Descriptions - Discontinuities and Break statements concurrent break statements step limit specifications- Mixed signal descriptions- A/D and D/A Conversion- Mixed Technology Descriptions.
UNIT IV INTRODUCTION TO SYSTEM VERILOG
10 hrs.
Introduction to system verilog- Data types Arrays - Data declarations Attributes operators and Expressions - procedural statements and control flow statements- process, tasks and functions- classes - Random constraints.
UNIT V INTERPROCESS SYNCHRONIZATION & COMMUNICATION IN SYSTEM VERILOG
10 hrs.
Introduction scheduling Semantics Clocking blocks Program blocks Assertions Hierarchy - interfaces coverage- parameters configuration libraries system tasks and system functions compiler directives.
TEXT BOOKS:
1. J. Ashenden & Peterson The System Designers Guide to VHDL-AMS, Morgan Kaufmann Publishers, 2003. 2. Chris Spear System Verilog for Verification, Springer Science+Business Media, 2008.
REFERENCE BOOKS:
1. Simon Davidmann & Stuart Sutherland System Verilog For Design, Springer Science+Business Media, 2008. 2. Stephen Brown "Funtamentals of Digital logic with verilog Design", Tata McGraw Hill, 2008.


REGULATIONS 2010
SECX5031
ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY

(Common to VLSI, Embedded, Appl. Elec.)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I EMI ENVIRONMENT
10 hrs.
Introduction to EMI/EMC-Basics of electro Magnetic interference(EMI)Fundamentals of electromagnetic compatibility(EMC)-Radiation hazards Transients and other EMI sources Transients Electrostatics discharge(ESD)-Tempest- Lightning Standards of EMI
UNIT II EMI COUPLING
10 hrs.
EMI from apparatus and circuits: Introduction-Electromagnetic emission-Appliances-noise from relays and switches-nonlinearities in circuits-Passive inter modulation-Cross talk in transmission lines-Transmission in power supply lines-Electromagnetic interference.
UNIT III EMI SPECIFICATION/STANDARDS AND MEASUREMENTS
10 hrs.
Units of specification-civilian standards and military standards.Basics of EMI measurements-EMI measurement tools-TEMcell-measurement using TEM cell-Reverberating chamber-GTEM cell-Anechoic chamber-Open area test site-RF absorbers-conducted interference measurements-conducted EMI from equipments-Experimental setup for measuring conducted EMI-Measurement of DM interferences.
UNIT IV EMI CONTROL TECHNIQUE

Shielding technique-Filter techniques-Grounding components-Isolation transformer-Transient suppressor techniques-Bonding techniques-Cable
10 hrs.
connectors and
UNIT V EMC DESIGN OF PCB
10 hrs.
Designing for EMC:Introduction-Different techniques involved in designing for EMC-EMC guide lines for PCB designs-EMC design guide line for audio and control circuit design-EMC guide lines for RF design-EMC guidelines for power supply design-Mother board designs and propagation delay performance models
TEXT BOOK:
1. Bernhard Keiser Principles of Electromagnetic Compatibility, Artech house, 3rd edition 1987.
REFERENCES BOOKS:
1. 2. 3. 4. 5. Henry W.Ott Noise reduction Techniques in Electronics systems,Johnwiley and sons.New York.1976. DonWhite consultant incorporate-Handbook of EMI/EMC- Vol 1-1985 Clayton R. Paul "Introduction to EMC", Wiley & sons, 2006. Sathyamurthy.S Basics of Electro Magnetic Compatibility, Society of EMC Engineerings (India), 2003. Kodali.V.P "Engineering EMC Principles, Measurements and Technologies", IEEE Press, 2001.


REGULATIONS 2010
SECX5032
DIGITAL SIGNAL PROCESSORS ARCHITECTURES AND APPLICATIONS
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I FUNDAMENTALS OF PROGRAMMABLE DSPS
10 hrs.
Multiplier and Multiplier accumulator Modified Bus Structures and Memory access in P-DSPs Multiple access memory Multi port memory VLIW architecture pipelining Special Addressing modes in P-DSPs On Chip Peripherals.
UNIT II TMS320C5X PROCESSOR
10 hrs.
Architecture Assembly Language syntax- Addressing modes- Assembly language Instructions pipeline structure, Operation Block diagram of DSP Starter kit Application Programs for processing real time signals.
UNIT III TMS320C3X PROCESSOR
10 hrs.
Architecture Data formats Addressing modes Groups of addressing modes Instruction sets Operation Block diagram of DSP starter kit Application, Programs for processing real time systems Generating and finding the sum of series, Convolution of two sequences , Filter design.
UNIT IV ADSP PROCESSORS
10 hrs.
Architecture of ADSP-21XX and ADSP 210XX series of DSP processors Addressing modes and Assembly language instructions Applications programs Filter design, FFT calculation- Blackfin DSP Processor
UNIT V ADVANCED PROCESSORS
10 hrs.
Architecture of TMS320C54X: Pipe line operation, Code Composer Studio Architecture of TMS320C6X Architecture of Motorola DSP563XX Comparison of the features of DSP family processors.
TEXT BOOK:
1. B.Venkataramani and M.Bhaskar, Digital Signal Processors Architecture Programming and Application Tata McGraw Hill Publishing Company Limited. New Delhi, 2008.
REFERENCE BOOKS:
1. User guides Texas Instrumentation, Analog Devices, Motorola. 2. Simon Haykin Adaptive filter theory, Prentice Hall, 2001. 3. Anil K Jain Fundamental of Digtal image processing, Prentice Hall, 1989.


REGULATIONS 2010
SECX5085
BLUETOOTH TECHNOLOGY (Common to VLSI, Embedded)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION
10 hrs.
Introduction to Wireless technologies: WAP services, serial and parallel Communication, Asynchronous and synchronous communication, EDM, TFM, Spread spectrum technology Introduction to Bluetooth: Specification, core protocols, cable replacement protocol
UNIT II BLUETOOTH RADIO AND NETWORKING
10 hrs.
Bluetooth Radio: Type of Antenna, Antenna Parameters, Frequency hoping Bluetooth Networking: Wireless networking, Wireless network types, devices roles and states, adhoc network, scatter net.
UNIT III CONNECTION ESTABLISHMENT PROCEDURE
10 hrs.
Connection establishment procedure, notable aspects of connection establishment, Mode of connection, Bluetooth Security, Security architecture, Security level of services, profile and usage model: Generic access profile (GAP), SDA, serial profile, Secondary Bluetooth profile.
UNIT IV HARDWARE
Hardware: Bluetooth implementation, Baseband overview, packet format, Transmission
10 hrs.
Buffers, Protocol implementation: link manager protocol, logical link control Adaptation protocol, Host control interface, protocol interaction with layers.
UNIT V APPLICATIONS
10 hrs.
Programming with Java: Java Programming, J2ME architecture, Javax, Bluetooth package interface, classes, exceptions, Javax.obex package:interfaces, classes Bluetooth services overview of IRDA, HomeRF, Wireless LANs, JINI
TEXT BOOK:
1. C.S.R.Prabhu and A.P.Reddi Bluetooth Technology, Prentice Hall of India 2004.
REFERENCE BOOKS:
1. Charels P.Pfleeger Security in computing, Prentice Hall 2003 2. Andreas F.Molisch Wideband wireless Digital Communication, Prentice Hall, 2001. 3. George.V.Tsoulous Adaptive Antennas for wireless Communication, IEEE Press, 2001


REGULATIONS 2010
SECX5033
DESIGN OF SEMICONDUCTOR MEMORIES
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I RANDOM ACCESS MEMORY TECHNOLOGIES
10 hrs.
Static Random Access Memory(SRAMs):SRAM cell structure-MOS SRAM architecture-MOS SRAM cell and peripheral circuit operation-bipolar SRAM technologies- Silicon on insulator(SOI) technology-advanced SRAM archtectures and technologies, application specific SRAMs-CMOS CRAMs - DRAMs cell theory and advanced cell structures-BiCMOS DRAMs-soft error failure in DRAMs -Advanced DRAM designs and architecture-application specific DRAMs.
UNIT II NONVOLATILE MEMORIES
10 hrs.
Masked Read-only memories (ROMs) : High density ROMs-Programmable read only memories(PROMs) - Bipolar PROMs- CMOS PROMs-erssable(UV)- Programmable read only memories (EPROMs)-Floating Gate EPROMcell-one time programmable (OTP) EPROMs-Electrically Erasable PROMs(EEPROMs)- EEPROM technology and architecture-nonvolatile SRAM-Flash memories(EPROMs or EEPROM)-Advanced flash memory architecture.
UNIT III ADVANCED MEMORY TECHNOLOGIES AND HIGH DENSITY MEMORY PACKAGING TECHNOLOGIES
10 hrs.
Ferroelectric Random Access Memories(FRAMs)-Gallium Arsenide (GaAs) FRAMs-Analog memories magneto resistive random access memories(MRAMs) Experimental memory devices. Memory hybrids and MCMs(2D)-Memory stacks and MCMs (3D)-Memory MCM testing and reliability issues-memory cards-high density memory packaging future directions.
UNIT IV SEMICONDUCTOR MEMORY RELIABILITY AND RADIATION EFFECTS
10 hrs.
General Reliability issues-RAM failure modes and mechanism-nonvolatile memory reliability-reliability modeling and failure rate prediction- design for reliability-reliability test structures-reliability screening and qualification. Radiationeffects-single event phenomenon(SEP)-radiation hardening techniques-radiation hardening process and design issues-radiation hardened memory characteristics-radiation hardness assurance and testing-radiation dosimetry - water level radiation testing and structures.
UNIT V MEMORY FAULT MODELING,TESTING AND MEMORY DESIGN FOR TESTABILITY AND DAULT TOLERANCE 10 hrs.
RAM fault modeling,electrical testing,Pseudo random testing-megabit DRAM-nonvolatile memory modeling and testing-IDDQ fault modeling and testing-application specific memory testing and the tools for fault modeling and testing
TEXT BOOK:
1. Ashok K.Sharma Semiconductoer Memories Technology,testing and reliability", IEEE Press, 1997.
REFERENCE BOOKS:
1. Ivan Sutherland Bob sproull, David Harris, "Logical Efforts, Designing Fast CMOS Circuits", Kluwr Academic Press, 1999. 2. David Harris, "Skew Tolerant domino Design", Prentice Hall of India Private Ltd , 2000


REGULATIONS 2010
SCSX5031
CRYPTOGRAPHY & NETWORK SECURITY (Common to VLSI, Embedded)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION & MATHEMATICAL FOUNDATION
10 hrs.
Beginning with a simple communication game wresting between safeguard and attack Probability and Information Theory - Algebraic foundations Number theory.
UNIT II ENCRYPTION SYMMETRIC TECHNIQUES
10 hrs.
Substitution Ciphers - Transposition Ciphers - Classical Ciphers DES AES Confidentiality Modes of Operation Key Channel Establishment for symmetric cryptosystems.
UNIT III ENCRYPTION ASYMMETRIC TECHNIQUES & DATA INTEGRITY TECHNIQUES
10 hrs.
Diffie-Hellman Key Exchange protocol Discrete logarithm problem RSA cryptosystems & cryptanalysis ElGamal cryptosystem Need for stronger Security Notions for Public key Cryptosystems Combination of Asymmetric and Symmetric Cryptography Key Channel Establishment for Public key Cryptosystems - Data Integrity techniques Symmetric techniques - Asymmetric techniques
UNIT IV AUTHENTICATION
10 hrs.
Authentication Protocols Principles Authentication protocols for Internet Security SSH Remote logic protocol Kerberos Protocol SSL & TLS Authentication frame for public key Cryptography Directory Based Authentication framework Non - Directory Based Public-Key Authentication framework .
UNIT V SECURITY PRACTICES
10 hrs.
Protecting Programs and Data Information and the Law Rights of Employees and Employers Software Failures Computer Crime Privacy Ethical Issues in Computer Security.
TEXT BOOK:
1. Wenbo Mao Modern Cryptography Theory and Practice, Pearson Education, First Edition, 2006.
REFERENCE BOOKS:
1. Douglas R. Stinson Cryptography Theory and Practice , Third Edition, Chapman & Hall/CRC,2006. 2. Charles B. Pfleeger, Shari Lawrence Pfleeger Security in Computing, Fourth Edition, Pearson Education, 2007. 3. Wade Trappe and Lawrence C. Washington Intrduction to Cryptography with Coding Theory Second Edition, Pearson Education, 2007.


REGULATIONS 2010
SECX5034
VLSI FOR WIRELESS COMMUNICATION
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I
10 hrs.
Review of Modulation Schemes BFSK- BPSK QPSK OQPSK Classical Channel - Additive White Gaussian Noise Finite Channel Bandwidth - Wireless Channel- Path Environment - Path Loss Friis Equation - Multipath Fading Channel Model - Envelope Fading Frequency Selective Fading Fast Fading - Comparison of different types of Fading- Review of Spread Spectrum DSSS FHSS - Basic Principle of DSSS - Modulation Demodulation - Performance in the presence of noise-narrowband and wideband interferences.
UNIT II
10 hrs.
Receiver Front End Motivations - General Design Philosophy- Heterodyne and Other architectures - Filter Design - Band Selection Filter Image Rejection Filter - Channel Filter - Non idealities and Design Parameters Harmonic Distortion Intermodulation -Cascaded Nonlinear Stages Gain Compression Blocking Noise - Noise Sources -Noise Figure - Design of Front end parameter for DECT.
UNIT III
10 hrs.
Low Noise Amplifier Introduction - Matching Networks Matching for Noise and Stability Matching for Power Implementation - Comparison of Narrowband and Wideband LNA - Wideband LNA Design - Narrowband LNA Impedance matching -Power matching- Salient features of LNA Core Amplifier Design.
UNIT IV
10 hrs.
Demodulators - Delta Modulators - Low Pass Sigma Delta Modulators High Order Modulators - One Bit DAC and ADC Passive Low Pass Sigma Delta Modulator - Band pass Sigma Delta Modulators Comparison - PLL based Frequency Synthesizer - Loop Filter Design and Implementation.
UNIT V
10 hrs.
Implementations: VLSI architecture for Multitier Wireless System - Hardware Design Issues for a Next generation CDMA System - Efficient VLSI Architecture for Base Band Signal processing.
TEXT BOOK:
1. Bosco Leung VLSI for wireless Communication, Prentice Hall, 2002.
REFERENCE BOOKS:
1. Andreas F.Molisch Wideband wireless Digital Communication, Prentice Hall PTR, 2001. 2. George.V.Tsoulous Adaptive Antennas for wireless Communication", IEEE Press, 2001. 3. Xiaodong Wang and H.Vincent Wireless Communication System ,Advanced Techniques for Signal Reception, Pearson Education. 2004


REGULATIONS 2010
SECX5035
RF IC DESIGN
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I RF ELECTRONIC CONCEPTS
10 hrs.
Introduction RF Microwave Vs DC or AC signals Importance of radio frequency design RF behaviour of passive components High frequency resistors - High frequency capacitors - High frequency inductors Chip components Circuit board consideration Chip resistors-Chip capacitors-Surface mounted inductors- resonant circuits Analysis of a simple circuit and Phasor domain Impedance transformation Insertion loss- Impedance transformersRF impedance matching. BJT and MOSFET behavior at RF.
UNIT II SMITH CHART
10 hrs.
Introduction to smith chart Applications of smith chart From reflection coefficient to load impedance Parametric reflection coefficient equation Graphical representation Impedance transformation Admittance transformation Parallel line series connection. Definition of impedance matching Selection of a matching network Goal of impedance matching Design of matching circuits using lumped elements Matching network design using distributed elements.
UNIT III MATCHING AND BIASING NETWORK
10 hrs.
Impedance Matching using discrete component- Two component matching networks-Forbidden regions, Frequency response, Quality factor, T and Pi matching networks, micro-strip line matching network- discrete component from micro strip lines, single stub matching networks, double stub matching networks, amplifier classes of operation and biasing network, classes of operation and efficiency of amplifiers, bipolar transistors biasing networks, Field Effect transistors biasing networks.
UNIT IV DESIGN OF AMPLIFIERS
10 hrs.
Stability considerations in active network Gain considerations in amplifiers Power gain concepts Unilateral transistor Mismatch factor Input &output VSWR Maximum gain design Constant gain circles Unilateral figure of merit Bilateral case Amplifiers RF circuit design Design of different types of amplifiers Narrow band amplifier design High gain amplifier design Maximum gain amplifier design Low noise amplifier design -Maximum noise amplifier design Broad band amplifier design- Multistage small signal amplifier design High power amplifier Large signal amplifier design - Integrated RF Filters,
UNIT V RF MICROWAVE OSCILLATOR DESIGN
10 hrs.
Introduction Basic oscillator model negative resistance oscillator High frequency oscillator configuration Oscillator Vs amplifier design Oscillation condition Two port NR oscillators One port NR oscillators Condition of stable operation Design of transistor oscillator -Fixed frequency oscillator - dielectric resonator oscillator - Frequency tunable oscillator YIG tuned oscillator Varactor tuned oscillator Gunn element oscillator,Mixers.
TEXT BOOKS:
1. Matthew M.Radmanesh Radio frequency & Microwave Electronics illustrated, Prentice Hall, 2001. 2. Reinhold Ludwig Panel Brechko RF circuit design, Pearson Education, 2009.
REFERENCE BOOKS:
1. Robbert J Webber Radio frequency & design applications, IEEE Press, 2001 2. Jeremy Everard Fundamentals of RF Circuit Design, John Wiley, 2001. 3. Thomas H.Lee, The Design of RF Integrated Circuits ,Cambridge university press, 2004.

REGULATIONS 2010
SECX5036
COMPUTER ARCHITECTURE AND PARALLEL PROCESSING
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I THEORY OF PARALLELISM
10 hrs.
Parallel computer models-the state of computing, multiprocessors and Multicomputers and Multivectors and SIMD computers, PRAM and VLSI models, Architectural development tracks.
UNIT II APPLICATIONS
10 hrs.
Programs and network properties-conditions of parallelism, Program partitioning and scheduling, program flow mechanisms, system interconnect architectures, principles of scalable performance matrices and measures, parallel processing applications, speed up performance laws, scalability analysis and approaches.
UNIT III HARWARE TECHNOLOGIES
10 hrs.
Processor and memory hierarchy advanced processor technology, superscalar and vector processors, memory hierarchy technology, virtual memory technology, bus cache and shared memory-backplane bus systems, cache memory organizations, shared memory organizations, sequential and weak consistency models
UNIT IV PIPELINING AND SUPER SCALAR TECHNOLOGIES
10 hrs.
Parallel and scalable architectures, Multiprocessor and multicomputers, Multivector and SIMD computers, Scalable, Multithreaded and data flow architecture.
UNIT V SOFTWARE AND PARALLEL PROGRAMMING
10 hrs.
Parallel models, Languages and compilers, Parallel program development environments, UNIX, MACH and OSF/1 for parallel computers.
TEXT BOOK:
1. Kai Hwang Advanced computer Architecture, Tata McGraw Hill International, 1993.
REFERENCE BOOKS:
1. William Stalling Computer Organization and Architecture, Pearson Education, INC, 2010. 2. M.J.Quinn Designing Efficient Algorithms for parallel computers, McGraw Hill international, 1987.


REGULATIONS 2010
SECX5037
MIXED SIGNAL PROCESSING
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION
10 hrs.
Introduction-modeling basic analog concepts-analog circuit analysis-network independent-dependence data sampled analog systems, loading.
UNITT II VHDL APPLICATION TO ANALOG AND MIXED SIGNAL EXTENSIONS
10 hrs.
Introduction-language design objectives-Theory of differential algebraic equation-the 1076.1 language-tolerance groups-conservative systems-time and the simulation cycle-A/D and D/A interaction-Question point-frequency domain modeling and examples.
UNIT III ANALOG EXTENSIONS TO VERILOG
10 hrs.
Introduction-equation construction-solution-waveform filter functions-simulator-control analysis-multi-disciplinary model.
UNIT IV BEHAVIORAL GENERIC MODEL OF OPERATIONAL AMPLIFIERS

Introduction-description of generic opamp block-conflict resolution-application examples. model-structure-configuration-functional
10 hrs.
specification-auxiliary
UNIT V NON-LINEAR STATE SPACE AVERAGED MODELING OF 3-STATE DIGITAL PHASEFREQUENCY DETECTOR
10 hrs.
Introduction-modeling of multi state phase frequency detector-resetable integrator-AC analysis-sample application.
TEXT BOOK:
1. Alain Vachoux jean-Michel Borage oz levia Analog and mixed signal hardware description language (current issues in electronic modeling V.10)", Kluwer academic publishers 1997.
REFERENCE BOOKS:
1. 2. 3. 4. Philip E-Allen, Dougles R.Holberg CMOS analog circuit design second edition oxford university press 2002. Behzad Razavi Design of analog CMOS integrated circuits Tata McGraw Hill edition 2002. John G Proakis Digtal signal processing, Pearson Prentice Hall, 2007. Simon Haykin Adaptive filter theory, Prentice Hall, 2002.


REGULATIONS 2010
SECX5038
HIGH SPEED VLSI DESIGN
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I
10 hrs.
Clocked logic styles, single-Rail Domino logic styles, Dual-Rail Domino structures, Latched Domino structures, clocked pass gate logic Non clocked logic styles, Static CMOS ,DCVS logic ,N0n-clocked pass Gate Families.
UNIT II
10 hrs.
Circuit design Margining, Design induced Variations, process induced Variations, Application induced Variations, Noise.
UNIT III
10 hrs.
Latching strategies, Basic Latch Design, Latching Differential logic,Hazards,Race Free Latches for Pre-charged logic, Asynchronous latch techniques.
UNIT IV
10 hrs.
Signaling standards, chip-to-chip communication Networks, ESD Protection, Standards and Models with design -Skew Tolerant design.
UNIT V
10 hrs.
Clocking styles, clock jitter, signal skew, clock skew, and data feed through clock generation, clock distribution, and asynchronous clocking techniques.
TEXT BOOK:
1. Kerry Bernstein "High Speed CMOS Design styles", Kulwer Academic Publishers, 2002.
REFERENCES BOOKS:
1. Ivan Sutherland, Bob sproull, David Harris "Logical Efforts: Designing Fast CMOS Circuits", Kluwr Academic Publishers, 1999. 2. David Harris, "Skew Tolerant domino Design", Prentice Hall of India Private Ltd, 2000.


REGULATIONS 2010
SECX5039
BASICS OF NANOTECHNOLOGY (Common to VLSI, NanoTech)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION TO NANOTECHNOLOGY
10 hrs.
Nanoscale technology : Consequences of the nanoscale for technology and society. Beyond Moores Law. Molecular building blocks for nanostructure systems, Nano-scale 1D to 3D structures, Energy Band Diagram : Energy level diagram, Fermi function, n-type operation, p-type operation, Rate equations for a one-level model, Current in a one-level model, Inflow / Outflow, Pauli blocking, quantum of conductance, Potential profile, Iterative procedure for self-consistent solution, Quantum capacitance, Negative Differential Resistance (NDR).
UNIT II ELECTRICAL RESISTANCE-AN ATOMISTIC VIEW
10 hrs.
Negative differential resistance-thermo electric effect-Nano transistors-inelastic spectroscopy-NEGF formalism-input parameters-derivation of NEGF equations-model Hamiltonian.
UNIT III MOLECULAR ELECTRONIC DEVICES
10 hrs.
Basic Concepts- Self assembled Layers, Charge transport Mechanisms; Synthesis of Molecular wires and devices synthesis of two terminal devices, Fabrication of molecular transport devices; Simple SAM metal-insulator-metal Tunneling.
UNIT IV NANOSCALE DEVICE MODELING
10 hrs.
Inadequacy of macroscopic models, Equilibrium, Non-Equilibrium, Density Matrix and current operator; NEGF Formalism Broadening.
UNIT V NANOSCALE DEVICE MODELING
10 hrs.
Quantum Point Contact- Hamiltonian, Self energy; SAM- Signals used to control and probe molecules, Synthesis; Fabrication and overview of Nanotube devices- their properties.
REFERENCE BOOKS:
1. 2. 3. 4. Mark A. Reed and Takhee Lee Molecular Nano electronics, American scientific Publisher, 2003. Suprio Dutta "Tutorial on Electrical Resistance-an atomistic view", Purdue University, 2004. Horst-Gunter Rubahn "Basics of Nano Technology", Wiley-VCH verlagGmbh & Co, 2008. Chris Binns "Introduction to Nano science and Nano Technology", John wiley & sons, 2010.

Exam Duration : 3 hrs 30 marks 50 marks

REGULATIONS 2010
SECX5040
NANO SENSORS AND APPLICATIONS (Common to VLSI, NanoTech)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I
10 hrs.
Fundamentals of Nano Sensors: Micro and nano-sensors, Fundamentals of sensors, biosensor, micro fluids, MEMS and NEMS, Packaging and characterization of sensors, Method of packaging at zero level, dye level and first level.Sensors.
UNIT II
10 hrs.
Quantum Structures and Devices:Quantum layers, wells, dots and wires, Mesoscopic Devices, Nanoscale Transistors, Single Electron Transistors, MOSFET and NanoFET, Resonant Tunneling Devices, Carbon Nanotube based logic gates, optical devices. Connection with quantum dots, quantum wires, and quantum wells.
UNIT III
10 hrs.
Sensors for aerospace and defense: Accelerometer, Pressure Sensor, Night Vision System, Nano tweezers, nano-cutting tools, Integration of sensor with actuators and electronic circuitry, Civil applications: metrology, bridges and other industrial applications.
UNIT IV
10 hrs.
Biosensors:Clinical Diagnostics, generation of biosensors, immobilization, characteristics, applications, conducting Polymer based sensor, DNA Biosensors, optical sensors. Biochips. Metal Insulator Semiconductor devices, molecular electronics, information storage, molecular switching, Schottky devices. Sensor for bio-medical applications: Cardiology, Neurology and as diagnostic tool.
UNIT V
10 hrs.
Magnetic biosensors: Introduction, Magnetoresistance-based sensors, Hall effect sensors, Other sensors detecting stray magnetic fields, Sensors detecting magnetic relaxations, Sensors detecting ferrofluid susceptibility.
REFERENCE BOOKS:
1. H. Mexiner " Sensors: Micro & Nanosensors, Sensor Market trends", Wiley-VCH-1995. 2. Ping Sheng, Zikang Tang "Nanoscience & Technology: Novel Structure and phenomena", Taylor & Francis-2003. 3. Michael Rieth "Nano Engineering in Science & Technology: An Introduction to the world of Nano design", World Scientific publishing Co.pte.ltd-2003. 4. Vijay K.Varadan "Nanosensors, Microsensors and Biosensors and systems", SPIE International Society for Optical Engine-2007. 5. Larry Nagahara, Nongjian Tao, Thomas Thundal "Introduction to Nanosensors Series: Nanostructure Science and Technology", Springer-verlag New York Inc-2008

Max. Marks: 80 Part A: 6 Questions of 5 marks each No choice Part B: 2 Questions from each unit of internal choice each carrying 10 marks

REGULATIONS 2010
SECX5041
DIGITAL DESIGN WITH CPLD APPLICATION
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION TO DIGITAL SYSTEMS
10 hrs.
Analog vs Digital systems, digital devices, integrated circuits, programmable logic devices, digital design levels, software aspects of digital design.
UNIT II LOGIC CIRCUITS
10 hrs.
Combinational circuit synthesis minimization, Karnaugh Maps, sum of products and product of sums expressions and their minimization, programmed minimization methods Quine McCluskey minimization algorithm, timing hazards static and dynamic hazards, introduction to VHDL hardware description language.
UNIT III SEQUENTIAL LOGIC PRINCIPLES
10 hrs.
Bistable elements, Latches and flipflops, S-R latch, D latch, Edge triggered D flipflop, Master/slave flipflops, T flipflop.
UNIT IV INTRODUCTION TO PLDS & MAX PLUS II
10 hrs.
Programming PLDs using MAX PLUS II, Graphic Design File, Compiling MAX PLUS II Files, Hierarchical Design.
UNIT V COMBINATIONAL LOGIC DESIGN PRACTICES
10 hrs.
Documentation standards, Circuit timing, Combinational PLDs. Design using SSI and MSI devices Decoders, Encoders, Three state buffers, Multiplexers, Parity circuits, Comparators, Adders, Subtractors, ALUs, Combinational multipliers. Using VHDL and PLDs Combinational circuit design examples barrel shifter, simple floating point encoder, cascading comparator.
TEXT BOOK:
1. Robert K. Dueck "Digital Design with CPLD Applications and VHDL", Thomson Asia Pte. Ltd., Singapore, 2001.
REFERENCE BOOKS:
1. 2. 3. 4. John F. Wakerley "Digital Design: Principles and Practices", third edition updated, Prentice Hall, 1990. Stephen Brown & Zvonko Vranesic "Fundamentals of Digital logic with VHDL design", first edition, McGraw Hill, 2008. Alan B. Marcovitz "Introduction to logic design", McGraw Hill International edition 2007. James Bignell & Robert Donovan "Digital Electronics", fourth edition, Thomson Asia Pte. Ltd., Singapore, 2006.


REGULATIONS 2010
SECX5042
ALGORITHMS FOR VLSI DESIGN AUTOMATION
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I METHODS FOR COMBINATIONAL OPTIMIZATION
10 hrs.
Introduction to Design Methodologies, Design Automation tools, algorithmic Graph Theory, Computational complexity, Tractable and Intractable problems. Backtracking, Branch and Bound, Dynamic Programming, Integer Linear Programming, Local Search, Simulated Annealing, Tabu search, Genetic Algorithms.
UNIT II CLUSTERING
10 hrs.
Layout Compaction, Placement, Floor planning And Routing Problems, Rajaraman and Wong Algorithm, Flow Map Algorithm, Multi-Level Coarsening Algorithm.
UNIT III PARTITIONING & FLOOR PLANNING

Kernighan and Lin Algorithm, Fiduccia and Mattheyses Algorithm, EIG Algorithm, FBB Algorithm.
10 hrs.
Floorplanning algorithms - Stockmeyer Algorithm, Normalized Polish Expression, ILP Floor planning Algorithm, Sequence Pair Representation.
UNIT IV PLACEMENT & ROUTING
10 hrs.
Mincut Placement, GORDIAN Algorithm, TimberWolf Algorithm. Routing - Steiner Min-Max Tree Algorithm , Multi-Commodity Flow Routing Algorithm , Iterative Deletion Algorithm , Yoshimura and Kuh Algorithm.
UNIT V PHYSICAL DESIGN AUTOMATION OF FPGAS & MCMS
10 hrs.
FPGA technologies, Physical Design cycle for FPGAs, partitioning and routing for segmented and staggered Models.MCM technologies, MCM physical design cycle, Partitioning, Placement - Chip Array based and Full Custom Approaches.
TEXT BOOK:
1. S.H.Gerez, WILEY "Algorithms for VLSI Design Automation", Student Edition, John wiley & Sons (Asia) Pvt. Ltd., 1999.
REFERENCE BOOKS:
1. 2. 3. 4. Sung Kyu Lim "Practical Problems in VLSI Physical Design Automation", Springer, 2008. Naveed Sherwani "Algorithms for VLSI Physical Design Automation", 3rd edition, Kluwer Academic Publishers, 1995. Hill & Peterson "Computer Aided Logical Design with Emphasis on VLSI", Wiley, 1993. Wayne Wolf "Modern VLSI Design: Systems on silicon", Pearson Education Asia, 2nd Edition, 2006.

Max. Marks: 80 Part A: 6 Questions of 5 marks each No choice Part B: 2 Questions from each unit of internal choice,each carrying 10 marks

REGULATIONS 2010
SECX5043
HIGH-LEVEL SYNTHESIS OF DIGITAL CIRCUITS
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION TO HIGH-LEVEL SYNTHESIS
10 hrs.
System-Level Design of Hardware Systems - Overview of High-Level Synthesis - Role of Parallelizing Compiler Transformations in HLS - HLS for Behaviors with Complex Control Flow - Intermediate Representations in High-Level Synthesis - Use of Loop Transformations in Compilers and High-Level Synthesis
UNIT II MODELS AND REPRESENTATIONS
10 hrs.
Modeling the Problem - Design Description Modeling - Modeling Data Dependencies - Better Design Visualization - Modeling Control Flow - Modeling Hardware Resources, Timing and Data Types - Formulation of the Scheduling Problem - Constraints due to Data Dependencies - Resource-Constrained Scheduling - Model-ing Parallelizing Code Motions - Scheduling Designs with Control Flow - Modeling Resource Utilization
UNIT III PARALLELIZING HIGH-LEVEL SYNTHESIS
10 hrs.
Methodology- Design Flow through a PHLS Framework -Passes and Techniques- Pre-Synthesis Compiler Optimizations -Common Sub-Expression Elimination- Loop-Invariant Code Motion- Loop Unrolling -Loop Index Variable Elimination -Compiler and Synthesis Transformations-Limits of Parallelism within Basic Blocks-Speculation and Predicated Execution in Compilers-Role of Speculative Code Motions in High-Level Synthesis-Dynamic Common Sub-Expression Elimination-Chaining Operations Across Conditional Boundaries-Loop Shifting
UNIT IV CODE TRANSFORMATIONS AND SCHEDULING
10 hrs.
Software Architecture of the Scheduler-Priority-based Global List Scheduling Heuristic-Collecting the List of Available Operations-Trailblazing-Based code motion algorithm-Dynamic CSE Algorithm-Design Traversal Algorithms-Dynamic Branch Balancing-Incorporating Chaining into the Scheduler-Loop Shifting Algorithm-Resource Binding and Control Synthesis- Introduction -Resource Binding-Modeling Interconnect Minimizing Resource Binding-Operation to Functional Unit Binding-Variable to Register Binding- Control Synthesis in the PHLS Framework
UNIT V SPARK: IMPLEMENTATION, SCRIPTS AND DESIGN EXAMPLES
10 hrs.
Implementation of the SPARK PHLS Framework-Command-line Options and Scripts in SPARK-Interdependencies between the Code Motions- Enabling and Disabling One Code Motion at a Time - Enabling Multiple Code Motions at a Time- Ways of Calculating Priority- Design Examples- Study of Loop Unrolling and Loop Shifting - Synthesis of an Instruction Length Decoder.
TEXT BOOK:
1. Sumit Gupta, Rajesh K. Gupta A Parallelizing Approach to The High-Level Synthesis of Digital Circuits, Kluwer Academic Publishers, 2004
REFERENCE BOOKS:
1. Philippe Coussy , Adam Morawiec High Level Synthesis from Algorithm to Digital Circuit, Springer 2008. 2. Richard Sharp Higher-Level Hardware Synthesis, Springer 2004.


REGULATIONS 2010
SECX5083
PROGRAMMING IN PERL
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION
10 hrs.
Typical uses of Perl Event driven Simulators -Perl -Perl philosophy - A Perl program-Three virtues of a programmer - Parts of Perl - The Perl interpreter - Manuals/Documentation-Perl Modules - Perldoc: Using perldoc Other ways to access perldoc - Creating and running a Perl program: Perl program- Running a Perl program from the command line Executing code-The "shebang" line for Unix-The "shebang" line for non-Unixes -Command line options and warnings-Lexical warnings.
UNIT II VARIABLES AND ARRAYS
10 hrs.
Perl variables- Special characters - Advanced variable interpolation- Arrays-Initializing an array-Reading and changing array values -Array slices - Array interpolation Counting backwards - Finding out the size of an array -Printing out the values in an array-Hashes -Initializing a hash-Reading hash values -Adding new hash elements -Changing hash values-Deleting hash values-Finding out the size of a hash -Other things about hashes-Special variables.
UNIT III OPERATORS AND FUNCTIONS
10 hrs.
Operators- Arithmetic operators-String operators-Other operators Functions-Types of arguments-Return values -Some easy functions-String manipulation-Finding the length of a string-Case conversion -Numeric functions -Type conversions -Manipulating lists and arrays-push, pop, shift and unshift -Ordering lists-Converting strings to lists.
UNIT IV CONDITIONAL CONSTRUCTS
10 hrs.
The if conditional construct -Comparison operators -Existence and definitiveness-boolean logic operators -Logic operators and short circuiting -Boolean assignment -Loop conditional constructs -while loops-for and foreach-Practical uses of while loops: taking input from STDIN -Named blocks-Breaking out or restarting loops-Smart-match-given and when.
UNIT V SUBROUTINES AND REGULAR EXPRESSIONS
10 hrs.
Subroutines: Introducing subroutines-Using subroutines in Perl.-Calling a subroutine- Passing arguments to a subroutine -Passing in scalars -Passing in arrays and hashes-Returning values from a subroutine -Regular expressions -Regular expression operators and functions-m/PATTERN/ - the match operator -s/PATTERN/REPLACEMENT/ - the substitution operator-Binding operators -Easy modifiers -Meta characters -Some easy meta characters-Quantifiers -Grouping techniques -Character classes -Alternation-The concept of atoms.
TEXT BOOK:
1. Kirrily Robert,Paul Fenwick,Jacinta Richardson, "Programming Perl", OReilly & Associates, Inc 2000.
REFERENCES BOOKS:
1. Gabor Szabo "Fundamentals of Perl", 1.11 Edition,Published Sun May 27 23:22:58 2007. 2. Perl Programmers Reference Guide-Version 5.005_02-18-Oct-1998


REGULATIONS 2010
SECX5051
RF MEMS AND ITS APPLICATIONS (Common to VLSI, NanoTech, Appl. Elec.)
L 3
T 0
P 0
Credits 3
Total Marks 100
UNIT I INTRODUCTION 10 hrs. MEMS-Microfabrications for MEMS -Surface micromachining of silicon -Wafer bonding for MEMS-LIGA process-Micromachining of polymeric MEMS devices -Three-dimensional microfabrications.Transducers: Electromechanical transducers-Piezoelectric transducers -Electrostrictive transducers -Magnetostrictive transducers -Electrostatic actuators-Electromagnetic transducers -Electrodynamic transducers- Actuators: Electrothermal actuators-Comparison of electromechanical actuation schemes. UNIT II MICRO SENSING FOR MEMS 10 hrs. Piezoresistive sensing - Capacitive sensing - Piezoelectric sensing - Resonant sensing - Surface acoustic wave sensors.
Materials: Materials for MEMS - Metal and metal alloys for MEMS - Polymers for MEMS - Other materials for MEMS.Metals : Evaporation Sputtering. Semiconductors :Electrical and chemical properties-Growth and deposition.Thin films for MEMS and their deposition techniques -Oxide film formation by thermal --oxidation -Deposition of silicon dioxide and silicon nitride -Polysilicon film deposition -Ferroelectric thin films. Materials for polymer MEMS: Classification of polymers -UV radiation curing -SU-8 for polymer MEMS.
UNIT III MICRO MACHINING AND LITHOGRAPHY 10 hrs. Micromachning : Bulk micromachining for silicon-based MEMS -Isotropic and orientation-dependent wet etching - Dry etching -Buried oxide process -Silicon fusion bonding -Anodic bonding -Silicon surface micromachining Sacrificial layer technology - Material systems in sacrificial layer technology - Surface micromachining using plasma etching -Combined integrated-circuit technology and anisotropic wet etching .Lithography : Microstereolithography for polymer MEMS -Scanning method -Two-photon microstereolithography Surface micromachining of polymer MEMS -Projection method -Polymeric MEMS architecture with silicon, metal and ceramics -Microstereolithography integrated with thick film lithography. UNIT IV MEMS INDUCTORS AND CAPACITORS 10 hrs. Introduction- MEMS/micromachined passive elements: pros and cons. MEMS inductors : Self-inductance and mutual inductance - Micromachined inductors - Effect of inductor layout - Reduction of stray capacitance of planar inductors-Approaches for improving the quality factor Folded inductors - Modeling and design issues of planar inductors - Variable inductors Polymer based inductors.MEMS capacitors: MEMS gap-tuning capacitors - MEMS area-tuning capacitors - Dielectric tunable capacitors. Micromachined antennae : Introduction - Overview of microstrip antennae- Basic characteristics of microstripeantennae - Design parameters of microstrip antennae - Micromachining techniques to improve antenna performance - Micromachining as a fabrication process for small antennae - Micromachined reconfigurable antennae. UNIT V APPLICATIONS 10 hrs. Switching: Introduction- Switch parameters- Basics of switching - Mechanical switches-Electronic switches- Switches for RF and microwave applications - Mechanical RF switches - PIN diode RF switches - Metal oxide semiconductor field effect transistors and monolithic microwave integrated circuits. RF MEMS switches : Integration and biasing issues for RF switches -Actuation mechanisms for MEMS devices-Electrostatic switching - Approaches for low-actuation-voltage switches - Mercury contact switches -Magnetic switching - Electromagnetic switching - Thermal switching.Dynamics of the switch operation : Switching time and dynamic response - Threshold voltage. MEMS switch design, modeling and evaluation:Electromechanical finite element analysis - RF design - MEMS switch design considerations. TEXT BOOK:
1. Vijay K.Varadan, K.J.Vinoy and K.A.Jose RF MEMS and Their Applications", John Wiley & Sons Ltd., 2003.
REFERENCE BOOKS:
1. P. Rai-choudhury MEMS and MOEMS Technology and Applications, SPIE The Internation Society for Optical Engineering, 2003. 2. S. Senturia "Microsystem Design", Kluwer Academic Publisher, 2001. 3. J.W. Gardner, V.K. Varadan, O.O. Awadelkarim "Microsensors, MEMS & Smart Devices", JohnWiley & Sons, 2001.


REGULATIONS 2010

VLSI

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SATHYABAMA UNIVERSITY

(Established under section 3 of UGC Act, 1956)

Jeppiaar Nagar, Rajiv Gandhi Salai, Chennai - 119.

SYLLABUS MASTER OF TECHNOLOGY PROGRAMME IN VLSI DESIGN (4 SEMESTERS) REGULATIONS 2010

FACULTY OF ELECTRONICS ENGINEERING

SATHYABAMA UNIVERSITY REGULATIONS 2010

M.Tech (VLSI DESIGN)

FACULTY OF ELECTRONICS ENGINEERING

RANGE OF MARKS FOR GRADES

CUMULATIVE GRADE POINT AVERAGE CALCULATION

where Ci - Credits for the subject

i - Sum of all subjects successfully cleared during all the semesters

FACULTY OF ELECTRONICS ENGINEERING

Final Degree is awarded based on the following :

M.Tech (VLSI DESIGN)

FACULTY OF ELECTRONICS ENGINEERING

M.Tech VLSI DESIGN REGULATIONS 2010 CURRICULUM SEMESTER I

M.Tech (VLSI DESIGN)

FACULTY OF ELECTRONICS ENGINEERING

Total Credits: Total Credits For the Course:

LIST OF ELECTIVE SUBJECTS

L - Lecture Hours; T - Tutorial Hours; P - Practical Hours; C - Credits

M.Tech (VLSI DESIGN)

FACULTY OF ELECTRONICS ENGINEERING

Total Marks 100

UNIT III WAVELET TRANSFORMS

UNIT IV PROBABILITY & RANDOM VARIABLES

UNIT V RANDOM PROCESS

UNIVERSITY EXAM QUESTION PAPER PATTERN

Exam Duration : 3 hrs. 30 marks 50 marks

FACULTY OF ELECTRONICS ENGINEERING

ADVANCED DIGITAL SYSTEM DESIGN (Common to VLSI, Embedded, Appl. Elec.)

Total Marks 100

UNIT I SEQUENTIAL LOGIC CIRCUITS

UNIT II SYNCHRONOUS SEQUENTIAL CIRCUIT DESIGN

UNIT III ASYNCHRONOUS SEQUENTIAL CIRCUIT DESIGN

UNIT IV PROGRAMMABLE LOGIC DEVICES

UNIT V STUDY OF FPGA AND XILINX

UNIVERSITY EXAM QUESTION PAPER PATTERN

Exam Duration : 3 hrs. 30 marks 50 marks

FACULTY OF ELECTRONICS ENGINEERING

VLSI DESIGN (Common to VLSI, Embedded)

Total Marks 100

UNIVERSITY EXAM QUESTION PAPER PATTERN

Exam Duration : 3 hrs. 30 marks 50 marks

FACULTY OF ELECTRONICS ENGINEERING

MOS DEVICE MODELING (Common to VLSI, NanoTech)

Total Marks 100

UNIVERSITY EXAM QUESTION PAPER PATTERN

Exam Duration : 3 hrs. 30 marks 50 marks

FACULTY OF ELECTRONICS ENGINEERING

VLSI TECHNOLOGY (Common to VLSI, NanoTech)

Total Marks 100

UNIT I CRYSTAL GROWTH, WAFER PREPARATION, EPITARY AND OXIDATION.

UNIT II LITHOGRAPHY AND RELATIVE PLASMA ETCHING

UNIT III DEPOSITION, DIFFUSION , ION IMPLANTATION AND METALIZATION

UNIT V ANALYTICAL , ASSEMBLY TECHNIQUES & PACKAGING OF VLSI DEVICES

UNIVERSITY EXAM QUESTION PAPER PATTERN

Exam Duration : 3 hrs. 30 marks 50 marks

FACULTY OF ELECTRONICS ENGINEERING

Total Marks 100

UNIT I SPECTRUM ESTIMATION & PREDICTION

UNIT II ADAPTIVE FILTERS