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BAT760

Medium power Schottky barrier single diode


Rev. 03 17 October 2008 Product data sheet

1. Product prole
1.1 General description
Planar medium power Schottky barrier single diode with an integrated guard ring for stress protection, encapsulated in a SOD323 (SC-76) very small Surface-Mounted Device SMD plastic package.

1.2 Features
I I I I Ultra high-speed switching Very low forward voltage Guard-ring protected Very small SMD plastic package

1.3 Applications
I Ultra high-speed switching I Voltage clamping I Protection circuits

1.4 Quick reference data


Table 1. Symbol VR IF VF
[1]

Quick reference data Parameter reverse voltage forward current forward voltage IF = 1 A
[1]

Conditions

Min -

Typ 480

Max 20 1 550

Unit V A mV

Pulse test: tp 300 s; 0.02.

NXP Semiconductors

BAT760
Medium power Schottky barrier single diode

2. Pinning information
Table 2. Pin 1 2 Pinning Description cathode anode
[1]

Simplied outline
1 2

Graphic symbol
1 2
sym001

[1]

The marking bar indicates the cathode.

3. Ordering information
Table 3. Ordering information Package Name BAT760 SC-76 Description plastic surface-mounted package; 2 leads Version SOD323 Type number

4. Marking
Table 4. BAT760 Marking codes Marking code A4 Type number

5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF IFSM Parameter reverse voltage forward current non-repetitive peak forward current junction temperature ambient temperature storage temperature tp = 8.3 ms; half-sine wave; JEDEC method Conditions Min Max 20 1 5 Unit V A A

Tj Tamb Tstg

65 65

125 +125 +150

C C C

BAT760_3

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 17 October 2008

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NXP Semiconductors

BAT760
Medium power Schottky barrier single diode

6. Thermal characteristics
Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1] [2]

Min -

Typ -

Max 220 180

Unit K/W K/W

[1] [2]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 10 10 mm2. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 40 40 mm2.

7. Characteristics
Table 7. Characteristics Tamb = 25 C unless otherwise specied. Symbol VF Parameter forward voltage IF = 10 mA IF = 100 mA IF = 1 A IR reverse current VR = 5 V VR = 8 V VR = 15 V Cd
[1]
[1]

Conditions
[1]

Min -

Typ 240 300 480 5 7 10 19

Max 270 350 550 10 20 50 25

Unit mV mV mV A A A pF

diode capacitance
Pulse test: tp 300 s; 0.02.

VR = 5 V; f = 1 MHz

BAT760_3

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 17 October 2008

3 of 9

NXP Semiconductors

BAT760
Medium power Schottky barrier single diode

103 IF (mA) 102

mld562

105 IR (A) 104


(1)

mld563

103
(1) (2) (3)

(2)

10 102 1 10
(3)

101

0.2

0.4

VF (V)

0.6

10

15

20

VR (V)

25

(1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C

(1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C

Fig 1.

Forward current as a function of forward voltage; typical values

Fig 2.

Reverse current as a function of reverse voltage; typical values


mld564

80 Cd (pF) 60

40

20

0 0 5 10 15 VR (V) 20

f = 1 MHz; Tamb = 25 C

Fig 3.

Diode capacitance as a function of reverse voltage; typical values

BAT760_3

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 17 October 2008

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NXP Semiconductors

BAT760
Medium power Schottky barrier single diode

8. Package outline
1.35 1.15 1 0.45 0.15 1.1 0.8

2.7 2.3

1.8 1.6

2 0.40 0.25 Dimensions in mm 0.25 0.10 03-12-17

Fig 4.

Package outline SOD323 (SC-76)

9. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BAT760
[1]

Package SOD323

Description 4 mm pitch, 8 mm tape and reel

Packing quantity 3000 -115 10000 -135

For further information and the availability of packing methods, see Section 13.

BAT760_3

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 17 October 2008

5 of 9

NXP Semiconductors

BAT760
Medium power Schottky barrier single diode

10. Soldering
3.05 2.1 solder lands solder resist 1.65 0.95 0.5 (2) 0.6 (2) solder paste occupied area 2.2 0.5 (2) 0.6 (2) Dimensions in mm

sod323_fr

Fig 5.

Reow soldering footprint SOD323 (SC-76)


5 2.9 1.5 (2) solder lands solder resist occupied area

2.75

1.2 (2)

Dimensions in mm preferred transport direction during soldering

sod323_fw

Fig 6.

Wave soldering footprint SOD323 (SC-76)

BAT760_3

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 17 October 2008

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NXP Semiconductors

BAT760
Medium power Schottky barrier single diode

11. Revision history


Table 9. BAT760_3 Modications: Revision history Release date 20081017 Data sheet status Product data sheet Change notice Supersedes BAT760_2 Document ID

The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 1 Quick reference data: added Figure 4: superseded by minimized package outline drawing Section 9 Packing information: added Section 10 Soldering: added Section 12 Legal information: updated Product specication Product specication BAT760_1 -

BAT760_2 BAT760_1

20040126 20010312

BAT760_3

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 17 October 2008

7 of 9

NXP Semiconductors

BAT760
Medium power Schottky barrier single diode

12. Legal information


12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]

Product status[3] Development Qualication Production

Denition This document contains data from the objective specication for product development. This document contains data from the preliminary specication. This document contains the product specication.

Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Denitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

12.2 Denitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofce. In case of any inconsistency or conict with the short data sheet, the full data sheet shall prevail.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specied use without further testing or modication. Limiting values Stress above one or more limiting values (as dened in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/prole/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

12.3 Disclaimers
General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental

12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

13. Contact information


For more information, please visit: http://www.nxp.com For sales ofce addresses, please send an email to: salesaddresses@nxp.com

BAT760_3

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 17 October 2008

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NXP Semiconductors

BAT760
Medium power Schottky barrier single diode

14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product prole . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 6 7 8 8 8 8 8 8 9

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.

NXP B.V. 2008.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 October 2008 Document identifier: BAT760_3