Esm Android Smart Phone 53693009 LG L 04c SM

Internal Use Only
Service Manual
L-04C
Date: January, 2011 / Issue 1.0
- -
Copyright 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
Table Of Contents
1. INTRODUCTION ..................................................................... 3
1.1 Purpose ........................................................................................................ 3
1. Regulatory Information ......................................................................... 3
1.3 Abbreviations............................................................................................. 5
2. PERFORMANCE ...................................................................... 7
.1 The Name of the Product ...................................................................... 7
. Objectives .................................................................................................... 7
.3 Product Outline ......................................................................................... 7
.4 Application Range ................................................................................... 7
.5 Terms of Defnition .................................................................................. 8
.6 Product Condtitution ............................................................................. 9
.7 Electrical Characteristics ..................................................................... 11
3. TECHNICAL BRIEF ................................................................ 25
3.1 General Description ............................................................................. 5
3. GSM Mode ................................................................................................ 7
3.3 UMTS Mode ............................................................................................. 31
3.4 LO Phase-locked Loop ......................................................................... 35
3.5 Of-chip RF Components ................................................................... 36
3.6 Digital Baseband(DBB/MSM77) .................................................. 53
3.7 Modem system / subsystem ............................................................. 56
3.8 Power Block ............................................................................................. 65
3.9 Memory Support ................................................................................... 77
3.10 H/W Sub System .................................................................................. 8
3.11 Main features ...................................................................................... 110
3.1 RF Component ................................................................................... 111
3.13 Main Component.............................................................................. 113
4. TROUBLE SHOOTING ........................................................ 122
4.1 Checking VCXO Block ........................................................................ 1
4. Checking FEM SW Block ................................................................... 13
4.3 Checking UMTS Block ........................................................................ 15
4.4 Checking GSM Block .......................................................................... 134
4.5 GPS ............................................................................................................ 138
4.6 Bluetooth/WLAN OFF-CHIP RF COMPONENTS ....................... 140
4.7 GPS, Wi-Fi/BT RF COMPONENTS .................................................... 146
4.8 GPS, Wi-Fi/BT SIGNAL PATH ............................................................. 149
4.9 GPS, BT/Wi-Fi TROUBLE SHOOTING ............................................. 151
4.10 Power ONTroubleshooting ........................................................... 156
4.11 Charger Troubleshooting .............................................................. 159
4.1 USB Troubleshooting ...................................................................... 16
4.13 RUIM Detect Troubleshooting ..................................................... 165
4.14 3 Mega Camera Troubleshooting............................................... 167
4.15 Keypad Backlight Troubleshooting ........................................... 170
4.15 Keypad Backlight Troubleshooting ........................................... 17
4.16 Main LCD Troubleshooting ........................................................... 174
4.17 Receiver Path ...................................................................................... 175
4.18 Headset path ...................................................................................... 178
4.19 Speaker phone path ........................................................................ 181
4.0Main microphone .............................................................................. 184
4.1 Headsetmicrophone ....................................................................... 186
4. Vibrator ................................................................................................. 188
4.3 SD card operation ............................................................................. 190
4.4 Touch Troubleshootingz ................................................................ 193
4.5 Proximity Sensor Troubleshooting ............................................ 195
4.6 Digital Compass Troubleshooting ............................................. 197
5. DOWNLOAD ....................................................................... 199
6. BLOCK DIAGRAM ............................................................... 212
7. CIRCUIT DIAGRAM ............................................................ 224
8. BGA Pin Map ...................................................................... 237
9. PCB LAYOUT ....................................................................... 244
10. CALIBRATION ................................................................... 252
10.1 Introduction ........................................................................................5
10. Terminology ........................................................................................5
10.3 Installation ...........................................................................................5
10.4 Tachyon Start ......................................................................................55
10.5 Tachyon Main UI ................................................................................ 58
10.6 Functional explain ............................................................................ 63
11. EXPLODED VIEW & REPLACEMENT PART LIST ............. 281
11.1 EXPLODED VIEW ................................................................................ 81
11. Replacement Parts ........................................................................... 8
11.3 Accessory ............................................................................................. 310
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1. INTRODUCTION

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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your companys employees, agents, subcontractors, or person working on your
companys behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common-carrier telecommunication service of
facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is not
done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and
may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
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1. INTRODUCTION

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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such
as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
2. INTRODUCTION
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1. INTRODUCTION

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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked Loop OPLL
Light Emitting Diode LED
Low Drop Output LDO
Liquid Crystal Display LCD
Intermediate Frequency IF
International Portable User Identity IPUI
Global System for Mobile Communications GSM
General Purpose Interface Bus GPIB
Gaussian Minimum Shift Keying GMSK
Flexible Printed Circuit Board FPCB
Electrostatic Discharge ESD
Electrical Erasable Programmable Read-Only Memory EEPROM
Digital Signal Processing DSP
dB relative to 1 milli watt dBm
Digital Communication System DCS
Digital to Analog Converter DAC
Constant Current Constant Voltage CC-CV
Bit Error Ratio BER
Baseband BB
Automatic Power Control APC
1. INTRODUCTION
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1. INTRODUCTION

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Wireless Application Protocol WAP
Voltage Control Temperature Compensated Crystal Oscillator VCTCXO
Voltage Controlled Oscillator VCO
Universal Asynchronous Receiver/Transmitter UART
Time Division Multiple Access TDMA
Time Division Duplex TDD
Travel Adapter TA
Side Tone Masking Rating STMR
Pseudo SRAM PSRAM
Static Random Access Memory SRAM
Sending Loudness Rating SLR
Subscriber Identity Module SIM
Surface Acoustic Wave SAW
Real Time Clock RTC
Root Mean Square RMS
Receiving Loudness Rating RLR
Radio Frequency RF
Public Switched Telephone Network PSTN
Phase Locked Loop PLL
Programmable Gain Amplifier PGA
Printed Circuit Board PCB
Power Amplifier Module PAM
1. INTRODUCTION
2. PERFORMANCE
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2 1The Name of the Product 2.1 The Name of the Product
This product is Android OS Smart phone which has GSM/GPRS/WCDMA dual mode of GSM/GPRS form and
wireless connection/WCDMA FDD form, called L-04C.
2.2 Objectives
The objective of L-04C, Japan 3G Android Smart phone, is to pursue Total Information & Entertainment Station The objective of L 04C, Japan 3G Android Smart phone, is to pursue Total Information & Entertainment Station
through Mobile Multimedia, satisfying UMTS release 5 Version.
2.3 Product Outline
1. WCDMA / GSM (EGSM,DCS,PCS) Dual Mode
2. HSDPA (Category 8 Up to 7.2Mbps) + HSUPA (Category 5 Up to 2Mbps)
3. GPS, Bluetooth 2.1+EDR, Wi-fi 802.11 b/g 3. G S, B uetoot . D , 80 . b/g
4. Android 2.2 (Froyo) OS
5. 8Gbits NAND + 4Gbits DDR SDRAM
6. Slide Qwerty Keypad
7. 3.2 HVGA 320(RGB) X 480 TFT LCD
8. 3.1Mega Pixel CMOS AF Camera
9. Capacitive Full Touch Window
10. External Micro-SD (Up to 32GB) Memory Support
11. USB 2.0 Hi-Speed
12. 18X10 Type Speaker , Q-Coin Motor
13. Proximity Sensor, Acceleration Sensor
14. Digital Compass
15. 3.5 Stereo Headset
16. 5 pin Standard MicroUSB Connector
2.4 Application Range
1. Phone
2. Battery (1,350mAh)
3. Battery Cover
4. Charging Gender (Arib to MicroUSB)
5. Stereo Earmic Set
6 USB C bl 6. USB Cable
2. PERFORMANCE
2. PERFORMANCE
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2.5Terms of Definition 2.5 Terms of Definition
1. GSM(Global System for Mobile): The standard digital cellular system in Europe, Asia, and other parts of the
world. It is a variation on TDMA, with a data transfer rate of 9.6Kbps.
2. GPRS(General Packet Radio Services): General packet radio service (GPRS) is a packet oriented mobile data
service available to users of the 3G cellular communication systems.
GPRS allows a data transmission rate of up to 171.2 kbps and is suitable for internet access.
3 DBB(Di i l B B d) Th l i d i l di P f i S i id l d 3. DBB(Digital Base Band): The control unit product including Processor for use in Set inside control and
the DSP which operate GSM algorithm.
4. ABB (Analog Base Band processor): Transmission and reception of Baseband, Supporting control parts
keeping input and output of Voice band (a mic, speaker connection) and ADC are included.
5. Memory: All S/W including protocol, User Interface is stored, and to apply.
6. USIM(Universal Subscriber Identity Module): USIMis part of a removable smart card ICC
(Integrated Circuit Card), is stored personal information.
So, Even if user use other mobile phone, not users own mobile phone, it can be used if USIM is in it.
7. RF Transceiver: This component has Low noise signal amplifier (LNA) of the reception first grade,
Mixer which mixes a signal, module in Transmission and reception part including A Programmable amplifier
and IQ strange demodulators.
8. VCTCXO(Voltage Controlled Temperature Compensated Crystal Oscillator): A voltage controlled /
temperature compensated crystal oscillators are used in applications that require excellent phase noise temperature compensated crystal oscillators are used in applications that require excellent phase noise
performance.
9. PLL (Phase Locked Loop): A circuit that consists essentially of a phase detector which compares the
frequency of a voltage-controlled oscillator with that of an incoming carrier signal or reference-frequency
generator.
10. VCO (Voltage Controlled Oscillator): An oscillator that can be tuned over a wide range of frequencies
by applying a voltage (tuning voltage) to it. Used in many applications such as radio tuners, y pp y g g ( g g ) y pp ,
VCOs are less costly than crystal oscillators, but not as stable. Contrast with crystal oscillator.
11. SAW (Surface Acoustic Wave) Filter: A semiconductor device that is used to filter out desired frequencies.
Widely used in mobile phones to filter both RF and IF frequencies, a SAW filter uses the piezoelectric effect
to turn the input signal into vibrations that are turned back into electrical signals in the desired frequency
range.
12. PAM (Power Amplifier Module): PAMis a form of signal modulation where the message information is
encoded in the amplitude of a series of signal pulses.
13. APC(Automatic Power Control): A signal level of PAM is adjusted precisely.
14. FEM (Front End Module): The switch which chooses transmission and reception of wireless signal
and a frequency band.
2. PERFORMANCE
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3
15. UMTS(Universal Mobile Telecommunication System): UMTS is one of the third-generation (3G) mobile 15. UMTS(Universal Mobile Telecommunication System): UMTS is one of the third generation (3G) mobile
telecommunications technologies.
16. WCDMA(Wide-band Code Division Multiple Access): WCDMA has been designed for high speed data
services and, more particularly, Internet-based packet-data, offering up to 2Mbps in stationary or office
environments and up to 384Kbps in wide area or mobile environments.
2.6 Product Condtitution
2.6.1 A Whole Product Appearance
2. PERFORMANCE
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2 6 2 Basic Constitution of a Product 2.6.2 Basic Constitution of a Product
Item Type / Spec Function Explanation & Characteristics
1. Battery Li-Ion 564447 Cell, 1,350mAh
Charging Voltage : 4.2V (Typical)
1350mAh,5.0Mh/3.7V , L10
2. Charging Gender 5.4V Input , 4.6V Output DoCoMo TA Charging Gender
3. Battery Cover
4. Ear_Mic 3.5 Stereo Earphone, Carnal , Stereo Headset, Headset call,Ear Hook
5. USB Data Cable MicroUSB 5 pin USB data Communication
6. Micro SD Card 2GB Micro SD Memory User Data storage
7. Manual User Manual
* L-04C Uses NTT DoCoMo Standard Travel Adapter and Other Accessary. Which are not Provided.
2. PERFORMANCE
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2.7 Electrical Characteristics 2.7 Electrical Characteristics
It depends on a national (Japan and Pan-Europe, the Americas) electric characteristic standard
(a form approval standard).
2.7.1 System Outline
List Type / Spec.
1. Phone Type Full Touch Qwerty Slide
2. Size 116 x 58 x 15.3(mm)
3. Weight 149g
4. Battery 1,350mAh (Li-Ion)
5. MSM chipset MSM7227, RTR6285, PM7540
6 M 8Gb(N d Fl h) / 4Gb(SDRAM) 6. Memory 8Gb(Nand Flash) / 4Gb(SDRAM)
7. OS Android 2.2 (Froyo)
8. LCD Size 3.2 inch
Dot 320(RGB) X 480
Color 16,777,216 Colors
Display Type Transmissive,Normally Black, p y yp y
In-Plane Switching.
NTSC 70% (typ.)
Contrast Ratio 500 (typ.)
Pixel Pitch 0.141mm
9. Camera (3M) Type CMOS image sensor
R l ti (Eff ti ) 2072(H) X 1552(V) i l Resolution (Effective)
(Output)
2072(H) X 1552(V) pixels.
2048(H) X 1536(V) pixels.
Frame Rate Max 15 (QXGA) fps
Digital Zoom 3M,2M,1M, VGA, QVGA (X9)
Image Scaling Down 3M,2M,1M, VGA, QVGA
Moving Picture
10. Audio 1) Speaker 18X10 Speaker/Receiver Dual Mode
2) Mic SMD type
3) Headset 3.5 Stereo Headset and Mic.
2. PERFORMANCE
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Li t T / S
12. Bluetooth Effective Distance 10M
13. WLAN Spec. IEEE 802.11b/g
Throughput MAX 4Mbps
(Depends on SDIO Driver Perfornance)
11. Motor 10 Q-Coin Motor
List Type / Spec.
Effective Distance 50 ~ 200m (Depends on Environment)
14. GPS
2.7.2 Using Condition
) Ph U i E i
Item Spec. Unit
Using Voltage 3.7 (Typ.), 4.2 (Max.) V
Using Temp. -20 ~ + 60
Store Temp. -30 ~ + 85
1) Phone Using Environment
Humidity 0 ~ 80 %
Item Spec.
Input Voltage AC 100 ~ 240V,50~ 60Hz
2) TA Using Environment
2. PERFORMANCE
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2 7 3 wireless characteristic 2.7.3 wireless characteristic
wireless characteristic follows GSM Approval examination Specification(ETSI EN 300 607 11.10)
1) Electrical Characterisrics of WCDMA Transmission Part.
Item Spec. Min Typ. Max Unit
Maximum Output
Power
Power class 21.0 24 25.0 dBm/3.84MHz
Power
Frequency
Accuracy
0.1 ppm -200 - +200 Hz
Minimum Output
Power
- - - -50 dBm/3.84MHz
Occupied
Bandwidth
- - - 4.6 MHz
Adjacent Channel
Leakage Power
Ratio
f = r 5MHz - - -33 dBm/3.84MHz
f = r 10MHz - - -43 dBm/3.84MHz
Error Vector
Magnitude(EVM)
- - - 17 %
Peak Code Domain
Error
- - - 15 dBm/3.84MHz
Open Loop
Output Power
Ior =-106.7dBm/3.84MHz -46.7 - -28.7 dBm/3.84MHz
Ior =-65.7dBm/3.84MHz -23.0 - -5.0 dBm/3.84MHz
Ior =-25.0dBm/3.84MHz -0.0 - 14.0 dBm/3.84MHz
Transmit Off Power - - - -56 dBm/3.84MHz
f = 2.5~3.5MHz -35-15 * (f-2.5) dBc/30KHz
Spectrum Emission
Mask
f = 3.5~7.5MHz -35-1 * (f-3.5) dBc/1MHz
f = 7.5~8.5MHz -39 10 * (f-7.5) dBc/1MHz
f = 8.5~12.5MHz -49 dBc/1MHz
Transmit Spurious
9kHz ~ 150kHz -36 dBm
150kHz ~ 30MHz -36 dBm
Emission
30MHz ~ 1GHz -36 dBm
1GHz ~ 12.5GHz -30 dBm
2. PERFORMANCE
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2) Electrical Characterisrics of WCDMA Reception Part. 2) Electrical Characterisrics of WCDMA Reception Part.
Reference
Sensitivity Level
BER < 0.1% - - -106.7 dBm/3.84MHz
Maximum
Input Level
Pin = -25dBm - - 0.1 BER(%)
Adjacent Channel
Selectivity(ACS)
Jammer(Modulation)
= -52dBm/3.84MHz
f = r 5MHz
BER < 0.001%
- - -103 dBm/3.84MHz
In Band Blocking
Jammer(Modulation)
= -56dBm/3.84MHz
f = r 10MHz
BER < 0.001%
- - -103.7 dBm/3.84MHz
Jammer(Modulation) Jammer(Modulation)
= -44dBm/3.84MHz
f = r 15MHz
BER < 0.001%
- - -103.7 dBm/3.84MHz
Inter-modulation
Desensitization
Jammer1(CW)= -46dBm
Jammer2(Modulation)
= -46dBm/3.84MHz
f=r 10MHz
BER < 0.001%
- - -103.7 dBm/3.84MHz
Jammer1= -46dBm(CW) ( )
Jammer2(Modulation)
= -46dBm/3.84MHz
f=r 20MHz
BER < 0.001%
- - -103.7 dBm/3.84MHz
30kHz ~ 1GHz - - -57 dBm/30kHz
1GHz ~ 1.92GHz - - -47 dBm/1MHz
G G dB /
Spurious Emissions
1.92GHz ~ 1.98GHz - - -60 dBm/3.84MHz
1.98GHz ~ 2.11GHz - - -47 dBm/3.84MHz
2.11GHz ~ 2.17GHz - - -60 dBm/3.84MHz
2.17GHz ~ 12.75GHz - - -47 dBm/1MHz
2. PERFORMANCE
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3) Electrical Characterisrics of HSDPATransmission and ReceptionPart. 3) Electrical Characterisrics of HSDPA Transmission and ReceptionPart.
5.2.A Maximum
Output Power with
HS-DPCCH
1/15 d Ec/Ed d 12/15
13/15 d Ec/Ed d 15/8
15/7 d Ec/Ed d 15/0
21
20
19
23
22.5
22
25
25
25
dBm/3.84MHz
5.7A HS-DPCCH
MAX /
0dBm
Step 0 0 dBm+/- 1 dB dB
Step 1 Step 0 6 dB +/- 2.3 dB dB
T
r
a
n
s
m
i
s
s
i
o
n
5.9A Spectrum
Emission Mask with
HS-DPCCH
f = 2.5~3.5MHz -35-15 * (f-2.5) dBc/30KHz
f = 3.5~7.5MHz -35-1 * (f-3.5) dBc/1MHz
f = 7.5~8.5MHz -39 10 * (f-7.5) dBc/1MHz
f = 8.5~12.5MHz -49 dBc/1MHz
5.10A Adjacent
Channel Leakage
Power Ratio with HS-
DPCCH
f = r 5MHz - - -33 dBm/3.84MHz
f = r 10MHz - - -43 dBm/3.84MHz
5 13 1A Error Vector 5.13.1A Error Vector
Magnitude (EVM) with
HS-DPCCH
MAX Power
-20 dBm
- - 17.5 %
R
e
c
e
p
t
i
o
n
6.3A Maximum
Input Level for
HS-PDSCH Reception
Pin = -25dBm - - 10 BLER(%)
2. PERFORMANCE
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4) Electrical Characterisrics of GSMTransmission and Reception Part.
Item Spec.
Phase Error
Rms : 5
Peak : 20
Frequency Error
GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
4) Electrical Characterisrics of GSM Transmission and Reception Part.
EMC(Radiated Spurious Emission Disturbance) GSM/DCS : < -28dBm
Transmitter Output power and Burst Timing
GSM : 5dBm 33dBm 3dB
DCS/PCS : 0dBm 30dBm 3dB
Burst Timing <3.69us
Spectrum due to modulation out to less than
kH ff
200kHz : -36dBm
1800kHz offset
600kHz : -51dBm/-56dBm
Spectrum due to modulation out to larger than
1800kHz offset to the edge of the transmit
band
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
I d l i j i S h h l
800kHz, 1600kHz
Intermodulation rejection Speech channels
,
: -98dBm/-96dBm (2.439%)
AM Suppression
-GSM : -31dBm - DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance 0.5T
- Frequency Range : GSM(880~915MHz/925~960MHz), DCS(1710~1785MHz/1805~1880MHz)
PCS (1850~1910MHz/1830~1990MHz)
- Local Oscillation Frequency Range : 1688 ~ 1736 MHz
- IF : zero IF
- Rated MAX Power : 1995.3 mW(33dBm)
2. PERFORMANCE
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5) Electrical Characterisrics of Bluetooth Transmission 5) Electrical Characterisrics of Bluetooth Transmission
Output Power
DH5
PRBS9
Nominal Pwr -6 - +4 dBm
Peak Pwr - - +23 dBm
Power Density
DH5
@100kHz BW +20 dBm Power Density
PRBS9
@100kHz BW - +20 dBm
Frequency Range
DH5
PRBS9
-30dBm
@100kHz BW
2400 - 2483 MHz
Tx Output Spectrum
(20dB BW)
DH5
PRBS9
f =f
H
-f
L
- 1 MHz
Tx Output Spectrum
(Adj t O t t
DH5
@M-N = 2 - -20 dBm
(Adjacent Output
Power)
D 5
PRBS9
@M-N >= 3 - -40 dBm
Modulation Index
DH5
11110000
f1
AVG
140 - 175 kHz
DH5
10101010
f2
MAX
115 - kHz
f2
AVG
/f1
AVG
0.8 -
Initial Carrier Freq.
Tolerance
DH5
PRBS9
-75 - +75 kHz
Carrier Frequency Drift
DH1
10101010
Freq. Drift -25 - +25 kHz
Drift Rate -20 - +20 kHz/50us
DH3
Carrier Frequency Drift
10101010
DH5
10101010
Out of Band Spurious
Emission
DH1
PRBS9
@ 30MHz ~ 12.75GHz 20 dBc
Gray Items cannot be measured now.
2. PERFORMANCE
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6) Electrical Characterisrics of Bluetooth Reception Part 6) Electrical Characterisrics of Bluetooth Reception Part
Sensitivity
(Single Slot Packet)
DH1
PRBS9
BER @ 0.1% - -70 dBm
Sensitivity
(Multi Slot Packet)
DH5
PRBS9
BER @ 0.1% - -70 dBm
C/I Performance
DH1
Co-Channel
-60dBm@ BER0.1%
- 11
dB
C/I @1MHz
-60dBm@ BER 0.1%
- 0
C/I @2MHz
-60dBm@ BER 0.1%
- -30
C/I Performance
PRBS9
dB
C/I @3MHz
-67dBm@ BER0.1%
- -40
C/I @Image
-67dBm@ BER 0.1%
- -9
C/I @1MHz Image
-67dBm@ BER 0.1%
- -20
Blocking Performance
DH1
PRBS9
-10dBm @
30M ~2 GHz
- -67 dBm
-27dBm @
2 ~ 2.4 GHz
-27dBm @
2.5 ~ 3 GHz
-10dBm@ 10dBm @
3 ~ 12.75 GHz
Intermodulation Performance
DH1
PRBS9
f = +5MHz (CW)
f = +10MHz (BT)
BER @ 0.1%
- -64 dBm
f = -5MHz (CW)
f = -10MHz (BT)
BER @0 1%
- -64 dBm
BER @ 0.1%
Maximum Input Level
DH1
PRBS9
BER @ 0.1% -20 - dBm
Gray Items cannot be measured now.
2. PERFORMANCE
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8) Electrical Characterisrics of GPS Reception Part
Referred to Qualcomm A-GPS Specification
8) Electrical Characterisrics of GPS Reception Part
Item Spec.
Radiated C/No C/No 34dB
Calculated TIS -149dBm / Hz
p
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
9) Electrical Characteristics of WLAN 802.11b Transmission and Receptioin Part
Tx Power Level
20dBm under (Europe), 30dBm under (USA)
Frequency Tolerance within 25 PPM
Chip clock Frequency
Tolerance
within 25 PPM
Spectrum Mask -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz
-50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time
2us
Carrier Suppression
-15dB
Modulation Accuracy
(Peak EVM)
35%
Spurious Emissions < -36 dBm@ 30MHz ~ 1GHz
< -30 dBmabove @ 1GHz ~ 12.75GHz
< -47 dBm@ 1.8GHz ~ 1.9GHz
< -47 dBm@ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%
Rx Max input Sensitivity -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%
Rx Adjacent Channel
Rejection
35dB @FER 8%,
interference input signal -70dBm@fc25MHz(11Mbps)
2. PERFORMANCE
- 0 -
14
10) Electrical Characteristics of WLAN802.11g Transmission and Receptioin Part
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level
20dBm under (Europe), 30dBm under (USA)
10) Electrical Characteristics of WLAN 802.11g Transmission and Receptioin Part
Chip clock Frequency
Tolerance
within 25 PPM
Spectrum Mask
-20 @ 11MHz offset (9Mhz ~ 11MHz)
-28 @ 20MHz offset (11MHz ~ 20Mhz)
-40 @ 30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error
(rms EVM)
-5.6%
Spurious Emissions
< -36 dBm@ 30MHz ~ 1GHz
< -30 dBmabove @ 1GHz ~ 12.75GHz
< -47 dBm@ 1.8GHz ~ 1.9GHz
< -47 dBm@ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity
PER 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER 10%
PER 10%,
Rx Adjacent Channel
Rejection
ACR 16dB@6Mbps, ACR 15dB@9Mbps,
ACR 13dB@12Mbps, ACR 11dB@18Mbps,
ACR 8dB@24Mbps, ACR 4dB@36Mbps
ACR 0dB@48Mbps, ACR -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity
2. PERFORMANCE
- 1 -
15
2 7 4 Electrical Characteristics (continued) 2.7.4 Electrical Characteristics (continued)
1) Current Consumption
Item
Specification
WCDMA GSM
1. Sleep Mode Under 3 mA Under 3 mA p
2. Sleep : Ear jack conencted Under 3.5 mA Under 3.5 mA
3. Idle Mode Under 160 mA Under 160 mA
4. Standby (Sleep & Idle Avg.) Under 5.5mA @ DRX 7 Under 5.5mA @ P.P 5
5. Talk Mode
Tx 23dBm (LCD OFF):
Under 600 mA @Avg
EGSM LVL 5(LCD OFF)
Under 350 mA @Avg
RF Current Consumptions are measured in Backlight Off state.
Under 600 mA @ Avg Under 350 mA @ Avg
6. No SVC Mode Under 160 mA Under 160 mA
7. Power Off Mode Under 450 uA Under 450 uA
2) RSSI indicate (traffic)
Antenna BAR
Specification
unit
WCDMA GSM(EGSM) GSM(DCS/PCS)
43 -892 -912 -912
32 -952 -992 -992
RSSI is measured 10 seconds after Power change. (For RSSI stability)
In WCDMA case, There is not display No SVC in traffic.
dBm 21 -1022 -1042 -1032
10 -1052 -1062 -1052
0No SVC -113 2 -1172 -1172
In WCDMA case, There is not display No SVC in traffic.
2. PERFORMANCE
- -
16
3) Battery Discharging Graph : Referredto Battery Log File 3) Battery Discharging Graph : Referred to Battery Log File
TOCAD (Sanyo Cell 1350mAh), 300mA Load current
Battery
Capacity
Battery Voltage
90% 4.02V r 0.05(3.97V~4.07V)
60% 3.76V r 0.05(3.71V~3.81V)
30% 3.67V r 0.05(3.62V~3.72V)
Battery Icon Battery Capacity Bar
90~100 6
70~89 5
50~69 4
30% 3.67V r 0.05(3.62V 3.72V)
10% 3.58V r 0.05(3.53V~3.63V)
OFF Under 3.30V
30~49 3
15~29 2
5~14 1
0~4 0
2. PERFORMANCE
- 3 -
17
4) Battery Usage Time ) y g
Specification Test Condition
Standby Time
& Current
(WCDMA)
Over 200 hrs
Under 6mA
DRX 7 @ BATT Capacity : 1350mA/h
Standby Time
& C t
Over 200 hrs
EGSMP2 BATT C i 1350 A/h
& Current
(GSM)
Under 6mA
EGSM P2 @ BATT Capacity : 1350mA/h
Voice Call
Time
(WCDMA)
Over 250 min. 10dBm @ BATT Capacity :1350mA/h (AMR Mode)
Voice Call
Time
Over 240 min. EGSM, LV5 @ BATT Capacity : 1350mA/h
5) MP3 Usage Time
(GSM)
Charging
Time
Under 240 min. Phone off
Speaker Over 6 hrs
Reference MP3 : Life is good.mp3
-92dBm, Half Rate, Backlight Off, Volume Max.
Ear Phone Over 6 Hrs
6) Ringtone SPL
Over 60% Over 60 dBspl 1 m distance
100% Over 55 dBspl 1 m distance
2. PERFORMANCE
- 4 -
18
2.7.5 examination measurement method and a rule 2.7.5 examination measurement method and a rule
Voltage of mobile phone that is applied at the time of each measurement (contact terminal of battery) is Typ.
DC 4.0Volt, Min. DC 3.4Volt.
1. Electric characteristic measurement method : Follow standard examination method of product
performance examination rules.
2. Reliability examination method: Follow standard examination method of reliability examination rules. y y
3. U/I verification rules: Follow standard examination method of QE U/I verification rules.
4. Field Test rules: Follow standard examination method of QE Field Test.
5. Examination method and SPEC. definition according to new functions: New functions for S/W is measured
by method mentioned in the manual.
3. TECHNICAL BRIEF
- 5 -
1. TECHNICAL BRIEF
3.1 General Description
The L-04C supports UMTS-800, UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS. All
receivers and the UMTS transmitter use the radioOne
1
Zero-IF architecture to eliminate intermediate frequencies,
directly converting signals between RF and baseband.
The tri-band GSM transmitters use a baseband-to-IF up conversion followed by an offset phase-locked loop that
translates the GMSK-modulated or 8-PSK-modulated signal to RF.
G
Fig 1.1-1 Block diagram of RF part
A generic, high-level functional block diagram of L-04C is shown in Figure 1-1. One antenna collects base station
forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit
paths through a FEM(Front End Module) (plus two duplexers for UMTS high-band and low-band operations).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the
signal directly from RF-to-baseband using radioOne ZIF techniques.
GGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGGG
1
QUALCOMMs branded chipset that implements a Zero-IF radio architecture.
G
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
- 6 -
The high-band UMTS receive path and low-band path are accommodated in the RTR6285 IC.
The RFIC.s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx
baseband outputs share the same inputs to the MSM IC .
For the transmit chains, the RTR6285 IC directly translates the Tx baseband signals (from the MSM device) to an
RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6285 IC outputs deliver
fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. The
high- and low-band UMTS RF transmit signals emerge from the RTR6285 transceiver.
In the GSM receive path, the received RF signals are applied through their band-pass filters and down-converted
directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with the UMTS receiver
and routed to the MSM IC for further signal processing. .
The GSM transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into
phase and amplitude components to produce an open-loop Polar topology:
1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a
constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier
from a DAC within the MSM
L-04C power supply voltages are managed and regulated by the PM7540 Power Management IC. This versatile
device integrates all wireless handset power management, general housekeeping, and user interface support
functions into a single mixed signal IC. It monitors and controls the external power source and coordinates
battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.
The devices general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-
chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as
temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and
higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal
presence are monitored to protect against detrimental conditions.
3. TECHNICAL BRIEF
- 7 -
3.2 GSM Mode
3.2.1 GSM Receiver
The Dual-mode L-04Cs receiver functions are split between the three RFICs as follows:
UMTS-800, UMTS-2100, GSM-900, DCS-1800, and PCS-1900 modes use the RTR6285 IC only.
Each mode has independent front-end circuits and down-converters, but they share common baseband
circuits (with only one mode active at a time). All receiver control functions are beginning with SSBI-
controlled parameters.
RF Front end consists of antenna, Front End Module(D5017) which includes nine path antenna SW and quad
band GSM PAM(GSM850, GSM900, DCS, and PCS). The Front End Module allows multiple operating bands and
modes to share the same antenna.
In L-04C, a common antenna connects to one of eight paths:
1) UMTS-800 Rx/Tx, 2) UMTS-2100 Rx/Tx, 3) GSM-900 Rx, 4) GSM-900 Tx,
5) DCS-1800 Rx, 6) PCS-1900 Rx, 7) DCS-1800 TX, 8) PCS-1900 TX.
UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a
duplexer that separates receive and transmit signals.
GSM850/GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active
at any time and a frequency duplexer is not required.

Table 1.2-1 Antenna Switch Module Control logic

3. TECHNICAL BRIEF
- 8 -
The GSM900, DCS, and PCS receiver inputs of RTR6285 are connected directly to the transceiver front-end
circuits(filters and antenna switch module). GSM900, DCS, and PCS receiver inputs use differential configurations
to improve common-mode rejection and second-order non-linearity performance.
The balance between the complementary signals is critical and must be maintained from the RF filter outputs all
the way into the IC pins. The RTR6285 input stages include MSM-controlled gain adjustments that maximize
receiver dynamic range.
Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one
time), switches are used to separate Rx and Tx signals in place of frequency duplexers this is accomplished in
the switch module.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters.
The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having
passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC
offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing.
3. TECHNICAL BRIEF
- 9 -
Fig 1.2-1 RTR6285 RX feature
3. TECHNICAL BRIEF
- 30 -
3.2.2 GSM Transmitter
The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1)include on-chip output matching inductors.
50ohm output impedance is achieved by adding a series capacitor at the output pins.
The capacitor value may be optimized for specific applictions and PCB characteristics based on pass-band
symmetry about the band center frequency, the suggested starting value is shown in Figure1.2.2
Figure 1.2-2 GSM Transmitter matching
The RTR6285 IC is able to support GSM 850/1900 and GSM 1800/1900 mode transmitting.
This design guideline shows a quad-band GSM application.
Both high-band and low band outputs are followed by resistive pads to ensure that the load
Presented to the outputs remains close to 50ohm. The low-band GSM. Tx sSAW can be eliminated because ETSI
spec requires mid channels to pass RX Band noise only.
G
G
3. TECHNICAL BRIEF
- 31 -
3.3 UMTS Mode
3.3.1 Receiver
The UMTS duplexer receiver outputs are routed to LNA circuits within the RTR6285 device.
The RTR6285/RTR6285 receive paths include four WCDMA Rx signal paths(two single-ended and two differential)
for one UMTS low-band and three UMTS high-bands.
WCDMA_100_RX
WCDMA_800_RX
Figure 1.3-1 RTR6285 IC functional block diagram
3. TECHNICAL BRIEF
- 3 -
The two RTR6285/RTR6285 UMTS single-ended inputs accept its UMTS 2100/1900/1800/1700 input signal from
the handset RF front-end filters. The UMTS Rx inputs are provided with onchip LNAs that amplify the signal
before second-stage filters that provide differential signal to a shared downconverter.
This second-stage input is configured differentially to optimize secondorder inter-modulation and common
mode rejection performance. The gain of the UMTS front-end amplifier and the UMTS second-stage differential
amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers.
The second-stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-to-baseband downconverters. The
downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband
characteristics suitable for UMTS Rx processing. These filter circuits allow DC-offset corrections, and their
differential outputs are buffered to interface with the MSM IC.
The RTR6285/RTR6285 UMTS differential input paths stay on-chip; off-chip inter-stage filtering is not required.
Other than this, the architecture is similar to the single-ended inputs. The UMTS duplexer receiver output is
routed to LNA circuits within the RTR6285 device.
UMTS LNA circuits(one for low-band UMTS and one for high-band UMTS path) separated from all other receive
functions contained within the RTR6285 IC to improve mixer LO to RF isolation- a critical parameter in the ZIF
architecture. Isolation is further improved using high-reverse isolation circuits in the LNA designs
3. TECHNICAL BRIEF
- 33 -
3.3.2 Transmitter
The RTR6285/RTR6285 transmit includes four transmit signal paths with five outputs (three high bands and two
low bands) supporting multi-band and multi-mode GSM/GPRS/EDGE polar transmit and WCDMA/HSDPA
transmit architectures. The transmit path begins with differential baseband signals (I and Q) from the MSM
device.
These analog input signals are buffered, filtered by low-pass filters, amplified, and then applied to the
quadrature upconverter mixers. The upconverter outputs are amplified by multiple variable gain stages that
provide transmit AGC control.
SSBI control from the MSM IC is used to generate the gain range control signal. The AGC outputs are then
applied to the high-band and low-output driver amplifiers; the specified driver amplifier output level is achieved
while supporting the GSM/EDGE and UMTS transmit standards requirements for GSM ORFS, carrier and image
suppression, WCDMA ACLR, spurious emissions, Rx-band noise, and so forth. Again, the upconverter LO signals
are generated by circuits described in Section 1.2.3.
These upconverters translate the polar GMSK-modulated or 8-PSK modulated baseband PM signals and/or
WCDMA baseband signals directly to the RF signals, which are filtered and fed into the GSM/EDGE polar PA
and/or WCDMA PA. The WCDMA TX power is coupled back to the RTR6285/RTR6285 internal power detector
input pin, PWD_DET_IN, using a coupler for power measurement.
The low-band drive amplifiers are used to transmit the polar phase modulated (PM) signal for GSM/EDGE
850/900 while the high-band driver amplifiers are for the GSM/EDGE 1800/1900.
By using the radioOne architecture, the same high-band transmit path can be used to transmit the UMTS
2100/1900/1800/1700 signal, and the low-band transmit path can be used to transmit the UMTS 800/850/900
signal, depending on the application.
The envelope path is used in polar mode of operation for GSM and EDGE. Input from the MSM IC, the baseband
envelope (AM) signal, is applied directly to the ramp control pin of the GSM/EDGE polar PA to modulate the
power supply of the PA so that the polar modulated GSM/EDGE signal in the MSM can be recovered and
transmitted.

3. TECHNICAL BRIEF
- 34 -
WCDMA_100_TX
WCDMA_800_TX
Figure 1.3-2 RTR6285 IC functional block diagram
3. TECHNICAL BRIEF
- 35 -
3.4 LO Phase-locked Loop
The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to
yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS upconverters and
downconverters; with the help of these LO generation and distribution circuits, true zero-IF architecture is
employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF-to-
baseband and from baseband-to-RF.
Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the
RTR6285/RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS operation. The first
synthesizer (PLL1) in the RTR6285/6280 creates the transceiver LOs that support the UMTS transmitter, and all
four GSM band receivers and transmitters including: GSM 850, GSM 900, GSM 1800, and GSM 1900.
The second synthesizer (PLL2) in the RTR6285/RTR6285 IC provides the LO for the UMTS primary receiver. For the
RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The third
synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input signal is
required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked.
The RTR6285/RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip
loop filter-series capacitors, which significantly reduces off-chip component requirement.
With the integrated fractional-N PLL synthesizers, the RTR6285/RTR6285 ICs have the advantage of more flexible
loop bandwidth control, fast lock time, and low-integrated phase error.

RTR6285 PLLs functional block diagram
GSM RX/TX / WCDMA TX
WCDMA RX
GPS RX
3. TECHNICAL BRIEF
- 36 -
3.5 Off-chip RF Components
3.5.1 Front End module (FL1001 : D5017)
Product Description
D5017 is a transmit and receive Front End Module (FEM) designed in a very low profile (1.1 mm), compact form
factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation .
RF input and output ports of the D5017 are internally matched to a 50 load to reduce the number of external
components for a quad-band design. Band selection and control of transmit and receive RF signal flows are
performed by use of four external control pads.
See Figure 1.5.1 shown on overleaf. Mode of operation Tx, Rx, Band (GSM850, GSM900, DCS, PCS, and UMTS) is
controlled with CTRL 1~4 inputs (figure 1.5.2)
Fig 1.5-1 D5017 block diagram
3. TECHNICAL BRIEF
- 37 -

Absolute Maximum Ratings
1

D5017 Control Characteristics

Fiure 1.5.2 D5017 control table

3. TECHNICAL BRIEF
- 38 -

3.5.2 UMTS 2100 duplexer ; (FL1003 : SAYFP1G95AA0B00)

3. TECHNICAL BRIEF
- 39 -
3. TECHNICAL BRIEF
- 40 -
3.5.3 UMTS 800 duplexer (FL1004 : SAYFP836MCA0F00R00)
3. TECHNICAL BRIEF
- 41 -
3. TECHNICAL BRIEF
- 4 -
3.5.4 UMTS 2100 Power Amplifier modules (U1003 : SKY77701)
SKY77701 Description
The SKY77701 Power Amplifier Module(PAM) is a fully matched 10-pad surface mount module developed for
WCDMA applications. This small and efficient module packs full 1920-1980Mhz bandwith coverage into a single
compact packae.
Because of high efficiencies attaited throught the entire power range, the SKY77701 delivers unsurpassed talk-
time advantages. A directional coupler is intergrated into the module thus eliminating the need for any any
external coupler.
The SKY77701 PAM is manufactured with Skyworks InGaP GaAs HBT BiFET process that provides for all positive
voltage DC supply operation while maintaining high efficiency and good linearity.
Primary bias to the SKY77701 is supplied directly from any three-cell Ni-Cd, a single-cell li-ion,or other suitable
battery with an output in the 3.2 to 4.2Volt range. Power down is accomplished by setting the voltage on
VENABLE to zero volts.
SKY77701 Functional block diagram
3. Technical Brief
- 43 -
SKY77701 Pin names and configuration(top view)
SKY77701 Absolute Electrical ratings
VCC1
RF_IN
VMODE_1
VMODE_0
VEN
VCC2
RF_OUT
CPL_IN
GND
CPL_OUT
GROUND PAD
1
2
3
4
5
10
9
8
7
6
SKY77701 Pin names and configuration(top view)
SKY77701 Absolute Electrical ratings
3. TECHNICAL BRIEF
- 44 -
SKY77701 Recommecded operation conditions
SKY77701 Mode of Operation
3. TECHNICAL BRIEF
- 45 -
3.5.5 UMTS 800 Power Amplifier modules (U1004: SKY77704)
SKY77704Description
The SKY77704Power Amplifier Module(PAM) is a fully matched 10-pad surface mount module developed for
WCDMA applications. This small and efficient module packs full 824-849Mhz bandwith coverage into a single
compact packae. Because of high efficiencies attaited throught the entire power range, the SKY77704 delivers
unsurpassed talk-time advantages.
A directional coupler is intergrated into the module thus eliminating the need for any any external coupler.The
SKY77704 PAM is manufactured with Skyworks InGaP GaAs HBT BiFET process that provides for all positive
voltage DC supply operation while maintaining high efficiency and good linearity.
Primary bias to the SKY77704 is supplied directly from any three-cell Ni-Cd, a single-cell li-ion,or other suitable
battery with an output in the 3.2 to 4.2Volt range. Power down is accomplished by setting the voltage on
VENABLE to zero volts.
SKY77704 Block Diagram

3. TECHNICAL BRIEF
- 46 -

SKY77704 Pin names and Configuration(top view)
SKY77704 Absolute Maximum rating
3. TECHNICAL BRIEF
- 47 -
SKY77704 Recommended Operation Conditions
SKY77704 Mode of Operation
3. TECHNICAL BRIEF
- 48 -
SKY77704 Electrical Specifications for Nominal operating conditions
3. TECHNICAL BRIEF
- 49 -
3.5.6 UMTS Rx SAW filter (FL1002: SAFEB2G14FA0F00)
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses
before the LNA. The most important parameters of this component include:
Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of
particular concern to beyond three times the highest passband frequency.
Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-
modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band
leakage.
Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver
significant power levels to the receiver input.
Phase and amplitude balance - the ZIF architecture requires well-balanced differential inputs to the
RTR6285/80. This is accomplished by the RF filters which take a single-ended outputs from the ICs and provide
differential outputs having nominal 180 phase separation. Phase and/or amplitude imbalance causes
degraded common-mode rejection and second-order nonlinearity, so their requirements are specified jointly.
3. TECHNICAL BRIEF
- 50 -
Table 1.5-6 SAFEB2G14FA0F00 Electrical specification.

3. TECHNICAL BRIEF
- 51 -
3.5.7 VCTCXO (X300 : KT-3225L-19.2MHz)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference
frequency for all RFIC synthesizers as well as clock generation functions within the MSM7227 IC.
The oscillator frequency is controlled by the MSM7227s TRK_LO_ADJ pulse density modulated signal in the
same manner as the transmit gain control.
The filtered PDM signal results in an analog control signal into the VCTCXO tuning port whose voltage is directly
proportional to the density of the digital bit stream. The MSM device varies the pulse density to change the
analog control voltage that sets the oscillator frequency all within a feedback control loop that minimizes
handset frequency drift relative to the network.

3.5.8 UMTS 2100 TX SAW Filter (FL1004 : SAFEB1G95KA0F00)

3. TECHNICAL BRIEF
- 5 -
3.5.9 UMTS 800 TX SAW Filter (FL1005 : SAFEB836MAL0F00)

3. TECHNICAL BRIEF
- 53 -
3. Technical Brief
3.6 Digital Baseband(DBB/MSM7227)
3.6.1 General Description
L-04C supports UMTS-800, UMTS-2100, GSM-900, GSM -1800, GSM-1900. All receivers and the transmitter use
the radio One Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between
RF and baseband.
A generic, high-level functional block diagram of L-04C is shown in Figure 1. One antenna collects base station g , g g g
forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit
paths through a SPDT( Single Port Double Throw ).
RTR6285 receive paths include four GSM/EDGE Rx signal paths that support
GSM 900, 1800, and 1900 bands, and four WCDMA Rx signal paths(two single-ended and two differential)
for one UMTS low-band and three UMTS high-bands.
RTR6285 transmit includes four transmit signal paths with five outputs (three high bands and two low bands)
supporting multi-band and multi-mode GSM/GPRS/EDGE polar transmit and WCDMA/HSDPA transmit
architectures.
L-04C power is managed and regulated by the PM7540 Power Management IC.
This versatile device integrates all wireless handset power management, general housekeeping, and user
interface support functions into a single mixed signal IC.
It monitors and controls the external power source and coordinates battery recharging while maintaining the
handset supply voltages using low dropout, programmable regulators.
The devices general housekeeping functions include an ADC and analog multiplexer circuit for monitoring
on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as
temperature and battery ID.
Various oscillator, clock, and counter circuits support IC and higher-level handset functions.
Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect
against detrimental conditions.
3. TECHNICAL BRIEF
- 54 -
A. Features(MSM7227)
The basic MSM7227 system solution consists of the MSM7227, RTR6285, and PM7540 ICs, plus AMSS
system software with the SURF7227 platform available for development.
General features include:
WCDMA Rel 99 plus HSDPA and HSUPA
GSM/GPRS/EDGE
High-performance ARM1136JF-S application processor at up to 600 MHz; QDSP5000 at 320 MHz
High-performance ARM926EJ-S modem processor at up to 400 MHz; QDSP4000 at 122.88 MHz
Java hardware acceleration for faster Java-based games and other applets
Support for Bluetooth 2.1 EDR via an external Bluetooth System-on-Chip (SoC)
High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnection cost
between the MSM device and the LCD panel
R i di it t f WCDMA d th b idi i d it d d t th h t Receive diversity support for WCDMA mode, thereby providing improved capacity and data throughput
USB 2.0 compliant high-speed USB core with limited OTG capabilities
Integrated high-speed USB PHY
Integrated wideband stereo codec for digital audio applications
Direct interface to digital camera module with video front-end (VFE) image processing
GPS position location capabilities
Vocoder s pport (GSM HR FR EFR AMR and AMR WB/+) Vocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)
Advanced 12 12 1.05 mm, 0.4 mm pitch, 560 NSP
3. TECHNICAL BRIEF
- 55 -
Figure. MSM7227 functionl Block Diagram in typical application
3. TECHNICAL BRIEF
- 56 -
3.7 Modem system / subsystem
3. Technical Brief
The modem subsystem includes all blocks that provide modem functionality directly (such as airlink
modulation and demodulation, searching, etc) plus supporting functions (such as the modem DSP,
modem AHB bus, sleep controller, interrupt controller, etc):
An ARM926EJ-S (ARM9) as the main modem processor.
A bridge to the peripheral bus that connects the modem subsystem to functions like the crypto-engine,
keypad, UART, and EBI2.
Th AHB t AXI b id th t id t hi h d i EBI1 ll th ti li ti The AHB-to-AXI bridge that provides access to high-speed memory via EBI1 as well as the entire applications
subsystem.
A modem DSP (mDSP) that controls modem hardware blocks and assists with symbol-level processing of
physical layer traffic. All modem functions require mDSP support to operate.
It has a limited amount of processing power and program/data storage; it must meet the sum of all modem
MIPS and memory requirements (plus some overhead) for concurrent operation.
A 64 kB secure boot ROM containing the primary boot loader for the ARM9 processor.
An internal RAM (IRAM) used for inter-processor communications between the modem and applications
processors. Its top eight word locations are vectors to the modem processor exception handlers.
A security mode control (SMC) block
Electrical fuses that are used to disable specific functionality (such as ARM debug modes
that are useful for testing but pose a potential security breach during normal operation).
Memory protection that physically prevents certain masters on the modemsubsystembus fromaccessing Memory protection that physically prevents certain masters on the modem subsystem bus from accessing
certain memory regions. This memory protection prevents modem DM access to either IRAM or the SMC; it
only allows access via the modem ARM in its supervisor mode.
The SMC block also contains other security features, such as a device ID to uniquely identify a chip.
An always-on modem power manager (MPM) block that controls power collapsing of the modem subsystem.
3. TECHNICAL BRIEF
- 57 -
3. Technical Brief
Bus interfaces provide the necessary connections to other functions:
The high-speed AXI bus provides access to the applications subsystem.
The modem processor and other masters can access the application subsystem, but masters within the p pp y
application subsystem (such as the application processor) cannot access the modem subsystem for
security reasons.
The local AHB bus is connected to the peripheral subsystem through a bridge.
The modem processor shares access to this subsystem with the applications processor.
Peripherals include standard interfaces (such as USB, UART, and UIM) for external communications, and
can access MSM-internal peripheral functions as well.
The local AHB bus also bridges to asynchronous buses to communicate with the modemhardware blocks The local AHB bus also bridges to asynchronous buses to communicate with the modem hardware blocks.
The local AHB bus is a slow-speed request/acknowledge-based bus that is used to configure the modem
cores.
The DM host interface is used to program the data mover through the modem processor. Since these data
paths have moderately high data rates (up to 3.1 Mbit/sec plus overhead), they have a direct connection to
the AHB instead of going through an asynchronous bus.
Figure. MSM7227 modem subystem functional block diagram
3. TECHNICAL BRIEF
- 58 -
3.7.1 ARM9 modem processor
3. Technical Brief
The ARM9 is a single-clock, high-performance, Java-enabled, synthesizable core:
Harvard architecture, 16 kB instruction and 16 kB data caches; each 4-way associative supported on the
modem subsystem
ARM and THUMB states are supported
Jazelle ARM9 core (Java support)
Embedded trace macrocell (ETM) support pp
DC power-saving techniques
Operation at a target frequency of 400 MHz
Key functions and modes are discussed in the following subsections.
3.7.2 Reset and pause
The modem microprocessor includes reset and pause functions that are responsible for:
Generating synchronous reset signals for the modem processor as well as the other bus architecture
peripherals.
Providing status information concerning the source of the last reset (pin or watchdog generated).
Controlling the clock to the ARM microprocessor, thereby providing reset or pause mechanisms for the
modem processor.
Allowing software to control this pause mechanism to halt the ARM for a specified duration.
3. TECHNICAL BRIEF
- 59 -
3.7.3 Watchdog timer
W t hd ti h t i ti
3. Technical Brief
Watchdog timer characteristics:
14-bit counter running off the sleep controller clock regime
Enables the handset to recover from unexpected hardware or software anomalies
If the microprocessor fails to periodically reset the watchdog timer the timer expires and the handset is reset
Disabled and/or reset by grounding the WDOG_EN pin or by asserting the RESIN_N pin Hardware disabling
example: the ARM processor enters debug mode (indicated by the DBGACK pin of the processor
i i i f l hi h) transitioning from low to high)
Enabled by leaving the WDOG_EN pin unconnected (it has an internal pull-up) or by connecting it to VDD If
temporarily disabled, it can be re-enabled by applying a system reset that clears the state of the internal
signal wdog_disable When enabled, the watchdog circuit pulses the WATCHDOG_EXPIRED signal whenever
its timer has expired. In NATIVE mode this signal is combined with the RESIN_N pin to generate the
RESOUT_N signals and the MSM device's internal reset.
3.7.4 Sleep mode and watchdog freeze
The modem processor cannot reset the watchdog timer while in its sleep mode, but the watchdog can be
frozen before entering sleep mode.
To enable the freeze, the microprocessor writes a 1-0 sequence to the WDOG_FREEZE register.
3.7.5 Non-sleep mode p
In non-sleep mode the processor must reset the watchdog timer at least once every 390 ms. If not, the
watchdog timer expires and asserts an internal RESIN_N signal to the system.
The WDOG_EXPIRED signal lasts between 53 and 106 ms (97.5 ms typical). To reset the watchdog timer,
the microprocessor must write a 1-0-1 sequence to the WATCH_DOG bit of the SLEEP_CTL register.
3. TECHNICAL BRIEF
- 60 -
3.7.6 Modem DSP (mDSP)
3. Technical Brief
The modem subsystem includes the modem DSP (mDSP) and supporting blocks like the data mover, a master
that is connected to the AXI bus for access to internal and external memory. A QDSP4000 running at up to
128 MHz is used.
3.7.7 Applications system
The MSM7227 applications system consists of the following subsystems and major functional blocks.
The ARM1136JF-S (ARM11) applications processor subsystem with supporting watchdog, clock, and timers
The applications subsystem that includes key apps functions (the aDSP and data mover) plus several
multimedia and connectivity functions
The peripheral subsystem
Peripheral functions like crypto-engine, SDIOs, EBI2, UART/UIM, I2C, etc. Most of these functions are
discussed within the connectivity chapter. y p
A bridge that connects the modem subsystem, applications processor subsystem, aDSP, applications data
mover, and MDP to the peripheral functions.
The peripheral buses
AXI wrappers and AXI bus that connect the applications system to the modem system The applications
system includes six AXI bus masters: 1) aDSP external memory master, 2) data mover, 3) HS USB, 4) MDDI, 5)
VFE, and 6) MDP. The AXI bus is discussed in Section 3.3.1, but a few comments about the applications
system masters are highlighted here: y g g
The data mover is a general-purpose DMA engine that supports up to 16 channels. Under control of the
modem ARM, application ARM, or aDSP, it handles memory-to-memory data transfers as well as aDSP,
crypto engine, NAND controller, SD controller, and USB RLP data transfers.
The data mover is used for byte alignment/packing of USB RLP data and putting it back into system
memory, and then the USB DMA master transfers the byte-aligned data from system memory. The USB AHB
slave interface is on the peripheral bus and is used for configuring the USB registers.
The mobile display processor is a hardware accelerator responsible for transferring an updated image from
system memory to an LCD module through the MDDI host.
The video front-end receives camera data directly from the parallel camera interface. It communicates with
aDSP through an xDMA channel and has its own AXI bus master to access system memory.
3. TECHNICAL BRIEF
- 61 -
3. Technical Brief
Memory
D l b t th hi h d b t (EBI1) f l d d Dual-memory buses separate the high-speed memory subsystem (EBI1) from low-speed memory and
peripheral devices (EBI2).
The example application supports 200 MHz DDR SDRAM memory on EBI1, and adds NAND memory and the
UBM subsystem via EBI2 (either 1.8 or 2.6 V devices).
Other EBI2 device options include mux OneNAND flash memory and LCD support. EBI2 memory is used
for system boot .
Air interfaces
The MSM7227 device supports WCDMA (Rel 99, HSDPA, and HSUPA), and GSM (Rel 99, GPRS, and EDGE).
These enable rich wireless multimedia services, such as high-speed upload of multimedia files and
attachments, interactive gaming, and a variety of IP-based services such as voice over internet protocol
(VoIP).
Real-time conversation services such as push-to-talk, video telephony, and instant multimedia (an
extension of push-to-talk that combines immediate voice with simultaneous delivery of video and pictures)
are also supported.
Very high peak data rates are supported: 7.2 Mbps on the downlink and 5.76 Mbps on the uplink using
HSDPA/HSUPA.
Such high data rates enable network operators to provide an even broader range of wireless multimedia
and other data services for consumers and enterprise customers. HSDPA/HSUPA are optimized for packet
data service and provide some of the lowest costs per bit when compared with other wireless wide area data service and provide some of the lowest costs per bit when compared with other wireless wide area
network (WWAN) technologies.
The MSM7227 solution integrates powerful application processors into the Qualcomm market-proven
wireless modem, offering increased processing capacity combined with lower power consumption.
With the MSM7227 chipset solution, handset manufacturers can design sleek, converged consumer wireless
devices that boast the industrys most advanced image quality and resolution to provide enhanced 3D
animation, gaming, streaming video, videoconferencing, broadcast reception, and more.
Multimedia
The MSM7227 IC enables Enhanced Platform products that leverage the convenience of consumer
electronics to support a wide array of multimedia features.
Camera interface and video front-end
Expanded image processing capabilities include a direct interface for digital camera modules with video Expanded image-processing capabilities include a direct interface for digital camera modules with video
front-end image processing. The high-quality digital-camera processing supports CCD or CMOS image
sensors up to 8 megapixels.
3. TECHNICAL BRIEF
- 6 -
3. Technical Brief
Display support
Di l i l d hi h d bil di l di i l i f (MDDI) f i i b Display support includes a high-speed mobile display digital interface (MDDI) for communications between
the MSM and display devices and/or a camera.
The third-generation mobile display processor (MDP3) is a hardware accelerator that: 1) improves processing
speeds; 2) has a more flexible architecture; and 3) expands compatibility to include the RGB interface relative
to previous generations. The embedded LCD controller is also used to support the RGB interface.
Audio codec
The integrated wideband stereo codec supports digital audio applications with several input/output
combinations:
Left and right LINE inputs, two MIC inputs, and one auxiliary input Headphone, earpiece, LINE, and auxiliary
outputs Key audio features include: external vocoder support; internal vocoder that supports 13 kbps
PureVoice; PureVoice VR voice recognition; acoustic echo cancellation; PureVoice Audio AGC; standard
MIDI with 16 voices; and 128-tone CMX (text, picture, and MIDI streaming).
Connectivity
In addition to the basic handset-control interfaces like the keypad and touch screen, the MSM7227 IC supports
a variety of consumer electronics with its connectivity ports:
High-speed universal serial bus (HS-USB) with built-in PHY
USB universal integrated circuit card (UICC) USB universal integrated circuit card (UICC)
Four universal asynchronous receiver transmitter (UART) serial ports
Two data mover (DM) high-speed UARTs (4 Mbps)
Two user identity module (UIM) controllers; 1.8 and 3.0 V options
Four integrated 4-bit secure digital (SD) controllers for SD/mini-SD cards and SDIO; two can be combined to
form one 8-bit SDIO interface
Transport stream interface (TSIF) for reception of digital mobile broadcast signals, including the Qualcomm
MediaFLO technology, DVB-H, ISDB-T, T-DMB, and S-DMB LCD controller for RGB interface gy
AUX_PCM for Bluetooth, stereo ADC, and stereo DAC support
Inter-integrated circuit (I2C) interface for peripheral devices Various combinations of these connectivity
ports are used to support wireless connectivity systems, including:
Bluetooth (BT 2.1 EDR) requires an external Bluetooth system-on-chip IC, (for example, the Qualcomm
BTS4025 device)
802.11 wireless local area network (WLAN) requires an external system-on-chip (SoC) Universal
Broadcast Modem (UBM) device requires an external Mobile Broadcast Platform IC, either the Qualcomm
MBP1600 or the MBP1610 device
3. TECHNICAL BRIEF
- 63 -
RF transceivers
T RFIC d h k h d i li k
3. Technical Brief
Two RFICs are used to connect to the networks over the supported airlinks:
The RTR6285 RF transceiver IC supports UMTS and GSM reception and transmission over the following
operating bands:
Low band UMTS paths support UMTS-800, UMTS-850, and UMTS-900 High band UMTS paths support
UMTS-1700, UMTS-1800, UMTS-1900, UMTS-2100, and UMTS-AW Low band GSM paths support GSM-850 and
GSM-900 High band GSM paths support GSM-1800 and GSM-1900 The RTR6285 RFIC includes primary and
secondary receiver paths, thereby enabling advanced techniques such as Mobile Receive Diversity (MRD).
Additional RFIC details are available in their document sets (80-VD861-x for the RTR6285 IC).
Power management
The MSM7227 chipset is powered by a Qualcomm powerOne series PM7540 power management IC.
The power source is selected from either the battery, external charger, adaptor, or USB device, and then the IC
generates all of the regulated voltages needed to power the handset electronics.
The main battery and backup coin-cell voltages are monitored, and charging is conducted as needed.
In addition to these basic power functions, the PMIC also provides:
Housekeeping functions
Analog multiplexer that allows monitoring of IC-level and handset-level sensors System clocks, including the
MSM ICs 32 kHz sleep clock and 19.2 MHz operating clock Real-time clock and associated alarms.
- User interfaces
- Current drivers for keypad and LCD backlights, LEDs, and camera flash
- Vibration driver for silent incoming call alerts
- Two-channel speaker driver for far-field speakers
- Video amplifier for camcorder or slide presentations
IC l l i f - IC-level interfaces
- Monitoring of triggering events and coordination of the power-on and power-off sequences
Software features
Qualcomm provides a complete software suite that extends handset capabilities and expedites product
development.
3. TECHNICAL BRIEF
- 64 -
Advance Mobile Subscriber Software (AMSS)
Many hardware features and operational parameters are enabled by the proper versions of AMSS software
3. Technical Brief
Many hardware features and operational parameters are enabled by the proper versions of AMSS software.
This software is designed to run on a Subscriber Unit Reference (SURF) phone platform, an optional
development platform used to evaluate, test, and debug AMSS software.
Launchpad Suite
The Launchpad Suite of integrated applications offers wireless operators and manufacturers a cost-effective,
scalable, and timely solution for providing advanced wireless data services. This seamlessly integrated scalable, and timely solution for providing advanced wireless data services. This seamlessly integrated
solution enables advanced next-generation applications and services that incorporate multimedia,
position-location, connectivity, customized user interface, and storage capabilities.
Launchpad features are available for each Qualcomm chipset, closely matching the specific functionality and
cost-target objectives agreed upon in joint product planning with manufacturers and wireless service
operators worldwide.
The MSM7227 solution supports Launchpads advanced feature set, including streaming video and audio,
still-image and video encoding and decoding, Java acceleration, and an 8-megapixel camera interface. still image and video encoding and decoding, Java acceleration, and an 8 megapixel camera interface.
The MSM7227 solution also integrates gpsOne functionality to support assisted and standalone GPS
enabling a wide variety of location-based services and applications, including points-of-interest, personal
navigation, and friend finder.
Seamless communication directly with printers, digital cameras, keyboards, and other accessories is also
supported via the integrated wireless Bluetooth and USB controller functions.
3. TECHNICAL BRIEF
- 65 -
3.8 Power Block
3. Technical Brief
3.8.1 General
MSM7227 included RF, is fully covered by PM7540(Qualcomm PMIC). PM7540 cover The power of MSM7227,
MSM memory, RF block, Micro SD, USIM and TCXO.
Major power components are :
PM7540 (U704, Main PCB) : Phone Power Supply
AAT2870 (U101, Qwerty Key PCB) : LCD Backlight charge pump
MAX17040G (U1005, Main PCB) : FUEL GUAGE IC
3.8.2 PM7540
The PM7540 device (Figure 1-1) integrates all wireless handset power management, general housekeeping,
and user interface support functions into a single mixed signal IC.
Its versatile design is suitable for CDMA and non-CDMA handsets, and other wireless products such as PC PDAs.
The power management portion accepts power from common sources - battery, external charger, adapter,
USB_VBUS, coin cell backup - and generates all the regulated voltages needed to power the appropriate
handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying
that they are within acceptable operational limits, and coordinates battery and coin cell recharging while
maintaining the handset electronics supply voltages.
On-chip voltage regulators generate 24 programmable output voltages using a combination of switched-
mode power supplies and low dropout voltage regulators, all derived from a common trimmed voltage
reference. One regulator is dedicated for generating microphone bias voltages.
The device's general housekeeping functions include a 16-position analog multiplexer that has five internal
connections, six hardwired external connections, and supports an additional 22 external connections.
The internal connections are used to monitor on-chip functions such as the temperature sensor.
The hardwired external connections access input power nodes such as VCHG, VBAT, etc. p p , ,
The 22 additional external connections are made using the IC's multipurpose pins configured as analog inputs
that are routed through switch circuits to create five multiplexer inputs; these are available to monitor system
parameters such as temperature and battery ID.
3. TECHNICAL BRIEF
- 66 -
The multiplexer output signal's offset and gain is adjusted, then buffered and routed to the Mobile Station
Modem (MSM) device for analog-to-digital conversion.
3. Technical Brief
( ) g g
Various oscillator, clock, and counter circuits are provided to initialize and maintain valid pulse waveforms and
measure time intervals for higher-level handset functions.
A dedicated controller manages the TCXO warmup and signal buffering, and key parameters are monitored to
protect against detrimental conditions.
Figure. PM7540 functional block diagram
3. TECHNICAL BRIEF
- 67 -
Handset-level user interfaces are also supported. The IC includes four backlight or LED drivers with
brightness (current) control that could be used for keypad, LCD, camera flash, and general-purpose drivers.
3. Technical Brief
brightness (current) control that could be used for keypad, LCD, camera flash, and general purpose drivers.
A vibration motor driver alerts handset users of incoming calls, and a two-channel speaker driver with
volume control can be used for audio alerts or speakerphone and melody-ringer applications.
The speaker circuits accept stereo differential, stereo single-ended, and mono-differential inputs, and can be
configured for stereo or mono outputs. A video amplifier is included that allows the handset to be used as a
camcorder or for slide presentations.
IC-level interfaces include the configurable serial bus interface (SBI) used by the MSM device to control and
status the PM7540 IC. This bus is supplemented by an interrupt manager for time-critical information. status the PM7540 IC. This bus is supplemented by an interrupt manager for time critical information.
Another dedicated IC interface circuit monitors multiple trigger events and controls the poweron/poweron
sequences.
A universal serial bus/on-the-go (USB-OTG) transceiver is included for interfacing the MSM device to
computers as a USB peripheral, or connecting the MSM device to other peripherals. removable user identity
module (RUIM) level translators enable MSM device interfacing with external modules.
The PM7540 IC is a mixed signal BiCMOS device and is available in the 137-pin chip scale package (137-CSP)
that includes several center ground pins for electrical ground and thermal relief. that includes several center ground pins for electrical ground and thermal relief.
Since the PM7540 IC includes so many diverse functions, its operation is more easily understood by
considering major functional blocks individually. Therefore, the PM7540 document set is organized by the
following device functionality:
Input power management
Output voltage regulation
General housekeeping General housekeeping
User interfaces
IC interfaces
Multipurpose pins (which can be configured to function within some of the other categories)
3. TECHNICAL BRIEF
- 68 -
3.8.3 Charging control
3. Technical Brief
Voltage regulation (VDDor VBAT)
The PM7540 IC provides closed-loop control of the active pass transistor (via CHG_CTL_N or USB_CTL_N) to
regulate either the handset supply voltage (VDD) when not charging or the main battery final voltage (VBAT)
when charging.
When fast charging is disabled, the battery MOSFET is opened and the voltage regulation point is the ISNS_M
pin (VDD). When fast charging is enabled, the VBAT pin is the voltage regulation point,
thereby improving the voltage precision of the fully charged battery (Li-ion battery manufacturers specify 1%
accuracy).
3. TECHNICAL BRIEF
- 69 -
Current regulation, monitoring, and protection
3. Technical Brief
If a sense resistor is installed across ISNS_P and ISNS_M (pins C1 and C2, respectively) the PM7540 IC constantly
monitors the total handset electronics plus charging current. If the programmed current threshold is exceeded,
the active pass transistor is forced to a higher resistance, disrupting VDD or VBAT regulation but protecting
against excess current.
The VCHG current monitor defaults to its 1 Amp current setting upon powerup, thereby minimizing the risk of a
large in-rush load collapsing VDD. Similarly, the VUSB current monitor defaults to its 0.5 A current setting upon
powerup.
Battery
C it
Battery Voltage
Battery Icon Battery Capacity Bar
Capacity
y g
90% 4.02V r 0.05(3.97V~4.07V)
60% 3.76V r 0.05(3.71V~3.81V)
30% 3.67V r 0.05(3.62V~3.72V)
90~100 6
70~89 5
50~69 4
30~49 3
15~29 2
10% 3.58V r 0.05(3.53V~3.63V)
OFF Under 3.30V
5~14 1
0~4 0
L-04C Battery Bar Display
3. TECHNICAL BRIEF
- 70 -
Main Battery Charging
3. Technical Brief
The PM7540 IC provides support circuitry for charging lithium-ion batteries, cycling through as many as four
charging techniques: trickle, constant current, constant voltage, and pulsed. Battery voltage, external supply
voltage, and total detected current measurements are available to the MSM device through the PM7540
analog multiplexer.
This allows the MSM device to monitor charging parameters, make decisions, and control the charging
process.
3. TECHNICAL BRIEF
- 71 -
Trickle Charging
3. Technical Brief
Trickle charging of the main battery, enabled through MSM control and powered from VDD, is provided by
the PM7540 IC. This mode is used to raise a severely depleted battery's voltage to a level sufficient to begin
fast charging.
Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA
3. TECHNICAL BRIEF
- 7 -
3. Technical Brief
Constant Current Charging
The PM7540 IC supports constant current charging of the main battery by closing the battery MOSFET
(connecting the battery to VDD), and closed-loop controlling the active pass transistor (charger or USB).
The closed-loop control regulates the total current (handset electronics plus charging current) to match the
programmed value (IMAXSEL).
The MSM device monitors the charging process as described earlier and continues the constant current mode
until the battery reaches its target voltage. Lithium-ion batteries require further charging using constant
voltage or pulsed techniques.
3. TECHNICAL BRIEF
- 73 -
3. TECHNICAL BRIEF
- 74 -
Constant Voltage Charging
3. Technical Brief
Once constant current charging of a lithium-ion battery is finished, the charging continues using either
constant voltage or pulse techniques.
The MSM device and its software determines if and when it is appropriate to begin the constant voltage mode
within the charging process. Usually the decision to stop the constant current mode is based upon the battery
voltage reaching a programmed threshold slightly above the intended final voltage.
3. TECHNICAL BRIEF
- 75 -
Pulse charging
3. Technical Brief
Once constant current charging of a lithium-ion battery is finished, the charging continues using either
constant voltage or pulse techniques.
Charging Feature
Charging Method : CC & CV (Constant Current & Constant Voltage)
Maximum Charging Voltage : 4.225V
Maximum Charging Current : 500mA
Nominal Battery Capacity : 1350mAh
Charger Voltage : 5.4V
Charging time : Max 240min (Except time trickle charging)
Full charge indication current (icon stop current) : 140mA
Low battery message : 3.30 0.05V
3. TECHNICAL BRIEF
- 76 -
3.8.4 MAX17040G
3. Technical Brief
The classical coulomb-counter-based fuel gauges suffer from accuracy drift due to the accumulation of the
offset error in the current-sense measurement. Although the error is often very small, the error increases over
time in such systems, cannot be eliminated, and requires periodic corrections. The corrections are usually
performed on a predefined SOC level near full or empty. Some other systems use the relaxed battery voltage
to perform corrections.
These systems determine the true SOC based on the battery voltage after a long time of no activity. Both have
the same limitation: if the correction condition is not observed over time in the actual application, the error in
th t i b dl I t f ll h /di h l i i d t li i t th d ift the system is boundless. In some systems, a full charge/discharge cycle is required to eliminate the drift error.
1
2
5
8
R
K
0
7
4
U1005
MAX17040G
9
7 4
8 1
6
5
3 2
CELL VDD
SEO
EO
CTG SDA
GND SCL
D
N
G
P
C8550
1u
VBAT
0
2
5
8
R
0
5
1
9
1
5
8
R
0
5
1
C8551
10n
VREG_MSMP_2.6V
K
2
.
2
2
2
5
8
R
K
2
.
2
3
2
5
8
R
1u
C8549
FUEL_I2C_SDA
FUEL_I2C_SCL
FUEL GUAGE
3. TECHNICAL BRIEF
- 77 -
3.9 Memory Support
3. Technical Brief
The MSM7227 IC external memory support (Figure 3.9) includes the following major functions:
For high-speed memory devices EBI1 port, DDR SDRAM controller, and the AXI memory controller (MemC)
bridge for access to the AXI bus
For lower-speed memory devices, an LCD, and asynchronous devices like UBM EBI2 port, a set of EBI2
controllers, and an AHB interface for access to the peripheral bus
i l hi h l l bl k di Figure3.9 Extemal memory support high-level block diagram
Table Memory and LCD configuration
Figure. 3.9 Extemal memory support high-level block diagram
Table.3.9 Memory and LCD confgurations
3. TECHNICAL BRIEF
- 78 -
3.9.1 High-speed memory interface (EBI1)
3. Technical Brief
EBI1 provides connectivity between multiple bus masters and their high-bandwidth memory controllers.
Using the AXI (Section 3.3.1) as a standard interface between bus masters and slaves ensures high-
performance data transfers. The EBI1 high-level architecture (Figure 3.9.1) includes two major functional
blocks:
AXI memory controller bridge the interface block to the AXI bus interconnect. Its primary function is to
communicate with command and data transfer masters through the interconnect; it supports most non-
blocking features of the AXI bus protocol. g p
SDRAM controller the memory controller that interfaces externally with DDR SDRAM devices, and internally
with the AXI memory controller bridge over a 64-bit AHB-lite interface. Its primary function is to receive and
execute SDRAM memory commands from the AXI memory controller bridge.
Figure3.9.1 EBI1 high-level archiecture
EBI1 connections
All EBI1-related pins are located in the same general area of the IC package. This allows optimal routing and
should minimize interference from this bus to more sensitive functions (such as analog baseband).
EBI1 layout guidelines are given in Section 4.3.3.2. A single 32-bit DDR SDRAM memory device or two 16-bit
devices are supported (Figure 3.9.2).
3. TECHNICAL BRIEF
- 79 -
3. Technical Brief
Figure3.9.2 EBI1 intetface options
3. TECHNICAL BRIEF
- 80 -
Lower-speed memory interfaces (EBI2)
3. Technical Brief
The second external memory interface (Figure 3.9.3)provides the interface for slow peripheral devices such
as LCDs, flash memory, and the UBM receiver. In order to support all these device types, the interface
requires three different controllers:
- Serial flash controller to access NAND and OneNAND devices
- LCD controller for LCD devices
- External memory controller (EBI2_XMEM) to access SRAM and generic asynchronous interface devices
(including the UBM receiver)
Figure3.9.3 EBI2 functional block diagram
General EBI2 features
1.8 V or 2.6 V memory interface support
Three categories of devices are supported
- NAND or OneNAND via the serial flash controller
- Display via the LCD controller
A h d i i h l ll (i l di UBM i ) - Asynchronous devices via the external memory controller (including UBM receiver)
Boot from NAND or OneNAND In addition, specific EBI2 features are listed in each controller subsection.
3. TECHNICAL BRIEF
- 81 -
3. Technical Brief
Figure3.9.4 EBI2 example applition
3. TECHNICAL BRIEF
- 8 -
L1015
1.2n
C1013 33p
1
0
0
1
R
0
C1073 100p
9
4
0
1
C
u
1.
0
C1042 10n
C1041 1n
0
0
0
1
R
I
N
D
VREG_MSMP_2.6V
u
1.
0
7
3
0
1
C
6
3
0
1
C
p
0
0
1
5
3
0
1
C
u
7.
4
4
3
0
1
C
u
7 .
4
C1033
10u
u
1.
0
2
3
0
1
C
5.1
R1007
R1006
5.1
VREG_RFRX1_2.7V
1n
C1031
C1030
0.1u
u
1.
0
9
2
0
1
C
C1028 10n
p
2
2
7
2
0
1
C
12K R1003
C1072 22p
C1025 100p
RTR6285
U1000
3
2
9
2
8
2
5
3
4
3
9
6
62
61
60
54
43 36
37 38
27 68
25 52
21 42
8
7 45
1 44
53 47
22 46
10
6 49
4 48
3
51
67 50
19 39
40
18
17 41
16
15 33
32
13 31
14 30
12
11 59
58
9 56
24
5 57
55
65
66 20
63 2
64 26
RF_ON TX_IP
TCXO TX_IN
SBDT TX_QP
TX_QN
LB_RF_OUT1
LB_RF_OUT2 VTUNE1
VTUNE2
HB_RF_OUT1 VTUNE_GPS
HB_RF_OUT2
HB_RF_OUT3 PRX_QP
PRX_QN
WPRXLBP PRX_IP
WPRXLBN PRX_IN
WPRXHBP
WPRXHBN DRX_QP
DRX_QN
WDRXLB DRX_IP
DRX_IN
WDRXHB1
WDRXHB2 NC
GCELL_INP DAC_IREF
GCELL_INN
VDDA1_1
EGSM_INP VDDA1_2
EGSM_INN VDDA1_3
VDDA1_4
DCS_INP VDDA1_5
DCS_INN VDDA1_6
GPCS_INP VDDA2_1
GPCS_INN VDDA2_2
VDDA2_3
GPS_IN VDDA2_4
PDET_IN VDDA2_5
TX_RBIAS VDDA2_6
WPRXSE1 VDDA2_7
WPRXSE2 VDDA2_8
VDDA2_9
VDDA2_10
VDDA2_11
VDDA2_12 D
N
G
P
T
U
O
_
2
E
S
X
R
P
W
T
U
O
_
1
E
S
X
R
P
W
P
NI
_
X
M
_
B
W
M
NI
_
X
M
_
B
W
M
D
D
V
4.7u
C1024
p
0
0
1
3
2
0
1
C
C1026 7p
C1038 27p
22p
C56
10u
C53
2
2
0
1
C
u
1.
0
VRF_SMPS_2.1V
VDD_RX
600
FB1001
FB1000
600
68p
C1012
C1011
68p
C1010
0.1u
u
1.
0
9
0
0
1
C
u
1.
0
5
0
0
1
C
4
0
0
1
C
u
1.
0
3
0
0
1
C
u
1 .
0
0 3
R
2
0
0
1
C
u
1.
0
1
0
0
1
C
u
1.
0
u
1.
0
0
0
0
1
C
L1016
DNI
TCXO_RTR_19.2MHZ
RTR_DAC_REF
RTR_TXIP
RTR_TXIM
RTR_TXQP
RTR_TXQM
RTR_RXIP
RTR_RXIM
RTR_RXQM
RTR_RXQP
RTR_DRXIP
RTR_DRXIM
RTR_DRXQM
RTR_DRXQP
RTR6285_SSBI
RX_WCDMA_1900
GPS_IN
DCS_PCS_TX
GSM_TX
RX_PCS_P
RX_PCS_M
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_M
RX_WCDMA_2100
PDET_IN
RX_DCS_P
RTR_TXON
WCDMA_800_TX_OUT
VSNS_RF_SMPS
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_800_M
RX_WCDMA_800_P
WB2100_MIX_INM
WB2100_MIX_INP
WCDMA_2100_TX_OUT
VDDA2 [2.1V] : Pin 1,7,8,21,25,27,37,43
VDDA2 [2.1V] : Pin 54,60,61,62
==> PLL1, PLL2, GPS PLL, VCOs
==> DCS/PCS LNA, dirver amp, mixers and baseband Tx
VDDA1 [2.7V] : Pin 3,4,6,10,22,53
Close to RTR
==> Baseband Rx, WCDMA LNA, Cell/EGSM LNA
VDDA1: PIN 3,4,6,10,22,53 = 2.7V VDC
1%
1608 1608
VDDA2: PIN 1,7,8,21,25,27,37,43,54,60,61,62 = 2.1V VDC
1608
0603
0603
0603
0603
0603
0603
3.10 H/W Sub System
3.10.1 RF Interface
3. TECHNICAL BRIEF
- 83 -
A. RTR6285 (WCDMA_Tx/Rx)
MSM7227 controls RF part(RTR6285) using these signals.
y RTR SSBI : SSBI interface signals to control RTR6285
y RX_I/Q_M/P,TX_I/Q_M/P : I/Q data for Tx/Rx of RF
B. The others
y RTR_TRK_LO_ADJ : VC-TCXO(19.2MHz) Control
y PA_ON0,1: WCDMA(2100,800) TX Power Amp Enable
y PA_R0: Power Amp Mode Control
y GSM_PA_RAMP: GSM Power Amp gain control signal
y GSM_PA_EN: GSM Power Amp Enable
y GSM_PA_BAND: Power Amp Band select Control
3. TECHNICAL BRIEF
- 84 -
3.10.2 MSM Sub System
3. Technical Brief
3.10.2.1 USIM Interface
The MSM side is powered by (or referenced to) VREG_MSME or VREG_MSMP voltage; the selection is made via
SBI. VREG_MSME can be programmed from 0.75V to 3.05 V in 25-mV increments, while the VREG_MSMP
options are 1.5 V to 3.05 V in 50-mV increments.
The RUIM side is referenced to the VREG_RUIM output that can be set from 1.5 V to 3.05 V in 50 mV increments.
Since the two sides (MSM device and RUIM) can run off different voltages, a level-translation is achieved.
The RUIMside usually runs off either 1 8 V or 3 0 V The RUIM side usually runs off either 1.8 V or 3.0 V.
SIM interface scheme is shown in Figure. And, there control signals are followed
y SIM_CLK: SIM Clock
y SIM_Reset: SIM Reset
y SIM_Data: SIM Data T/Rx
MSM7227 PM7540
USIM
MSM_USIM CLK
MSM_USIM RST
MSM USIM Data
SIM IO
SIM RST
SIM CLK
VREG_RUIM 3.0V
Figure. SIM Interface
MSM_USIM Data
3.10.2 MSM Sub System
3.10.2.1 USIM Interface
3. TECHNICAL BRIEF
- 85 -
PM7540 PM7540
3.10.2.2 Universal asynchronous receiver transmitter (UART) Interface
The MSM7227 IC provides four UART ports capable of applications such as:
- Serial data interface that conforms to the RS-232 interface protocol
- Handsets serial data port for test and debug
- External keypad or ringer interface
Wi h EEPROM fl h d l d d/ d f - With EEPROM or flash memory used to load and/or upgrade system software
3. TECHNICAL BRIEF
- 86 -
3. Technical Brief
3.10.2.3 USB
The universal serial bus (USB) is an interconnection standard widely supported by the electronics industry.
The USB 2.0 specification defines three operating data rates: low-speed (1.5 Mb/s); full-speed (12 Mb/s); and
high-speed (480 Mb/s).
The MSM7227 IC supports one High Speed USB (HS-USB) USBH port with built-in PHY and one Full Speed
USB-UICC port. The MSM7227 IC supports USB interfaces using two controllers:
The primary controller is the HS-USB port with an integrated physical layer (PHY). This HS-USB port is also
capable of supporting USB operations at low speed and full speed capable of supporting USB operations at low-speed and full-speed.
The secondary controller is the FS USB-UICC port, which only supports host mode functionality.
3. TECHNICAL BRIEF
- 87 -
3. TECHNICAL BRIEF
- 88 -
3.10.2.4 HKADC(House Keeping ADC)
3. Technical Brief
The MSM7227 IC has an on-chip 12-bit analog-to-digital converter (ADC) that is available for digitizing analog
signals representing parameters such as battery voltage, temperature, and RF power levels.
These parameters support handset-level housekeeping functions various tasks that must be performed to
keep the house, or handset, in order. This ADC is also used as a touch screen interface, so the acronyms
TS-ADC and HK/TS-ADC are sometimes used.
The HK/TS-ADC is a 12-bit successive-approximation circuit with a programmable resolution of 8, 10, or 12 bits.
Its high-level block diagram is illustrated and explained in Figure 3.10.1.
Channel Signal Note
HKAIN0 - -
HKAIN1 HOOK ADC Earjack hook recogni e
Figure 3.10.1 HK/TS-ADC functional block diagram
Table. HKADC channel table
HKAIN1 HOOK_ADC Earjack hook recognize
HKAIN2 AMUX_OUT Delivery the battery temperature and Main PCB
revision from PMIC to MSM
3. TECHNICAL BRIEF
- 89 -
3.10.3 Key Pad
3. Technical Brief
There are 55 buttons in Qwerty key, 3 main keys and 2 side keys in Figure. Shows the Keypad circuit.
END Key is connected Key_PWR_ON_Nto PMIC(PM7540).
L3
100n
2
2
3
A
V
4
3
3
R
K
2.
2
VREG_MSMP_2.6V
C303
0.1u
3
3
3
R
K
2.
2
0.1u
C302
470 R332
0
2
3
A
V
9
1
3
A
V
8
1
3
A
V
7
1
3
A
V
470 R331
PP2106M3
U301
4
1
3
1
2
1
1
1
0
1
9 8
15 7
16 6
17 5
18 4
19 3
20 2
21 1
2
2
3
2
4
2
5
2
6
2
7
2
8
2
9
2
D
N
G
P
2
D
N
G
B
T
E
S
E
R
I
X O
X
L
E
S
_
K
L
C
D
D
V
0
1
P
TEST P40
SEL_28P P41
P57 P42
P56 P43
P55 P44
P17 P45
P15 P46
1
D
N
G
4
5
P
3
5
P
2
5
P
1
5
P
0
5
P
7
4
P
6
1
3
A
V
5
1
3
A
V
4
1
3
A
V
3
1
3
A
V
2
1
3
A
V
1
1
3
A
V
0
1
3
A
V
9
0
3
A
V
8
0
3
A
V
KB353
7
0
3
A
V
470 R324
470 R323
470 R322
R321 470
470 R320
470 R319
470 R318
R317 470
470 R316
R315 470
470 R314
R313 470
R312 470
K
0
2
1
1
1
3
R
KB351 KB350 KB356 KB355 KB349
KB352
KB348
3
2
3
A
V KB347
KB345 KB344 KB357 KB354 KB343 KB342 KB341 KB317
KB339 KB338 KB337 KB336 KB335 KB334 KB333
KB324
KB331 KB330 KB329 KB328 KB327 KB326 KB325
KB332
KB323 KB322 KB321 KB320 KB319 KB318
KB340
KB316
KB315
KB314 KB313 KB312 KB311 KB310 KB309
KB346
KB307 KB306 KB305 KB304 KB303 KB302 KB301
470 R302
100n L5
KEY_COL[2]
QTKEY_SCL
KEY_COL[3]
KEY_ROW[7]
QTKEY_SDA
QTKEY_RESET
QTKEY_INT
KEY_COL[0] KEY_COL[1]
KEY_ROW[5]
KEY_COL[7]
KEY_ROW[6]
KEY_ROW[1]
KEY_COL[4]
SPACE2
Key Coder IC
Qwerty 54key / 4pie DR
%
1
1 2 3 4 5 6 7
BACK
8 9 0
DEL ENTER1 SEARCH
Q W E R T Y U
I O P
Fn
A S
LANG
D F G H J K L
MENU
DOT
Z X C V
SPACE1
B N M
MANNER
UP DOWN
HIPEN
END
COMA
SHIFT1
SHIFT2
HOME
HOME SEND LEFT RIGHT
3. TECHNICAL BRIEF
- 90 -
KB308
100n
L4
2
L
n
0
0
1
KEY_ROW[1]
KEY_COL[5]
ENTER2
KB101
0
0
1
A
V
1
0
1
A
V
5
0
1
A
V
3
0
1
A
V
2
0
1
A
V
KB102
KB100
KPD_PWR_N
KEY_ROW[7]
KEY_ROW[7]
KEY_COL[6]
KEY_COL[7]
END
HOME
SEND
CN301
3
2
1
5
0
3
A
V
R309 100ohms
R308 100ohms
2
0
3
A
V
DK_Volume_DOWN
DK_Volume_UP
VOLUME SIDEKEY
Changed 03/24
From 4P to 3P
3. TECHNICAL BRIEF
- 91 -
3.10.4 Camera Interface
3. Technical Brief
L-04C Installed 3 Mega Pixel Auto Focus Camera.
Below figure shows the camera board to board connector and camera I/F signal.
Figure. 3 Mega Camera module and Qwerty PCB 34Pin Board to Board Connector
10u
C119
VREG_CAM_AVDD_2.7V
R110 12
GB042-34S-H10-E3000
CN101
17
16
15
14
13
12
11
10
9
8
7
6
5
31 4
32 3
33 2
34 1
30
29
28
27
26
25
24
23
22
21
20
19
18
VREG_CAM_DVDD_1.2V
120
FB102
C117
0.1u
VREG_CAM_AF_2.8V
VA1
VREG_CAM_IOVDD_1.8V
C3
DNI
0.1u
C114
C113
0.1u
FB101
120
0.1u
C112
VA101
C111
1u
33p
C120
CAM_PWDN
CAM_RESET_N
FLT_CAM_DATA[7]
FLT_CAM_DATA[6]
FLT_CAM_DATA[5]
FLT_CAM_DATA[4]
FLT_CAM_DATA[3]
FLT_CAM_DATA[2]
FLT_CAM_DATA[1]
FLT_CAM_DATA[0]
CAM_MCLK
CAM_PCLK
FLT_CAM_VSYNC
FLT_CAM_HSYNC
FLT_CAM_I2C_SDA
FLT_CAM_I2C_SCL
3. TECHNICAL BRIEF
- 9 -
3. Technical Brief
3 Mega Camera module is connected to Qwerty Key PCB with 34pin Board to Board connector.
This interface is dedicated camera interface port in Camera ISP and also MSM7227. This interface is dedicated camera interface port in Camera ISP and also MSM7227.
The camera port supply 26.6 MHz master clock to camera module and is received 79.8 MHz pixel clock ,
vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera ISP. The camera module is
controlled by I2C port from MSM7227.
3. TECHNICAL BRIEF
- 93 -
3.10.5 Qwerty slide OPEN/CLOSE Operation
3. Technical Brief
There is a magnet to detect the Qwerty slide OPEN/CLOSE status If a magnet is close to the hall-effect switch,
the voltage at pin-out of Hall-effect switch goes to 2.6V. Otherwise, 0V.
This SLIDE_DETECT signal delivered to MSM7227.
Figure. Schematic of Qwerty slide OPEN/CLOSE detection circuit at Qwerty Key PCB
D207
D208
U202
3 2
4 1
VDD OUT
VSS NC
100n
C203
VREG_MSMP_2.6V
C202
0.1UF
SLIDE_DETECT
SLIDE DETECT
Changed 03/24
Active : Low
3. TECHNICAL BRIEF
- 94 -
3.10.6 Numeric Keypad LED Light
3. Technical Brief
There are 3 White LEDs in RF_slide PCB, which are driven by SLIDE_KPD_DRV_N line from PM7540.
Figure. Numeric Keypad lighting Circuit
LD100
CL-435F-WQT-SD-TS
4
3
2
1
LD102
CL-435F-WQT-SD-TS
4
3
2
1
VA104
+VPWR
R103
33
R104
33
CL-435F-WQT-SD-TS
LD101
4
3
2
1
R102
33
SLIDE_KPD_DRV_N
3. TECHNICAL BRIEF
- 95 -
3.10.7 LCD Module (TX08D39VM0BAA : Hitachi LCD module)
3. Technical Brief
- The TX08D39VM0BAA model is a Color TFT Main LCD Module. It is supplied by Hitachi Display Ltd.
This main Module has a 3.2 inch diagonally measured active display area with 320 X 3(R,G,B)(W) X 480(H)
dots resolution. Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in
vertical stripes.
* Features
- Display mode(Main LCD) : Transmissive Type, Normally Black Mode, In-Plane Switching Mode
- LCD Driver IC & Driving Method : S6D05A1 (Source, Gate and Power IC) g
- Interface : MDDI Interface
Figure. LCD Module Block Diagram
3. TECHNICAL BRIEF
- 96 -
* LCD Module Interface
LCDmodule is connected to 25pin Zip connector (GB042-50P-H10-E3000)
3. Technical Brief
LCD module is connected to 25pin Zip connector (GB042 50P H10 E3000)
The LCD module is controlled by MDDI from MSM7227.
Figure. LCD Module 25 pin Zip Connector (GB042-50P-H10-E3000)
2.2u
C107
2.2u
C106
D102
4 3
5 2
6 1
+VPWR
VREG_LCD_1.8V VREG_LCD_2.8V
04-6293-025-001-829
CN103
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
ICMEF214P101M FL100
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
C108
2.2u
LCD_MAKERID_LOW
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_P
LCD_RESET_N
LCD_VSYNC_O
WLED7
WLED6
WLED1
WLED2
WLED3
WLED4
WLED5
3. TECHNICAL BRIEF
- 97 -
3. Technical Brief
No. Name Function
1 GND Ground
2 - Back Light Control of LED Driver
3 LCD_VSYNC_O Tearing Effect Signal
4 LCD_MAKERID_LOW Maker ID (Low : GND level)
5 GND Ground
6 MDDI P STB M MDDI strobe negative signal 6 MDDI_P_STB_M MDDI strobe negative signal
7 MDDI_P_STB_P MDDI strobe positive signal
8 GND Ground
9 MDDI_P_DATA_M MDDI data negative signal
10 MDDI_P_DATA_P MDDI data positive signal
11 GND Ground
12 VREG_LCD_1.8V Power Supply for Interface I/O
13 VREG_LCD_2.8V Power Supply for Analog and Voltage booster block
14 LCD_RESET_N Reset
15 WLED7 Ground for LED
22 +VPWR Power Supply for LED
Table. Interface between LCD module and Folder FPCB
24 - Non Connect Pin
25 GND Ground
3. TECHNICAL BRIEF
- 98 -
3. Technical Brief
3.10.8 Touch Module (TSMC-P307A : LG Innotek)
- The TSMC-P307A model is a L-04C Touch Module. It is supplied by LG Innotek.
This main Module has a 3.25 inch diagonally measured active display area.
* Features
Item Spec. Remark
Active Screen Size 3.25 Diagonal
Mechanical
Active Screen Size 3.25 Diagonal
Out Dimension (With Window) 50[W] x 94.2[H] []
Out Dimension (Only TSP) 49.6[W] x 82.57[H] []
View Area 46.09[W] x 68.63[H] []
Thickness 1.33 []
Input Method Finger .
Total light transmittance 80% 400 (Nippon Denshoku)
Optical
g pp
Type Clear
Figure. Touch Module 10 pin B to B Connector (GB042-10P-H10-E3000) g p
CN100
GB042-10P-H10-E3000
6 5
7 4
8 3
9 2
10 1
6
0
1
A
V
7
0
1
A
V
C109
1u
8
0
1
A
V
VREG_TOUCH_3.0V
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SDA
Touch Connector
1 pin : right, lower
3. TECHNICAL BRIEF
- 99 -
3.10.9 Q-coin Motor driver IC (TPA6202A1)
3. Technical Brief
- The TPA6202A1 is a 1.25W mono amplifier
*Features
1.25 W Into 8 From a 5V Supply at THD = 1% (Typical)
CN601
2
1
L511 100n
L512
100n
5
2
3
A
V
4
2
3
A
V
Q601
C
B
E GND
IN
OUT
R619
100K
TPA6202A1ZQVR
U601
B2 C1
A1 B1
B3 C2
A3 C3
IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
VREG_MOTOR_3.3V VREG_MOTOR_3.3V
K
1
7
1
6
R
100K
R622
51K
R620
51K
R621
C638
0.1u
10n C640
8
1
6
R
K
1
K
7
.
4
3
2
6
R
C639
1u
MOTOR_PWM
CONNECTOR Type
%
1
%
1
1%
Q-coin MOTOR
1%
1%
1%
3. TECHNICAL BRIEF
- 100 -
3.10.10 Compass (AMI304)
3. Technical Brief
- The AMI304 is a n intelligent electronic compass that integrates three Magnet-Impedance sensor elements
(MI-element) with their controller IC in a single small package.
- The controller IC of the AMI304 consists of a circuit for detecting the magnetic signals from three MI-
sensor elements, an amplifier capable of compensating each sensors offset and setting appropriate
sensitivity values, a thermal sensor for measuring the ambient temperature, a 12bit AD converter, an I2C
serial interface circuit and a constant voltage circuit for power control.
470n
C2
6
R
K
3
.
3
1
C
n
0
1
U1
AMI304
12
11
10
9
5
4
6
3
7
2
8
1
D
D
V
D
G
E
R
V
A
D
N
G
S
D
N
G
D
D
V
A
ADDR
SCL
NC1
T
N
I
VPP
DRDY
SDA
K
3
.
3
7
R
TP1
VREG_PROX_COMPASS_2.6V
0 R2
R4 0
PROX_COMPASS_I2C_SDA
PROX_COMPASS_I2C_SCL
COMPASS_DRDY
3. TECHNICAL BRIEF
- 101 -
<Pin description>
3. TECHNICAL BRIEF
- 10 -
3.10.11 Proximity Sensor
3. Technical Brief
- The GP2AP002S00F model is a Proximity Sensor. It is supplied by SHARP.
- GP2AP002S00F is equipped with a 7-bit address as a slave device on the I
2
C bus interface.
Through the SDA and SCL terminals, GP2AP002S00Fs registers can be set up, and also
GP2AP002S00Fs sensing result can be read out.
No. Name Pin name
1 GND LED Anode
2 - LED Cathode
3 LCD_VSYNC_O Vcc
4 PROX_OUT Output
5 GND Ground 5 GND Ground
6 VREG_PROX_COMPASS_2.6V Logic I/O output
7 PROX_COMPASS_I2C_SDA I
2
C DATA BUS
8 PROX_COMPASS_I2C_SCL I
2
C CLOCK
R100
4.7
u
1
1
0
1
C
TP100
0.1u
C103 C102
4.7u
R101
10
C100 4.7u
U100 GP2AP002S00F
5 4
6 3
7 2
8 1
LEDA SCL
LEDC SDA
VCC VIO
VOUT
GND
PROX_OUT
Proximity Sensor
Tuning point
3. TECHNICAL BRIEF
- 103 -
3.10.12 Accelerometer Sensor
3. Technical Brief
- The KR3DM model is a Accelerometer Sensor. It is supplied by STMicroelectronics.
- The KR3DM is an ultra low-power high performance three axes linear accelerometer belonging to the
nano family, with digital I2C/SPI serial interface standard output.
* Features
Wide supply voltage, 2.16V to 3.6V
Lo oltage compatible IOs 1 8V Low voltage compatible IOs, 1.8V
I2C/SPI digital output interface
8 bit resolution
C810
0.1u
VREG_MSMP_2.6V
K
2
.
2
3
0
8
R
K
2
.
2
4
0
8
R
C809
4.7u
KR3DM
U801
6
1
7 6
5
4
8
3
9
2
10
1
11
12
13
4
1
5
1
2
D
E
V
R
E
S
E
R
D
D
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
S
C
SCL_SPC
GND1
O
D
S
_
I
D
S
_
A
D
S
0
A
S
_
O
D
S
4
D
N
G
MOTION_INT
MOTION_I2C_SDA
MOTION_I2C_SCL
3. TECHNICAL BRIEF
- 104 -
Pi d i ti <Pin description>
3. TECHNICAL BRIEF
- 105 -
3.10.13 Audio Signal Processing & Interface
3. Technical Brief
Audio signal processing is divided uplink path and downlink path.
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then
transmits it to DBB Chip (MSM7227).
This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset.
The downlink path amplifies the signal from DBB chip (MSM7227) and outputs it to receiver (or speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output.
The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (AUXOP, AUXON) are differential outputs. p p ( , ) y ( , ) p
Earphone2 (EAR2/EAR3) is a single-ended output stage designed to drive a headset speaker.
The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a
two-stage audio amplifier.
Figure. Audio Interface Detailed Diagram(MSM7227)
3. TECHNICAL BRIEF
- 106 -
3. Technical Brief
MSM7227 Audio part
Figure . Audio part schematics
C321
39p
6
R
0
C311
22u
0.1u
C310
VA305
u
1
.
0
7
0
3
C
6
0
3
C
u
1
.
0
u
1
.
0
5
0
3
C
3
0
3
C
u
1
.
0
3
2
3
C
u
1
.
0
47p
C301
MIC_BIAS
3
1
C
5
1
B
4
1
B
3
1
B
8
H
6
F
5
F
0
1
J
0
1
H
9
H
0
1
C
0
1
B
9
C
9
B
8
F
8
E
7
F
7
E
7
C
7
B
6
C
5
C
6
B
5
B
P
I
_
R
_
E
N
I
L
N
I
_
R
_
E
N
I
L
P
I
_
L
_
E
N
I
L
N
I
_
L
_
E
N
I
L
P
1
C
I
M
N
1
C
I
M
P
2
C
I
M
N
2
C
I
M
P
I
X
U
A
N
I
X
U
A
P
O
_
E
N
I
L
N
O
_
E
N
I
L
P
O
_
1
R
A
E
N
O
_
1
R
A
E
T
U
O
X
U
A
R
_
H
P
H
L
_
H
P
H
P
M
O
C
C
S
A
I
B
_
C
I
M
F
E
R
V
_
H
P
H
K
L
C
S
Y
S
_
Y
H
P
B
S
U
P
D
_
Y
H
P
B
S
U
N
D
_
Y
H
P
B
S
U
L
_
H
P
H
R
_
H
P
H
N
_
V
C
R
P
_
V
C
R
M
D
_
H
B
S
U
P
D
_
H
B
S
U
K
L
C
S
Y
S
_
H
B
S
U
N
1
_
C
I
M
C
I
M
_
S
H
P
1
_
C
I
M
P
O
_
E
N
I
L
N
O
_
E
N
I
L
MIC_1P_PIN
n
i
p

5
E

o
t

e
s
o
l
C
3. TECHNICAL BRIEF
- 107 -
3. Technical Brief
3.5 Ear Jack
3 1 2 R
I N D
Z
D
2
0
1
Z
D
2
0
2
Z
D
2
0
5
C
2
1
6
1
0
0
p
4 1 2 R
I N D
F
B
2
0
2
1
8
0
0
F
B
2
0
3
1
8
0
0
C
2
0
6
4
.7
u
R
2
1
6
1
0
0
K
1
8
0
0
F
B
2
0
1
0
.1
u
C
2
1
2
4
7
p
C
2
1
0
3
3
p
C
2
0
8
2
.2
u
C
2
0
7
9 1 2 R
K 7 4
4
7
p
C
2
0
4
4 0 2 D
V
R
E
G
_
M
S
M
P
_
2
.
6
V
K 2 . 2
3 0 2 R
3
3
p
C
2
0
1
2 0 2 D
1 0 2 D
2 0 2 R
K 0 0 1
1
8
0
0
F
B
2
0
4
U
2
0
1
5
3
2
4
1
V
O
U
T
V
IN
G
N
D
S
T
B
Y
D N G P
0 0 1 Q
D
G
S
0 2 2 R
M 1
V
R
E
G
_
M
S
M
P
_
2
.
6
V
J
2
0
1
2 3 6 5 4 1
M
5
_
M
IC
M
4
_
L
M
3
_
D
E
T
E
C
T
M
4
D
-D
E
T
E
C
T
M
1
_
R
M
6
_
G
N
D
H
O
O
K
_
A
D
C
E
A
R
_
R
E
A
R
_
L
H
S
_
M
IC
_
B
IA
S
_
E
N
H
S
_
M
IC
E
A
R
_
S
E
N
S
E
A
U
D
I
O
_
G
N
D
3
.
5

E
A
R
_
J
A
C
K
M
A
T
IN
G
E
A
R
_
S
E
N
S
E
U
N
M
A
T
IN
G
S
T
A
T
E
L
O
W
(
D
E
F
A
U
L
T
)
H
IG
H
5
/
1
0

A
d
d
e
d
3. TECHNICAL BRIEF
- 108 -
3. Technical Brief
Audio Sub system
Microphone
FB701
600
C710
39p
3
0
7
R
0
2
4
0
7
R
0
2
R724 47K
C783
10u
C711
39p
C712
39p
C713
39p C715
0.1u
R725 47K C717 1u
C716 1u
C707 47n
47n C706
K
7
.
4
1
1
R
9
R
K
7
.
4
VREG_MSMP_2.6V
0.1u
C701 C700
2.2u
C714
0.1u
C900
2.2u
470n C708
C709 470n
U701
WM9093ECS-R
3
B
A4
C3
C2
2
B
D1
D3
4
D
C1
A1 D2
1
B
D5
A2
A5
A3
B5
4
B
C5
4
C
D
N
G
OUT+
D
D
V
P
H
CPVDD
CPVSS
CN
HPL
OUT-
S
A
I
B
IN2- HPR
IN1+
D
D
V
S
IN3-
IN2+
A
D
S
IN1-
IN3+
CP
L
C
S
C722
2.2u
+VPWR_AUDIO
2.2u
C719
2.2u
C723
2.2u C720
VREG_MSME_1.8V
HPH_L
HPH_R
RCV_N
RCV_P
SPK_RCV-
SPK_RCV+ LINE_OP
LINE_ON
EAR_R
EAR_L
AUDIO_I2C_SDA
AUDIO_I2C_SCL
AUDIO SUBSYSTEM
MIC1
6
5
4
3
2
1
OUT
G1
G2
G3
PWR
G4
1
0
2
R
I
N
D
5
1
2
C
p
5
1
4
1
2
C
u
0
1
3
1
2
C
p
7
4
FB1
1800
MIC_1P
MIC_1N
MIC_BIAS
3. TECHNICAL BRIEF
- 109 -
* Audio Mode
3. Technical Brief
MODE Device Description
Voice Call
Receiver Mode Receiver Voice Call
Loud Mode Speaker Phone
Headset Headset Voice Call
Loud Mode Speaker OGG Bell
Table Audio Mode
OGG
Loud Mode Speaker OGG Bell
Headset Headset OGG Bell
SD contents
Loud Mode Speaker MP3
Headset Headset MP3
Table. Audio Mode
Audio & Sound Main Component
There are 5 main components in L-04C
Component Design No. Maker Part No. Note
1 MSM7227 U302 MSM7227 Base-Band Modem
2 3.5 Ear Jack J201 KJA-PH-0-0176 3.5 Ear Jack
3 Audio sub system U701 WM9093ECS-R Mono Class D Speaker driver
Mono Class AB earpiece driver
4 Speaker &
Receiver
1810-8T-05W1P 8 ohm DUAL MODE SPEAKER
Table. Audio main component list
Receiver
5 MIC MIC1 SPM0410LR5H-QB - 38 dB microphone
3. TECHNICAL BRIEF
- 110 -
3.11 Main features
1. Main Features
Mech. : Full touch Qwerty Slide Smart Phone
RF: WCDMA with HSDPA (Category 8) / HSUPA (Category 5)
- UMTS : 800 / 2100 , GSM 900/1800/1900
Modem: MSM7227
OS: Android 2.2 (Froyo)
Di l 3 2" HVGA (320 480) TFT Display : 3.2",HVGA (320x480) TFT
Touch : Capacitive Multi Touch
Camera : 3M AF, Sony(1/5")
Memory : 8G NAND+4G DRAM & Micro SD Card
Media : MP3, OGG bell
Battery : 1350mAh UF564447F (Li-ion) / Sanyo
Connectivity : USB 2.0, Bluetooth, 3.5 Ear-jack
SPK/RCV : 18 X 10, 8, DUAL MODE SPEAKER
I/O : Micro 5 Pin USB
Function : GPS, Wi-Fi, Bluetooth
Sensor : Accelerometer, Proximity, Digital Compass
3. TECHNICAL BRIEF
- 111 -
3.12 RF Component
FL1005
FL1006
U1004
U1003
FL1003
FL1002
U1000
U1002
FL1004
FL1001
SW1000
U400
U302
U1002
U704
X300
U1001
FL1000
3. TECHNICAL BRIEF
- 11 -
Diagram Ref. No Part Name Function Comment
RF
U1003 SKY77701 21000 PAM TX
U1004 SKY77704 800 PAM TX
FL1001 D5017 FEM Band selection/TX
SW1000 MS-156C Test Connector Calibration etc
FL1003 SAYFP1G95AA0B00 W2100 Duplexer Tx/RX
FL1004 SAYFP836MCA0F00R00 W800 Duplexer Tx / Rx
FL1005 SAFEB836MAL0F00 W800 SAW TX
FL1006 SAFEB1G95KA0F00 W2100 SAW TX
U1002 SKY77336 QUAD GSM PAM TX
FL1002 SAFEB2G14FB0F00 W2100 SAW RX
U1000 RTR6285 RF Transceiver Tx / Rx

Diagram Ref. No Part Name Function Comment
RF
U400 MT29C8G96MAGAPDZA-5IT Memory 8G/4G
U302 MSM7227 Main Control Main Chipset
U704 PM7540 Power Control Power Supply
X300 TG-5010LH(19.2M)-75A VCTCXO 19.2MHz
U1002 LBEH19UNBC-338 WiFi/BT Transceiver Tx / Rx
U1001 RF2815 GPS LNA Rx
FL1000 SAFEB1G57KB0F00 GPS SAW Rx
G
G
3. TECHNICAL BRIEF
- 113 -
3.13 Main Component
2. Main Components
Main board, Top
Main board, Bottom
3. TECHNICAL BRIEF
- 114 -
2. Main Components
Qwerty board, Top
Qwerty board, Bottom
3. TECHNICAL BRIEF
- 115 -
2. Main Components
RF-Slide board, Bottom RF-Slide board, Top
B TO B board, Bottom B TO B board, Top
3. TECHNICAL BRIEF
- 116 -
- Logic
2. Main Components
Main board, Top
Reference Part Number Description
CN700 HSMU-5SB-24DR2 connectorI/O
Q1Q2 QST4 TRBipolar
Q3 SIA431DJ FET
U301 NC7SV00P5X_NL ICMCPNOR
U1005 MAX17040G ICFuel Gauge C ue Gauge
U704 PM7540 ICPMIC
IC1 TS5USBA33402YZPR ICMUIC
U302 MSM7227 ICDigital Baseband Processor3 G
U701 WM9093ECS-R ICAudio Sub System
U801 KR3DM ICAcceleration Sensor
U300 74LVC1G79GM ICFlip Flop
U400 MT29C8G96MAZAPDJA-5 IT MCP
Main board, Top
U400 MT29C8G96MAZAPDJA-5 IT MCP
X300 KT3225L19200DCW28RA0 OscillatorVCTCXO
X700 FC-135 Crystal
3. TECHNICAL BRIEF
- 117 -
2. Main Components
- Logic
Main board, Bottom
CN900 24-5804-080-000-829+ ConnectorBtoB
J800 KP09N-6S-2_54SF Sim Card Socket
SW1001 UFL-R-SMT10 ConnectorRF
SW1000 MS-156C ConnectorRF
FL700 NFM18PC104R1C3 FilterEMI/Power
CN701 KQ03LP1-3R ConnectorBattery
U700 MAX14528 ICOver Voltage Protection
U802 BU28TD2WNVX ICLDO Voltage Regulator
Main board, Bottom
3. TECHNICAL BRIEF
- 118 -
- Qwerty PCB
2. Main Components
Qwerty PCB ASSY, Top
CN401 GB042 50S H10 E3000 C t Bt B
Qwerty PCB ASSY, Top
CN401 GB042-50S-H10-E3000 ConnectorBtoB
U301 PP2106M3 ICKey Encoder
U1 AMI304 ICDigital Compass Sensor
U202 S-5711AC-I4T1G ICHall IC
3. TECHNICAL BRIEF
- 119 -
- Qwerty PCB
2. Main Components
Qwerty PCB ASSY, Bottom
CN101 GB042-34S-H10-E3000 Connector, BtoB
CN402 24-5804-080-000-829+ Connector, BtoB
CN601 24-8000-002-000-829 Connector, I/O
J201 KJA-PH-0-0176 EarJack
CN1 SCHA4B0402 Socket, SD Card
SW401 UFL-R-SMT10 Connector, RF
Q601 KRC402E TR Bipolar Q601 KRC402E TR, Bipolar
Q100 SI1305-E3 FET
U101 AAT2870 IC, Sub PMIC
U103 NLSX4373MUTAG IC, Level Translator
U102 NLSV1T244MUTBG IC, Level Translator
U601 TPA6202A1ZQVR IC, Motor Driver IC
CN4, CN5 HJ-BCT-04Y ANT Contact
Qwerty PCB ASSY, Bottom
MIC1 SPM0410LR5H-QB Microphone, Condenser
FL1, FL101, FL102 ICVE10184E070R100FR Filte, EMI/Power
3. TECHNICAL BRIEF
- 10 -
- RF-Slide FPCB
2. Main Components
CN100 GB042-10P-H10-E3000 ConnectorBtoB
U100 GP2AP002S00F ICProximity
RF-Slide FPCB ASSY, TOP RF-Slide FPCB ASSY, Bottom
SUB FPCB ASSY, TOP, Bottom
FL100 ICMEF214P101M FilterEMI/Power
CN102 GB042-50P-H10-E3000 ConnectorBtoB
CN103 04-6293-025-001-829 ConnectorFFC/FPC/PIC
BAT100 311HR-VG1 Coin Battery
3. TECHNICAL BRIEF
- 11 -
- BTOB FPCB
2. Main Components
BTOBFPCB, Top BTOBFPCB, Bottom
BTOB FPCB, Top BTOB FPCB, Bottom
BTOB FPCB, Top, Bottom
4. TROUBLE SHOOTING
- 1 -
sTW[jG
G
4. TROUBLE SHOOTING

4.1 Checking VCXO Block
The reference frequency (19.2MHz) from X10 (TCXO) is used in UMTS TX part, GSM part and BB part.
G
G G
G
G
G
G
G
4. TROUBLE SHOOTING
R10 0
10n
C313
R306
100
19.2MHz
X300
KT3225L19200DCW28RA0
4 2
3 1
VCONT OUT
GND VCC
C309
100p
33
R309
C312 1n
1n
C314
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C315 100p
C316
0.1u
100K
R313
0.1u
C319
NC7SV00P5X_NL
U301
3
2
4
1
5
VCC
GND
SC1
1
SC2
1
TCXO_RTR_19.2MHZ
TCXO_PM_19.2MHZ
TCXO_EN
USBH_SYSCLK
RTR_TRK_LO_ADJ
1.0T
TCXO Circuit
Clesed to TCXO
TP1
TP2
TP4
TP3
4. TROUBLE SHOOTING
- 13 -
Check TP1
VCC of VCXO
VCC .8V Check TP1 of PMIC (U704)
No
Yes
Check TP
TRK_LO_ADJ
V Voltage 1V Check TP of MSM (U30)
No
Yes
Check TP3,4
With Oscilloscope
V Voltage 1V
Check soldering and
components
No
Yes
VCXO is OK
Check other part
4.2 Checking FEM SW Block
4. TROUBLE SHOOTING
- 14 -
sTW[jG
G
G
Logic Table of the Front End Module

Check Soldering of
ANT_SEL 0, 1, ,3 High Level
1.5V < Voltage < 3.0V Check TP1
No
Yes
Check the Logic in each mode
Checking Switch Block power source
4. TROUBLE SHOOTING
- 15 -
sTW[jG
G
G
4.3 Checking UMTS Block
4.3.1 Checking TX POWER of UMTS2100MHz

9
9
0
1
C
n
8
.
1
C1101
0.5p
L1029
15n
2
8
0
1
C
n
3
.
3
FL1003 B7697
1950MHz, 2140MHz
9 5
8 4
7 2
3
6 1
RX ANT
TX
GND1 GND4
GND2 GND5
GND3 GND6
TP1
C1053
1.5n
DNI
C1051
MS-156C SW1000
4 3
2
1
ANT COMMON
G3 G4
L1003
68n
L1002
68n
L1027
2.7n
FL1006
SAFEB1G95KA0F00
1950MHz
5 2
4 1
3
G3
IN OUT
G1 G2
L8057
DNI
C1086
3.3n
0
0
1
1
C
n
6
.
5
TP2
TP4
TP3
4. TROUBLE SHOOTING
- 16 -
Run a FTM program set RF
mode to 100 set uplink freq.
To 1750 Click Tx On and
WCDMA set PA Range R0 and
R1 on set Tx AGC to 330
Check a
current over
500mA?
Check TP4
over -5dBm?
Check a PAM
(U1003)
Check TP1
over 7dBm?
Check TP1
Check TP
over 4dBm?
Check FL1003
and TP
Check TP3
over 3dBm?
Check TP3
Tx is OK
No
Yes
Yes
Yes
Yes
No
Yes No
No
No
Check RTR
and FL1006?
4. TROUBLE SHOOTING
- 17 -
Checking TX POWER of UMTS 800MHz
G
Measured value and spectrum of TP1

G
G
26.77
24.66
23.34
4. TROUBLE SHOOTING
- 18 -
sTW[jG
G
G

FL1004
B7671
836.5 MHz,881.5 MHz
9 5
7
3
1
2
8
4
6
ANT
GND2
RX_OUT2
GND1
RX_OUT1
TX_IN
GND4
GND3 GND5
DNI
L1031
L1033
1p
L1026
6.8n
TP1
C1053
1.5n
DNI
C1051
MS-156C SW1000
4 3
2
1
ANT COMMON
G3 G4
L1003
68n
L1002
68n
FL1005
SAFEB836MAL0F00
836.5MHz
3 2
4 1
5
GND
IN OUT
G1 G2
100p
L1024
L1032
DNI
L1034
8.2n
C8555
DNI
TP2
TP4
TP3
4. TROUBLE SHOOTING
- 19 -
Run a FTM program set RF
mode to 800 set uplink freq.
To 835 Click Tx On and
WCDMA set PA Range R0 and
R1 on set Tx AGC to 330
Check a
current over
500mA?
Check TP4
over -5dBm?
Check a PAM
(U1004)
Check TP1
over 7dBm?
Check TP1
Check TP
over 4dBm?
Check FL1004
and TP
Check TP3
over 3dBm?
Check TP3
Tx is OK
No
Yes
Yes
Yes
Yes
No
Yes No
No
No
Check RTR
and FL1005?
4. TROUBLE SHOOTING
- 130 -
G

G
26.39
24.43
23.55
23.43 dBm
23.43 dBm
22.55 dBm
4. TROUBLE SHOOTING
- 131 -
sTW[jG
G
G
4.3.3 Checking UMTS PAM Control Block
PAM control signal
TP1 : PWR_DET : UMTS Tx Power Detected value.
TP2, 2* : PA_ON0, PA_ON1 : UMTS2100, UMTS800 PAM enable (about 2.6V)
TP3, 3* : OCP_+VPWR : UMTS2100, UMTS800 PAM Main Voltage ( 3V <VPWR < 4.2V)
G G

TP3
C1098 1n
C1096
100p 100p
C1095
680p
C1094
680p
C1093C1091
4.7u
+VPWR
3
2
0
1
R
0
1
1
56
R1022
1
2
0
1
R
0
1
1
U1004 SKY77704-15
6 5
7 4
8 3
9 2
10 1
11
PGND
VCC1 VCC2
RFIN RFOUT
VMODE_1 CPL_IN
VMODE_0 GND
VEN CPL_OUT
C1104
56p
PA_R0
PA_ON1 PDET_IN
8.5dB
sTW[jG
G
G
4.3.3 Checking UMTS PAM Control Block
PAM control signal
TP1 : PWR_DET : UMTS Tx Power Detected value.
TP2, 2* : PA_ON0, PA_ON1 : UMTS2100, UMTS800 PAM enable (about 2.6V)
TP3, 3* : OCP_+VPWR : UMTS2100, UMTS800 PAM Main Voltage ( 3V <VPWR < 4.2V)
G G

+VPWR
51
R1024
680p
C1092 C1090
680p
100p
C1089
100p
C1088
33p
C1087
SKY77701
U1003
6 5
7 4
8 3
9 2
10 1
11
PGND
VCC1 VCC2
RFIN RFOUT
VMODE_1 CPL_IN
VMODE_0 GND
VEN CPL_OUT
4.7u
C57
PA_ON0
PA_R0
TP3
TP3*
TP2
TP2* TP1
4. TROUBLE SHOOTING
- 13 -
sTW[jG
G
G
4.3.4 Checking RF Rx Level of UMTS 2100/800MHz

9
9
0
1
C
n
8
.
1
C1101
0.5p
L1029
15n
2
8
0
1
C
n
3
.
3
FL1003 B7697
1950MHz, 2140MHz
9 5
8 4
7 2
3
6 1
RX ANT
TX
GND1 GND4
GND2 GND5
GND3 GND6
4.3.4 Checking RF Rx Level of UMTS 2100/800MHz
TP2
FL1002
SAFEB2G14FB0F00
2140MHz
4 5
1
3 2
G1 O1
IN
G2 O2
L1078
2.7n
C1076
0.5p
L1020
1n
C1075
2.2n L1019
1n
C1053
1.5n
DNI
C1051
MS-156C SW1000
4 3
2
1
ANT COMMON
G3 G4
L1003
68n
L1002
68n
TP1
FL1004
B7671
836.5 MHz,881.5 MHz
9 5
7
3
1
2
8
4
6
ANT
GND2
RX_OUT2
GND1
RX_OUT1
TX_IN
GND4
GND3 GND5
DNI
L1031
L1033
1p
L1026
6.8n
TP3*
TP2*
TP3*
TP4
TP4
TP3
4. TROUBLE SHOOTING
- 133 -
Check vbias / vbias over V? Check bias block soldering
No
Yes
Rx is OK
Chack TP1/TP1* signal exist? Check ANT
No
Yes
Check TP / TP*signal exist? Check FEM FL1001
No
Yes
Check TP4 / TP4*signal exist? Check U1007
No
Yes
Set the phone Rx is ON
Check TP3 / TP3*signal exist? Check Duplexer FL1003, FL1004
No
Yes
TP* : UMTS 800 Rx PATH
TP : UMTS 100 Rx PATH
4. TROUBLE SHOOTING
- 134 -
sTW[jG
G
G
4.4 Checking GSM Block
4.4.1 Checking GSM PAM Block
TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.45V
TP2. OCP_+VPWR : PAM Supply Voltage Vcc higher than 3.0V
G G
G
+VPWR
9
1
0
1
R
180
C1060
39p
8
1
0
1
R
120
39p
C1059
R1017
51
SKY77336
U1002
23 22
24 21
25 20
26 19
27 18
28 17
9 8
10 7
11 6
12 5
13 4
14 3
15 2
16 1
DCS_PCS_IN DCS_PCS_OUT
BS GND6
TX_EN GND5
VBATT VCC_OUT
VAPC GND4
NC GND3
GND1 GND2
GSM_IN GSM_OUT
PGND1 PGND12
PGND2 PGND11
PGND3 PGND10
PGND4 PGND9
PGND5 PGND8
PGND6 PGND7
6
1
0
1
R
120
5
1
0
1
R
180
R1014
2.2K
30
R1013
C1070
10u
GSM_PA_EN
GSM_PA_RAMP
GSM_PA_BAND
GND DCS_PCS_TX
GSM_TX
DCS1800(1710-1785 MHz)
PCS1900(1850-1910 MHz)
GSM900(880-915 MHz)
2mm
5dB
8dB
TP2
TP1
4. TROUBLE SHOOTING
- 135 -
sTW[jG
G
G
4.4.2 Checking RF Rx Block of GSM Bands

1.8p C1068
DNI
L1014
18n
L1013
1.8p C1067
C1062 2.2p
L1009
3.9n DNI
L1010
C1064 2.2p
L1008
DNI
C1063 2.2p
L1007
4.7n
FL1001
D5017
850,1900,2100MHz
6 5 4 3 7
11
9
22
21
20
13 24
12 23
10
15 8
14 1
17
16 2
19
18
PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
D
D
V
1
L
R
T
C
2
L
R
T
C
3
L
R
T
C
4
L
R
T
C
C1061 2.2p
RX_PCS_P
RX_PCS_M
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_M
RX_DCS_P
WCDMA_2100_RTX
WCDMA_800_RTX
DCS(1805-1880 MHz)
GSM(925-960 MHz)
PCS(1930-1990 MHz)
TP3
TP3
TP2
TP2
TP1
TP1
4. TROUBLE SHOOTING
- 136 -
*** WCDMA FTM control order using QPST

XG
YG ZG [G
\G
]G
^G
_G
1. Choose mode WCDMA
2. Choose com port
3. Choose FTM
4. Click Mode Control button
5. Choose band 2100MHz or 800MHz
6. Choose channel & enter
7. Tx control pannel
8. Write wanted AGC value & enter WCDMA : 344
*** WCDMA FTM control order using QPST
4. TROUBLE SHOOTING
- 137 -
G
*** GSM FTM control order using QPST

XG
YG ZG [G
\G
]G
^G
_G `G
1. Choose mode GSM
2. Choose com port
3. Choose FTM
4. Click Mode Control button
5. Choose band EGSM or DCS or PCS
6. Choose channel & enter
7. Check on Tx on
8. Write wanted PA DAC value
- GSM : 15000
9. Click PA DAC input button
*** GSM FTM control order using QPST
4. TROUBLE SHOOTING
- 138 -
sTW[jG
G
G
4.5 GPS
4.5.1. GPS RECEIVER
The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the
GPS antenna, through a band pass filter and then an impedance transformer circuit that optimally matches the
impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in Figure 4.1.

G
Figure 4.1. The impedance transformer circuit topology
G

4.5.2. GPS RECEIVER SPECIFICATION
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite -142dBm, 7 satellites -147dBm at coarse time aiding
G
4. TROUBLE SHOOTING
- 139 -
sTW[jG
G
G
4.5.3. GPS OFF-CHIP RF COMPONENTS
4.5.3.1. GPS LNA (RF2815)
The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along
with high gain, achieved by the RF2815 makes it ideal for GPS receivers requiring high sensitivity.
This module builds upon RFMDs leading edge pHEMT process and integrates input matching and low loss high
rejection SAW filter at the output. This results in high performance and a reduced solution size.
The ease of implementation simplifies the receiver design. The RF2185 is packaged in a compact
3.3mmx2.1mmx1.0mm package with low external component count required to achieve the best-in-class
performance. The block diagram of RF2815 is shown in Figure 4.2.
G
Figure 4.2. RF2815 block diagram
G
4. TROUBLE SHOOTING
- 140 -
sTW[jG
G
G
4.6 Bluetooth/WLAN OFF-CHIP RF COMPONENTS
4.6.1. Bluetooth/WLAN Module (LBEH19UNBC-338)
The L-04C device provides the highest level of integration for a mobile wireless system, with integrated
IEEE802.11 b/g, Bluetooth 2.1. The LBEH19UNBC that is included of BCM4325 solution is supported three kinds of
functions. It is the one antenna structure which is supported of WLAN/Bluetooth in 2.4GHz band.

G
Figure 4.3. Block diagram of Bluetooth/WLAN module in L-04C

4. TROUBLE SHOOTING
- 141 -
sTW[jG
G
G
G
G
Figure 4.4. Pin layout of Bluetooth/WLAN module in L-04C
4. TROUBLE SHOOTING
- 14 -
sTW[jG
G
G
G
Table 4.1. Pin description of Bluetooth/WLAN module in L-04C
G
G
G
Table 4.2. Rating of Bluetooth/WLAN module in L-04C
4. TROUBLE SHOOTING
- 143 -
sTW[jG
G
G
G
G
Table 4.3. Operating condition of Bluetooth/WLAN module in L-04C
G
G
G
Table 4.4. Power consumption of Bluetooth/WLAN module in L-04C
G
4. TROUBLE SHOOTING
- 144 -
sTW[jG
G
G
4.6.1.1. BLUETOOTH
The L-04C provides the Bluetooth 2.1 + EDR specification. The Bluetooth module is the optimal solution for any
voice or data application that requires the Bluetooth SIG standard Host Controller Interface (HCI) using a high-
speed UART and PCM.
The Bluetooth solution has an integrated radio transceiver that has been optimized for 2.4GHz Bluetooth
wireless systems. It has been designed to provided low-power, low-cost, robust communications for applications
operating in the globally available 2.4GHz unlicensed ISM band.
It is fully compliant with the Bluetooth Radio Specification and meets or exceeds the requirements to provide
the highest communication link quality of service. It shows the Bluetooth system architecture in the L-04C in
Figure 4.3.

G
Figure 4.5. The Bluetooth system architecture in the L-04C
G G G
4.5.
System HW Block Diagram ; BLUETOOTH & Wi-Fi
i{|hy{{k
nwpv[\
BT_RXD
i{|hy{yk
i{|hy{j{z
i{|hy{y{z
nwpv[\
nwpv[]
nwpv[Z
nwpv[[
i{wjtpu
nwpv]_
nwpv]`
BT/Wi-Fi
ANTENNA
BT_TXD
BT_RTS
BT_CTS
BT_PCM_DOUT
BT_PCM_DIN
i{wjtv|{
i{wjtjsr
i{wjtzuj
nwpv]`
nwpv^X
nwpv^W
BT_RESET_N
BT_WAKEUP
RF_IN_OUT
i{ nwpv W
_ _
BT_PCM_CLK
BT_PCM_SYNC
i{yz{u
nwpv[Y
nwpvXYZ
PM7540
SLEEP_CLK
BT_HOST_WAKEUP
zsllwjsr
nwpv_Z
SLEEP_CLK
i{nwpvW
MSM7227
i{nwpvX
nwpv[Y
PM7540
}kk
}ih{pu
VREG_MSMP_2.6V
VREG_MSMP
nwpv]Y
WLAN_CMD
+VPWR
WLAN_CLK
WLAN_SDIO[3]
WLAN_SDIO[2]
WLAN SDIO[1]
zkpv kX
zkpvkY
zkpvkZ
zkpvjsr
zkpvjtk nwpv]Z
nwpv][
nwpv]\
nwpv]]
nwpv`[
nwpv`Z
jsrylx
~shu ovz{ ~hrl i
_ [ ]
WLAN_SDIO[0]
WLAN_RESET_N
WLAN_WAKEUP
WLAN_REG_ON
WLAN HOST WAKEUP
~shuylnvu
~shu~hrl|w
~shuylzl{u
zkpvkW
zkpvkX
LDO
nwpvYZ
nwpv]]
nwpv]^
nwpvXYY
26MHZ
TCXO
mjsrpu
nwpv`[
BT / Wi-Fi
~shuovz{~hrli
WLAN_HOST_WAKEUP
VDD_TCXO
LBEH19UNBC-338
4. TROUBLE SHOOTING
- 145 -
sTW[jG
G
G
4.6.1.2. WLAN
The L-04C supports single-band 2.4GHz IEEE802.11b/g standardization. The WLAN module which is consisted of
the BCM4325 single chip device provides for the highest level of integration for a mobile or handheld wireless
system, with integrated IEEE802.11TM b/g (MAC/baseband/radio).
The BCM4325's integrated CMOS WLAN 2.4GHz power amplifier provides sufficient output power to meet the
need of most WLAN devices. The interface between MSM7227 and WLAN module is the standard interfaces SDIO
v1.2 (4-bit and 1-bit). Figure 4.4 shows the WLAN system architecture in the L-04C.

G
Figure 4.6. The WLAN system architecture in the L-04C
G
4. TROUBLE SHOOTING
- 146 -
sTW[jG
G
G
4.7 GPS, Wi-Fi/BT RF COMPONENTS
4.7.1. GPS RF COMPONENTS

G
Figure 4.7. GPS RF component, Main Bottom side
G
G
Reference Description
ANT801 GPS Chip Antenna
FL1000 GPS Saw Filter
U1001 GPS LNA

Table 4.5. GPS RF components

G G
4. TROUBLE SHOOTING
- 147 -
sTW[jG
G
G
4.7.2. BT/Wi-Fi RF COMPONENTS

G
Figure 4.8. BT/Wi-Fi RF component, Main Bottom side
4. TROUBLE SHOOTING
- 148 -
sTW[jG
G
G
G
G
Figure 4.9. BT/Wi-Fi RF component, Main Top side
G
G
Reference Description
ANT800 BT/Wi-Fi Chip Antenna
U802 BT/Wi-Fi TCXO LDO
U800 BT/Wi-Fi Module
Table 4.6. BT/Wi-Fi RF components
G
4. TROUBLE SHOOTING
- 149 -
sTW[jG
G
G
4.8 GPS, Wi-Fi/BT SIGNAL PATH
4.8.1. GPS SIGNAL PATH

G
Figure 4.10. GPS signal path (GPS Rx path)
G
G
G
G
G
G
4. TROUBLE SHOOTING
- 150 -
sTW[jG
G
G
4.8.2. BT/Wi-Fi SIGNAL PATH
G
Figure 4.11. BT/Wi-Fi Signal Path (BT/Wi-Fi Tx Rx Path)
G
4. TROUBLE SHOOTING
- 151 -
sTW[jG
G
G
4.9 GPS, BT/Wi-Fi TROUBLE SHOOTING
4.9.1. A-GPS BLOCK
G
Figure 4.12. Test Points of LNA for the GPS in the L-04C (Schematic)

G
G
Figure 4.13. Test Points of LNA for the GPS in the L-04C
C8554
2.5p
C8553
1n
L1000 8.2n
R1002
1K
C1016
15n
C1050
DNI
L8056 1n
p
0
0
1
0
4
0
1
C
RF2815
U1001
3
2
5
4
1
N
I
_
F
R
FIL_OUT
VDD
S_D
GND
C1019 33p
C1018
DNI
VREG_RFRX1_2.7V
DNI
C1017
FL1000
SAFEB1G57KB0F00
1575.42 MHz
5 3 2
4 1
IN OUT
G1 G2 G3
C1007
18p
DNI
C1015
C1014
0.1u
C1039
5.6n
ANT801
ODGPPTR3015
2
3 1
4
DUMMY3
FEED DUMMY2
DUMMY1
L1011
100n
L1001 5.6n
GPS_LNA_EN
GPS_IN
TP1
TP2
4. TROUBLE SHOOTING
- 15 -
Set the GPS is ON
The Voltage level
at TP1.7V
Check power LRC fter soldering.
No
Yes
Check the RTR circuit and the peripheral
circuit or the other parts.
The Voltage level
at TP.6V
Check SW and NV item
No
Yes
4. TROUBLE SHOOTING
- 153 -
4.9.2. BT/Wi-Fi BLOCK
U800
LBEH19UNBC-338
0
3
9
2
8
2
7
2
6
2
5
2
4
2
3
2
2
2
1
2
0
2
9
1
8
1
7
1
6
1
31
32 15
14
33
34 13
35 12
36 11
37 10
38 9
39 8
40 7
6
41 5
4
42
43 3
44 2
45
1
6
4
7
4
8
4
9
4
0
5
1
5
2
5
3
5
4
5
1
D
N
G
2
D
N
G
3
D
N
G
4
D
N
G
B
_
E
K
A
W
_
T
S
O
H
_
L
W
D
X
T
_
T
R
A
U
_
T
B
N
_
S
T
C
_
T
R
A
U
_
T
B
N
_
S
T
R
_
T
R
A
U
_
T
B
D
X
R
_
T
R
A
U
_
T
B
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
B
B
2
X
L
V
_
R
S
B
B
T
U
O
V
_
R
S
OI
D
D
V
U
P
_
L
A
T
X
D
S
_
OI
D
D
V
T
U
O
_
2
P
1
_
G I
D
T
U
O
_
2
P
1
_
G
L
N
A
O
D
L
V
2
P
1
_
NI
V
T
U
O
_
2
O
D
L
N
L
A
D
S
_
T
B
L
C
S
_
T
B
1
OI
D
U
A
2
OI
D
U
A
N
_
T
S
R
_
T
B
7
D
N
G
R801
11K
L8055
4.7u
7
1
5
8
R
0
10u
C822
C8547
1u
3.3u L803
VREG_MSMP_2.6V
0.1u
C817
600
FB8501
2.2u
C8535
0.1u
C8543
4.7u
C816
0.1u
C823
2.2u
C8538
VREG_MSMP_2.6V
4.7u
C813
4.7u
C8541
10u
C8534
+VPWR
0.1u
C814
8.2p
C8544
TP4
TP10
TP3
TP2
TP6 TP7
TP8
TP9
BT_RESET_N
P
U
E
K
A
W
_
T
S
O
H
_
N
A
L
W
WLAN_RESET_N
SLEEP_CLK
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_DOUT
WLAN_CLK
WLAN_CMD
BT_WAKEUP
WLAN_SDIO[0]
WLAN_SDIO[2]
WLAN_SDIO[1]
BT_PCM_DIN
BT_HOST_WAKEUP
WLAN_SDIO[3]
D
X
T
_
T
R
A
U
_
T
B
D
X
R
_
T
R
A
U
_
T
B
S
T
C
_
T
R
A
U
_
T
B
S
T
R
_
T
R
A
U
_
T
B
WLAN_WAKEUP
CLK_REQ
CLK_IN
RF_IN_OUT
WLAN_REG_ON
TP2
TP1
Figure 4.14. BT/Wi-Fi module (LBEH19UNBC-338)
C825
2.2u
VDD_TCXO
+VPWR
K
0
0
1
5
0
8
R
C824
1u
BU28TD2WNVX U802
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
CLK_REQ
TCXO LDO
3
0
6
0
3
0
6
0
Figure 4.17. BT/Wi-Fi Main Clock part
TP3
TP4
4. TROUBLE SHOOTING
- 154 -
sTW[jG
G
G
G
Figure 4.18. Test Points of BT/Wi-Fi in the L-04C, main top
G
G
Figure 4.19. Test Points of BT/Wi-Fi in the L-04C, main bottom
4. TROUBLE SHOOTING
- 155 -
Activate Bluetooth/WiFi
The Voltage level at
TP1.6V, TP3.5V
Yes
Chang the main board
Check power circuit
No
The Voltage level is
1.V<TP3<3V
Yes
The Voltage level at
TP4=.8V
Yes
Check BT Ant, matching or flter.
No
Check TCXO LDO
No
Dose the Bluetooth/Wi-Fi
function work well?
No
4. TROUBLE SHOOTING
- 156 -
4.10 Power ONTroubleshooting
4. Troubleshooting
Power On sequence of L-04C is :
PWR key press (Main PCB) KEY_PWR_N go to low,PM7540 KPD_PWR_ON_N pinPM7540 Power Up
VREG_MSMC1_1.25V(C749), VREG_MSMC2_1.25V(C750) VREG_MSME_1.8V(C751), VREG_MSMP_2.6V(C768),
VREG_MSMA_2.6V(C767), VREG_TCXO_2.85V(C772) power up and system reset assert to MSM Phone
booting and PS_HOLD(R772) assert to PMIC.
Start
Check the Battery voltage.
higher than 3.23V?
Change or charge the
Battery
NO
TP1 high to low
when key press?
Check the Key Dome
Or Check Main PCB
YES
YES
NO
TP2/TP3 is1.35V?, TP4 is 1.8V?
TP5 is 2.6V,? TP6 is 2.6V?,
TP7 is 2.85V?
Change the Main board
NO
Is clock ok?
TP8 : 19.2M
TP9 : 32.768khz
Check the TXCO & Crystal
YES
YES
NO
TP1 high to low
when key press?
Yes
Change or charge the
Battery
No
TP/TP3 is1.35V?,
TP4 is 1.8V? TP5 is .6V,? TP6 is .6V?,
TP7 is .85V?
START
Yes
Is clock ok?
TP8 : 19.M, TP9 : 3.768khz
Yes
Check the Battery voltage.
higher than 3.3V?
Yes
Check the Key Dome
or Check Main PCB
No
No
Check the TXCO & Crystal
No
4. TROUBLE SHOOTING
- 157 -
4. Troubleshooting
TP2
TP3
TP6
M i b d TOP
TP4
TP5
TP7
TP9
Main board, TOP
TP1
Slide FPCB, TOP
TP8
Main board, TOP
4. TROUBLE SHOOTING
- 158 -
C779
33p
1
5
7
C
u
0
1
u
0
1
2
5
7
C
VREG_FEM_2.7V
0
0
7
X
5
3
1
-
C
F
z
H
K
8
6
7
.
2
3
2
1
R723 0
4.7u C754
C744
4.7u
2.2u
C761
2.2u
C771
4.7u
C768
4.7u
ELCP0008004
L703
VREG_TOUCH_3.0V
22p C774
22p C776
200K
R722
TP702
ELCP0008012
4.7u L701
9
4
7
C
u
2
2
VREG_LCD_1.8V
L704
ELCP0008004
4.7u
C760 2.2u
5
4
7
C
n
1
VREG_MSME_1.8V
C765
2.2u
VREG_RFRX1_2.7V
E10
F10
C12
M12
K7
N13
M13
G10
D9
H12
C13
A13
A12
G12
G1
M1
D13
E12
N11
A3
A10
A8
H13
G13
A11
K13
E13
B13
A9
N12
J13
A2
M4
N4
M9
N10
M6
N6
M8
N8
J1
K1
VSW_5V
VREG_5V
VSW_MSMC1
VREG_MSMC1
VSW_MSMC2
VREG_MSMC2
VSW_MSME
VREG_MSME
VSW_PA
VREG_PA
VREG_GP1
VREG_GP2
VREG_GP3
VREG_GP4
VREF_GP5
VREG_GP6
VREG_MMC
VREG_MSMA
VREG_MSME2
VREG_MSMP
VREG_RFRX1
VREG_RFRX2
VREG_RFTX
VREG_RUIM1
VREG_SYNT
VREG_TCXO
VREG_USB
VREG_WLAN
MIC_BIAS
REF_ISET
REG_GND
REF_BYP
TCXO_IN
TCXO_EN
TCXO_OUT
XTAL_IN
XTAL_OUT
SLEEP_CLK
AMUX_OUT
KPD_PWR_N
PON_RESET_N
PS_HOLD
R715 121K
VREG_TCXO_2.85V
R716 51
8
4
7
C
n
1
C762
2.2u
C770
2.2u
VREG_MSMC1_1.25V
VREG_MMC_3.0V
0.1u C773
n
1
6
4
7
C
VREG_RUIM_3.0V
C763
2.2u
VREG_MSMA_2.6V
2.2u
C766
VREG_MSMC2_1.25V
VRF_SMPS_2.1V
n
1
7
4
7
C
C772
1u
VREG_MSMP_2.6V
SDB310Q
D701
2.2u
C769
KDS114E-RTK_HA
D702
ELCP0008012
4.7u L702
0
5
7
C
u
7
.
4
+VPWR
1n C753
+VPWR_AUDIO
4.7u
C767
VREG_AUX2_2.9V
VREG_LCD_2.8V
C759 2.2u
2.2u
L700
PMIC_TCXO
TCXO_PM_19.2MHZ
JTAG_PS_HOLD
TCXO_EN
SLEEP_CLK
PS_HOLD
nPON_RST
AMUX_OUT
KPD_PWR_N
VSNS_RF_SMPS
VSNS_MSMC2_1.25V
VSNS_MSMC1_1.25V
VSNS_MSME_1.8V
2010.03.20
2009.11.18
0.3mm 0.3mm
09.11.12
Turbo Mode
0603
NDK --> EPSON
0603
0603
Route together
0.6mm
These CAPs close to inductors
0.6mm
0.6mm
Place in PM7540 room at shield edge
Local Ground Plan
0.5mm
1%
Place crystal and load caps close to PM7540
TP2
5
0
1
A
V
KB102
KPD_PWR_N
END
R10 0
10n
C313
R306
100
19.2MHz
X300
4 2
3 1
VCONT OUT
GND VCC
C309
100p
33
R309
C312 1n
1n
C314
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C315 100p
C316
0.1u
100K
R313
0.1u
C319
NC7SV00P5X_NL
U301
3
2
4
1
5
VCC
GND
SC1
1
SC2
1
TCXO_RTR_19.2MHZ
TCXO_PM_19.2MHZ
TCXO_EN
USBH_SYSCLK
RTR_TRK_LO_ADJ
1.0T
TCXO Circuit
Clesed to TCXO
TP3
TP4
TP6
TP5
TP7
TP9
TP1
TP8
4. TROUBLE SHOOTING
- 159 -
4.11 Charger Troubleshooting
Check the pin and battery
Connect terminals of I/O connector
Connection OK?
Yes
Change I/O connector
No
START
Is the TA voltage 5.4V?
Yes
Change TA
No
Is the TP3 4.6V?
Yes
Check U700 And FL700 or
Change the Main Board
Is it charging properly
After turning on Q1, Q, Q3?
No
END
Yes
4. TROUBLE SHOOTING
- 160 -
4. Troubleshooting
5.4V
TP3
4. TROUBLE SHOOTING
- 161 -
C703
1u
SC3
4
3
2
1
CN700
HSMU-5SB-24DR2
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
D700
C704
22p
C702
22p
ZD700
FL700
NFM18PC104R1C3
1
IN OUT
GND1 GND2
C705
1u
VCHG_VBUS
U700
MAX14528
9 6
5 3
4
8 2
7 1
IN1 OUT1
IN2 OUT2
IC1
OVLO IC2
D
N
G
D
N
G
P
USB_ID
MAX_DM
MAX_DP
2mm 2mm
u-USB Connector
VBUS 2mm TP2
Troubleshooting Procedure
- Check the charger connector:TP
- Check the Current path :TP3 / TP4
- Check the battery
Charging Procedure
- Connect TA
- Control the charging current by PM7540 IC
Charging current fows into the battery
Troubleshooting Setup
- Connect TA and battery to the phone
Check Point
- Connection of TA
- Charging current path
- Battery
Check Charging Current
- Idle 500mA
- Voice Call 500mA (Alternative)
Q1
QST4
3 2 1
4 5 6
VCHG_VBUS
Q3
SIA431DJ
S1 S2
G
D1 D2 D3 D4 D5
5
C
u
3
3
Q2
QST4
3 2 1
4 5 6
3
1
7
R
1
.
0
VBAT
+VPWR
R16
51
10n
C757
+VPWR
BATT_FET_N
CHG_CTL_N
ISNS_P
ISNS_M
1%
2mm
Battery Charging Circuit
10V
1608
2mm
TA
(5.4V)
Main
Battery
TP3
TP4
4. TROUBLE SHOOTING
- 16 -
4.12 USB Troubleshooting
USB Initial sequence of L-04C is :
USB connected to L-04C power on VCHG_VBUS IC1 (USB_ID) USBH_DP/DM and UART_TX/RX USB work.
Cable is inserted?
Yes
Insert cable
No
START
TP1 is 5V?
Yes
Check U700
No
TP is High?
Yes
Check IC1 or
Change Main Board
TP3 Is triggered?
Yes
Check IC1 or
Change Main Board
No
Power is on?
Yes
Go to power on trouble
shooting
No
TP4 Is triggered?
Yes
Check MSM77 or
Change Main Board
No
No
4. TROUBLE SHOOTING
- 163 -
8
0
7
R
K
7
.
4
10n
C725
TS5USBA33402YZPR
IC1
4
B
D2
B2
A1 A2
B3
C2
A4
C1
A3 D1
E4
D3 D4
E3
E2 C3
E1 C4
1
B
Y
L
P
P
U
S
V
UART_TX VBUS
UART_RX DM
DP
USB_DM ID
USB_DP
AUDIO_L R2_2K
AUDIO_R
MIC
DSS
_INT
SDA CLDO
SCL
GND
T
E
S
I
2.2K
R705
C724
0.1u
VCHG_VBUS
K
2
7
0
7
R
6
0
7
R
K
2
VREG_MSMP_2.6V
C721
0.1u
+VPWR
USBH_DM
USBH_DP
MUIC_INT
MUIC_I2C_SCL
MUIC_I2C_SDA
UART2_TXD
UART2_RXD
USB_ID
MAX_DM
MAX_DP
MUIC
TP2
C703
1u
SC3
4
3
2
1
CN700
HSMU-5SB-24DR2
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
D700
C704
22p
C702
22p
ZD700
FL700
NFM18PC104R1C3
1
IN OUT
GND1 GND2
C705
1u
VCHG_VBUS
U700
MAX14528
9 6
5 3
4
8 2
7 1
IN1 OUT1
IN2 OUT2
IC1
OVLO IC2
D
N
G
D
N
G
P
USB_ID
MAX_DM
MAX_DP
2mm 2mm
u-USB Connector
VBUS 2mm
TP1
TP3
TP4
4. TROUBLE SHOOTING
- 164 -
4. Troubleshooting 4. Troubleshooting
TP1
TP2
TP4
TP3
4. TROUBLE SHOOTING
- 165 -
4.13 RUIM Detect Troubleshooting
RUIM Initial sequence of L-04C is :
SIM_CLK, SIM_RST,SIM_IO triggered VREG_RUIM_3V go to 3V RUIM IF work
Re-insert the RUIM card
Work well?
No
END
Yes
START
TP1 is 3V?
TP is triggered ?
Check J800
No
Work well?
No
END
Yes
Change RUIM card
4. TROUBLE SHOOTING
- 166 -
4. Troubleshooting
TP1
TP2
TP1
TP2
TP1
Main Bottom
C801
22p 22p
C800
0
0
8
R
K
7
.
4
J800
ENSY0024301
KP09N-6S-2_54SF
9 8
10 7
6 3
5 2
4 1
VCC GND1
RST VPP
CLK IO
GND2 GND5
GND3 GND4
22p
C803 C802
0.1u
C804
10p
VREG_RUIM_3.0V
SIM_IO SIM_CLK
SIM_RST
TP2
TP1
4. TROUBLE SHOOTING
- 167 -
4.14 3 Mega Camera Troubleshooting
3 Mega Camera control signals are generated by MSM77.
Check the camera connector and
reconnect the camera
Camera is OK?
No
END
Yes
START
TP1 is1 V?, TP is 1.8V?
TP3 is .7V?, TP4 is .8V?
Yes
Change the Qwerty board
No
Camera is OK
No
END
Yes
Change the camera
TP6 is the MCLK?
Yes
No
Check the TP5 (PCLK)
Yes
No
MCLK: 6 Mhz
PCLK : 7 Mhz
4. TROUBLE SHOOTING
- 168 -
10u
C119
VREG_CAM_AVDD_2.7V
R110 12
GB042-34S-H10-E3000
CN101
17
16
15
14
13
12
11
10
9
8
7
6
5
31 4
32 3
33 2
34 1
30
29
28
27
26
25
24
23
22
21
20
19
18
VREG_CAM_DVDD_1.2V
120
FB102
C117
0.1u
VREG_CAM_AF_2.8V
VA1
VREG_CAM_IOVDD_1.8V
C3
DNI
0.1u
C114
C113
0.1u
FB101
120
0.1u
C112
VA101
C111
1u
33p
C120
CAM_PWDN
CAM_RESET_N
FLT_CAM_DATA[7]
FLT_CAM_DATA[6]
FLT_CAM_DATA[5]
FLT_CAM_DATA[4]
FLT_CAM_DATA[3]
FLT_CAM_DATA[2]
FLT_CAM_DATA[1]
FLT_CAM_DATA[0]
CAM_MCLK
CAM_PCLK
FLT_CAM_VSYNC
FLT_CAM_HSYNC
FLT_CAM_I2C_SDA
FLT_CAM_I2C_SCL
TP5
Qwerty To Camera Connector
TP6
TP3
TP1
TP2
TP4
4. TROUBLE SHOOTING
- 169 -
4. Troubleshooting
Qwerty BD
TP1 TP2 TP3 TP4 TP6
TP5
TP 5 TP 6
4. TROUBLE SHOOTING
- 170 -
4.15 Keypad Backlight Troubleshooting
Key Pad LED Light is on as below :
Key pressing QT_KPD_DRV_N is Low KEYPAD LED Lighting (on)
Key press
TP1 s Low
Yes
Chage Dome Sheet
No
START
Battery voltage is higher
Than 3.8V?
Yes
Change the Battery
No
4. TROUBLE SHOOTING
- 171 -
TP1
TP1
LD305
4
3
2
1
LD304
4
3
2
1
LD303
4
3
2
1
+VPWR
LD301
4
3
2
1
5
3
3
R
0
VA321
C301
1u
33 R330
R329 33
33 R328
R327 33
QT_KPD_DRV_N
TP1
4. TROUBLE SHOOTING
- 17 -
4.15 Keypad Backlight Troubleshooting
Key Pad LED Light is on as below :
Key pressing QT_KPD_DRV_N is Low KEYPAD LED Lighting (on)
Key press
TP1 s Low
Yes
Chage Dome Sheet
No
START
Battery voltage is higher
Than 3.8V?
Yes
Change the Battery
No
4. TROUBLE SHOOTING
- 173 -
TP1
TP1
TP1 TP1
magnet
D207
D208
U202
3 2
4 1
VDD OUT
VSS NC
100n
C203
VREG_MSMP_2.6V
C202
0.1UF
SLIDE_DETECT
SLIDE DETECT
Changed 03/24
Active : Low
TP1
4. TROUBLE SHOOTING
- 174 -
4.16 Main LCD Troubleshooting
Main LCD control signals are generated by MSM77. The signal path is :
MSM77 CN40 BtoB CN CN401 CN103 CN10 LCD Moudle
Press END key
Key LED is on?
Yes
GO to power on trouble
shooting
No
START
Check the solder of and reconnect
LCD display OK? END
Yes
Change the LCD Module
LCD display OK?
No
END
Yes
Change the Folder Assy
LCD display OK?
No
END
Yes
Change the Qwerty Board END
Yes
No
Change the Main Board
Yes
4. TROUBLE SHOOTING
- 175 -
4.17 Receiver Path
MSM77 RCV+/RCV- AMP (U701) Main to Qwerty PCB Qwerty PCB to RF_Slide FPCB SPK&RCV
Can you hear the tone?
No
END
Yes
START
The sine wave appears at TP1?
No
Change SPK&RCV
Yes
Check the solder of
CN01,CN401 and reconnect
The sine wave appears at TP?
No
Change RF_Slide FPCB
Yes
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
No
4. TROUBLE SHOOTING
- 176 -
4. Troubleshooting
TP1
TP1
p
9
3
5
0
1
C
4
0
1
C
p
9
3
CN101
2
1
1
0
1
D
0
0
1
D
SPK_RCV-
SPK_RCV+
TP1
4. TROUBLE SHOOTING
- 177 -
4. Troubleshooting
TP2
TP2
VREG_TOUCH_3.0V
GB042-50P-H10-E3000
CN102
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50 1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
SPK_RCV-
SPK_RCV+
PROX_OUT
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SDA
WLED7
WLED6
WLED1
WLED2
WLED3
WLED4
WLED5
VCOIN
TP2
4. TROUBLE SHOOTING
- 178 -
4. Troubleshooting
4.19 Headset path
MSM7227 HPH_R, HPH_L AMP (U701) J201 (3.5 Ear jack)
Start
YES
equipment and setup call.
Setup 1KHz tone out
and insert headset.
END
YES
Sine wave appears
at TP1?
Change the Headset
NO
NO
NO
YES
Sine wave appears
at TP2?
Change the Qwerty_Key PCB
4.18 Headset path
MSM77 HPH_R, HPH_L AMP (U701) J01 (3.5 Ear jack)
No
END
Yes
START
No
Change the Headset
Yes
No
Change the Qwerty_Key PCB
Yes
Connect
the phone to network
equipment and setup call.
Setup 1KHz tone out
and insert headset.
4. TROUBLE SHOOTING
- 179 -
4. Troubleshooting
TP1 (L, R)
Ear_Jack
TP1 (R)
TP1 (L)
Qwerty bottom
1800
FB201
J201
2
3
6
5
4
1 M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
TP1(R)
TP1(L)
4. TROUBLE SHOOTING
- 180 -
TP2
Amp
TP2
Main Top Main Top
FB701
600
C710
39p
3
0
7
R
0
2
4
0
7
R
0
2
R724 47K
C783
10u
C711
39p
C712
39p
C713
39p C715
0.1u
R725 47K C717 1u
C716 1u
C707 47n
47n C706
K
7
.
4
1
1
R
9
R
K
7
.
4
VREG_MSMP_2.6V
0.1u
C701 C700
2.2u
C714
0.1u
C900
2.2u
470n C708
C709 470n
U701
WM9093ECS-R
3
B
A4
C3
C2
2
B
D1
D3
4
D
C1
A1 D2
1
B
D5
A2
A5
A3
B5
4
B
C5
4
C
D
N
G
OUT+
D
D
V
P
H
CPVDD
CPVSS
CN
HPL
OUT-
S
A
I
B
IN2- HPR
IN1+
D
D
V
S
IN3-
IN2+
A
D
S
IN1-
IN3+
CP
L
C
S
C722
2.2u
+VPWR_AUDIO
2.2u
C719
2.2u
C723
2.2u C720
VREG_MSME_1.8V
HPH_L
HPH_R
RCV_N
RCV_P
SPK_RCV-
SPK_RCV+ LINE_OP
LINE_ON
EAR_R
EAR_L
AUDIO_I2C_SDA
AUDIO_I2C_SCL
AUDIO SUBSYSTEM
TP2
4. TROUBLE SHOOTING
- 181 -
4.19 Speaker phone path
MSM77 LINE_ON, LINE_OP AMP (U701) Main to Qwerty PCB Qwerty PCB to RF_Slide FPCB SPK&RCV
No
END
Yes
START
No
Change SPK&RCV
Yes
Check the solder of
CN01,CN401 and reconnect
No
Change RF_Slide FPCB
Yes
Equipment and setup call
Setup 1KHz tone out
No
4. TROUBLE SHOOTING
- 18 -
4. Troubleshooting
TP1
TP1
p
9
3
5
0
1
C
4
0
1
C
p
9
3
CN101
2
1
1
0
1
D
0
0
1
D
SPK_RCV-
SPK_RCV+
TP1
4. TROUBLE SHOOTING
- 183 -
4. Troubleshooting
TP2
TP2
TP2
VREG_TOUCH_3.0V
GB042-50P-H10-E3000
CN102
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50 1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
SPK_RCV-
SPK_RCV+
PROX_OUT
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SDA
WLED7
WLED6
WLED1
WLED2
WLED3
WLED4
WLED5
VCOIN
TP2
4. TROUBLE SHOOTING
- 184 -
4.20 Main microphone
MIC1 MIC1P
TP1 is 1.8V ?
Yes
Change Qwerty Board
No
START
Yes
Change the MIC
No
Make a call
Make sound to MIC
Yes
Work well? END
Yes No
4. TROUBLE SHOOTING
- 185 -
4. Troubleshooting
TP2
TP1
TP1
TP2
MIC1
6
5
4
3
2
1
OUT
G1
G2
G3
PWR
G4
1
0
2
R
I
N
D
5
1
2
C
p
5
1
4
1
2
C
u
0
1
3
1
2
C
p
7
4
FB1
1800
MIC_1P
MIC_1N
MIC_BIAS
TP2
TP1
4. TROUBLE SHOOTING
- 186 -
4.21 Headsetmicrophone
Headset ZD06 MICP
No
END
OK
START
TP1 is High?
Yes
Change the MAIN board
No
Change the Main PCB
TP is .6v?
Yes
Change the Qwerty Board
No
Change the headset and retry
Make a call
Yes
Change the headset or
Qwerty Board and retry.
No
Yes
4. TROUBLE SHOOTING
- 187 -
3
1
2
R
I
N
D
ZD201 ZD202
ZD205
C216
100p
4
1
2
R
I
N
D
FB202 1800
FB203 1800
C206
4.7u
R216
100K
1800 FB201
0.1u
C212
47p
C210
33p
C208
2.2u
C207
9
1
2
R
K
7
4
47p
C204
4
0
2
D
VREG_MSMP_2.6V
K
2
.
2
3
0
2
R
33p
C201
2
0
2
D
1
0
2
D
2
0
2
R
K
0
0
1
1800
FB204
U201
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
0
0
1
Q
D
G
S
0
2
2
R
M
1
VREG_MSMP_2.6V
J201
2
3
6
5
4
1 M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
HOOK_ADC
EAR_R
EAR_L
HS_MIC_BIAS_EN
HS_MIC
EAR_SENSE
AUDIO_GND
3.5 EAR_JACK
MATING
EAR_SENSE
UNMATING
STATE
LOW(DEFAULT)
HIGH
5/10 Added
4. Troubleshooting
TP1
TP2
TP3
< Main Bottom >
TP1
TP3
TP2
TP2
TP3
TP1
4. TROUBLE SHOOTING
- 188 -
4.22 Vibrator
MSM77 (MOTOR_PWM) U601 Motor
START
TP1 is PWM?
Yes
Check the MAIN or Replace
No
Change vibrator
Check TP signal exist ?
Ch k th U601
Check the Or Replace
No
Operate the Vibrator
Yes
No
Key Function is OK?
No
No
No
4. TROUBLE SHOOTING
- 189 -
TP1
TP2
TP2
CN601
2
1
L511 100n
L512
100n
5
2
3
A
V
4
2
3
A
V
Q601
C
B
E GND
IN
OUT
R619
100K
TPA6202A1ZQVR
U601
B2 C1
A1 B1
B3 C2
A3 C3
IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
K
1
7
1
6
R
100K
R622
51K
R620
51K
R621
C638
0.1u
10n C640
8
1
6
R
K
1
K
7
.
4
3
2
6
R
C639
1u
MOTOR_PWM
CONNECTOR Type
%
1
%
1
1%
Q-coin MOTOR
1%
1%
1%
TP1
TP2
4. TROUBLE SHOOTING
- 190 -
4.23 SD card operation
START
Check TP1 Level High?
Yes
Check the R1 & Re soldering
No
Check TP Level 3V?
Yes
Reconnect BtoB or
Check U704(Main PCB)
No
Yes
Check TP3, TP4 Signal is exist? Change Qwerty PCB
No
SD card operation is OK?
END
Low level : 0V
High level : 3V
4. TROUBLE SHOOTING
- 191 -
ZD206
CN1
16
8
7
6
5
4
3
2
1 15
G5 G3 G1 CD
C1
C2
C3
C4
C5
C6
C7
C8
G6 G4 G2 COM
G7
2
1
2
R
s
m
h
o
K
0
0
1
0.1u
C205
K
7
4
1
1
2
R
6
0
2
D
4
3
5
2
6
1
VREG_MSMP_2.6V
R210 2.2
VREG_MMC_3.0V
5
0
2
D
4
3
5
2
6
1
K
7
4
9
0
2
R
8
0
2
R
K
7
4
K
7
4
7
0
2
R
K
7
4
6
0
2
R
MMC_CLK
MMC_CMD
MMC_DATA[3]
MMC_DATA[2]
MMC_DATA[1]
MMC_DATA[0]
MICROSD_DET_N
Open
Detect
Close (Detect =COM)
S/W
LOW (Detect)
HIGH (Normal)
Micro SD Socket
TP2
TP3
TP4
TP1
4. TROUBLE SHOOTING
- 19 -
4. Troubleshooting
TP2
TP1
TP3 TP4
TP1
4. TROUBLE SHOOTING
- 193 -
4.24 Touch Troubleshooting
Touch Window
Press Touch Window
Yes
Change theTouchWindow
No
TP is triggered ?
Yes
Reconnect RF Slide FPCBConnector
with Touch Window
No
Yes
TP1 is 3V ? Reconnect BtoB Connector
No
Touch operating OK?
END
4. TROUBLE SHOOTING
- 194 -
CN100
GB042-10P-H10-E3000
6 5
7 4
8 3
9 2
10 1
6
0
1
A
V
7
0
1
A
V
C109
1u
8
0
1
A
V
VREG_TOUCH_3.0V
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SDA
Touch Connector
4. Troubleshooting
TP2
TP1
TP2
TP1
TP1
TP2
Touch WindowConnector RF Slide FPCB Connector Touch Window Connector RF Slide FPCB Connector
TP2
TP2
TP1
4. TROUBLE SHOOTING
- 195 -
4.25 Proximity Sensor Troubleshooting
Proximity Some Objects
Cognition Objects?
Yes
Reconnect CN10 to Qwerty
Board
No
Change the RF Slide FPCB
TP is LOW ?
Yes
Check the U100 or Replace
No
Yes
TP1 is .6V ? Change the Qwerty Board
No
Compass operating OK?
END
4. TROUBLE SHOOTING
- 196 -
4. Troubleshooting
TP2
TP1
TP1
TP2
RF Slide FPCB BOT RF Slide FPCB TOP
R100
4.7
u
1
1
0
1
C
TP100
0.1u
C103 C102
4.7u
R101
10
C100 4.7u
U100 GP2AP002S00F
5 4
6 3
7 2
8 1
LEDA SCL
LEDC SDA
VCC VIO
VOUT
GND
PROX_OUT
Proximity Sensor
Tuning point
TP1
TP2
4. TROUBLE SHOOTING
- 197 -
4.26 Digital Compass Troubleshooting
Navigate Compass
The needle of a compass moving?
Yes
Reconnect CN401 to Qwerty
Board
No
Cognition Objects?
Yes
Check the U1 or Replace
No
Yes
TP is triggered ? Change the Main board
No
Compass operating OK?
END
4. TROUBLE SHOOTING
- 198 -
470n
C2
6
R
K
3
.
3
1
C
n
0
1
U1
AMI304
12
11
10
9
5
4
6
3
7
2
8
1
D
D
V
D
G
E
R
V
A
D
N
G
S
D
N
G
D
D
V
A
ADDR
SCL
NC1
T
N
I
VPP
DRDY
SDA
K
3
.
3
7
R
TP1
0 R2
R4 0
COMPASS_DRDY
4. Troubleshooting
TP2
TP1
TP1
TP2
Qwerty Board BOT Qwerty Board TOP
TP1
TP2
TP2
5. DOWNLOAD
- 199 -
5. DOWNLOAD
- 164 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
5. DOWNLOAD
5. DOWNLOAD
L-04C
L-04C
5. DOWNLOAD
- 00 -
LGE Internal Use Only - 165 -
5. DOWNLOAD
L-04C
L-04C
L-04C
5. DOWNLOAD
- 01 -
- 166 -
5. DOWNLOAD
L-04C
L-04C
5. DOWNLOAD
- 0 -
5. DOWNLOAD
L-04C
L-04C
L-04C
5. DOWNLOAD
- 03 -
- 168 -
5. DOWNLOAD
L-04C
5. DOWNLOAD
- 04 -
5. DOWNLOAD
5. DOWNLOAD
- 05 -
- 170 -
5. DOWNLOAD
5. DOWNLOAD
- 06 -
5. DOWNLOAD
5. DOWNLOAD
- 07 -
- 172 -
5. DOWNLOAD
5. DOWNLOAD
- 08 -
5. DOWNLOAD
5. DOWNLOAD
- 09 -
- 174 -
5. DOWNLOAD
L-04C
L-04C
L-04C
L-04C
L-04C
L-04C
L-04C L-04C
5. DOWNLOAD
- 10 -
5. DOWNLOAD
L-04C L-04C
L-04C L-04C
L-04C
L-04C L-04C
5. DOWNLOAD
- 11 -
- 176 -
5. DOWNLOAD
L-04C L-04C
L-04C
L-04C
6. BLOCK DIAGRAM
- 1 -
6.Block diagram
Elini Total Block Diagram
6. BLOCK DIAGRAM
- 13 -
System HW Block Diagram ; RF
6. BLOCK DIAGRAM
- 14 -
System RF Block Diagram ; Control signals and Clocks
6. BLOCK DIAGRAM
- 15 -
System HW Block Diagram ; BLUETOOTH & Wi-Fi
6. BLOCK DIAGRAM
- 16 -
System HW Block Diagram ; Memory, MICRO-SD, USIM
6. BLOCK DIAGRAM
- 17 -
System HW Block Diagram ; LCD
6. BLOCK DIAGRAM
- 18 -
System HW Block Diagram ; CAMERA
6. BLOCK DIAGRAM
- 19 -
System HW Block Diagram ; Audio
6. BLOCK DIAGRAM
- 0 -
Power Block
6. BLOCK DIAGRAM
- 1 -
Power Block
6. BLOCK DIAGRAM
- -
BLUETOOTH Block
6. BLOCK DIAGRAM
- 3 -
Wi-Fi Block
- 224 - Copyright 2011 LG Electronics. Inc. All right reserved.
7. CIRCUIT DIAGRAM
L1015
1.2n
C8554
2.5p
+VPWR
C1013 33p
FL1004
B7671
836.5 MHz,881.5 MHz
9 5
7
3
1
2
8
4
6
ANT
GND2
RX_OUT2
GND1
RX_OUT1
TX_IN
GND4
GND3 GND5
1001R
0
1.8p C1068
DNI
L1014
18n
L1013
1.8p C1067
FL1005
SAFEB836MAL0F00
836.5MHz
3 2
4 1
5
GND
IN OUT G1 G2
C1062 2.2p
C8553
1n
L1009
3.9n DNI
L1010
L1000 8.2n
C1064 2.2p
L1008
DNI
C1063 2.2p
L1007
4.7n
9101
R
180
C1060
39p
8101
R
120
39p
C1059
DNI
C1058
R1017
51
C1057
DNI
SKY77336
U1002
23 22
24 21
25 20
26 19
27 18
28 17
9 8
10 7
11 6
12 5
13 4
14 3
15 2
16 1
DCS_PCS_IN DCS_PCS_OUT
BS GND6
TX_EN GND5
VBATT VCC_OUT
VAPC GND4
NC GND3
GND1 GND2
GSM_IN GSM_OUT
PGND1 PGND12
PGND2 PGND11
PGND3 PGND10
PGND4 PGND9
PGND5 PGND8
PGND6 PGND7
15p C1056
L1006
15n
6 1 0 1
R
120
5101
R
180
R1014
2.2K
+VPWR
L1005
DNI
30
R1013
1K R1012
1K R1011
R1010 1K
15n
L1004
1K R1009
C1053
1.5n
C1054
0.1u C1073 100p
L1027
2.7n
9901C
n8.1
C1052
33p
VREG_FEM_2.7V
FL1001
D5017
850,1900,2100MHz
6 5 4 3 7
11
9
22
21
20
13 24
12 23
10
15 8
14 1
17
16 2
19
18
PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
D DV
1LRTC
2LRTC
3L RT C
4 LRT C
DNI
C1051
R1002
1K
C1016
15n
C1050
DNI
9401C
u1.0
51
R1024
L8056 1n
L1017
6.8n
C1042 10n
C1041 1n
0
0
0
1
R
I
N
D
p 0 0 1
0 4 0 1 C
L1023
2.2n
RF2815
U1001
3
2
5
4
1
N I _ FR
FIL_OUT
VDD
S_D
GND
VREG_MSMP_2.6V
u1.0
7301C
6301C
p001
5301C
u7.4
4301C
u7.4
C1033
10u
u1.0
2301C
5.1
R1007
R1006
5.1
VREG_RFRX1_2.7V
1n
C1031
C1030
0.1u
u1.0
9201C
C1028 10n
p22
7201C
12K R1003
C51
DNI
C1072 22p
C1084 1.8p
C1025 100p
RTR6285
U1000
32 92 82 53 43 96
62
61
60
54
43 36
37 38
27 68
25 52
21 42
8
7 45
1 44
53 47
22 46
10
6 49
4 48
3
51
67 50
19 39
40
18
17 41
16
15 33
32
13 31
14 30
12
11 59
58
9 56
24
5 57
55
65
66 20
63 2
64 26
RF_ON TX_IP
TCXO TX_IN
SBDT TX_QP
TX_QN
LB_RF_OUT1
LB_RF_OUT2 VTUNE1
VTUNE2
HB_RF_OUT1 VTUNE_GPS
HB_RF_OUT2
HB_RF_OUT3 PRX_QP
PRX_QN
WPRXLBP PRX_IP
WPRXLBN PRX_IN
WPRXHBP
WPRXHBN DRX_QP
DRX_QN
WDRXLB DRX_IP
DRX_IN
WDRXHB1
WDRXHB2 NC
GCELL_INP DAC_IREF
GCELL_INN
VDDA1_1
EGSM_INP VDDA1_2
EGSM_INN VDDA1_3
VDDA1_4
DCS_INP VDDA1_5
DCS_INN VDDA1_6
GPCS_INP VDDA2_1
GPCS_INN VDDA2_2
VDDA2_3
GPS_IN VDDA2_4
PDET_IN VDDA2_5
TX_RBIAS VDDA2_6
WPRXSE1 VDDA2_7
WPRXSE2 VDDA2_8
VDDA2_9
VDDA2_10
VDDA2_11
VDDA2_12 DNGP
TUO_2ESXRP
W
TUO_1ESXRP
W
PNI_X
M_B
W
MNI_X
M_B
W
MDDV
4.7u
C1024
p001
3201C
MS-156C SW1000
4 3
2
1
ANT COMMON
G3 G4
C1102
3.3n
C1101
0.5p
C1098 1n
DNI
L1031
L1033
1p
FL1006
SAFEB1G95KA0F00
1950MHz
5 2
4 1
3
G3
IN OUT
G1 G2
L1036
22n
L1026
6.8n
C1096
100p 100p
C1095
680p
C1094
680p
C1093
L8057
DNI
680p
C1092
C1091
4.7u
C1090
680p
100p
C1089
100p
C1088
DNI
L1028
33p
C1087
C1086
3.3n
C1026 7p
C1085 33p
L1030
12n
FL1002
SAFEB2G14FB0F00
2140MHz 4 5
1
3 2
G1 O1
IN
G2 O2
DNI
L1025
+VPWR
L1029
15n
100p
L1024
C1083
15p
C1061 2.2p
C1038 27p
L1018
33p
2801C
n3.3
DNI
C52
22p
C56
10u
C53
3
2
0
1
R
0
1
1
2201C
u1.0
L1003
68n
0011C
n6.5
C1019 33p
C1018
DNI
VREG_RFRX1_2.7V
DNI
C1017
FL1000
SAFEB1G57KB0F00
1575.42 MHz 5 3 2
4 1
IN OUT
G1 G2 G3
C1007
18p
56
R1022
VRF_SMPS_2.1V
DNI
C1015
L1078
2.7n
C1077
100p
VDD_RX
600
FB1001
FB1000
600
C1076
0.5p
0 2 01 R
K1
L1020
1n
C1014
0.1u
1
2
0
1
R
0
1
1
68p
C1012
C1011
68p
C1010
0.1u
u1.0
9001C
C1075
2.2n
C1039
5.6n
u1.0
5001C
4001C
u1.0
3001C
u1.0
L1019
1n
ANT801
ODGPPTR3015
2
3 1
4 DUMMY3
FEED DUMMY2
DUMMY1
L1022
DNI
L1032
DNI
0 3R
2001C
u1.0
FL1003 B7697
1950MHz, 2140MHz
9 5
8 4
7 2
3
6 1
RX ANT
TX
GND1 GND4
GND2 GND5
GND3 GND6
L1011
100n
L1002
68n
1 0 0 1C
u1. 0
U1004 SKY77704-15
6 5
7 4
8 3
9 2
10 1
11
PGND
VCC1 VCC2
RFIN RFOUT
VMODE_1 CPL_IN
VMODE_0 GND
VEN CPL_OUT
L1034
8.2n
GND
CN7
1
CN8
1
GND
u1.0
0001C
SW1001
UFL-R-SMT10
G1
ANT G2
CN5
1
GND GND C1097 1.8p
SKY77701
U1003
6 5
7 4
8 3
9 2
10 1
11
PGND
VCC1 VCC2
RFIN RFOUT
VMODE_1 CPL_IN
VMODE_0 GND
VEN CPL_OUT
CN6
1
GND
CN3
1
GND
CN4
1
GND
CN1
1
GND
CN2
1
L1001 5.6n
C8555
DNI
L1016
DNI
C1103
33p
C1104
56p
C1079
DNI
5301L
n2.2
5501C
n 2.2
0.1u
C1074
4.7u
C57
33p
C55 p 3 3
45
C C1070
10u
ANT_SEL0
ANT_SEL1
ANT_SEL2
GSM_PA_EN
GSM_PA_RAMP
ANT_SEL3
TCXO_RTR_19.2MHZ
RTR_DAC_REF
RTR_TXIP
RTR_TXIM
RTR_TXQP
RTR_TXQM
RTR_RXIP
RTR_RXIM
RTR_RXQM
RTR_RXQP
RTR_DRXIP
RTR_DRXIM
RTR_DRXQM
RTR_DRXQP
GSM_PA_BAND
PA_ON0
RTR6285_SSBI
GPS_LNA_EN
PA_R0
PA_R0
PA_ON1
GND
RX_WCDMA_1900
RX_WCDMA_1900
GPS_IN
GPS_IN
DCS_PCS_TX
DCS_PCS_TX
GSM_TX
GSM_TX
RX_PCS_P
RX_PCS_P
RX_PCS_M
RX_PCS_M
RX_DCS_M
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_P
RX_GSM_900_M
RX_GSM_900_M
RX_WCDMA_2100
RX_WCDMA_2100
PDET_IN
PDET_IN
VDD_RX
RX_DCS_P
RX_DCS_P
RTR_TXON
WCDMA_800_TX_OUT
WCDMA_800_TX_OUT
VSNS_RF_SMPS
RX_WCDMA_800_M
RX_WCDMA_800_M
RX_WCDMA_800_P
RX_WCDMA_800_P
WB2100_MIX_INM
WB2100_MIX_INM
WB2100_MIX_INP
WB2100_MIX_INP
WCDMA_2100_RTX
WCDMA_2100_RTX
WCDMA_2100_TX_OUT
WCDMA_2100_TX_OUT
WCDMA_800_RTX
WCDMA_800_RTX
VDDA2 [2.1V] : Pin 1,7,8,21,25,27,37,43
VDDA2 [2.1V] : Pin 54,60,61,62
==> PLL1, PLL2, GPS PLL, VCOs
==> DCS/PCS LNA, dirver amp, mixers and baseband Tx
VDDA1 [2.7V] : Pin 3,4,6,10,22,53
8.5dB
Close to RTR
DCS1800(1710-1785 MHz)
PCS1900(1850-1910 MHz)
GSM900(880-915 MHz)
DCS(1805-1880 MHz)
GSM(925-960 MHz)
PCS(1930-1990 MHz)
HIGH
HIGH LOW
LOW LOW
LOW
LOW
HIGH
LOW
LOW
HIGH
LOW
LOW
LOW
LOW LOW
LOW DCS/PCS TX
LOW
ANT_SEL0 ANT_SEL2
LOW
LOW
EGSM TX HIGH
DCS1800 RX
WCDMA 850 (PIN21)
HIGH
HIGH
LOW
ANT_SEL3 ANT_SEL1
EGSM RX
PCS1900(1850-1910 MHz)
2mm
5dB
GSM900(880-915 MHz)
DCS1800(1710-1785 MHz)
8dB
PCS1900 RX
WCDMA 2100 (PIN20) HIGH
HIGH
LOW LOW
==> Baseband Rx, WCDMA LNA, Cell/EGSM LNA
GSM_PA_BAND
LOW
HIGH
VDDA1: PIN 3,4,6,10,22,53 = 2.7V VDC
MODE
1%
WCDMA RX 2100 LNA Circuit
ANTENNA SWITCH MODULE LOGIC (D5017)
GSM
1608 1608
LNA for the GPS
VDDA2: PIN 1,7,8,21,25,27,37,43,54,60,61,62 = 2.1V VDC
1608
DCS/PCS
0603
0603
0603
0603
W2100 RX(2110 - 2170 MHz)
0603
0603
GSM
WCDMA
7. CIRCUIT DIAGRAM
7. CIRCUIT DIAGRAM
CN300
JTAG_STD_1COLUMN_10P
10
9
8
7
6
5
4
3
2
1 TCK
RTCK
TDO
TDI
TMS
TRST
VCC
RESIN
PS_HOLD
GND
R10 0
VA300 VA301 VA302 VA303
VA304
TP300
VBAT
UAT300
12
11
10
9
8
7
6
5
4
3
2
1 GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G 2.5G
VCHG_VBUS
TP302
TP303
TP304
C321
39p
VREG_MSMP_2.6V
K01
103R
0.1u
C300
K001
003R
10n
C313
R306
100
C304 47p
K01
213R
V6.2_
P
M
S
M_
G
E
R
V
19.2MHz
X300
4 2
3 1 VCONT OUT
GND VCC
1 0 3D
C309
100p
V6 .2 _
P
M
S
M _
G
E
R
V
33
R309
6 R
0
113R
K01
513R
001
47p C322
49.9
R310
613R
001
TP310
803R
0406
IND
4 R
C311
22u
K1
703R
0.1u
C310
TP309
VA305
u1.0
70 3 C
603C
u1.0
C312 1n
u1.0
503C
303C
u1.0
323C
u1.0
2 03 D
47p
C301
MIC_BIAS
M5
Y18
AC19
AF18
Y17
U16
AC18
AF17
W16
AE17
AC17
Y16
AB17
W5
W3
V5
V6
MSM7227
U302
AB9
V9
V8
Y9
W8
AB8
V3
V2
U2
U8
U9
AF4
AE2
AB7
AE4
AE3
AD3
L2
L8
L3
L9
AD2
AC6
AC3
AC2
U15
W15
AC16
AB16
AF15
Y15
AC15
AB15
W14
AE14
AC14
Y14
AC13
U13
Y13
AB13
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
AE21
AB22
AC22
AE24
AE25
AF24
6M 8M 9M 8EA
7FA
8CA
6FA
7CA
6EA
11R
81BA
81W
11Y
71C
71B
61H
81H
71M
62G
01Y
11T
01W
61EA
8FA
61F A
5FA
31F
21C
21B
11H
11J
21H
21J
11E
21F
11F
21E
91EA
91FA
02BA
51 C
61F
31H
41H
4 1J
31J
11C
41L
3F 2F 3E 2E 2D 52G
61L
91C
91B
91H
62F
02H
81J
71J
32H
22 F
32F
61J
71E
5 1J
71F
61B
6 1C
51H
81B
52B
12F
02B
02F
71H
0 2E
02C
81C
81F
B21
B22
C21
E21
C22
C24
E26
B24
F25
C26
D26
C23
B23
C25
D25
E23
W20
AD26
N17
T20
J25
M20
N25
V26
H26
L25
P20
U26
V19
AC25
U19
U20
AB23
W25
W26
R19
T19
W22
AC26
V23
AB26
AB25
AA23
AA25
Y26
Y23
T17
Y22
W23
AA26
V20
J26
K20
J20
J23
J22
K19
K26
L22
L19
L23
L20
M19
L26
M26
M22
M23
N26
N19
N20
P26
R26
P19
R25
T26
R22
R23
R20
T23
T22
U25
U23
U22
4C 6G 5G 6N 3N 2N 2W 6W 3M 8T 2K 3K 2J 3J 2H 3H 2G 3G 6R 2P 3P 2R 3R
11B
41FA
31FA
21FA
11FA
5BA
3BA
2BA
3AA
2 AA 2Y
6AA 2M 3U
11W
9 EA
9CA
6BA 3Y
71W
91BA
51E
41C
3 1C
51B
41B
3 1B 8H 6F 5F
01J
01H 9H
0 1C
01B 9C 9B 8F 8E 7F 7E 7C 7B 6C 5C 6B 5B
P I_ R_ E NI L
N I_ R _E N IL
PI_L_ENIL
NI_L_ENIL
P1CIM
N1CIM
P2CIM
N 2 CI M
PIXUA
NIXUA
PO _E N IL
NO_ENIL
PO_1RAE
NO _ 1R A E
TUOXUA
R_HPH
L_ H PH
PMOCC
SAIB_CIM
FE RV _ HP H
KLCSYS_YHPBSU
P D _YH P BS U
N D_ Y HP B SU
DI_YHPBSU
S UB V _YH P BS U
T XE R _YH P BS U
N_NISER
N_TUOSER
N E_GODW
0_EDOM
1_EDOM
2_ E DO M
3_EDOM
O X CT
JDA_OL_KRT
KLC_PEELS
I D T
SMT
N_ T SR T
ODT
KCT
K CT R
P_ATAD_IDDM
N _A T AD_ I DD M
P_BTS_IDDM
N_BTS_IDDM
KLCP_CDCL
P_TUO_I
N_TUO_I
P_TUO_Q
N_TUO_Q
FER_CAD
0HC_PI_I
0HC_MI_I
0HC_PI_Q
0HC_MI_Q
1HC_PI_I
1HC_MI_I
1HC_PI_Q
1HC_MI_Q
NO_XT
JDA_CGA_XT
0NO_AP
0EGNAR_AP
LTC_RWP_AP
M_LTC_RWP_AP
FER_GB_MSG
0NIAKH
1NIAKH
2NIAKH
EBI1_DQ_0
EBI1_DQ_1
EBI1_DQ_2
EBI1_DQ_3
EBI1_DQ_4
EBI1_DQ_5
EBI1_DQ_6
EBI1_DQ_7
EBI1_DQ_8
EBI1_DQ_9
EBI1_DQ_10
EBI1_DQ_11
EBI1_DQ_12
EBI1_DQ_13
EBI1_DQ_14
EBI1_DQ_15
EBI1_DQ_16
EBI1_DQ_17
EBI1_DQ_18
EBI1_DQ_19
EBI1_DQ_20
EBI1_DQ_21
EBI1_DQ_22
EBI1_DQ_23
EBI1_DQ_24
EBI1_DQ_25
EBI1_DQ_26
EBI1_DQ_27
EBI1_DQ_28
EBI1_DQ_29
EBI1_DQ_30
EBI1_DQ_31
EBI1_ADR_0
EBI1_ADR_1
EBI1_ADR_2
EBI1_ADR_3
EBI1_ADR_4
EBI1_ADR_5
EBI1_ADR_6
EBI1_ADR_7
EBI1_ADR_8
EBI1_ADR_9
EBI1_ADR_10
EBI1_ADR_11
EBI1_ADR_12
EBI1_ADR_13
EBI1_CKE0
EBI1_CKE1
EBI1_DCLK
EBI1_DCLKB
EBI1_WE_N
EBI1_CS0_N
EBI1_CS1_N
EBI1_BA_0
EBI1_BA_1
EBI1_DQS_0
EBI1_DQS_1
EBI1_DQS_2
EBI1_DQS_3
EBI1_DM_0
EBI1_DM_1
EBI1_DM_2
EBI1_DM_3
EBI1_RAS_N
EBI1_CAS_N
EBI1_RESOUT_N
EBI1_CAL
EBI2_DATA_0
EBI2_DATA_1
EBI2_DATA_2
EBI2_DATA_3
EBI2_DATA_4
EBI2_DATA_5
EBI2_DATA_6
EBI2_DATA_7
EBI2_DATA_8
EBI2_DATA_9
EBI2_DATA_10
EBI2_DATA_11
EBI2_DATA_12
EBI2_DATA_13
EBI2_DATA_14
EBI2_DATA_15 0_RDA_ 2IBE
1_RDA_ 2IBE
2 _ RD A_2 I B E
3_R D A_2IBE
4_RDA_2IBE
5 _ RD A _2I B E
6 _R D A_ 2I BE
7 _RDA_ 2I BE
8 _RD A _2 I BE
9_RD A_ 2IBE
0 1 _ RD A_2 I B E
11_R D A_2 I BE
21_RDA_2IBE
31 _ RDA_2I B E
41 _R D A _2I BE
51_RDA_2IBE
6 1 _RD A _2 I BE
N _ 0S C_ 2I B E
N _ 1S C_2 I B E
N _4SC_2IBE
N _ 5S C _2I B E
N_6S C _2I B E
N _7 S C_2 I BE
K L C_ 2I BE
N _E W _2IBE
N_E O _2IBE
N_ B U_ 2I BE
N_ B L_ 2I BE
N_0 Y SU B _2IBE
RE P IW
R L_ ST
LL_ST
RU_ST
LU _ ST
23 1 _OIPG
131_O I PG
03 1 _OI P G
921_O I PG
821_O I PG
72 1 _OIPG
62 1 _OI P G
521_O I PG
4 2 1_ OI PG
321_OIPG
221_OIPG
1 2 1_ OI P G
021_OIPG
911_OIPG
8 1 1_ OI PG
711_OIPG
611_OIPG
511_O I PG
411_OIPG
311_OIPG
211_OIPG
111_OIPG
011_OIPG
901_OIPG
801_OIPG
701_OIPG
601_OIPG
501_OIPG
401_OIPG
301_OIPG
201_OIPG
101_OIPG
001_OIPG
99_OIPG
89_OIPG
79_OIPG
69_OIPG
59_OIPG
49_OIPG
39_OIPG
29_OIPG
19_OIPG
09_OIPG
98_OIPG
88_OIPG
78_OIPG
68_OIPG
58_OIPG
GPIO_0
GPIO_1
GPIO_2
GPIO_3
GPIO_4
GPIO_5
GPIO_6
GPIO_7
GPIO_8
GPIO_9
GPIO_10
GPIO_11
GPIO_12
GPIO_13
GPIO_14
GPIO_15
GPIO_16
GPIO_17
GPIO_18
GPIO_19
GPIO_20
GPIO_21
GPIO_22
GPIO_23
GPIO_24
GPIO_25
GPIO_26
GPIO_27
GPIO_28
GPIO_29
GPIO_30
GPIO_31
GPIO_32
GPIO_33
GPIO_34
GPIO_35
GPIO_36
GPIO_37
GPIO_38
GPIO_39
GPIO_40
GPIO_41
GPIO_42
GPIO_43
GPIO_44
GPIO_45
GPIO_46
GPIO_47
GPIO_48
GPIO_49
GPIO_50
GPIO_51
GPIO_52
GPIO_53
GPIO_54
GPIO_55
GPIO_56
GPIO_57
GPIO_58
GPIO_59
GPIO_60
GPIO_61
GPIO_62
GPIO_63
GPIO_64
GPIO_65
GPIO_66
GPIO_67
GPIO_68
GPIO_69
GPIO_70
GPIO_71
GPIO_72_GRFC_9
GPIO_73_GRFC_8
GPIO_74_GRFC_7
GPIO_75_GRFC_6
GPIO_76_GRFC_5
GPIO_77_GRFC_4
GPIO_78_GRFC_3
GPIO_79_GRFC_2
GPIO_80_GRFC_1
GPIO_81_GRFC_0
GPIO_82
GPIO_83
GPIO_84
47p
C25
V6.2_
A
M
S
M_
G
E
R
V
U300
74LVC1G79GM
4 3
5 2
6 1 D VCC
CP NC
GND Q
0.1u
C718
(0603)
2.2n
C35
15 31R
1n
C314
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C315 100p
C316
0.1u
C317
0.1u
100K
R313
C318
33p
0.1u
C319
2K
R314
VREG_TCXO_2.85V
C320
33n
NC7SV00P5X_NL U301 3
2
4
1
5
VCC
GND
7.5p
C4
47
R14
TP306
TP307
TP308
7.5p
C3
SC1
1
SC2
1
VCHG_VBUS
ANT_SEL0
ANT_SEL1
ANT_SEL2
GSM_PA_EN
P
M
A
R_
A
P_
M
S
G
ANT_SEL3
TCXO_RTR_19.2MHZ
F
E
R_
C
A
D_
RT
R
PI
XT_
RT
R
MI
XT_
RT
R
P
Q
XT_
RT
R
M
Q
XT_
RT
R
PI
X
R_
RT
R
MI
X
R_
RT
R
M
Q
X
R_
RT
R
P
Q
X
R_
RT
R
PI
X
R
D_
RT
R
MI
X
R
D_
RT
R
M
Q
X
R
D_
RT
R
P
Q
X
R
D_
RT
R
GSM_PA_BAND
0
N
O_
A
P
RTR6285_SSBI
GPS_LNA_EN
0
R_
A
P
PA_ON1
CAM_MCLK
N_T
E
S
E
R_T
B
P
U
E
K
A
W_T
S
O
H_
N
AL
W
T
NI_
H
C
U
OT
L
C
S_
C2I_
S
S
A
P
M
O
C_
X
O
R
P
N_T
E
S
E
R_
N
AL
W
T
U
O_
X
O
R
P
PMIC_TCXO
O
X
CT_
C I
M
P
TCXO_PM_19.2MHZ
JTAG_PS_HOLD
MOTION_INT
nSDRAM_CS0
nSDRAM_WE
E
O_
D
N
A
Nn
E
W_
D
N
A
Nn
Y
D
A
E
R _
H
S
ALF_
D
N
A
N
EBI2_DATA[7]
EBI2_DATA[6]
EBI2_DATA[5]
EBI2_DATA[4]
EBI2_DATA[3]
EBI2_DATA[2]
EBI2_DATA[1]
EBI2_DATA[0]
EBI2_DATA[15]
EBI2_DATA[14]
EBI2_DATA[13]
EBI2_DATA[12]
EBI2_DATA[11]
EBI2_DATA[10]
EBI2_DATA[9]
EBI2_DATA[8]
N
E_
O
X
CT
TCXO_EN
KL
C_
P
E
EL
S
L_
H
P
H
R_
H
P
H
N_
V
C
R
PM_INT_N
PS_HOLD
MSM_USIM_CLK
MSM_USIM_DATA
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_DOUT
WLAN_CLK
WLAN_CMD
BT_WAKEUP
SDRAM_DQM3
SDRAM_DQM2
SDRAM_DQM1
SDRAM_DQM0
SDRAM_DQS3
SDRAM_DQS2
SDRAM_DQS1
SDRAM_DQS0
nRESETOUT
SDRAM_DCLK0
SDRAM_DCLK1
SDRAM_CKE
SDRAM_ADDR[12]
SDRAM_ADDR[11]
SDRAM_ADDR[10]
SDRAM_ADDR[9]
SDRAM_ADDR[8]
SDRAM_ADDR[7]
SDRAM_ADDR[5]
SDRAM_ADDR[4]
SDRAM_ADDR[3]
SDRAM_ADDR[2]
SDRAM_ADDR[1]
SDRAM_ADDR[0]
SDRAM_ADDR[6]
SDRAM_DATA[16]
SDRAM_DATA[0]
SDRAM_BA0
SDRAM_BA1
SDRAM_ADDR[13]
SDRAM_DATA[1]
SDRAM_DATA[2]
SDRAM_DATA[3]
SDRAM_DATA[4]
SDRAM_DATA[5]
SDRAM_DATA[6]
SDRAM_DATA[7]
SDRAM_DATA[8]
SDRAM_DATA[9]
SDRAM_DATA[10]
SDRAM_DATA[11]
SDRAM_DATA[12]
SDRAM_DATA[13]
SDRAM_DATA[14]
SDRAM_DATA[15]
SDRAM_DATA[17]
SDRAM_DATA[18]
SDRAM_DATA[19]
SDRAM_DATA[20]
SDRAM_DATA[21]
SDRAM_DATA[22]
SDRAM_DATA[23]
SDRAM_DATA[24]
SDRAM_DATA[25]
SDRAM_DATA[26]
SDRAM_DATA[27]
SDRAM_DATA[28]
SDRAM_DATA[29]
SDRAM_DATA[30]
SDRAM_DATA[31]
nSDRAM_RAS
nSDRAM_CAS
B
U_
D
N
A
Nn
BL _
D
N
A
Nn
MSM_USIM_RST
WLAN_SDIO[0]
WLAN_SDIO[2]
WLAN_SDIO[1]
BT_PCM_DIN
BT_HOST_WAKEUP
WLAN_SDIO[3]
F
E
R_
C
A
D_
A
P_
M
S
G
P_
V
C
R
L
C
S_
C2I_
H
C
U
OT
S
C _
H
S
ALF_
D
N
A
Nn
A
D
S_
C2I_
H
C
U
OT
T
S
R_
N
O
Pn
REMOTE_PWR_ON
REMOTE_PWR_ON
M
D _
H
B
S
U
P
D _
H
B
S
U
T
U
O_
X
U
M
A
MOTION_I2C_SDA
MOTION_I2C_SCL
N
O
XT_
RT
R
SDRAM_CKE1
MUIC_INT
L
C
S_
C2I_L
B_
D
CL
A
D
S_
C2I_L
B_
D
CL
LCD_BL_EN
CAM_DATA[0]
CAM_DATA[1]
MSM_RTCK
K
CT
R_
M
S
M
MSM_TDO
O
DT_
M
S
M
MSM_TDI
I
DT_
M
S
M
MSM_TMS
S
MT_
M
S
M
MSM_TCK
K
CT_
M
S
M
MSM_TRSTN
NT
S
RT_
M
S
M
USBH_SYSCLK
KL
C
S
Y
S_
H
B
S
U
OL _ KR T
TRK_LO
RTR_TRK_LO_ADJ
RTR_TRK_LO_ADJ
N1_CIM
CAM_RESET_N
CI
M_
S
H
CAM_PWDN
MICROSD_DET_N
C
D
A_
K
O
O
H
O_
C
N
Y
S
V_
D
CL_
M
S
M
BT_UART_TXD
BT_UART_RXD
BT_UART_CTS
BT_UART_RTS
W
OL_
DI
R
E
K
A
M_
D
CL
QTKEY_RESET
MUIC_I2C_SCL
MUIC_I2C_SDA
QTKEY_INT
D
XT_2T
R
A
U
UART2_TXD
UART2_TXD
D
X
R_2T
R
A
U
UART2_RXD UART2_RXD
MMC_CLK
MMC_CMD
MMC_DATA[3]
MMC_DATA[2]
MMC_DATA[1]
MMC_DATA[0]
P1_
CI
M
HS_MIC_BIAS_EN
CAM_I2C_SCL
CAM_I2C_SDA
SLIDE_DETECT
QTKEY_SDA
QTKEY_SCL
P
O_
E
NIL
EAR_SENSE
N
O_
E
NI L
M_
BT
S_
P_I
D
D
M
P_
BT
S_
P_I
D
D
M
M_
AT
A
D_
P_I
D
D
M
P_
AT
A
D_
P_I
D
D
M
N_T
E
S
E
R_
D
CL
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[6]
CAM_DATA[7]
CAM_DATA[5]
CAM_PCLK
CAM_HSYNC
CAM_VSYNC
P
U
E
K
A
W_
N
AL
W
I
B
S
S_
CI
M
P
AUDIO_I2C_SDA
AUDIO_I2C_SCL
nSDRAM_CS1
MOTOR_EN
MOTOR_PWM
WLAN_REG_ON
COMPASS_DRDY
A
D
S_
C2I_
S
S
A
P
M
O
C_
X
O
R
P
DK_Volume_UP
DK_Volume_DOWN
A
D
S_
C2I_L
E
UF
FUEL_I2C_SCL
MIC_1P_PIN
nJTAG_RESOUT
TUOSER_GATJn
Array TP UART TP
ARM9&ARM11 JTAG
%1
nip 5
E o t esol
C
1% Close to MSM
0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG
ARM9&ARM11 JTAG
MODE[3:0]
clse to MSM
1.0T
TCXO Circuit
GPS D FLIP-FLOP
Low = Detect
Changed 03/22
VPWR Delete
Clesed to TCXO
0001 : Native, ARM9 + ARM11 on PJTAG
7. CIRCUIT DIAGRAM
U400
MT29C8G96MAZAPDJA-5 IT
01P
1P 4M
M3
5G 1G 5E 01B
1B
H8
7H 7J 01R
9R
G10
2R
F9
1R
E10
01A
D9
9A
C10
2A
N10
M9
E7
L10
F8
K10
G6
J9
J8
H2
G9
G2
F10
K1
E9
B2
D10
E3
C9
G8
N9
F3
M10
J2
L9
K9
C7
J10
C8
D7
M2
D8
P9
D6
J1
E8
H9
D5
C1
F6
B9
F7
E6
M1
H4
P8
H3
H10
F5
H1
E4
D1
F4
B8
G4
G3
P6
J4
C5
H5
H6
N5
J5
B5
J6
G7
C6
K6
C3
K5
C4
K7
B4
L8
B7
K8
B3
L7
B6
L6
L5
N8
L4
M7
N7
K2
P5
J3
P4
F1
N4
F2
P3
K3
P2
D4
M8
E2
N6
D3
M6
E1
P7
D2
M5
C2
N3
L3
N2
L2
N1
L1
K4 A0
A1
IO0
A2
IO1
A3
IO2
A4
IO3
A5
IO4
A6
IO5
A7
IO6
A8
IO7
A9
IO8
A10
IO9
A11
IO10
A12
IO11
BA0
IO12
BA1
IO13
IO14
DQ0
IO15
DQ1
DQ2
CE#
DQ3
RE#
DQ4
WE#2
DQ5
CLE
DQ6
ALE
DQ7
WP#
DQ8
R_B#
DQ9
DQ10
VCC1
DQ11
VCC2
DQ12
DQ13
VSS6
DQ14
VSS7
DQ15
DQ16
VDD6
DQ17
VDD1
DQ18
VDD2
DQ19
VDD3
DQ20
VDD4
DQ21
VDD5
DQ22
DQ23
VSS8
DQ24
VSS1
DQ25
VSS2
DQ26
VSS3
DQ27
VSS4
DQ28
VSS5
DQ29
DQ30
VDDQ0
DQ31
VDDQ1
VDDQ5
CS0#
VDDQ3
CS1#
VDDQ4
CK
VDDQ2
CKE0
VDDQ7
CKE1
VDDQ6
WE#1
VDDQ8
RAS#
VDDQ9
CAS#
DM0
VSSQ0
DM1
VSSQ1
DM2
VSSQ2
DM3
VSSQ3
VSSQ4
0UND
VSSQ5
1UND
VSSQ6
2UND
VSSQ7
3UND
VSSQ8
4UND
VSSQ9
5UND
6UND
0SQD
2SQD
CK#
4CN
6CN
3SQD
UND
1SQD
A13
1UFR
2UFR
KCOL
0
R8
R7
0
0
R5
C1
10u
10u
C2
R1 0
0 R2
V52.1_ 1
C
M
S
M_
G
E
R
V
10n
C459
10n
C458 C457
10n
C456
10n
0.1u
C450
0.1u
C451
0.1u
C452 C448
10n 0.1u
C447
u01
044C
354C
u01
144C
u1.0
444C
u2.2
n01
244C
534C
u1.0
C443
0.1u
C454
10n
C20
0.1u
C30
1n
u7.4
314C
C28
10n
C31
1n
U302
L5
E10
AE22
AD25
AE18
AE15
AE11
AE7
Y5
T5
H25
E25
E22
Y25
V25
T25
P25
M25
K25
AE12
AC10
AC5
Y8
AF26
AF25
AF3
AF2
AE26
AB11
Y20
W19
U17
U11
P23
N23
M11
L17
L12
K23
K9
J19
G23
E19
C2
B26
B3
B2
T2
R8
R5
P9
N8
K6
K5
J6
J5
F9
E6
C8
C3
U6
T6
T3
R9
P8
P5
N9
K8
J9
J8
H6
H5
E9
E5
D3
B8
AE13
AE5
AB14
AB10
AA22
Y19
Y6
V22
U14
T16
T15
T14
T13
T12
R17
R16
R15
R14
R13
R12
P22
P17
P16
P15
P14
P13
P12
P11
P6
N22
N16
N15
N14
N13
N12
M16
M15
M14
M13
M12
L15
L13
L6
K22
G22
F19
F15
F10
E14
B4
7GA
6GA
5GA
4GA
3GA
72GA
62GA
52GA
42GA
32GA
22GA
12GA
02GA
2GA
91GA
81GA
71GA
61GA
51GA
4 1GA
31 GA
21GA
11GA
0 1GA
1GA
72FA
1FA
72 EA
1EA
72DA
1DA
72 CA
1C A
72BA
1BA
72 AA
1AA
72A
62A
52A
4 2A
3 2A
22A
12A
0 2A
91 A
81A
71A
6 1A
51 A
41A
31A
21 A
11 A
01A
9A 8A 7A 6A 5A 4A 3A 2A 1A
61E
41F
5AA
22H
11N 5N
81E
31E 5U 9T
7 2Y 1Y
72W 1W
7 2V 1V
72U 1U
72T 1T
72R 1R
7 2P 1P
72N 1N
72M 1M
7 2L 1L
72K 1K
7 2J 1J
72H 1H
7 2G 1G
72F 1F
72E 1E
72D 1D
72C 1C
72B 1B
9GA
8GA
5 6 _C N
66_CN
76_CN
86_CN
9 6 _C N
0 7 _C N
1 7 _C N
27_CN
37_CN
4 7 _C N
5 7 _C N
67_CN
77_CN
8 7 _C N
97 _ CN
08_CN
18 _ CN
28 _ CN
38_CN
48_CN
58_CN
68_CN
78_CN
8 8 _C N
98_CN
09_CN
1 9 _C N
2 9 _C N
39_CN
49_CN
5 9 _C N
6 9 _C N
79_CN
89_CN
9 9 _C N
00 1 _C N
101_CN
201_CN
3 01 _ CN
401_CN
1D V SR
2DVSR
8P_DDV
9P_DDV
01P_DDV
GRP_ESUFQ_DDV
1C_SNS_DDV
2C_SNS_DDV
6P2_YHPBSU_DDV
3P3_YHPBSU_DDV
1 _CN
2_C N
3_ C N
4_ C N
5 _C N
6_CN
7 _C N
8_CN
9_CN
0 1_ C N
1 1 _C N
21_CN
31_CN
4 1_ C N
5 1 _C N
61_CN
7 1_ C N
8 1 _C N
9 1 _C N
02_CN
1 2_ C N
2 2 _C N
3 2 _C N
42_CN
5 2_ C N
6 2 _C N
72_C N
8 2_ C N
9 2_ C N
03_CN
1 3 _C N
2 3 _C N
33_CN
43_CN
5 3_ C N
6 3 _C N
73_CN
8 3_ C N
9 3_ C N
0 4 _C N
14_CN
2 4_ C N
3 4 _C N
4 4 _C N
54_CN
64_CN
74_CN
84_CN
94_CN
05_CN
15_CN
25_CN
35_CN
45_CN
55_CN
65_CN
75_CN
85_CN
95_CN
06_CN
16_CN
26_CN
36_CN
46_CN
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21
GND22
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
GND38
GND39
GND40
GND41
GND42
GND43
GND44
GND45
GND46
GND47
GND48
GND49
GND50
GND_A1
GND_A2
GND_A3
GND_A4
GND_A5
GND_A6
GND_A7
GND_A8
GND_A9
GND_A10
GND_A11
GND_A12
GND_A13
GND_A14
GND_A15
GND_A16
VDD_A1
VDD_A2
VDD_A3
VDD_A4
VDD_A5
VDD_A6
VDD_A7
VDD_A8
VDD_A9
VDD_A10
VDD_A11
VDD_A12
VDD_A13
VDD_C1_1
VDD_C1_2
VDD_C1_3
VDD_C1_4
VDD_C1_5
VDD_C1_6
VDD_C1_7
VDD_C1_8
VDD_C1_9
VDD_C1_10
VDD_C1_11
VDD_C1_12
VDD_C1_13
VDD_C1_14
VDD_C1_15
VDD_C1_16
VDD_C1_17
VDD_C1_18
VDD_C1_19
VDD_C1_20
VDD_C1_21
VDD_C1_22
VDD_C1_23
VDD_C1_24
VDD_C2_1
VDD_C2_2
VDD_C2_3
VDD_MDDI
VDD_P1_1
VDD_P1_2
VDD_P1_3
VDD_P1_4
VDD_P1_5
VDD_P1_6
VDD_P2_1
VDD_P2_2
VDD_P2_3
VDD_P3_1
VDD_P3_2
VDD_P3_3
VDD_P3_4
VDD_P3_5
VDD_P3_6
VDD_P4_1
VDD_P4_2
VDD_P7_1
VDD_P7_2
V3.3_
B
S
U_
G
E
R
V
V6.2_
A
M
S
M_
G
E
R
V
10n
C400
V9.2_2
X
U
A_
G
E
R
V
V8.1_
E
M
S
M_
G
E
R
V
VREG_MSMP_2.6V
VREG_MSME_1.8V
VREG_MSMC2_1.25V
VREG_MSMC1_1.25V
VREG_MSMA_2.6V
VREG_USB_3.3V
C455
10n
C409
10n
C445
0.1u
VREG_MSME_1.8V
C436
0.1u
VREG_AUX2_2.9V
C415
0.1u 0.1u
C416
10n
C417 C418
0.1u
0.1u
C19
0.1u
C446
0.1u
C423
0.1u
C424
0.1u
C425
0.1u
C426
C428
10n 22u
C434 C429
1n
C34
1n 10u
C430
0.1u
C431
C404
0.1u
C433
10u
VREG_MSMA_2.6V VREG_MSMP_2.6V
VREG_MSMC1_1.25V
VREG_MSME_1.8V VREG_MSMC2_1.25V
VREG_MSME_1.8V
TP408
VREG_MSME_1.8V
VREG_MSME_1.8V
834C
u2.2
TP407
n1
734C
TP406
TP405
TP404
TP403
TP402
C439
0.1u
n01
724C
R403
10K
0.1u
C414
TP401
TP5
C32
1n
V6.2_
P
M
S
M_
G
E
R
V
100K
R15
C21
0.1u
C15
10n 1n
C33
C449
0.1u
DNI
R12
10n
C422
C29
10n
PMAR _ AP_MSG
MIXT_RTR
MQXT_RTR
MIXR_RT R
MQX R _RTR
MIXRD_RTR
MQXRD_RTR
IBSS_5826RTR
0R_AP
N_TESER_TB
TUO_XORP
nSDRAM_CS0
nSDRAM_WE
nNAND_OE
E O _DNANn
nNAND_WE
NAND_FLASH_READY
EBI2_DATA[7]
]6[A TAD_ 2IBE
EBI2_DATA[6]
]5[ATAD_2IBE
EBI2_DATA[5]
EBI2_DATA[4]
EBI2_DATA[3]
]3[ATAD_2IBE
EBI2_DATA[2]
EBI2_DATA[1]
EBI2_DATA[0]
EBI2_DATA[15]
]51 [AT AD_2I BE
EBI2_DATA[14]
]41[AT A D_2IBE
EBI2_DATA[13]
EBI2_DATA[12]
EBI2_DATA[11]
EBI2_DATA[10]
]9[A TAD_ 2IBE
EBI2_DATA[9]
EBI2_DATA[8]
]8 [AT AD_2I BE
ATAD _MIS U_MS M
SDRAM_DQM3
SDRAM_DQM2
SDRAM_DQM1
0 M QD_MARD S
SDRAM_DQM0
3SQD_MARDS
SDRAM_DQS3
SDRAM_DQS2
SDRAM_DQS1
0SQD_MARDS
SDRAM_DQS0
nRESETOUT
TU O TESERn
0KLCD_MARDS
SDRAM_DCLK0
SDRAM_DCLK1
SDRAM_CKE
SDRAM_ADDR[12]
]21[ RDD A_MAR DS
SDRAM_ADDR[11]
SDRAM_ADDR[10]
]01[RDDA_MARDS
SDRAM_ADDR[9]
SDRAM_ADDR[8]
SDRAM_ADDR[7]
SDRAM_ADDR[5]
SDRAM_ADDR[4]
SDRAM_ADDR[3]
SDRAM_ADDR[2]
SDRAM_ADDR[1]
]1[ RDD A_MAR DS
SDRAM_ADDR[0]
] 6[RDDA_ M ARDS
SDRAM_ADDR[6]
SDRAM_DATA[16]
SDRAM_DATA[0]
SDRAM_BA0
SDRAM_BA1
SDRAM_ADDR[13]
SDRAM_DATA[1]
SDRAM_DATA[2]
SDRAM_DATA[3]
SDRAM_DATA[4]
SDRAM_DATA[5]
SDRAM_DATA[6]
SDRAM_DATA[7]
] 8[ATAD_ M ARDS
SDRAM_DATA[8]
SDRAM_DATA[9]
SDRAM_DATA[10]
]11[ATAD_MARDS
SDRAM_DATA[11]
]21[ATA D _MARDS
SDRAM_DATA[12]
SDRAM_DATA[13]
SDRAM_DATA[14]
]51[ATA D _MARDS
SDRAM_DATA[15]
SDRAM_DATA[17]
]81[ATAD_MARDS
SDRAM_DATA[18]
]91[ATAD_MARDS
SDRAM_DATA[19]
SDRAM_DATA[20]
SDRAM_DATA[21]
SDRAM_DATA[22]
SDRAM_DATA[23]
SDRAM_DATA[24]
]52[ATAD_MARDS
SDRAM_DATA[25]
SDRAM_DATA[26]
SDRAM_DATA[27]
SDRAM_DATA[28]
SDRAM_DATA[29]
SDRAM_DATA[30]
]13[ ATAD _MAR DS
SDRAM_DATA[31]
nSDRAM_RAS
nSDRAM_CAS
nNAND_UB
nNAND_LB
P _VCR
nNAND_FLASH_CS
V6. 2 _AMSM_G E RV
ADS_C2I_HCUOT
MD_ HBSU
PD_HBSU
SDRAM_CKE1
TNI_CIUM
ADS_C2I_LB_DCL
O DT_MSM
IDT _MSM
SMT_M SM
KLCSYS_HBSU
OL_KRT
N_TESER_MAC
DXT_ T RAU_TB
S TR_ TRAU_ TB
LCS_C2I_CIUM
KLC_CMM
DMC_C MM
LCS_ C 2I_MAC
PO_ENIL
M_BTS_P_IDDM
P_BTS _P _IDDM
M_ATAD _P _IDDM
P_A TAD _P_ID DM
]2[ATAD_MAC
]6[ATAD_MAC
]7[ATAD_MAC
CNYSV_MAC
V52.1_1CMSM_GERV
V52.1_1CMSM_GERV
V52.1_1CMSM_GERV
V52.1_1CMSM_GERV
V52.1_1CMSM_GERV
V 5 2.1_ 1CM SM_GE RV
V 52.1_1CM S M_GERV
VSNS_MSMC2_1.25V
VSNS_MSMC1_1.25V
VSNS_MSME_1.8V
nSDRAM_CS1
ADS_C2I_SSAPMOC_XORP
NWOD_emuloV_KD
N IP _ P 1_CI M
MSM7227 Power Part
Cap for MSM7227 Power
Micron 8G+4G (EUSY0430901)
7. CIRCUIT DIAGRAM
C779
33p
157
C
u01
u01
257
C
VREG_FEM_2.7V
Q1
QST4
3 2 1
4 5 6
VCHG_VBUS 10u C781
C703
1u
207R
K003
1258R
K074
FB701
600
U1005
MAX17040G
9
7 4
8 1
6
5
3 2
CELL VDD
SEO
EO
CTG SDA
GND SCL DNGP
SC3
4
3
2
1
C710
39p
307R
02
4 07 R
02
R724 47K C783
10u
C711
39p
R600
10K
C712
39p
007X
531-CF
zHK867.23
2
1
C713
39p C715
0.1u
R723 0
CN700
HSMU-5SB-24DR2
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
Q3
SIA431DJ
S1 S2
G
D1 D2 D3 D4 D5
R725 47K C717 1u
C716 1u
5C
u33
C707 47n
C8550
1u
CN701
KQ03LP1-3R
3
2
1
D1
D2
VBAT
0 2 58 R
051
9158R
051
807R
K7.4
47n C706
C8551
10n
VREG_MSMP_2.6V
10n
C725
K2.2
2258R
K2.2
3 25 8 R
K086
917R
470K
R717
K7.4
11R
9R
K7.4
VREG_MSMP_2.6V
107R
K051
D700
107DZ
u1.0
087C
577C
u33
VBAT
s
mhoK6.08
027R
VREG_MSMP_2.6V
VA700
777C
u1.0
C704
22p
C702
22p ZD700
FL700
NFM18PC104R1C3
1
IN OUT
GND1 GND2
877C
p22
1u
C8549
4.7u C754
TS5USBA33402YZPR
IC1
4B
D2
B2
A1 A2
B3
C2
A4
C1
A3 D1
E4
D3 D4
E3
E2 C3
E1 C4
1B
YLPPUSV
UART_TX VBUS
UART_RX DM
DP
USB_DM ID
USB_DP
AUDIO_L R2_2K
AUDIO_R
MIC
DSS
_INT
SDA CLDO
SCL
GND TESI
2.2K
R705
C724
0.1u
VCHG_VBUS
K2
707R
607R
K2
VREG_MSMP_2.6V
C721
0.1u
+VPWR
C744
4.7u
C8552
1u
2.2u
C761
BU33TD2WNVX U703
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
47K
R709
C730
2.2u
2.2u
C771
VREG_MSMP_2.6V
4.7u
C768
4.7u
ELCP0008004
L703
VREG_TOUCH_3.0V
VREG_USB_3.3V
+VPWR
22p C774
22p C776
200K
R722
TP702
VREG_MSMP_2.6V
TP701
TP700
R710
4.7
ELCP0008012
4.7u L701
VREG_MSME_1.8V
947C
u22
VREG_LCD_1.8V
L704
ELCP0008004
4.7u
C760 2.2u
547
C
n1
+VPWR
VREG_MSME_1.8V
C765
2.2u
VREG_RFRX1_2.7V PM7540
U704
9J 8J 7J 6J 5J 9H 8H 7H 6 H 5 H 9G 8G 7G 6G 5G 9F 8F 7F 6F 5F 9E 8E 7E 6E 5E
H1
E10 F1
F10 E1
C12 N2
B1
M12 B2
K7
A5
N13 A4
M13 B5
B4
G10 A7
D9 A6
H12 B7
B6
C13
A13 D10
A12 K10
H10
G12 J10
G1
M1 K4
D13 J4
E12 H4
N11 M2
A3 L2
A10 H2
A8
H13 K2
G13 J2
A11 G4
K13 F4
E13 D5
B13 B3
A9 M5
N12 N3
J13 N1
A2 M3
K6
M4 K5
N4 K9
M9 K8
N10 M11
M6 L12
N6 A1
M8 D4
N8 B12
J1 D8
K1 N5
M7
2G
21 D 7D 8B
01M 6 D 9 B
21J
31F
21 F
21K 7N 9N
01B
31L
11B 2F 4E 2C 1C 1D 1 L 2 D 2E
GHCV
N_LTC_ G HC
S UBV_BS U
N _ L T C_BS U
P_SNSI
M_SNSI
N_TE F _ TAB
TABV
NIOCV
P UKCAB_V
A NA _ D DV
E_1C_DDV
AP _2 C _DDV
2PG_ D DV
6P G _DDV
2E
MS
M _ D DV
P
MS
M_ D DV
1FR_DDV
2F R_ D DV
M I U R_D DV
RKPS_L_DDV
RKPS_R_DDV
OX C T _ DDV
NAL
W_ D DV
MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1D N G
2DNG
3 D N G
4 D N G
5 D N G
6DNG
7DN G
8 D N G
9D N G
01DNG
1 1DN G
2 1 D N G
3 1 D N G
41D N G
51 D N G
6 1 D N G
7 1 DNG
8 1 DNG
9 1DNG
0 2DNG
12D N G
22D N G
32DN G
4 2 D N G
5 2 D N G
Q2
QST4
3 2 1
4 5 6
R715 121K
K01
117
R
VREG_TCXO_2.85V
R716 51
847
C
n1
C762
2.2u
1K
R712
C770
2.2u
VBAT
VREG_MSMC1_1.25V
VREG_MMC_3.0V
VCHG_VBUS
0.1u C773
n1
647
C
VREG_RUIM_3.0V
u 2 . 2
0 4 7
C
C763
2.2u
VREG_MSMA_2.6V
2.2u
C766
VREG_MSMC2_1.25V
VRF_SMPS_2.1V
n1
747
C
C772
1u
VREG_MSMP_2.6V
SDB310Q
D701
2.2u
C769
KDS114E-RTK_HA
D702
ELCP0008012
4.7u L702
10u C743
057
C
u7.4
C739 0.1u
0.1u C736
C735 0.1u
0.1u C734
C733 0.1u
0.1u C732
C731 0.1u
+VPWR
1n C753
0.1u C729 C728
33p
+VPWR_AUDIO
C742 1n
4.7u
C767
VREG_AUX2_2.9V
VREG_LCD_2.8V
C759 2.2u
0.1u C727
0.1u C726
C705
1u
VCHG_VBUS
U700
MAX14528
9 6
5 3
4
8 2
7 1
IN1 OUT1
IN2 OUT2
IC1
OVLO IC2 DNG
DNGP
2.2u
L700
1n C741
317
R
1.0
VBAT
+VPWR
R16
51
10n
C757
0.1u
C701 C700
2.2u
C714
0.1u
C900
2.2u
470n C708
C709 470n
U701
WM9093ECS-R
3
B
A4
C3
C2
2
B
D1
D3
4
D
C1
A1 D2
1
B
D5
A2
A5
A3
B5
4
B
C5
4
C
D
N
G
OUT+
D
D
V
P
H
CPVDD
CPVSS
CN
HPL
OUT-
S
A I
B
IN2- HPR
IN1+
D
D
V
S
IN3-
IN2+
A
D
S
IN1-
IN3+
CP
L
C
S
C722
2.2u
+VPWR_AUDIO
2.2u
C719
2.2u
C723
2.2u C720
VREG_MSME_1.8V
VBAT_TEMP
VBAT_TEMP
PMIC_TCXO
TCXO_PM_19.2MHZ
JTAG_PS_HOLD
TCXO_EN
SLEEP_CLK
HPH_L
HPH_R
RCV_N
PM_INT_N
PS_HOLD
MSM_USIM_CLK
MSM_USIM_DATA
MSM_USIM_RST
GSM_PA_DAC_REF
RCV_P
nPON_RST
REMOTE_PWR_ON
USBH_DM
USBH_DP
AMUX_OUT
SLIDE_KPD_DRV_N
N I
O
C
V
SIM_IO
SIM_CLK
KPD_PWR_N
SIM_RST
SPK_RCV-
SPK_RCV+
MUIC_INT
MUIC_I2C_SCL
MUIC_I2C_SDA
UART2_TXD
UART2_RXD
LINE_OP
LINE_ON
USB_ID
USB_ID
MAX_DM
MAX_DM
MAX_DP
MAX_DP
PCB_REVISION
PCB_REVISION
+VPWR
R
W
P
V+
VSNS_RF_SMPS
VSNS_MSMC2_1.25V
VSNS_MSMC1_1.25V
VSNS_MSME_1.8V
BATT_FET_N
N_T
EF_TT
A
B
CHG_CTL_N
N _ L T
C _
G
H
C
ISNS_P
P_
S
N
S I
VBAT_SENSE
VBAT_SENSE
PMIC_SSBI
USB_3.3V_EN
USB_3.3V_EN
EAR_R
EAR_L
AUDIO_I2C_SDA
AUDIO_I2C_SCL
QT_KPD_DRV_N
FUEL_I2C_SDA
FUEL_I2C_SCL
2mm
Global 5pin TA
Global 5pin USB Cable
PCB Revision
Battery Connector
2mm
Jap. Charging Gender
Jap. Data Gender
430K
1.04V
R1
300K
0.62V
1.73V
100K
0.81V
680K Rev.1.2
D&I
Rev.1.0
0.16V
HKAIN0 : PCB Revision Check ADC
150K
150K
Rev.1.1
A&F
B&G
C&H
1.93V
REV
150K
150K
47K
68K
10K
2.13V
R2
150K
TEST&E
150K
ADC
150K
150K
150K
1.30V
u-USB Connector
MUIC
VBUS 2mm
2010.03.20
2010.01.28 added
2009.11.18
0.3mm 0.3mm
09.11.12
Turbo Mode
180k
Am 08 eldnaH n aC ecarT
180k
1608
0603
0603
0603
3
0
6
0
0603
m
m
5
.
0

9
N

,
7
N close to each other
FUEL GUAGE
NDK --> EPSON
M_S NS I
330k
Open
Short
Pulled By PC
Open
Pulled By PC
No Charging (TBD)
300mA Normal
Call : 500mA Alternative Charging (TBD)
Idle : 600mA Normal
DCM shop usage
ID Resistance USB D+/D-
0603
0603
1608
Place close to PM7540 pins
Route together
USB 3.3V LDO
0603
0.6mm
0603
These CAPs close to inductors
0.6mm
0.6mm
Place in PM7540 room at shield edge
PM7540
Local Ground Plan
0.5mm
rehtegot etuo
R
1%
Place crystal and load caps close to PM7540
ISNS_M
1%
2mm
Battery Charging Circuit
10V
1608
2mm
AUDIO SUBSYSTEM
7. CIRCUIT DIAGRAM
U800
LBEH19UNBC-338
03 92 82 72 62 52 42 32 22 12 02 91 81 7 1 61
31
32 15
14
33
34 13
35 12
36 11
37 10
38 9
39 8
40 7
6
41 5
4
42
43 3
44 2
45
1
64 74 84 94 05 15 25 35 45
1DN G
2DNG
3DNG
4DNG
B_EKA
W_TSOH_L
W
DXT_TRAU_TB
N_STC_TRAU_TB
N_STR_TRAU_TB
DXR_TRAU_TB
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
BB2XLV_RS
BBTUOV_RS
OIDDV
UP_LATX
DS _O IDDV
TUO_2P1_GID
TUO_2P1_GLNA
ODLV2P1_NIV
TUO_2ODLNL
ADS_TB
LCS_TB
1OIDUA
2OIDUA
N_TSR_TB
7DNG
C810
0.1u
VREG_MSMP_2.6V
K2.2
308
R
K2.2
408
R
C825
2.2u
L804
4.7n
C809
4.7u
KR3DM
U801
61
7 6
5
4
8
3
9
2
10
1
11
12
13
41 51
2DEVRESE R
DDV
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1 ODS_IDS_ADS
0AS _ O DS
4DNG
R801
11K
L8055
4.7u
C801
22p
7158R
0
C807
1.2p
C826 100p
22p
C800 ANT800
SNGF0048003
ITBTPTR3015
2
3 1
4 G2
FEED G1
NC
008R
K7.4
L801
100n
26MHz
X800
TG-5010LH-87N
4 2
3 1
NC OUT
GND VCC
J800
ENSY0024301
KP09N-6S-2_54SF
9 8
10 7
6 3
5 2
4 1
VCC GND1
RST VPP
CLK IO
GND2 GND5
GND3 GND4
VDD_TCXO
VDD_TCXO
+VPWR
10u
C822
C8547
1u
3.3u L803
VREG_MSMP_2.6V
0.1u
C817
600
FB8501
2.2u
C8535
0.1u
C8543
4.7u
C816
0.1u
C823
2.2u
C8538
VREG_MSMP_2.6V
4.7u
C813
4.7u
C8541
10u
C8534
+VPWR
0.1u
C814
8.2p
C8544
TP4
C805
12p
TP10
K 0 0 1
508R
C824
1u
BU28TD2WNVX U802
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
1u
C827
22p
C803 C802
0.1u
C804
10p
VREG_RUIM_3.0V
VREG_RUIM_3.0V
D800
4 3
5 2
6 1
TP3
TP2
TP6 TP7
TP8
TP9
BT_RESET_N
PUEKAW_TSOH_NALW
WLAN_RESET_N
MOTION_INT
SLEEP_CLK
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_DOUT
WLAN_CLK
WLAN_CMD
BT_WAKEUP
WLAN_SDIO[0]
WLAN_SDIO[2]
WLAN_SDIO[1]
BT_PCM_DIN
BT_HOST_WAKEUP
WLAN_SDIO[3]
MOTION_I2C_SDA
MOTION_I2C_SCL
SIM_IO
SIM_IO SIM_CLK
SIM_CLK SIM_RST
SIM_RST
DXT_TRAU_TB
DXR_TRAU_TB
STC_TRAU_TB
STR_TRAU_TB
WLAN_WAKEUP
CLK_REQ
CLK_REQ
CLK_IN
CLK_IN
RF_IN_OUT
RF_IN_OUT
WLAN_REG_ON
BT_ANT
RF
Wi-Fi&BT&FM MODULE
TCXO LDO
Acceleration SENSOR
USIM Socket
26MHz TCXO
0603
3
0
6
0
3
0
6
0
3
0
6
0
7. CIRCUIT DIAGRAM
+VPWR
VREG_MMC_3.0V
VREG_LCD_2.8V
VREG_LCD_1.8V
VREG_TOUCH_3.0V
VREG_MSMP_2.6V
CN900
24-5804-080-000-829+
41 40
42 39
43 38
44 37
45 36
46 35
47 34
48 33
49 32
50 31
51 30
52 29
53 28
54 27
55 26
56 25
57 24
58 23
59 22
60 21
61 20
62 19
63 18
64 17
65 16
66 15
67 14
68 13
69 12
70 11
71 10
72 9
73 8
74 7
75 6
76 5
77 4
78 3
79 2
80 1
CAM_MCLK
TOUCH_INT
PROX_OUT
TOUCH_I2C_SCL
TOUCH_I2C_SDA
MIC_BIAS
SLIDE_KPD_DRV_N
VCOIN
KPD_PWR_N
SPK_RCV-
SPK_RCV+
LCD_BL_I2C_SCL
LCD_BL_I2C_SDA
LCD_BL_EN
CAM_DATA[0]
CAM_DATA[1]
MIC_1N CAM_RESET_N
HS_MIC
CAM_PWDN
MICROSD_DET_N
HOOK_ADC
MSM_LCD_VSYNC_O
LCD_MAKERID_LOW
QTKEY_RESET
QTKEY_INT
MMC_CLK
MMC_CMD
MMC_DATA[3]
MMC_DATA[2]
MMC_DATA[1]
MMC_DATA[0]
MIC_1P
HS_MIC_BIAS_EN
CAM_I2C_SCL
CAM_I2C_SDA
SLIDE_DETECT
QTKEY_SDA
QTKEY_SCL
EAR_SENSE
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_P
LCD_RESET_N
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[6]
CAM_DATA[7]
CAM_DATA[5]
CAM_PCLK
CAM_HSYNC
CAM_VSYNC
EAR_R
EAR_L
MOTOR_EN
MOTOR_PWM
COMPASS_DRDY
DK_Volume_UP
DK_Volume_DOWN
QT_KPD_DRV_N
Audio GND - Routing Carefully
Main to Qwerty Connector
7. CIRCUIT DIAGRAM
CN2
14-5804-080-000-829+
41 40
42 39
43 38
44 37
45 36
46 35
47 34
48 33
49 32
50 31
51 30
52 29
53 28
54 27
55 26
56 25
57 24
58 23
59 22
60 21
61 20
62 19
63 18
64 17
65 16
66 15
67 14
68 13
69 12
70 11
71 10
72 9
73 8
74 7
75 6
76 5
77 4
78 3
79 2
80 1
VREG_LCD_2.8V
VREG_LCD_1.8V
+VPWR
VREG_MMC_3.0V
VREG_TOUCH_3.0V
VREG_MSMP_2.6V
CN1
14-5804-080-000-829+
41 40
42 39
43 38
44 37
45 36
46 35
47 34
48 33
49 32
50 31
51 30
52 29
53 28
54 27
55 26
56 25
57 24
58 23
59 22
60 21
61 20
62 19
63 18
64 17
65 16
66 15
67 14
68 13
69 12
70 11
71 10
72 9
73 8
74 7
75 6
76 5
77 4
78 3
79 2
80 1
VREG_MSMP_2.6V
VREG_TOUCH_3.0V
VREG_LCD_1.8V
VREG_LCD_2.8V
VREG_MMC_3.0V
+VPWR
LCD_BL_I2C_SCL LCD_BL_I2C_SCL
LCD_BL_I2C_SDA LCD_BL_I2C_SDA
LCD_BL_EN LCD_BL_EN
CAM_DATA[0] CAM_DATA[0]
SPK_RCV+ SPK_RCV+
SPK_RCV- SPK_RCV-
MIC_1N MIC_1N CAM_RESET_N CAM_RESET_N
HS_MIC HS_MIC
CAM_PWDN CAM_PWDN
MICROSD_DET_N MICROSD_DET_N
HOOK_ADC HOOK_ADC
MSM_LCD_VSYNC_O MSM_LCD_VSYNC_O
LCD_MAKERID_LOW LCD_MAKERID_LOW
QTKEY_RESET QTKEY_RESET
EAR_R EAR_R
EAR_L EAR_L
KPD_PWR_N KPD_PWR_N
QTKEY_INT QTKEY_INT
PROX_OUT PROX_OUT
MMC_CLK MMC_CLK
MMC_CMD MMC_CMD
MMC_DATA[3] MMC_DATA[3]
MIC_1P MIC_1P
HS_MIC_BIAS_EN HS_MIC_BIAS_EN
TOUCH_INT TOUCH_INT
CAM_I2C_SCL CAM_I2C_SCL
CAM_I2C_SDA CAM_I2C_SDA
TOUCH_I2C_SCL TOUCH_I2C_SCL
TOUCH_I2C_SDA TOUCH_I2C_SDA
SLIDE_DETECT SLIDE_DETECT
QTKEY_SDA QTKEY_SDA
QTKEY_SCL QTKEY_SCL
EAR_SENSE EAR_SENSE
MIC_BIAS MIC_BIAS
MDDI_P_STB_M MDDI_P_STB_M
MDDI_P_STB_P MDDI_P_STB_P
MDDI_P_DATA_M MDDI_P_DATA_M
MDDI_P_DATA_P MDDI_P_DATA_P
LCD_RESET_N LCD_RESET_N
CAM_MCLK CAM_MCLK
CAM_PCLK CAM_PCLK
CAM_HSYNC CAM_HSYNC
CAM_VSYNC CAM_VSYNC
QT_KPD_DRV_N QT_KPD_DRV_N
DK_Volume_DOWN DK_Volume_DOWN
DK_Volume_UP DK_Volume_UP
PROX_COMPASS_I2C_SDA PROX_COMPASS_I2C_SDA
COMPASS_DRDY COMPASS_DRDY
MOTOR_PWM MOTOR_PWM
MOTOR_EN MOTOR_EN
VCOIN VCOIN
SLIDE_KPD_DRV_N SLIDE_KPD_DRV_N
PROX_COMPASS_I2C_SCL PROX_COMPASS_I2C_SCL
AUDIO_GND AUDIO_GND
BtoB Connector
Main Connector Sub Connector
Main To Sub
7. CIRCUIT DIAGRAM
10u
C119
VREG_LCD_1.8V VREG_MSMP_2.6V
NLSV1T244MUTBG U102
4 3
5 2
6 1
VCCA VCCB
A B
GND OE_
VREG_CAM_AVDD_2.7V
R110 12
GB042-34S-H10-E3000
CN101
17
16
15
14
13
12
11
10
9
8
7
6
5
31 4
32 3
33 2
34 1
30
29
28
27
26
25
24
23
22
21
20
19
18
VREG_CAM_DVDD_1.2V
120
FB102
C117
0.1u
VREG_CAM_AF_2.8V
VA1
FL102 7.5pF
01 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
FL101 7.5pF
01 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2 G
VREG_CAM_IOVDD_1.8V
C3
DNI
0.1u
C114
C113
0.1u
FB101
120
0.1u
C112
VA101
C111
1u
AAT2870
U101
D2
1E
A4
C1
B3
3F 5C 3A
A2
C2
B2
D1
B1
A1
D3
F1
E2
F2
E3
E4
F4
E5
F5
C3
D5 A5
4C 4D 4B 5B
+2C
+1C
-1C
-2C
IN NEG
SDA
BL1
BL2
BL3
BL4
BL5
BL6
BL7
BL8
SCL
LDOA
LDOB
BC_M
LDOC
FLTR
LDOD 1DNGA
1DNGP
2 D N GP
SBIAS
AMB_IN
IN_LDO
2DNGA
EN
C110
33u
2.2u
C109
+VPWR
FL1 7.5pF
0 1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1 G 2 G
111R
K2 . 2
VREG_MSMP_2.6V
601R
K001 VREG_CAM_AF_2.8V
2.2u
C106
2.2u
C105 C104
2.2u
C103
2.2u
VREG_CAM_AVDD_2.7V
VREG_CAM_DVDD_1.2V
VREG_CAM_IOVDD_1.8V
VREG_CAM_IOVDD_1.8V
U103
EUSY0342405
NLSX4373MUTAG
5 4
6 3
7 2
8 1
VL VCC
IO_VL1 IO_VCC1
IO_VL2 IO_VCC2
GND EN
211R
K2.2
33p
C120
C107
1u 1u
C108
501R
K7.4
VREG_MSMP_2.6V
401R
K7.4
201R
K2.2
K2.2
101R
CAM_PWDN
CAM_RESET_N
FLT_CAM_DATA[7]
FLT_CAM_DATA[7]
FLT_CAM_DATA[6]
FLT_CAM_DATA[6]
FLT_CAM_DATA[5]
FLT_CAM_DATA[5]
FLT_CAM_DATA[4]
FLT_CAM_DATA[4]
FLT_CAM_DATA[3]
FLT_CAM_DATA[3]
FLT_CAM_DATA[2]
FLT_CAM_DATA[2]
FLT_CAM_DATA[1]
FLT_CAM_DATA[1]
FLT_CAM_DATA[0]
FLT_CAM_DATA[0] CAM_DATA[0]
CAM_DATA[1]
LCD_BL_I2C_SCL
LCD_BL_I2C_SDA LCD_VSYNC_O MSM_LCD_VSYNC_O
WLED7
WLED6
WLED1
WLED2
WLED3
WLED4
WLED5
LCD_BL_EN
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[6]
CAM_DATA[7]
CAM_DATA[5]
CAM_MCLK
CAM_PCLK
CAM_HSYNC
CAM_VSYNC
FLT_CAM_VSYNC
FLT_CAM_VSYNC
FLT_CAM_HSYNC
FLT_CAM_HSYNC
CAM_I2C_SDA
CAM_I2C_SCL
FLT_CAM_I2C_SDA
FLT_CAM_I2C_SDA
FLT_CAM_I2C_SCL
FLT_CAM_I2C_SCL
LCD BACKLIGHT CHARGE PUMP
LCD Vsync
CAMERA EMI FILTER
3M CAMERA
LGIT_1/4'' SVCY0024801(C3AA-Y314A)
7. CIRCUIT DIAGRAM
C2500
1u
11R
p001
C402
DNI
CN402
24-5804-080-000-829+
41 40
42 39
43 38
44 37
45 36
46 35
47 34
48 33
49 32
50 31
51 30
52 29
53 28
54 27
55 26
56 25
57 24
58 23
59 22
60 21
61 20
62 19
63 18
64 17
65 16
66 15
67 14
68 13
69 12
70 11
71 10
72 9
73 8
74 7
75 6
76 5
77 4
78 3
79 2
80 1
VREG_MSMP_2.6V
VREG_TOUCH_3.0V
VREG_MMC_3.0V
VREG_TOUCH_3.0V
VREG_LCD_2.8V
VREG_LCD_1.8V
VREG_LCD_1.8V
VREG_LCD_2.8V
CN5
HJ-BCT-04Y
1
VREG_MSMP_2.6V
CN4
HJ-BCT-04Y
1
SW401
G1
ANT G2
K7.4
304
R
K7.4
204
R
+VPWR
C403
27n
CN401
GB042-50S-H10-E3000
26 25
27 24
28 23
29 22
30 21
31 20
32 19
33 18
34 17
35 16
36 15
37 14
38 13
39 12
40 11
41 10
42 9
43 8
44 7
45 6
46 5
47 4
48 3
49 2
50 1
104R
K01
+VPWR
1K
R8
CAM_PWDN
CAM_RESET_N
CAM_DATA[0]
CAM_DATA[1]
LCD_BL_I2C_SCL
LCD_BL_I2C_SDA
LCD_VSYNC_O
MSM_LCD_VSYNC_O
WLED7
WLED6
WLED1
WLED2
WLED3
WLED4
WLED5
LCD_BL_EN
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[6]
CAM_DATA[7]
CAM_DATA[5]
CAM_MCLK
CAM_PCLK
CAM_HSYNC
CAM_VSYNC
VCOIN
VCOIN
MIC_1P
DK_Volume_DOWN
QTKEY_SCL
KEY_ROW[7]
QTKEY_SDA
QT_KPD_DRV_N
MIC_1N
HOOK_ADC
LCD_MAKERID_LOW
LCD_MAKERID_LOW
PROX_OUT
PROX_OUT
TOUCH_INT
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SCL
TOUCH_I2C_SDA
TOUCH_I2C_SDA
SPK_RCV-
SPK_RCV-
SPK_RCV+
SPK_RCV+
MDDI_P_STB_M
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_M
MDDI_P_DATA_P
MDDI_P_DATA_P
LCD_RESET_N
LCD_RESET_N
MMC_CLK
MMC_CMD
MMC_DATA[3]
MMC_DATA[2]
MMC_DATA[1]
MMC_DATA[0] QTKEY_RESET
EAR_R
EAR_L
MICROSD_DET_N
QTKEY_INT
HS_MIC_BIAS_EN
HS_MIC
SLIDE_DETECT
EAR_SENSE
MIC_BIAS
KEY_COL[7]
KEY_COL[6]
MOTOR_EN
MOTOR_PWM
COMPASS_DRDY
SLIDE_KPD_DRV_N
SLIDE_KPD_DRV_N
DK_Volume_UP
KPD_PWR_N
KPD_PWR_N
AUDIO_GND
CAM_I2C_SDA
CAM_I2C_SCL
Sub to LCD FPCB Connector
Main Antenna
Main to Sub Connector
PROX power : Route 0.2mm
PROX and COMPASS common Power/I2C
7. CIRCUIT DIAGRAM
LD305
CL-435F-WQT-SD-TS
4
3
2
1
LD304 4
3
2
1
L3
100n
LD303 4
3
2
1
+VPWR
LD301 4
3
2
1
533R
0
223
A
V
433
R
K 2.2
VREG_MSMP_2.6V
C303
0.1u
333
R
K 2.2
0.1u
C302
470 R332
VA321
023
A
V
913
A
V
813
A
V
713
A
V
470 R331
PP2106M3
U301
41 31 2 1 1 1 01 9 8
15 7
16 6
17 5
18 4
19 3
20 2
21 1
22 3 2 42 52 62 7 2 82 92
DNGP
2 D N G
B TESER
IX OX
LES _K LC
D DV
01P
TEST P40
SEL_28P P41
P57 P42
P56 P43
P55 P44
P17 P45
P15 P46
1 D N G
45P
35P
25P
1 5P
05P
74P
6 13
A
V
513
A
V
C301
1u
33 R330
413
A
V
R329 33
33 R328
R327 33
31 3
A
V
2 13
A
V
113
A
V
0 13
A
V
90 3
A
V
80 3
A
V
KB353
703
A
V
470 R324
470 R323
470 R322
R321 470
470 R320
470 R319
470 R318
R317 470
470 R316
R315 470
470 R314
R313 470
R312 470
CN301
3
2
1
K021
113R
KB351 KB350 KB356 KB355 KB349
KB352
503
A
V
KB348
R309 100ohms
R308 100ohms
203
A
V
323
A
V KB347
KB308
KB345 KB344 KB357 KB354 KB343 KB342 KB341 KB317
KB339 KB338 KB337 KB336 KB335 KB334 KB333
KB324
KB331 KB330 KB329 KB328 KB327 KB326 KB325
KB332
KB323 KB322 KB321 KB320 KB319 KB318
KB340
KB316
KB315
KB314 KB313 KB312 KB311 KB310 KB309
KB346
KB307 KB306 KB305 KB304 KB303 KB302 KB301
470 R302
100n L5
100n
L4
2L
n001
DK_Volume_DOWN
KEY_COL[2]
QTKEY_SCL
KEY_COL[3]
KEY_ROW[7]
QTKEY_SDA
QT_KPD_DRV_N
QTKEY_RESET
QTKEY_INT
KEY_ROW[5]
KEY_COL[7]
KEY_ROW[6]
KEY_ROW[1]
KEY_ROW[1]
KEY_COL[4]
KEY_COL[5]
DK_Volume_UP
SPACE2
Key Coder IC
Qwerty 54key / 4pie DR
%1
KEY LED LIGHT
VOLUME SIDEKEY
ENTER2
Changed 03/24
From 4P to 3P
Citizen for Japan
1 2 3 4 5 6 7
BACK
8 9 0 DEL ENTER1 SEARCH
Q W E R T Y U
I O P Fn A S
LANG
D F G H J K L
MENU
DOT
Z X C V SPACE1
B N M
MANNER UP DOWN
HIPEN
END
COMA
SHIFT1
SHIFT2
HOME
HOME SEND LEFT RIGHT
7. CIRCUIT DIAGRAM
312R
IND
MIC1
6
5
4
3
2
1
OUT
G1
G2
G3
PWR
G4
10 2 R
I ND
ZD206 ZD201 ZD202
D207
D208
ZD205
C216
100p
412R
IND
U202
3 2
4 1
VDD OUT
VSS NC
FB202 1800
FB203 1800
C206
4.7u
CN1
16
8
7
6
5
4
3
2
1 15
G5 G3 G1 CD
C1
C2
C3
C4
C5
C6
C7
C8
G6 G4 G2 COM
G7
5 12 C
p 5 1
41 2 C
u 0 1
3 1 2C
p7 4
R216
100K
1800 FB201
0.1u
C212
47p
C210
33p
C208
2.2u
C207
912R
K74
212
R
s
mho
K001
0.1u
C205
K74
112R
602D
4
3
5
2
6
1
VREG_MSMP_2.6V
R210 2.2
VREG_MMC_3.0V
5 0 2D
4
3
5
2
6
1
K74
9 0 2R
802R
K 74
K74
70 2 R
K7 4
6 02 R
47p
C204
402D
FB1 1800
100n
C203
VREG_MSMP_2.6V
C202
0.1UF
VREG_MSMP_2.6V
K2.2
302R
33p
C201
202D
102D
202R
K001
1800
FB204
U201
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
001Q
D
G
S
022R
M1
VREG_MSMP_2.6V
J201
2
3
6
5
4
1 M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
MIC_1P
MIC_1N
HOOK_ADC
MMC_CLK
MMC_CMD
MMC_DATA[3]
MMC_DATA[2]
MMC_DATA[1]
MMC_DATA[0]
EAR_R
EAR_L
MICROSD_DET_N
HS_MIC_BIAS_EN
HS_MIC
SLIDE_DETECT
EAR_SENSE
MIC_BIAS
AUDIO_GND
MICROPHONE SLIDE DETECT
3.5 EAR_JACK
MATING
EAR_SENSE
UNMATING
STATE
Open
Detect
Close (Detect =COM)
S/W
LOW(Detect)
HIGH (Normal)
Micro SD Socket
LOW(DEFAULT)
HIGH
Changed 03/24
Active : Low
5/10 Added
7. CIRCUIT DIAGRAM
CN601
2
1
L511 100n
L512 100n
470n
C2
523
A
V
423
A
V
C4
1u
6R
K3 . 3
1C
n01
U1
AMI304
12
11
10
9
5
4
6
3
7
2
8
1
DDVD
GERV
ADNG
SD NG
D DVA
ADDR
SCL
NC1
TNI
VPP
DRDY
SDA
K3.3
7 R
TP1
0 R2
R4 0
Q601
C
B
E GND
IN
OUT
R619
100K
TPA6202A1ZQVR
U601
B2 C1
A1 B1
B3 C2
A3 C3
IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
K1
716R
100K
R622
51K
R620
51K
R621
C638
0.1u
10n C640
816R
K1
K7.4
326R
C639
1u
C471
1u
R430
100K
+VPWR
VREG_MOTOR_3.3V
U405
BU33TD2WNVX
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
MOTOR_EN
MOTOR_PWM
COMPASS_DRDY
CONNECTOR Type
Digital Compass
%1
%1 1%
Q-coin MOTOR
1%
1%
1%
2010.03.10 added
Motor 3.3V LDO
0603
7. CIRCUIT DIAGRAM
KB101
LD100
CL-435F-WQT-SD-TS
4
3
2
1
001
A
V
101
A
V
501
A
V
301
A
V
201
A
V
LD102
CL-435F-WQT-SD-TS
4
3
2
1
KB102
KB100
VA104
+VPWR
R103
33
CN100
GB042-10P-H10-E3000
6 5
7 4
8 3
9 2
10 1
311HR-VG1
BAT100
p93
501
C
4 01
C
p 9 3
CN101
2
1
101
D
001
D
VREG_LCD_1.8V
VREG_LCD_2.8V
R100
4.7
u1 101C
TP100
+VPWR
0.1u
C103 C102
4.7u
R101
10
C100 4.7u
U100 GP2AP002S00F
5 4
6 3
7 2
8 1
LEDA SCL
LEDC SDA
VCC VIO
VOUT GND
VREG_TOUCH_3.0V
GB042-50P-H10-E3000
CN102
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50 1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
2.2u
C107
2.2u
C106
D102
4 3
5 2
6 1
+VPWR
VREG_LCD_1.8V VREG_LCD_2.8V
04-6293-025-001-829
CN103
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
ICMEF214P101M FL100
01 9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
R104
33
CL-435F-WQT-SD-TS
LD101
4
3
2
1
601AV
C110
DNI
R102
33
C108
2.2u
7 01 AV
C109
1u
801AV
SPK_RCV-
SPK_RCV-
SPK_RCV+
SPK_RCV+
PROX_OUT
PROX_OUT
LCD_MAKERID_LOW
LCD_MAKERID_LOW
VREG_TOUCH_3.0V
TOUCH_INT
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SCL
TOUCH_I2C_SDA
TOUCH_I2C_SDA
MDDI_P_STB_M
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_M
MDDI_P_DATA_P
MDDI_P_DATA_P
LCD_RESET_N
LCD_RESET_N
LCD_VSYNC_O
LCD_VSYNC_O
WLED7
WLED7
WLED6
WLED6
WLED1
WLED1
WLED2
WLED2
WLED3
WLED3
WLED4
WLED4
WLED5
WLED5
KPD_PWR_N
KPD_PWR_N
KEY_ROW[7]
KEY_ROW[7]
KEY_ROW[7]
SLIDE_KPD_DRV_N
SLIDE_KPD_DRV_N
KEY_COL[6]
KEY_COL[6]
KEY_COL[7]
KEY_COL[7]
VCOIN
VCOIN
VCOIN
SLIDE FPCB TO QW
SLIDE FPCB TO QW(HEADER)
SPEAKER
LCD FPCB side
Proximity Sensor
KEY PCB side
Touch Connector
Tuning point
END
HOME
SEND
2EA --> 3EA
LED : SEOUL-SEMI --> CITIZEN
3.2" HVGA LCD Connector
8. BGA PIN MAP
- 37 -
U302|
USE
NC USE
U302 MSM 7227
(EUSY0392302)
8. BGA PIN MAP
U302 : MSM 7227 (EUSY0392302)
USE
NO USE
8. BGA PIN MAP
- 38 -
U400|
USE
NC USE
U400 MT29C8G96MAZAPOJA5 T U400 MT29C8G96MAZAPOJA5 T
(EUSY043090!)
U400 : MT29C8G96MAZAPDJA-5 IT (EUSY0430901)
USE
NO USE
8. BGA PIN MAP
- 39 -
U704|
USE
NC USE
U704 PM7540 U704 PM7540
(EUSY034220!)
U704 : PM7540 (EUSY0342201)
USE
NO USE
8. BGA PIN MAP
- 40 -
C!|
USE
NC USE NC USE
C! TS5USBA33402YZPP
(EUSY037200!)
IC1 : TS5USBA33402YZPR (EUSY0372001)
USE
NO USE
8. BGA PIN MAP
- 41 -
U70!|
USE
NC USE NC USE
U70! WM9093ECSP
(EUSY040390!)
U701 : WM9093ECS-R (EUSY0403901)
USE
NO USE
8. BGA PIN MAP
- 4 -
U!0!|
USE
NC USE NC USE
U!0! AAT2870
(EUSY0336503)
U101 : AAT2870 (EUSY0336503)
USE
NO USE
8. BGA PIN MAP
- 43 -
U60!|
USE
NC USE NC USE
U60! TPA6202A!ZQVPG!
(EUSY040400!)
U601 : TPA6202A1ZQVRG1 (EUSY0404001)
USE
NO USE
9. PCB LAYOUT
F
13
A B C D E
1
N H G M L K J
K
D
A A
K
L
R
P
N
M
J
H
G
F
E
A
C
B
G A
F A
B A
C A
D A
E A
U
V
W
Y
L
M
N
P
R
T
1
J
H
G
F
E
D
C
B
A
1
D
1
5
0 1
7 2
4
C B
0 1
E D
1
C
P
A
B
H
G
F
E
D
L
N
M
J
K
R
0 0 7 X
5 1 7 R
9 6 7 C
F
B
8
5
0
1
2 6 7 C
1 7 7 C
0 1 7 R
0 4 7 C
1 1 7 R
3 2 7 R
7 6 7 C
C
7
3
3
5 6 7 C
2 1 7 R
C
7
3
9
7 5 7 C
C
7
3
6
4 7 7 C
0 0 6 R
9 4 5 8 C
1 2 5 8 R
C
780
L
8
0
5
5
L
8
0
3
0 2 3 C
4 0 7 R
3 3 4 C
6 1 8 C
3 1 8 C
7 1 3 C
3 4 5 8 C
0 0 3 U 1 4 5 8 C
1 0 7 R
3 0 7 R
C
7
2
3
1 0 3 U
2 0 3 U
1 0 7 U C
7
0
1
R
7
2
4
1 3 4 C
C
4
5
1
R
9
C
7
2
5
C
8
0
9
IC
1
R
3
0
0
2 0 7 D
2 0 4 P T
C
29
C
4
3
9
0 4 4 C
2 5 5 8 C
R
316
3 C S
C
N
7
0
0
3 1 4 C
6 0 4 P T
5 0 4 P T
7 0 4 P T
4 0 4 P T
5 C
C
827
C
826
C
7
2
6
T
P
7
0
1
3 Q
R
8522
C
8
5
5
0
R
8523
R
8519
R
7
1
3
2 P T
0 1 P T 3 P T
4 P T
X
8
0
0
2 2 8 C
C
8
5
3
5
C
8
5
4
4
1 0 8 R
8 2 7 C
C
754
1 0 7 D
1 3 7 C
C
7
5
3
C
7
3
5
2 0 7 P T
C
7
7
2
C
773
C
7
6
1
C
7
2
9
R
7
1
6
C
8551
R
8520 5 0 0 1 U
2 3 7 C
0 0 8 U
0 0 7 P T
R
7
0
9 0 0 7 L
C
7
4
4
U
7
0
4
C
7
6
3
C
7
6
8
7 2 7 C
C
7
5
9
4 3 7 C
C
7
6
6
R
7
1
7
R
719
C
750
C
741 1 8 7 C
C
8
5
3
4
9 P T
4 1 8 C 7 1 5 8 R
3 2 8 C
8 P T
C
8
5
4
7 7 P T 6 P T
4 0 7 L
2 0 7 L
C
7
6
0
3 R
C
752
C
7
4
9
C
742
1 0 7 L
3 4 7 C
6 7 7 C
C
751
3 0 7 L
0 7 7 C
5 7 7 C
0 0 7 A V 0 2 7 R
C
7
7
8
9 4 4 C
C
7
4
6
1 0 3 C
4 1 3 R
7 1 8 C
8 1 3 C
C
8
5
3
8
R
7
C
748
1 2 C
4 R
C
1
2 2 4 C
6 4 4 C
2 5 4 C
5 2 4 C
C
7
4
5
9 1 C
5 3 C
8 R
C
779
4 2 4 C
8 1 7 C
5 0 3 C
C
2 R
7
0
2
6 0 3 C
C
747
7 7 7 C
0 1 3 C
1 0 7 D Z
C
3
1
1
C
4
5
8
6 0 3 R
C
3
3
C
4
5
4
C
4
2
9
C
4
2
8
C
3
1
6 0 3 P T
C
9
0
0
5 1 7 C 3 1 7 C
0 0 3 X
3 1 3 C
6 1 3 C
4 1 3 C
8 0 3 P T
7 0 3 P T
1 2 3 C
7 0 7 C
2 2 7 C
C
303
V
A
305
R
6
7 0 3 C
8 0 7 C
9 0 7 C
6 0 7 C
C
3
2
3
4 1 7 C 2 1 7 C
3 1 3 R
4 C 3 C
9 0 3 R
4 1 R
TP309
C
7
2
0
2 1 3 C
9 0 3 C
5 1 3 C
TP310
C
717
3 8 7 C
C
7
1
6
C
7
0
0
R
7
2
5
0 1 7 C
1 1 7 C
R
1
1 9 1 7 C
C
8
1
0
5 5 4 C
C
4
4
7
C
4
1
8
C
4
2
3
C
4
4
8
C
4
1
6
R
8
0
4
U
8
0
1
R
8
0
3
R
1
0
7 1 4 C
C
3
1
9
C
4
3
0
0 5 4 C
R
3
0
8
C
20
C
4
3
4
1 0 7 B F
9 5 4 C
9 0 4 C
6 2 4 C 0 0 4 C
5 1 C
R
7
0
7
R
7
0
6
C
7
0
4
C
3
2
2
R
7
0
5
D
3
0
1
R
7
0
8
R
13
2 2 7 R
D
3
0
2
2 1 3 R
1 1 3 R R
307
C
25
R
3
1
0
C
28
R
12
R
2
T
P
4
0
1
C
3
4
C
32
C
4
5
6
C
4
0
4
3 5 4 C
C
4
3
5
C
4
5
7
C
4
1
5
U
703 0 3 7 C
C
7
2
1
D
7
0
0
R
3
0
1
V
A
3
0
3
C
7
2
4
2 Q
1 Q
1 R
0 0 4 U
C
4
1
4
C
4
3
6
C
4
3
8
V
A
3
0
2
R
315
C
304
T
P
4
0
8
C
4
4
1
C
4
4
3
R
15
R
4
0
3
4 4 4 C
T
P
5
C
4
2
7
V
A
3
0
0
C
4
4
5
V
A
3
0
4
C
4
3
7
V
A
3
0
1
C
4
4
2
5 R
C
30 3 0 4 P T
9. PCB LAYOUT
L-04C_MAIN_SPFY0244801-10_TOP
U800 BT, Wif Module
- No BT, WiFi
X800 BT, Wif Reference Oscillator
- No BT, WiFi
U704 PM7540
- No Booting, No Service
- No Charging
U1005 Fuel Guage IC
- No Battery Level
CN700 IO Connector
- No Charging
Q1, Q2 Charging TR
- No Charging
IC1 MUIC
- No USB, NO UART
U801 Acceleration Sensor
- No Auto Rotate Display
U302 MSM7227
- No Booting,No Service
U400 Memory
- No Booting
U301 NAND GATE
- No High Speed USB
X300 VCTCXO
- No Service
U300 D FlipFlop
- No GPS Sensitivity
9. PCB LAYOUT
7
8
80
41 40
4 1
1 0 0 1 W S
R
1
0
1
2
S
W
1
0
0
0
2 2 0 1 L
4 3 0 1 L
2 3 0 1 L
4 9 0 1 C
3 9 0 1 C
4 8 0 1 C
1 0 1 1 C
7 9 0 1 C
4 5 0 1 C
1 0 7 N C
F
L
1
0
0
6
5 1 0 1 L
5 0 8 R
6 8 0 1 C
2 0 0 1 L F
2 8 0 1 C
3 2 0 1 L
4 6 0 1 C
2 6 0 1 C
3 6 0 1 C
1 6 0 1 C
2 2 0 1 R
7 6 0 1 C
8 6 0 1 C
8 5 0 1 C
6 5 0 1 C
C
1
0
5
7
5 5 0 1 C
6 0 0 1 L
C
N
5
4 2 0 1 C
C
5
3
7 1 0 1 R
C
N
4
0 0 8 R
J
8
0
0
A
N
T
8
0
1
6 1 0 1 C
C
7
0
2
0 0 7 U
C
N
7
C
N
9
0
0
C
N
6
C
1
0
5
1
C
1
0
9
1
C
1
0
9
5
4 2 0 1 L C
1
0
9
6
L
1
0
0
3
L
1
0
0
2
4 0 0 1 L F
L
1
0
3
1
R
1
0
0
9
R
1
0
1
1
C
8
5
5
5
5 0 0 1 L F
1 N C
U
1
0
0
4
8 9 0 1 C
3 3 0 1 L
4 0 1 1 C
L
1
0
3
6
C
1
1
0
2
6 2 0 1 L C
1085 2 5 C
2 5 0 1 C
L
1
0
0
4
3 5 0 1 C
C
1087
C
1
0
8
8
4 2 0 1 R
C
1
0
8
9
F
L
1
0
0
1
L
1
0
3
0 L
1
0
1
6
R
1
0
1
0
4 0 8 L
7 0 8 C C
8
0
5 1 0 8 L
U
802
7 2 0 1 L
4 2 8 C
U
1
0
0
3
3 0 1 1 C
3 0 0 1 L F
L
1
0
2
5
L
1
0
3
5
9 9 0 1 C
L
1
0
2
9
1 5 C
L
1
0
0
8
L
1
0
1
0
4 5 C
C
5
5
L
1
0
1
4
8 N C
C
8
2
5
C
1
1
0
0
C
1075 0 2 0 1 R
7 5 0 8 L
C
5
7
3 7 0 1 C
0 0 8 T N A
8 7 0 1 L
8 1 0 1 L
8 2 0 1 L
7 1 0 1 L
2 9 0 1 C
0 9 0 1 C
R
1
0
0
1
4 0 0 1 C
C
1
0
7
7
9 7 0 1 C
C
1
0
7
4
R
1
0
0
0
3 8 0 1 C
3 0 0 1 C
L
1
0
0
9
L
1
0
0
7
5 0 0 1 L
L
1
0
1
3
1 2 0 1 R
C
1
0
1
3
C
1049
C
1005
L
1
0
2
0
0 0 0 1 B F
L
1
0
1
9
U
1
0
0
0
2 N C
3 3 0 1 C
C
1
0
3
5 6 7 0 1 C
0 3 0 1 C
8 2 0 1 C
6 5 C
C
1
0
2
6
C
1
0
7
2
C
1002
C
1
0
3
8
C
1001
C
1
0
2
5
3 2 0 1 R 8 1 0 1 R
2 0 0 1 U
3 N C
C
1034
C
1
0
0
0
1 0 0 1 B F
C
1
0
2
3
C
1
0
2
2
R
1
0
1
5
C
1
0
6
0
R
1
0
1
4
C
1010 C
1027
R
1
0
0
6
1 3 0 1 C
R
1
0
0
7
C
1037
C
1
0
3
6
C
1
0
4
1
2 3 0 1 C
C
1009
C
1
0
2
9
C
1
0
4
2
3 0 0 1 R
C
1011
C
1012
6 1 0 1 R
C
1
0
7
0
3 1 0 1 R
9 5 0 1 C
9 1 0 1 R
C
1
0
3
9
U
1
0
0
1
2 0 0 1 R 0 5 0 1 C
0 0 0 1 L
C
1
0
4
0
C
1
0
0
7
R
1
6
4 1 0 1 C
0 0 8 C
8 1 0 1 C
4 0 8 C
0 0 3 P T
F
L
1
0
0
0
C
8
5
5
3
2 0 8 C
4 5 5 8 C
5 1 0 1 C
7 1 0 1 C
6 5 0 8 L
9 1 0 1 C
1 0 8 C
1 0 0 1 L
D
8
0
0
1 1 0 1 L
C
3
0
0
3 0 8 C
3 0 3 P T 2 0 3 P T
0 0 3 N C
Z
D
7
0
0
C
7
0
3
C
7
0
5
0 0 7 L F
4 0 3 P T
L-04C_MAIN_SPFY0244801-10_BOT
FL1000 GPS Saw Filter
- No GPS
ANT801 GPS ANT
- No GPS
U1001 GPS LNA
- No GPS
U700 OVP(Over Voltage Protection) IC
- No Charging
J800 USIM Socket
- No SIM
ANT800 BT, WiFi ANT
- No BT, WiFi
U1004 WCDMA800 PAM
- No WCDMA TX, No Service
U1004 WCDMA800 PAM
- NoWCDMA TX, No Service
CN900 Main to Qwerty Connector
- No Display, No Camera
- No Booting
FL1004 WCDMA800 Duplexer
- No WCDMA TX, RX sensitivity
- No Service
FL1001 FEM
- No WCDMA, No GSM
- No Service
SW1001 RF Connector
- No Service
U1000 RTR6285
- No WCDMA / GSM
- No Service. No GPS
U1002 GSM PAM
- No GSM
FL1004 WCDMA800 Duplexer
- No WCDMA TX, RX sensitivity
- No Service
9. PCB LAYOUT
4
1
8
0
4
0
C
N
2
L-04C_F_SUB_SPCY0263701-10_TOP
Connector BtoB
14-5804-080-000-829+
9. PCB LAYOUT
4
1
4
0
8
0
C
N
1
L-04C_F_SUB_SPCY0263701-10_BOT
Connector BtoB
14-5804-080-000-829+
9. PCB LAYOUT
50
26 25
2 0 3 C
3 3 3 R
2 2 3 R 0 1 3 A V
C
214
1 1 3 A V
2 1 3 A V 4 2 3 R
3 2 3 R
9 1 3 R
0 2 3 R
7 0 3 A V
6 1 3 A V 2 3 3 R
8 0 3 A V
1 2 3 R 9 0 3 A V
KB304
KB312
KB311
KB309
KB313
KB306
KB307
KB305
KB324
KB301
KB316
R311
2 0 2 U
8 0 2 D
7 0 2 D
VA323
1 P T U
1
3 0 3 C
4 3 3 R
1 0 3 U
C
N
401
8 1 3 A V 5 1 3 R
R318
VA313
R302
C1 C2
C213
6 1 3 R
0 2 3 A V 7 1 3 R
9 1 3 A V
3 1 3 R
4 1 3 R
4 1 3 A V
5 1 3 A V
2 1 3 R
1 3 3 R 2 2 3 A V
7 1 3 A V
1 0 2 R
FB1
5 1 2 C
C120
R328
C2500
R8
R329
C3
0 1 1 R
R327
R330
LD
303
LD
305
LD
301
LD
304
KB350
KB356
KB355
KB357
KB343
KB303
KB351
KB349
KB347
KB348
KB344
KB345
KB338
KB337
KB336
KB335
KB339
KB333
KB334
KB330
KB331
KB329
KB354
KB326
KB323
KB315
KB341
KB308
KB32 7
KB325
KB322
KB321
KB320
KB318
KB319
KB342
KB317
KB328
KB310
KB314
KB353
KB352
KB332
K B346
KB302
KB340
U1 Digital Compass Sensor
- No Navigation
U301 Key Encoder
- No Key Interface
CN401 Qwerty PCB to Slide FPCB
Connector
- No Display
- No earjack
- No Key Interface
U202 Hall IC
- No Slide Detect
L-04C_QW_KEY_SPEY0069101-10_TOP
9. PCB LAYOUT
40
34
18
41
80
17
F
5
4 0 2 C
1 0 2 D
3 1 2 R
1 0 4 W S
M
IC
1
1 0 2 J
3 0 4 C
2 0 4 C
R220
C
119
R105
R104
C639
VA101
0 1 1 C
1 0 6 Q
L3
8 0 2 R
2 1 2 R
9 0 2 R
FB202
2 0 2 C
3 0 2 C
C
N
402
C
N
301
C208
0 1 2 C
1 0 2 D Z
4 1 2 R
D202
FB203
4 0 2 D
7 0 2 C
C
206
FB204
FL102
5 3 3 R
FB201
2 1 2 C
6 1 2 R R203
6 1 2 C
1 0 2 C
U201
ZD
205
9 1 2 R
2 0 2 R
1 2 3 A V
1 A V
FL101
1 0 3 C
FL1
VA305
R308
VA302
R309
R11
ZD
20 2
L511
VA325
C
N
101
R2 R6 R4 R7
VA324
L512
1 0 6 N C
CN5
R102
R101 0 0 1 Q
C117
3 0 1 C
FB102
6 0 1 C
4 0 1 C
4 1 1 C
U102
FB101
1 1 1 C
3 0 1 U
0 4 6 C
2 1 1 R
2 2 6 R
1 1 1 R
5 0 1 C
9 1 6 R
3 2 6 R
0 2 6 R
8 1 6 R C638
7 1 6 R
1 2 6 R U
601
CN4
7 0 1 C
C113
C112
C108
9 0 1 C
1 0 1 U
6 0 1 R
L5
C471 0 3 4 R
R403
R402
R401
5 0 4 U C4
ZD206
L2 L4
D206 R210
R207
5 0 2 C
D205
R206
R211
C
N
1
J201 Earjack
- No Earjack Detect
- No Earjack Sound
CN101 Camera Connector
- No Camera
CN402 Main to Qwerty Connector
- No Display, No Sound,No Service
- No Motor
FL1, FL101, FL102 EMI Filter
- No Camera Display
Q100 FET
- No Earjack Detect
U101 SUB PMIC
- No LCD Backlight
- No Camera
CN1 SD Socket
- No SD
U601 Motor Driver IC
- No Motor
SW401 RF Connector
- No Service
CN601 Motor Connector
- No Motor
MIC1 Microphone
- No Voice Transmit
CN601 Motor Connector
- No Motor
L-04C_QW_KEY_SPEY0069101-10_BOT
9. PCB LAYOUT
6 0 1
5 1
VA102
2 0 1 B K
0 0 1 P T
U
1
0
0
0 0 1 D L
VA103
VA105
R102
1 0 1 B K
2 0 1 D L
VA100
VA104
R104
R103
VA101
0 0 1 B K
1 0 1 D L
0 0 1 N C
U100 Proximity Sensor
- No Proximity Operation
CN100 Touch Connector
- No Touch
L-04C_RF_SLIDE_SPCY0259301-10_TOP
9. PCB LAYOUT
4 3
7 1
8 1
50
26 25
0 0 1 L F
C
N
1
0
1
7 0 1 A V C105
2 0 1 D
6 0 1 A V
8 0 1 A V
9 0 1 C
7 0 1 C
6 0 1 C
0 1 1 C
B
A
T100
0 0 1 R
1 0 1 C
0 0 1 C
3 0 1 C
2 0 1 C
1 0 1 R
C108
D101
3 0 1 N C
D100
C104
C
N
102
L-04C_RF_SLIDE_SPCY0259301-10_BOT
CN101 Speaker PAD
- No Sound
BAT100 Coin Battery
- No Real Time
CN102 Slide to Qwerty connector
- No Display, No Sound, No Touch
CN103 LCD to Slide Connector
- No Display
FL 100 LCD EMI Filter
- No Display
10. CALIBRATION
- 5 -
10. CALIBRATION
Tachyon User manual
10.1 Introduction
Tachyon will explain how to use the program for the user.
Used in this article Tachyon except for a detailed description of the environment file, and only the description
is only required.

10.2 Terminology
Tachyon : CMTest2, HotKimchi integrated program.
- Dictionary meaning : Quick bitboda of virtual particles.
- Mean : Want to reduce the time means fast bitboda moment.

10.3 Installation
Explains hot to install the program.

10.3.1 System demand
ITEM Minimum
requirements
Maximum
requiermensts
Recommand
OS Window XP SP2
CPU Pentium 4 1.0G higher
(support Hyper thread)
RAM 512M higher
HDD 1G higher

10.3.2 Install
10.3.2.1 Install Sequence
Below in order to install.
1. Excute the install file. (Install files released on http://ene.lge.com)
2. Click the Tachyon/OCX/OCX_Registration.bat file. (C:\LGE\Tachyon\Ocx)

10. CALIBRATION
- 53 -
Tachyon User manual
10.3.2.2 Directory
Directory structure is described.
Installation Location : C\LGE\Tachyon

<Ficture 1 : Tachyon Directory>

L-04C/ L-04C
L-04C
L-04C
L-04C
L-04C
10. CALIBRATION
- 54 -
Tachyon User manual
Folder explain
Folder Description
Tachyon Exe file and MFC dll, UI dll is present.
Common Common dll files.
(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)
Config Envirement files.
(Port configuration, Loss adjust)
Instrument Tester control dll.
Model Model files is present.
(Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL NAME(LGGM630,
LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, )
OCX Conponent files.
PhoneCmd Phone communication file
Report Report Files is present.
(Cal data, test data)
Temp

Configuration file explain
File Description
MODEL NAME_Calibration.XML
There are imformations to calibrate.
It consist of calibration items.
MODEL NAME_CallSetup.XML
There are imformations to call.

MODEL NAME_NV.INI It consists of default values.
It is written when cal&auto is begun.
MODEL NAME_Sequence.XML It is described a testing procedures.

10. CALIBRATION
- 55 -
Tachyon User manual
10.4 Tachyon Start
Below in order to excute.
1. Excute the c:/LGE/Tachyon/Tachyon_xx.Exe.

<Ficture 2 : Login >

Click the Login button after Pop-up a <Piccutue 2>. Settings do not need.
Then, find the instruments connected to PC.

Support instruments is as follows.
TESTER TESTER NAME
Base Station Agilent 8960 Series 10 E5515C (available)
R & S CMU200 (develop progress)
Anritsu MT8820 (develop progress)
Wiltek (develop progress)
Power Supply KE2303 /KE2306(available)
HP66311B(available)
R & S NGMO2(available)

10. CALIBRATION
- 56 -
Tachyon User manual

<Ficture 3 : Find Instrument>

2. If you found instruments <Ficture 3> the output.
3. If instrument(Base station) found only one, then <Ficture 3> would disappear immediately.
Otherwise if instrument found two or more, then you can decide whether to use instrument.
10. CALIBRATION
- 57 -
Tachyon User manual

<Ficture 4: Use of instrument>

If it is connected more than two instruments, you can use instrument that you wanted with checking Yes or No.

4. Progress has been correctly, then <Ficture 5> the output.

<Ficture 5>

Operation Info/ Result Dialog is test results to the output screen.
If you want disapper dialog with Click or ESC button.
10. CALIBRATION
- 58 -
Tachyon User manual
10.5 Tachyon Main UI
It will be explained in the Main Screen.

10.5.1 Menu / Toolbar / Run Button
Tachyon has Menu, Toolbar and Buttons.

<Ficture 6>

10.5.1.1 Menu
There are six kinds of menu.
(Program, Run, Additional Function, Option, View, Help)

Program
Menu Description
Model Selection Select model
Config Editor Develope progress
NV Item Manager Develop progress
Sequence Editor Develope progress
Exit Exit program

10. CALIBRATION
- 59 -
Tachyon User manual
Run
Menu Description
Calibration + Test Start Calibration and Auto Test
Calibration Only Start Calibration
Test Only Start Auto Test
Select band Calibration Start Calibration with selected Band
Select Band/Item Calibration Start Calibration with selected band and item.
Select Band Auto Test Start Auto Test with selected Band
NV Read Read the NV items.
NV Write Write the NV items.
Stop STOP

Additional Function
Menu Description
Loss Adjustment Configuratation and adjust RF-LOSS.
Instrument Calibration Instrument calibration(available on E5515C)
Phone Control Phone control (like QPST, available on Qaulcomm)
RF Switch Check Check the RF Switch Box.
Show Result Result screen pop-up/pop-down

Option
Menu Description
System Option COM-Port configuration
Run Option Special opstion.
Instrument Change Change instrument
Voltage / Current Setting Voltage,Current setting

View
Menu Description
Toolbar, Menubar Toggle.

Help
Menu Description
Tachyon Help Develope progress
Tachyon Hotkey
About Tachyon

10. CALIBRATION
- 60 -
Tachyon User manual
10.5.1.2 Toolbar
Toolbar Provides for frequently used commands.

<Ficture 7 : Toolbar>

<Ficture 7> Commands in order are as follows :
1. Model Selection
2. Calibration + Test
3. Not availalable.
4. Stop
5. Test Only
6. Calibration Only
7. Phone Control
8. Loss Adjustment
9. System Option
10. Run Option
11. Voltage / Current Setting
12. Show Result

10.5.1.3 Command Button

<Ficture 8 : Start Button>

Calibration + Test Button , Stop Button .
10. CALIBRATION
- 61 -
Tachyon User manual
10.5.2 UI Display Information
About the item on the screen output will be explained.

10.5.2.1 Port / Loss info

<Ficture 9 : COM Port / Loss Information>

Area 1, the output is imformation about the COM port.
Area 2, Show the RF-LOSS for the selected model.

10. CALIBRATION
- 6 -
Tachyon User manual
10.5.2.2 Phone Info / System Option Status

Model Information : Information of model that user selected
Solution : chipset (Qualcomm, Emp, ADI, Infineon)
Model : Model name, Buyer : Buyer name
Binary Ver : Binary Version.(Phone s/w version)
Product ID : PID (read from phone).
System Information : ezlooks, shield box, rf switch box.
Local : Factory location, Ezlooks Mode : On-line/Off-line
Limo : Using Shield box or not
Run Information : Option
Repeat Test : Aging test, ESN Write : Write the ESN(IMEI).
Test Only : Only auto test
Rework : Rework Option.
Verification : Using verification or not.
Base Inst. Information : information of instrument
Base Inst. : Equipment type
Execution Mode : Display the Command that user input
Time Elapse : test time
Voltage : voltage
Current Limit : current limit
Consumption Current(mA) : doesnt work

10. CALIBRATION
- 63 -
Tachyon User manual
10.6 Functional explain
This will be explained in detail about the functionality provided.

10.6.1 Model Selection
This provides the ablity to select and change.
Description
How to Excute 1. <Menu> Program -> Model Selection.
2. <Toolbar> Click .
Hot Key Ctrl + M

Model selection screen is shown below

<Ficture 10 : model selection dialog>

10. CALIBRATION
- 64 -
Tachyon User manual
The order follows :
1) Chipsets imformation, Check.
2) Select the Chipsets.

<Ficture 11 : Solution selection>

3) Select the model.

<Ficture 12 : Model selection>

L-03C
L-04C
L-05C
L-03C
L-04C
L-05C
10. CALIBRATION
- 65 -
Tachyon User manual
4) Select the buyer. (must be dobble clicked)

<Ficture 13 : Buyer selection>

5) After select Buyer, if environment files is normally, PASS screen shows. Otherwise Fail screen shows.
NOTE) The following files must exist.
- Model name_Calibration.xml (Buyer Folder)
- Model name_CalLogic.dll (Mdoel Folder)
- Model name_CallSetup.xml (Buyer Folder)
- Model name_Sequence.xml (Buyer Folder)
6) If Fail screen shows, check the File List.
7) If PASS screen shows, Click the Select button.
8) If normal progress, then the screen is as shown below

L-04C
L-03C
L-04C
L-04C
L-04C
L-04C
L-04C
L-04C
L-04C
L-04C
10. CALIBRATION
- 66 -
Tachyon User manual

<Ficture 14 : Normal screen>

Shows the selected model imformation and RF-LOSS.(Ficture14).
If you dont see imformation and RF-LOSS, the files was wrong.

L-04C
10. CALIBRATION
- 67 -
Tachyon User manual
10.6.2 Start / Run
This will be explained in detail about the functionality provided.

10.6.2.1 Calibration + Test
This perform the calibraton, Test.
Select when Calibration and Auto Test process
Description.
Excution 1. <Menu> Run-> Calibration + Test.
Hot Key F5 : Shield Box 1
F6 : Shield Box 2
Button
button Click.

<Calibration + Test> will be in the order. Sequence xml file has it.
i) Precede Action
- NV Write.
- Test command send
ii) Calibration
- Calibration
iii) Auto Test
- Auto test
iV) After Action
- Phone reset
- Change AMSS

If you have a multi-system, you must select the Channel(1,2) that you wanted, then you can test.

<Ficture 15 : Channel selection>

10. CALIBRATION
- 68 -
Tachyon User manual
10.6.2.2 Calibration Only
This perform only the Calibraton.
Select when Calibration only process.
Description.
Excution 1. <Menu> Run-> Calibration Only.
2. <Toolbar> Click.
Hot Key F9
Button NONE.


<Ficture 16 : Calibration Only>

10. CALIBRATION
- 69 -
Tachyon User manual
10.6.2.3 Test Only
This perform only the Test.
Select when Test Only process
Description.
Excution 1. <Menu> Run-> Test Only.
2. <Toolbar> Click.
Hot Key F8
Button NONE.


<Ficture 17 : Test Only>

10. CALIBRATION
- 70 -
Tachyon User manual
10.6.2.4 NV Read
This perform reading the NV items.
Description
Excution 1. <Menu> Run-> NV Read
Hot Key F1
Button NONE.
If there is a MODEL-NAME_NV.INT file, you can read the NV items. INI file define about NV items.
INI file should be existed to Read the NV items.

10.6.2.5 NV Write
This perform writing the NV items.
Description
Excution 1. <Menu> Run-> NV Write
Hot Key F2
Button NONE
Same as NV Read.

10.6.2.6 Stop
This perform Stopping the process.
Description.
Excution 1. <Menu> Run-> STOP
2. <Toolbar> Click.
Hot Key ESC
Button
button Click.

10.6.2.7 Select Band Calibration
This perform the calibration.only with user selected band
Description.
Excution 1. <Menu> Run-> Select Band Calibration
Hot Key NONE
Button NONE.

10. CALIBRATION
- 71 -
Tachyon User manual
Perform in the following order :
1) Select the TAB of channel you want test

<Ficture 18 : TAB of CH1_Calibration>

2) After 1), Select the BAND you want test.

<Ficture 19 : Band Select>

10. CALIBRATION
- 7 -
Tachyon User manual
3) After 2), RUN -> Select Band Calibration

<Ficture 20 : Select Band Calibration>

10. CALIBRATION
- 73 -
Tachyon User manual
10.6.2.8 Select Band/Item Calibration
This perform the calibration you selected item, after you selected band.
Description.
Excution 1. <Menu> Run Select Band / Item Calibration
Hot Key NONE
Button NONE

Perform in the following order :
1) Excute <6,2,7> 1 and 2.
2) Select the Calibration item in Band you wanted..

<Ficture 21 : Calibration Item>

3) Run ->Select Band/Item Calibration

<Ficture 22 : Select Band/Item Calibration >

10. CALIBRATION
- 74 -
Tachyon User manual
10.6.2.9 Select Band Auto Test
This perform the Auto Test you selected band, After you selected model..
Description.
Excution 1. <Menu> Run-> Select Band Auto Test
Hot Key NONE.
Button NONE

Perform in the following order:
1) Select the TAB of channel you want test. <Figure 23>

<Ficture 23 : Test Tab>

2) Select the band you wanted. <Figure 24>

<Figure 24 : Test Band>

3) RUN -> Select Band Auto Test.
10. CALIBRATION
- 75 -
Tachyon User manual
10.6.3 System Loss Setting
Explains how to set the RF-LOSS.

10.6.3.1 Loss Setting
This perform RF-LOSS setting.
Description
Excution 1. <Menu> Additional Function -> Loss Adjustment
2. <Toolbar> Click.
Hot Key Ctrl + L
Button NONE.

When you run the above command <Figure 25> is the output, such as Dialog.
Dialog is divided into two parts.
First part(Loss Adjustment), you can set the RF-Loss with inputed value
Second part(Detail Loss Adjustment), it doesnt work now.

<Ficture 25 : Loss Adjustment>
10. CALIBRATION
- 76 -
Tachyon User manual
10.6.3.2 Manual Loss Setting (Loss Adjustment)
In tachyon, RF-LOSS is the sum of value of MS Calble Type and value of RF Cable Type

MS Cable Loss Setting
User must select MS Cable Type.
Also, user can create new msl file for another MS Cable Type.

<Ficture 26 : MS Cable Type selection>

If you select MS Cable Type, then selected MS Cable Type Loss is output.

<Ficture 27 : MS Cable Loss (ex.) >
L-04C.msl
L-04C.msl
10. CALIBRATION
- 77 -
Tachyon User manual
You clicked the cell that you wanted twice(double click) when you want change the Loss.
And you can input new loss.

<Ficture 28 : Change the Loss>

You must save after change the loss.

<Ficture 29 : Save After change>

If there is no msl file about cable that you will use, you can create new file.
The dialog shows After you click the Create New File.

<Ficture 30 : Create new MS Cable Loss File>

Then you input the new file name and push the save button.
caution : You must not change location that file storing.
Now you can select MS cable type you created and you can input new value for one.
10. CALIBRATION
- 78 -
Tachyon User manual
RF Cable Loss Setting
If you use RF Cable, you must use loss of RF Cable Type.
Caution : RF Cable Loss is sum of all except MS Cable loss.
(ex : RF Cable Loss + Shield Box Loss + RF Switch box loss = RF Cable Loss)

<Ficture 31 : RF Cable type selection>

Inputting loss of RF Cable Type is similar inputting loss of MS Cable Type.
If the loss of RF Cable Type that you used is present, you can select the file. (Figure 31)
Also you can create new .rfl file for RF Cable Type. (Figure 32)

<Figure 32 : Create the new RF Loss File>

10. CALIBRATION
- 79 -
Tachyon User manual
Cable Loss setup
You must select Ms Cable loss and RF Cable loss. And you should proceed as follows.

<Figure 33 : Loss Adjust>

1) After you select MS Cable Type and RF Cable Type, you push the Display button.
Then cobined value is output on the screen.(Figure 33)
2) Determine the value is printed on the screen, Push the Apply Button.

System Loss File
Cobined value is saved below file.
< ..\Tachyon\Config\SystemLoss.Ini>

10.6.3.3 Auto Loss Setting (Detail Loss Adjustment>
It doesnt work now.

10. CALIBRATION
- 80 -
Tachyon User manual
10.6.4 System Option Setting
This perform setting varioust features or not setting.
There are features in System Option.
1) Setting the COM port
2) Setting the Repore Data
3) Setting the Language.
4) Setting the Message Queue..
5) Setting the Repeat Test.
6) File manager.

Description
Excution 1. <Menu> Option -> System Option
Hot Key Ctrl + O
Button NONE

<Ficture 34 : System Option>

<Ficture 34> is running screen, if you want to terminate then you push OK button.
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
MJN00
ACGT00
SVLM00
SUSY00
EBR01
AHFY00
MBJZ00
FAB04
MCCH00
ADCA01
AKAC00
SUMY00
SAEY00
AFBZ00
ABL00
SPKY00
MBFZ00
SAFY00
SNGF01
SNGF02
MCCE00
MBL00
ACGM00
FAB00
FAB03
ADCA00
SWCC00
EAU00
FAB01
FAB02
EBR00
ABM00
ABM01
MFEZ01
MFEZ02
SNGF00
SBPL00
ACGA00
ABM02
Location Description
SBPL00 Rechargeable Battery,Lithium Ion
ACGA00 Cover Assembly,Battery
FAB00 Screw,Machine
ACGM00 Cover Assembly,Rear
SNGF00 Antenna,Helical
MBL00 Cap,Mobile Switch
MCCE00 Cap,Receptacle
SVLM00 LCD,Module-TFT
FAB01 Screw,Machine
FAB02 Screw,Machine
MJN00 Tape,Protect
EAU00 Motor,DC
EBR00 PCB Assembly,Flexible
SAEY00 PCB Assembly,Keypad
SPKY00 PCB,Sidekey
ABL00 Camera Assembly
ADCA00 Dome Assembly,Metal
SUMY00 Microphone,Condenser
SUSY00 Speaker Module
SWCC00 Cable,Assembly
FAB03 Screw,Machine
FAB04 Screw,Machine
MCCH00 Cap,Screw
ACGT00 Cover Assembly,Upper
AFBZ00 Frame Assembly
AHFY00 Hinge Assembly
MBJZ00 Button
AKAC00 Keypad Assembly,Main
EBR01 PCB Assembly,Flexible
ADCA01 Dome Assembly,Metal
SAFY00 PCB Assembly,Main
ABM00 Can Assembly,Shield
MBFZ00 Bracket
MFEZ01 Frame
MFEZ02 Frame
- 8 -
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
1 AGF000000
Package
Assembly
- AGF75965906
L04C.ANTTWV BK:Black L-04C S_White
Silver(NTT2_720ea) Package Assembly
2 MAY047100 Box, Master MAY64817120
BOX TW 293 215 248 MULTI COLOR L04C.ANTTWV
BK:Black L-04C Set Master Box _NTT2
2 MAY084000 Box, Unit MAY64856716
BOX TW 188 49 139 MULTI COLOR L04C.ANTTWV
WV:WHITE SILVER L-04C Main Unit Box_White
Silver_NTT2
2 AGJ000000 PALLET ASSY - APLY0003308 L-01A NTTTK TK, ZZ, NTT-2 Palletizing-720ea
3 MBAD00 Bag, Vinyl MBAD0003101
COMPLEX PDM MIGRATION MODEL(Seoul) ZZ:Without
Color 1700*1700*0.04t EXTRUSION, LDPE,
3 MPBZ02 Damper MPBZ0036864 COMPLEX BL40 ORUBK ZZ:Without Color -
3 MBEC00 Box, Carton MBEC0000267 COMPLEX L-01A NTTXK ZZ:Without Color -
3 MCJZ00 Cover MCJZ0030564 COMPLEX L-01A NTTXK ZZ:Without Color -
3 MLAJ00 Label, Master Box MLAJ0004201
COMPLEX LG-VX6100 ZZ:Without Color
New_TDR_Shipping Label PRINTING,
3 MPBZ01 Damper MPBZ0036822 COMPLEX L-01A NTTXK BK:Black -
3 MPBZ00 Damper MPBZ0036823 COMPLEX L-01A NTTXK BK:Black -
3 MPCY00 Pallet MPCY0017602 COMPLEX L706ie NTTWT ZZ:Without Color -
2 MJN000000 Tape MTAZ0127608 COMPLEX L-03A NTTPW ZZ:Without Color -
2 MCQ007001 Damper, Box MPBA0004030 COMPLEX L-01A NTTXK ZZ:Without Color -
2 MEZ000002 Label MLAZ0050901 COMPLEX KU990 GBRBK ZZ:Without Color -
2 MEZ084100 Label, Unit Box MLAQ0018201
COMPLEX L-02B NTTPN ZZ:Without Color PRINTING,
NTT docomo Unit Box Label(70X30)
2 MEZ047200 Label, Master Box MLAJ0004402
COMPLEX CG300 CGR ZZ:Without Color LABEL,
MASTER BOX(for CGR TDR 2VER. mbox_label)
2 MFZ005600
Packing,
Blister(Lower)
MFZ62837403
MOLD PULP L04C.ANTTWV@WWZ.EKHQ ZZ:Without
Color L-04C NTT2 Packing, Blister(Lower)
2 MEZ003500 Label, Barcode MEZ63820101
PRINTING L01C.ANTTDH ZZ:Without Color Doccomo
New IMEI Peel Label_3 piece_71*40
2 MAF086500 Bag, Vinyl MBAD0005204 COMPLEX LG-LX260 SPRAG ZZ:Without Color -
11.2 Replacement Parts
Note: This Chapter is used for reference, Part order is ordered
<Mechanic component>
- 83 -
1 AAAY00 Addition Assembly - AAAY0488301 L-04C NTTWV ZZ:Without Color -
2 ACGA00
Cover Assembly,
Battery
- ACGA0052801 L-04C NTTWV WV:WHITE SILVER -
3 MAF000001 Bag MAF62668801 COMPLEX L04C.ANTTWV ZZ:Without Color -
3 MJN061100 Tape, Protect MJN67676501 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
3 MCJA00 Cover, Battery MCJA0129301
COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,
PC LUPOY SC-1004A,
1 APEY00 PHONE - APEY0951301 L-04C NTTWV WV, WV,
2 MEZ002100 Label, Approval MEZ63809401 COMPLEX L04C.ANTTWV ZZ:Without Color -
2 ACGY00
COVER ASSY,
EMS
- ACGY0053201 L-04C NTTWV WV, WV,
3 FAB03 Screw, Machine FAB31123901 FH Y 2.7M 3M SWRCH18A BLACK N A
3 EAN011400
IC, Memory Card,
MINI SD
SMZY0027202
SD-C02G2CYB MicroSD Card / 2GB (MLC NAND
16Gbx1), Module Assembly, TOSHIBA
3 ACGM00
Cover Assembly,
Rear
- ACGM0169801 L-04C NTTWV WV:WHITE SILVER -
4 SNGF00 Antenna, Helical SNGF0064303
L04C-MAIN-EMW 3.0, -2.0 dBd, L-04C Main Internal,
W800+2100+GSM900+1800+1900, Pb-Free, MULTI, -2.0,
50ohm, 3.0 E.M.W CO., LTD.
4 MBL00
Cap, Mobile
Switch
MBL64797401 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
4 MEV000000 Insulator MIDZ0276801
COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),
, , , ,
4 MKC009400 Window, Camera MWAE0066101
COMPLEX L04C.ANTTWV ZZ:Without Color CUTTING,
PMMA MR 200, , , , ,
4 MJN009400 Tape, Camera MTAK0042301
COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,
(empty), , , , ,
4 MCQ000000 Damper MCQ66596301 COMPLEX L04C.ANTTWV ZZ:Without Color -
4 MEZ000900
Label, After
Service
MLAB0003601 COMPLEX L602i NTTRY ZZ:Without Color -
4 MCQ009400 Damper, Camera MPBT0099601
, , , ,
4 MCCE00 Cap, Receptacle MCCE0063201
PC LUPOY SC-1004A, , , , ,
4 MCJN00 Cover, Rear MCJN0133901
PC LUPOY SC-1004A,
4 MDAY00 Decor MDAY0098701 COMPLEX L-04C NTTWV SV:Silver MOLD, ABS AF-308,
FAB00
- 84 -
3 ACGQ00
COVER ASSY,
SLIDE
- ACGQ0054301 L-04C NTTWV WV, WV,
4 SVLM00 LCD, Module-TFT SVLM0040101
TX08D39VM0BAA Main, 3.2", HVGA, 49.92x77.83x1.9t,
16.7M, TFT, TM, S6D05A0(Samsung), HITACHI
DISPLAY DEVICES LTD.
4 FAB01 Screw, Machine FAB31124101 FH Y 3.5M 2.5M SWRCH18A BLACK N A
4 MJN00 Tape, Protect MJN67676801 COMPLEX L04C.ANTTWV ZZ:Without Color window
, , , ,
4 MDS000000 Gasket MGAZ0104901
COMPLEX L04C.ANTTWV GD:Gold COMPLEX, (empty),
, , , ,
4 MDS000002 Gasket MDS63632401 COMPLEX L04C.ANTTWV ZZ:Without Color -
4 EAU00 Motor, DC EAU61523501
MVMF-A301K2 2V 40mA 40mA 12KRPM 12KRPM
30mSEC 40mGF.CM 36OHM LG INNOTEK CO., LTD
4 EBR00
PCB Assembly,
Flexible
- EBR73129101 L04C.ANTTWV 1.0 Flexible
5 EBR070400
PCB Assembly,
Flexible, SMT
6 EBR070300
PCB Assembly,
Flexible,
SMT Top
7 EAX010700 PCB, Flexible SPCY0263701
SPCY0263701 L04C.ANTTWV 1.0 POLYI Multi - 0.3mm
FLEXIBLE YOUNG POONG ELECTRONICS CO. LTD.
6 EBR070200
PCB Assembly,
Flexible, SMT
Bottom
4 SAEY00
PCB Assembly,
Keypad
- SAEY0073301 L04C.ANTTWV 1.0 KEYPAD
5 SAEB00
PCB Assembly,
Keypad, Insert
- SAEB0033001 L04C.ANTTWV 1.0 KEYPAD
6 SPKY00 PCB, Sidekey SPKY0098801
SPKY0098801 L04C.ANTTWV 1.1 POLYI Double 2 0.18
SIDEKEY YOUNG POONG ELECTRONICS CO. LTD.
6 ABL00 Camera Assembly - ABL72995501 L04C.ANTTWV ZZ:Without Color -
7 EBP000000 Camera Module EBP61301801
C3AA-Y314C C3AA-Y314C 3M AF, Sony(1/5"),
8.5x8.5x5.4t, FPCB 3.5mm, 90degree LG INNOTEK CO.,
LTD
, , , ,
- 85 -
7 MDS000001 Gasket MGAZ0113701 COMPLEX L-04C NTTWV GD:Gold COMPLEX, (empty),
6 RAA050100 RESIN, PC BRAH0001301 UF-1060, ; , , , , [empty]
6 RAA050101 RESIN, PC BRAH0002601 UNIQUE4000HFW, ; , , , , [empty]
6 ADCA00
Dome Assembly,
Metal
ADCA0121401 L-04C NTTWV ZZ:Without Color -
6 MFBZ00 Filter MFBZ0036201 COMPLEX L-04C NTTWV BK:Black COMPLEX, (empty),
5 SAEE00
PCB Assembly,
Keypad, SMT
- SAEE0039601 L04C.ANTTWV 1.0 KEYPAD
6 SAEC00
PCB Assembly,
Keypad, SMT
Bottom
- SAEC0038401 L04C.ANTTWV 1.0 KEYPAD
7 SUMY00
Microphone,
Condenser
SUMY0010610
SPM0410LR5H-QB SPM0410LR5H-QB, UNIT, 42 dB,
4.72*3.76*1.25, mems TDMA Improve KNOWLES
ACOUSTICS
6 SAED00
PCB Assembly,
Keypad,
SMT Top
- SAED0037701 L04C.ANTTWV 1.0 KEYPAD
7 EAX010400 PCB, Keypad SPEY0069101
SPEY0069101 L04C.ANTTWV 1.0 FR-4 Build-Up 6 0.5
KEYPAD LG Innotek.com
4 SUSY00 Speaker Module SUSY0028012
1810-8T-05W1P 1810-8T-05W1P, ASSY, 8 ohm, 92 dB,
1810 mm, 10mm KIRYN TELECOM CO., LTD
4 SWCC00 Cable, Assembly SWCC0011001
U.FL-2LPVHF-04N1TC-A76LG 76 mm, LINE, U.FL_U.FL,
H=2.0, WHITE, HIROSE KOREA CO., LTD
4 FAB00 Screw, Machine FAB31123701 FH Y 2.7M 3M SWRCH18A BLACK N A
4 MCCH00 Cap, Screw MCCH0165901
COMPLEX L04C.ANTTWV GR:Gray COMPLEX, (empty),
, , , ,
4 MJN061101 Tape, Protect MJN67750701 COMPLEX L04C.ANTTWV ZZ:Without Color -
4 MJN061102 Tape, Protect MJN67807701
COMPLEX L04C.ANTTWV ZZ:Without Color qwerty
keypad
4 MEZ000000 Label MLAZ0038303
COMPLEX LG-LC3200 WA:White PRINTING, PPRI
PRINTING
4 ACGT00
Cover Assembly,
Upper
- ACGT0011001 L-04C NTTWV WV:WHITE SILVER -
(empty), , , , ,
FAB03
- 86 -
5 MCQ000002 Damper MPBZ0331001
, , , ,
5 EBD030100
Touch Window
Assembly
SMZY0029603 Film to Film Contact 50*94.2 1% 90%
5 MJN000001 Tape MJN67771201
COMPLEX L04C.ANTTWV ZZ:Without Color remove touch
window
5 MDJ000000 Filter MFBZ0027201
, , , ,
5 MJN061100 Tape, Protect MTAB0428501
(empty), , , , ,
(empty), , , , ,
5 MJN000000 Tape MJN67676901 COMPLEX L04C.ANTTWV ZZ:Without Color remove
5 RAB150000 Magnet MMAZ0006601 COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,
5 MCQ043300 Damper, LCD MPBG0114301
, , , ,
, , , ,
, , , ,
5 AKAD00
Keypad Assembly,
Sub
AKAD0006001 L-04C NTTWV WV:WHITE SILVER -
5 MCJX00 Cover, Upper - MCJX0012801
PC LUPOY SC-2302,
6 MET099500 Insert, Nut MICE0016901 COMPLEX MECH_COMMON ZZ:Without Color -
6 MBFZ00 Bracket MBFZ0061801
COMPLEX L-04C NTTWV ZZ:Without Color PRESS, STS,
0.3,
4 AFBZ00 Frame Assembly - AFBZ0024201 L-04C NTTWV ZZ:Without Color MIDDLE
(empty), , , , ,
5 MJN000000 Tape MTAZ0351701
(empty), , , , ,
(empty), , , , ,
5 MFEZ00 Frame - MFEZ0045101
COMPLEX L-04C NTTWV ZZ:Without Color MOLD, PC
LUPOY SC-2302,
0.4,
- 87 -
4 AHFY00 Hinge Assembly - AHFY0005501 L-04C NTTWV WV:WHITE SILVER -
5 MJN061100 Tape, Protect MJN67807801 COMPLEX L04C.ANTTWV ZZ:Without Color lower
5 FAB010000 Screw, Machine GMEY0019201
GMEY0019201 FH + 1.4mM 1.8mM SWCH FZW N N
KUMGANG SCREW CO., LTD
5 ACGK00
Cover Assembly,
Front
- ACGK0180501 L-04C NTTWV WV:WHITE SILVER -
(empty), , , , ,
6 MJN061100 Tape, Protect MTAB0429601
(empty), , , , ,
6 MBJZ00 Button MBJZ0052801
COMPLEX L-04C NTTWV WV:WHITE SILVER
COMPLEX, (empty),
6 MEV000000 Insulator MEV63676501 COMPLEX L04C.ANTTWV ZZ:Without Color -
6 MCJK00 Cover, Front - MCJK0141701
PC LUPOY SC-1004A,
7 MET099500 INSERT, NUT MICE0016902 MECH_COMMON ZY, ZZ, PRESS, STS, , , , ,
7 MET099500 Insert, Nut MICE0016901 COMPLEX MECH_COMMON ZZ:Without Color -
6 MDAY00 Decor MDAY0098601
PC LUPOY SC-1004A,
6 MFEZ00 Frame MFEZ0044801 COMPLEX L-04C NTTWV BK:Black PRESS, STS, 0.2,
5 ACGU00
Cover Assembly,
Lower
- ACGU0008501 L-04C NTTWV WV:WHITE SILVER -
(empty), , , , ,
, , , ,
, , , ,
(empty), , , , ,
6 MDS000002 Gasket MDS63515501
COMPLEX L04C.ANTTWV ZZ:Without Color LOWER
FORM 2
(empty), , , , ,
, , , ,
(empty), , , , ,
- 88 -
6 MCJY00 Cover, Lower - MCJY0010001
PC LUPOY SC-2302,
7 MAZ000001 Bracket MAZ63004601
PRESS STEEL STS304-H 0.3 L04C.ANTTWV ZZ:Without
Color -
0.3,
5 ARDY00
Rail Assembly,
Slide
ARDY0017801 L-04C NTTWV WV:WHITE SILVER -
4 AKAC00
Keypad Assembly,
Main
AKAC0021101 L-04C NTTWV ZZ:Without Color -
4 EBR01
PCB Assembly,
Flexible
5 EBR070100
PCB Assembly,
Flexible, Insert
6 ADCA01
Dome Assembly,
Metal
ADCA0119301 L04C.ANTTWV ZZ:Without Color slide
5 EBR070400
PCB Assembly,
Flexible, SMT
6 EBR070200
PCB Assembly,
Flexible, SMT
Bottom
6 EBR070300
PCB Assembly,
Flexible,
SMT Top
7 EAX010700 PCB, Flexible SPCY0259301
SPCY0259301 L04C.ANTTWV 1.1 - - - - FLEXIBLE
YOUNG POONG ELECTRONICS CO. LTD.
3 SAFY00
PCB Assembly,
Main
- SAFY0387901 L04C.ANTTWV 1.0 MAIN
4 SAFB00
PCB Assembly,
Main, Insert
- SAFB0122201 L04C.ANTTWV 1.0 MAIN
5 ABM00
Can Assembly,
Shield
- ABM73456201 L04C.ANTTWV WV:WHITE SILVER -
6 MBK070300 Can, Shield MCBA0079401 COMPLEX L-04C NTTWV SV:Silver -
6 MEV000000 Insulator MEV63672701 COMPLEX L04C.ANTTWV BL:Blue CAN TOP 1
6 MEV000001 Insulator MEV63676901 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
5 RAA050100 RESIN, PC BRAH0001301 UF-1060, ; , , , , [empty]
5 RAA050101 RESIN, PC BRAH0002601 UNIQUE4000HFW, ; , , , , [empty]
5 MCQ015700
Damper,
Connector
MCQ66493201 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
- 89 -
5 ABM01
Can Assembly,
Shield
6 MEV000000 Insulator MEV63672801 COMPLEX L04C.ANTTWV BL:Blue CAN TOP 2
5 ABM02
Can Assembly,
Shield
6 MEV000000 Insulator MEV63691401 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
4 SAFF00
PCB Assembly,
Main, SMT
- SAFF0288401 L04C.ANTTWV 1.0 MAIN
5 MEZ000000 Label MLAZ0038301
COMPLEX LG-VX6000 ZZ:Without Color PID Label 4
Array PRINTING,
5 SAD010000 Software, Mobile SAD32863801 V10a - JAPAN QCT -
5 SAFC00
PCB Assembly,
Main, SMT Bottom
- SAFC0154701 L04C.ANTTWV 1.0 MAIN
ODGPPTR3015 SINGLE -2DB 50OHM 3 PARTRON
COMPANY LIMITED
ITBTPTR3015 SINGLE -2DB 50OHM 3 PARTRON
COMPANY LIMITED
5 SAFD00
PCB Assembly,
Main,
SMT Top
- SAFD0152601 L04C.ANTTWV 1.0 MAIN
6 EAX010000 PCB, Main SPFY0244801
SPFY0244801 L04C.ANTTWV 1.0 FR-4 Any Layer 10
0.75 MAIN LG Innotek.com
COMPLEX L-04C NTTWV ZZ:Without Color PRESS, NS,
, , , ,
6 MFEZ01 Frame MFEZ0032701 COMPLEX L-04C NTTWV SV:Silver -
6 MFEZ02 Frame MFEZ0033601 COMPLEX L-04C NTTWV SV:Silver -
- 90 -
7 CN2 Connector, BtoB ENBY0051101
14-5804-080-000-829+ 80P 0.40MM STRAIGHT MALE
SMD R/TP 900mM - KYOCERA ELCO KOREA SALES
CO., LTD.
14-5804-080-000-829+ 80P 0.40MM STRAIGHT MALE
CO., LTD.
7
CN4,
CN5
Contact MCIZ0008701
COMPLEX L-04C, ANTTWV ZZ:Without Color PRESS,
YCUT-FX, 4.2, 2.5, 1.5,
7
C204,
C210
Capacitor,
Ceramic, Chip
ECCH0000122
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
7
C103,
C104,
C105,
C106,
C207
Capacitor,
Ceramic, Chip
ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C
1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
7
D201,
D202,
D204
Diode, TVS EDTY0010101
ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.
7
R111,
R112
Resistor, Chip ERHY0009516
MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -
ROHM.
7 C109
Capacitor,
Ceramic, Chip
ECCH0005602
GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.
7
R101,
R102,
R203
Resistor, Chip ERHZ0000443
MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP -
ROHM.
7
C112,
C113,
C114,
C117,
C638
Capacitor,
Ceramic, Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
7 C640
Capacitor,
Ceramic, Chip
ECCH0009106
C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
7
C111,
C4,
C471,
C639
Capacitor,
Ceramic, Chip
ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -
45TO+85C 0603 R/TP - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
7 C206
Capacitor,
Ceramic, Chip
ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C
1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.
11.2 Replacement Parts
<Main component>
- 91 -
7 R220 Resistor, Chip ERHZ0000407
MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -
ROHM.
7 C119
Capacitor, TA,
Conformal
ECTH0003701
TCSCM0J106MJAR 10 uF, 6.3V, M, L_ESR, 1608, R/TP
SAMSUNG ELECTRO-MECHANICS CO., LTD.
7
C201,
C208
Capacitor,
Ceramic, Chip
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
7 C110
Capacitor, TA,
Conformal
ECTH0005203
TCTP1A336M8R , [empty] , [empty] , , [empty] , , [empty] ,
[empty] , [empty] , [empty] ROHM.
7
C107,
C108,
C301
Capacitor,
Ceramic, Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C
7
R104,
R105,
R402,
R403,
R623
ROHM.
7
C205,
C212
Capacitor,
Ceramic, Chip
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C
7
D205,
D206
VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
7
R106,
R430
MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP -
ROHM.
7
L2, L3,
L4, L5
Inductor,
Multilayer, Chip
ELCH0001430
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM 1.03GHZ
10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
7
L511,
L512
Inductor,
Multilayer, Chip
ELCH0004727
1005GC2TR10JLF 100NH 5% - 100mA 2.3OHM 600MHZ
8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
GB042-34S-H10-E3000 34P 0.4MM STRAIGHT SOCKET
SMD R/TP 1M - LS Mtron Ltd.
7
R2,
R335,
R4
PCB ASSY,
MAIN, PAD
SHORT
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
24-5804-080-000-829+ 80P 0.40MM STRAIGHT FEMALE
CO., LTD.
7 CN601 Connector, I/O ENEY0003801
24-8000-002-000-829 2P 1.00MM ANGLE SOCKET TYPE
SMD R/TP - KYOCERA ELCO KOREA SALES CO., LTD.
7 J201 Jack, Phone ENJE0007601
KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P -
KSD CO., LTD
7 CN1 Socket, Card ENSY0023601
SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPS
ELECTRIC KOREA CO., LTD.
- 9 -
7 R219 Resistor, Chip ERHY0009518
ROHM.
7
FB201,
FB202,
FB203,
FB204
Filter, Bead SFBH0008105
BLM15BD182SN1D 1800 ohm 1.0X0.5X0.5 25% 1.4 ohm
0.1A SMD R/TP 2P 0 MURATA MANUFACTURING CO.,
LTD.
7 SW401 Connector, RF ENWY0003901
U.FL-R-SMT(10) 1.90MM STRAIGHT SOCKET SMD
T/REEL CU 50OHM 300mDB HIROSE KOREA CO., LTD
7
R202,
R212,
R216
MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP -
ROHM.
7 Q601 TR, Bipolar EQBN0012401
KRC402E NPN 30V 0V 50V 100mA 500mA 50 100mW
ESM R/TP 3P KEC CORPORAITION
7
R308,
R309
MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -
ROHM.
7 Q100 FET EQFP0004501
SI1305-E3 P-CHANNEL MOSFET -8V +-8 -0.92A
0.28OHM 340mW SOT323 R/TP 9P VISHAY
INTERTECHNOLOGY ASIA PTE LTD
7
R617,
R618
MCR006YZPF1001 1KOHM 1% 1/20W 0603 R/TP -
ROHM.
ROHM.
7 C403
Inductor,
Multilayer, Chip
ELCH0004715
1005GC2T27NJLF 27NH 5% - 200mA 0.9OHM 1.4GHZ 8
SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
7
C202,
C203
Capacitor,
Ceramic, Chip
ECZH0004402
CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V -
MECHANICS CO., LTD.
7
R619,
R622
MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP -
ROHM.
7
R620,
R621
ROHM.
7 U103 IC, Bus Controller EUSY0342405
NLSX4373MUTAG 1.5~5.5V 2uA - DFN R/TP 8P - SCG
HONG KONG SAR LTD.
MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP -
ROHM.
7 R6, R7 Resistor, Chip ERHZ0000465
ROHM.
7
R206,
R207,
R208,
R209,
R211
ROHM.
- 93 -
7 C216
Capacitor,
Ceramic, Chip
ECCH0009103
C0603C0G1H101JT00NN 100pF 5% 50V X7R -
7 U101 IC, Sub PMIC EUSY0336503
AAT2870IUW-T1 CSP , 35 , R/TP , 3.1x2.6 , ; , IC, Sub
PMIC Advanced Analogic Technologies HK Limited
7 U102
IC, Level
Translator
EUSY0391601
NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P -
SCG HONG KONG SAR LTD.
7 U601
IC, Speaker
Amplifier
EUSY0404001
TPA6202A1ZQVR BGA, 8, R/TP, Class AB SPK Amp, IC,
Audio AmplifierIC, Audio Amplifier - BGA R/TP 8P - TEXAS
INSTRUMENTS KOREA LTD, HONGKONG BRANCH.
7 U405
IC, LDO Voltage
Regulator
EUSY0407201
BU33TD4WNVX SSON004, 4, R/TP, 3.3V 150mA Single
LDO, IC, LDO Voltage RegulatorIC, LDO Voltage Regulator
ROHM.
7 U201
IC, LDO Voltage
Regulator
EUSY0407501
ROHM.
7
VA302,
VA305,
VA324,
VA325
Varistor SEVY0001001
EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD
R/TP AMOTECH CO., LTD.
7
VA1,
VA101
ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
7 FB101, FB102 Filter, Bead SFBH0009901
HB-1M1005-121JT 120 ohm 1.0X0.5X0.5 25% 0.3 ohm
0.5A SMD R/TP 2P 0 CERATECH CORPORATION
7
FL1,
FL101,
FL102
Filter, EMI/Power SFEY0011701
ICVE10184E070R100FR ESD/EMI 0HZ 7.5pF 0H SMD
R/TP INNOCHIPS TECHNOLOGY
7
ZD201,
ZD202,
ZD205,
ZD206
ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP
2P 1 ON SEMICONDUCTOR
7 R11
Capacitor,
Ceramic, Chip
ECZH0000813
C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
7 C215
Capacitor,
Ceramic, Chip
ECCH0000112
MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005
7
C204,
C210
Capacitor,
Ceramic, Chip
ECCH0000122
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005
7 C1
Capacitor,
Ceramic, Chip
ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
7
C302,
C303
Capacitor,
Ceramic, Chip
ECCH0002001
C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C
- 94 -
7 C214
Capacitor, TA,
Conformal
ECTH0001901
F980J106MMA 10 uF, 6.3V, M, L_ESR, 1608, R/TP
NICHICON CORPORATION, EAST JAPAN SALES
OFFICE
7
C201,
C208
Capacitor,
Ceramic, Chip
ECZH0000830
7 C2
Capacitor,
Ceramic, Chip
ECZH0001210
C1005Y5V1A474ZT000F 470nF -20TO+80% 10V Y5V -
30TO+85C 1005 R/TP - TDK KOREA COOPERATION
7
LD301,
LD303,
LD304, LD305
LED, Chip EDLH0014307
CL-435F-WQT-SD-TS WHITE 2.8~3.6V 30mA 1200~2080
x, y 114mW - R/TP 4P - CITIZEN ELECTRONICS CO.,
LTD.
GB042-50S-H10-E3000 50P 0.4MM STRAIGHT SOCKET
7
D207,
D208
PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK
DEVICES INC.
ROHM.
7
R327,
R328,
R329,
R330
MCR01MZP5F33R0 33OHM 1% 1/16W 1005 R/TP -
ROHM.
7
R302,
R312,
R313,
R314,
R315,
R316,
R317,
R318,
R319,
R320,
R321,
R322,
R323,
R324,
R331,
R332
MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP -
ROHM.
ROHM.
MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP -
ROHM.
7
R101,
R102,
R203
ROHM.
- 95 -
7 U301 IC, Bus Controller EUSY0300008
PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5
CORPORATION
7 U202
IC, Acceleration
Sensor
EUSY0408901
S-5711ACDL 2.5 to 3.3 - - R/TP 4P - SEIKO
INSTRUMENTS INC
7 U1
IC, Geomagnetic
Sensor
EUSY0418501
AMI304 QFN, 12, R/TP, Geomagnetic Sensor, IC, A/D
ConverterIC, A/D Converter - QFN R/TP 12P - AICHI
STEEL CORPORATION
7
VA302,
VA305,
VA324,
VA325
EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD
7 FB1 Filter, Bead SFBH0008102
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2 ohm
LTD.
7
C107,
C108,
C301
Capacitor,
Ceramic, Chip
ECZH0001215
7 R201 Wire Pad, Open SAFO0000501 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM_1005_DNI
7
C205,
C212
Capacitor,
Ceramic, Chip
ECZH0003103
7
D207,
D208
PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK
DEVICES INC.
7
D205,
D206
PROTEK DEVICES INC.
7 C206
Capacitor,
Ceramic, Chip
ECCH0017601
CO., LTD.
7
C101,
C109
Capacitor,
Ceramic, Chip
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005
R/TP - MURATA MANUFACTURING CO., LTD.
7
C103,
C104,
C105,
C106,
C207
Capacitor,
Ceramic, Chip
ECCH0000198
LTD.
7
C104,
C105
Capacitor,
Ceramic, Chip
ECCH0000120
MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005
GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUG
7 BAT100
Capacitor
Assembly
SMZY0023501
PAS311HR-VG1 3.8 Backup Capacitor 0.03F, Module
Assembly, KOREA TAIYO YUDEN.CO., LTD.
7 FL100 Filter, EMI/Power SFEY0015901
ICMEF214P101MFR ICMEF214P101MFR, SMD, ESD
Common mode Filter INNOCHIPS TECHNOLOGY
- 96 -
ROHM.
MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -
ROHM.
7 CN103
Connector,
FFC/FPC/PIC
ENQY0015301
04-6293-625-005-829+ 25P 0.30MM FFC STRAIGHT
TOP SMD T/REEL LOCKING - KYOCERA ELCO KOREA
SALES CO., LTD.
7
LD301,
LD303,
LD304, LD305
LED, Chip EDLH0014307
CL-435F-WQT-SD-TS WHITE 2.8~3.6V 30mA 1200~2080
x, y 114mW - R/TP 4P - CITIZEN ELECTRONICS CO.,
LTD.
7 VA104 Varistor SEVY0005201
EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TP
AMOTECH CO., LTD.
7
VA302,
VA305,
VA324,
VA325
EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD
7 U100 IC, Proximity EUSY0376201
GP2AP002S00F GP2AP002S00F, 8, R/TP SHARP
CORPORATION.
7
R327,
R328,
R329,
R330
ROHM.
GB042-10P-H10-E3000 10P 0.4MM STRAIGHT MALE
6 L1000
Inductor,
Multilayer, Chip
ELCH0001426
LL1005-FHL8N2J 8.2NH 5% - 300mA 0.25OHM 4.7GHZ 9
SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 C804
Capacitor,
Ceramic, Chip
ECCH0000110
MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005
6 C1026
Capacitor,
Ceramic, Chip
ECCH0000108
C1005NP0709DGT 7pF 0.5PF 50V NP0 -55TO+125C
1005 R/TP - NEOTECH CO., LTD
6 C215
Capacitor,
Ceramic, Chip
ECCH0000112
MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005
6
C205,
C212
Capacitor,
Ceramic, Chip
ECZH0003103
6 C1007
Capacitor,
Ceramic, Chip
ECCH0000113
MCH155A180J 18pF 5% 50V NP0 -55TO+125C 1005
- 97 -
6
C1072,
C702,
C800,
C801,
C803
Capacitor,
Ceramic, Chip
ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005
6
C104,
C105
Capacitor,
Ceramic, Chip
ECCH0000120
MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005
6 C1038
Capacitor,
Ceramic, Chip
ECCH0000117
CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C
1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
6 C1031, C1041
Capacitor,
Ceramic, Chip
ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005
6 C1
Capacitor,
Ceramic, Chip
ECCH0000155
CORPORATION
6 C1082, C1086
Inductor,
Multilayer, Chip
ELCH0001405
LL1005-FHL3N3S 3.3NH 0.3NH - 400mA 0.16OHM
9.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.
6
C1067,
C1068,
C1084, C1097
Capacitor,
Ceramic, Chip
ECCH0000183
GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 -55TO+125C
6
C1061,
C1062,
C1063, C1064
Capacitor,
Ceramic, Chip
ECCH0000901
C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -
6 C807
Capacitor,
Ceramic, Chip
ECCH0000701
6
C302,
C303
Capacitor,
Ceramic, Chip
ECCH0002001
6
C1033,
C53
Capacitor,
Ceramic, Chip
ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,
LTD.
6 C8554
Capacitor,
Ceramic, Chip
ECCH0004906
GRM1555C1H2R5CZ01D 2.5pF 0.25PF 50V X7R -
55TO+125C 1005 R/TP - MURATA MANUFACTURING
CO., LTD.
6
C1024,
C1034,
C1035,
C1091,
C57
Capacitor,
Ceramic, Chip
ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C
1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
6 C1070
Capacitor,
Ceramic, Chip
ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C
CO., LTD.
- 98 -
6 C825
Capacitor,
Ceramic, Chip
ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C
CO., LTD.
6
C112,
C113,
C114,
C117,
C638
Capacitor,
Ceramic, Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
6 C216
Capacitor,
Ceramic, Chip
ECCH0009103
C0603C0G1H101JT00NN 100pF 5% 50V X7R -
6 C1011, C1012
Capacitor,
Ceramic, Chip
ECCH0009206
GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C 0603
6
C1027,
C56
Capacitor,
Ceramic, Chip
ECCH0009216
GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C 0603
6
C111,
C4,
C471,
C639
Capacitor,
Ceramic, Chip
ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -
MECHANICS CO., LTD.
6 L1033
Capacitor,
Ceramic, Chip
ECZH0000802
C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C
6
C201,
C208
Capacitor,
Ceramic, Chip
ECZH0000830
6 R11
Capacitor,
Ceramic, Chip
ECZH0000813
C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
6 C1104
Capacitor,
Ceramic, Chip
ECZH0000841
6 C1076, C1101
Capacitor,
Ceramic, Chip
ECZH0001002
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -
6
C1090,
C1092,
C1093, C1094
Capacitor,
Ceramic, Chip
ECZH0001122
C1005X7R1H681KT000F 680pF 10% 50V X7R -
6
C107,
C108,
C301
Capacitor,
Ceramic, Chip
ECZH0001215
6 C705
Capacitor,
Ceramic, Chip
ECZH0003503
GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608
6 C1013, C1052
Capacitor,
Ceramic, Chip
ECZH0025916
GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603
6
D205,
D206
PROTEK DEVICES INC.
- 99 -
6 ZD700 Diode, TVS EDTY0008602
PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP 2P 1
PROTEK DEVICES INC.
6 L1013
Inductor,
Multilayer, Chip
ELCH0001032
HK1005 18NJ-T 18NH 5% - 300mA 0.55OHM 2.1GHZ 8
SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO., LTD
6 C1100
Inductor,
Multilayer, Chip
ELCH0001054
1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM
3.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6 C1016
Inductor,
Multilayer, Chip
ELCH0001401
LL1005-FHL15NJ 15NH 5% - 300mA 0.5OHM 2.8GHZ 9
6 C1039, L1001
Inductor,
Multilayer, Chip
ELCH0001407
INC.
6 C1098
Inductor,
Multilayer, Chip
ELCH0001403
LL1005-FHL1N0S 1NH 0.3NH - 400mA 0.1OHM 20GHZ 7
6 C1053
Inductor,
Multilayer, Chip
ELCH0001404
15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.
6
L1007,
L804
Inductor,
Multilayer, Chip
ELCH0001406
LL1005-FHL4N7S 4.7NH 0.3NH - 300mA 0.2OHM 7GHZ
6 L1015
Inductor,
Multilayer, Chip
ELCH0001411
LL1005-FHL1N2S 1.2NH 0.3NH - 400mA 0.1OHM 16GHZ
6 C1099
Inductor,
Multilayer, Chip
ELCH0001412
15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.
6 L1009
Inductor,
Multilayer, Chip
ELCH0001420
LL1005-FHL3N9S_ 3.9NH 0.3NH - 300mA 0.18OHM
INC.
6 L1036
Inductor,
Multilayer, Chip
ELCH0001413
6
L1002,
L1003
Inductor,
Multilayer, Chip
ELCH0001431
6
L1027,
L1078
Inductor,
Multilayer, Chip
ELCH0001416
INC.
6 L1017
Inductor,
Multilayer, Chip
ELCH0004114
LLV0603-FH6N8J 6.8NH 5% - 220mA 0.4OHM 3.5GHZ 6
- 300 -
6 L1030
Inductor,
Multilayer, Chip
ELCH0004701
1005GC2T12NJLF 12NH 5% - 250mA 0.48OHM 2.1GHZ
ELECTRONICS LTD.
6 L1026
Inductor,
Multilayer, Chip
ELCH0001408
LL1005-FHL6N8J 6.8NH 5% - 300mA 0.23OHM 5.6GHZ 9
6 L1034
Inductor,
Multilayer, Chip
ELCH0004705
1005GC2T8N2JLF 8.2NH 5% - 250mA 0.37OHM 2.8GHZ
ELECTRONICS LTD.
6 C1102
Inductor,
Multilayer, Chip
ELCH0004709
4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6
L1004,
L1006,
L1029
Inductor,
Multilayer, Chip
ELCH0004710
1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM 2GHZ 8
SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6
C1055,
C1075,
L1023,
L1035
Inductor,
Multilayer, Chip
ELCH0004721
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6
C8553,
L1019,
L1020,
L8056
Inductor,
Multilayer, Chip
ELCH0004703
1005GC2T1N0SLF 1NH 0.3NH - 300mA 0.12OHM 10GHZ
ELECTRONICS LTD.
24-5804-080-000-829+ 80P 0.40MM STRAIGHT FEMALE
CO., LTD.
6 J800 Card Socket ENSY0024301
KP09N-6S-2.54SF SIM 6P ANGLE SMD R/TP - HIROSE
KOREA CO., LTD
U.FL-R-SMT(10) 1.90MM STRAIGHT SOCKET SMD
T/REEL CU 50OHM 300mDB HIROSE KOREA CO., LTD
MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU
50OHM 400mDB HIROSE KOREA CO., LTD
6 CN701
Connector,
Terminal Block
ENZY0027601
KQ03LP1-3R 3P 2.50MM STRAIGHT SMD R/TP -
HIROSE KOREA CO., LTD
ROHM.
ROHM.
MCR006YZPF51R0 51OHM 1% 1/20W 0603 R/TP -
ROHM.
- 301 -
6
R1009,
R1010,
R1011,
R1012, R1020
ROHM.
6
R106,
R430
ROHM.
ROHM.
MCR01MZSF1800 180OHM 1% 1/16W 1005 R/TP -
ROHM.
MCR01MZP5J111 110OHM 5% 1/16W 1005 R/TP -
ROHM.
MCR01MZP5J121 120OHM 5% 1/16W 1005 R/TP -
ROHM.
6
R101,
R102,
R203
ROHM.
MCR01MZP5J300 30OHM 5% 1/16W 1005 R/TP -
ROHM.
6 C805
Capacitor,
Ceramic, Chip
ECZH0000816
MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP -
ROHM.
ROHM.
MCR01MZP5J560 56OHM 5% 1/16W 1005 R/TP -
ROHM.
ROHM.
6 U1000
IC, RF
Transceiver, 3G
EUSY0344001
RTR6285 1.8VTO3V, 2.7VTO3V 500mW QFN R/TP 68P
QUALCOMM INCORPORATED.
6 U700
IC, Over Voltage
Protection
EUSY0374601
MAX14528 MAX14528, TDFN, 8, R/TP, Programmable
OVP MAXIM INTEGRATED PRODUCTS INC.
6 U802
IC, LDO Voltage
Regulator
EUSY0407101
ROHM.
- 30 -
6
CN1,
CN2,
CN3,
CN4,
CN5,
CN6,
CN7,
CN8
Clip MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -
6 R201 Wire Pad, Open SAFO0000501 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM_1005_DNI
6 FL1004
Filter, Duplexer,
DCN
SDDY0005101
B7671 881500000 869 to 894 836500000 824 to 849 2.7
2.1 2.5x2.0x0.68 DUAL SMD R/TP - EPCOS PTE LTD.
6 FL1003
Filter, Duplexer,
IMT
SDMY0003001
B7697 2140000000 2112.4 to 2167.6 1950000000 1922.4
to 1977.6 2.2 1.8 2.5x2.0x0.89 DUAL SMD R/TP - EPCOS
PTE LTD.
6 FL1001 Filter, Separator SFAY0012501
D5017 1.5 35 35 , dB, dB, dB, dB, 4532, FEM/SP9T,
Supply voltage(2.5V min, 3.2V max) EPCOS PTE LTD.
6
FB1000,
FB1001
Filter, Bead SFBH0000903
HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 25% 0.6 ohm
0.3A SMD R/TP 2P 0 CERATECH CORPORATION
6
R2,
R335,
R4
PCB ASSY,
MAIN, PAD
SHORT
6 FL700 Filter, EMI/Power SFEY0015301
NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP
MURATA MANUFACTURING CO., LTD.
6 FL1006 Filter, Saw SFSY0028101
SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5P
6
L2, L3,
L4, L5
Inductor,
Multilayer, Chip
ELCH0001430
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM 1.03GHZ
SAFEB2G14FB0F00 - - - - 2P MURATA
MANUFACTURING CO., LTD.
SAFEB836MAL0F00 836.5 1.4X1.1X0.6 SMD R/TP 5P
SAFEB1G57KB0F00 SAFEB1G57KB0F00, 1575.42 MHz,
1.4*1.1*0.6, SMD, 1574.22M~1576.62M, IL 0.8, 5pin, U-U,
50-50, GPS LOW LOSS MURATA MANUFACTURING
CO., LTD.
6 U1002
IC, Power
Amplifier
SMPY0019101
SKY77336 SKY77336, dBm, %, A, dBc, dB, 5x5, SMD,
Polar Edge for QCT SKYWORKS SOLUTIONS INC.
- 303 -
6 U1003
IC, Power
Amplifier
SMPY0022701
SKY77701 28.25 dBm, 40 %, 10 mA, -40 dBc, 27 dB,
3.0*3.0*1.0, SMD, WBAND 1, LBAND 1, CPL, 3 MODE,
3.2V~4.2V, 28.25dBm, 1, SMD, R/TP, 10, 3.2V~4.2V,
28.25dBm, 1, SMD, R/TP, 10 SKYWORKS SOLUTIONS
INC.
6 U1004
IC, Power
Amplifier
SMPY0023801
SKY77704-15 28.25 dBm, 40 %, 10 mA, -40 dBc, 27 dB,
3.0*3.0*1.0, SMD, DCN, WBAND 5, LBAND 5, 8PCL6, 3
MODE, 3.2V~4.2V, 28.25dBm, 1, SMD, R/TP, 10PIN
SKYWORKS SOLUTIONS INC.
6 U1001 IC, RF Amplifier SMZY0025501
RF2815 3.3*2.1*1.0, FILTER+GPS LNA+FILTER
MODULE, GPS, RF MICRO DEVICES INC
6 C816
Capacitor,
Ceramic, Chip
ECCH0007805
CL05A106MQ5NUNC 10uF 20% 6.3V X5R -55TO+85C
LTD.
6
C1072,
C702,
C800,
C801,
C803
Capacitor,
Ceramic, Chip
ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005
6 C1031, C1041
Capacitor,
Ceramic, Chip
ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005
6
C103,
C104,
C105,
C106,
C207
Capacitor,
Ceramic, Chip
ECCH0000198
LTD.
6 C1
Capacitor,
Ceramic, Chip
ECCH0000155
CORPORATION
6
C302,
C303
Capacitor,
Ceramic, Chip
ECCH0002001
6
C1033,
C53
Capacitor,
Ceramic, Chip
ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,
LTD.
6
C101,
C109
Capacitor,
Ceramic, Chip
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005
6
C1024,
C1034,
C1035,
C1091,
C57
Capacitor,
Ceramic, Chip
ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C
LTD.
6 C1070
Capacitor,
Ceramic, Chip
ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C
CO., LTD.
- 304 -
6
C112,
C113,
C114,
C117,
C638
Capacitor,
Ceramic, Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
6 C825
Capacitor,
Ceramic, Chip
ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C
CO., LTD.
6 C216
Capacitor,
Ceramic, Chip
ECCH0009103
C0603C0G1H101JT00NN 100pF 5% 50V X7R -
6 C640
Capacitor,
Ceramic, Chip
ECCH0009106
C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C
6
C321,
C710,
C711,
C712,
C713
Capacitor,
Ceramic, Chip
ECCH0009226
GRM0335C1E390J 39pF 5% 25V X7R -55TO+125C 0603
6 C35
Capacitor,
Ceramic, Chip
ECCH0009107
GRM033R71C222K 2.2nF 10% 16V X7R -55TO+125C
0603 R/TP - KOREA MURATA ELECTRONICS CO.
LTD.
6 C320
Capacitor,
Ceramic, Chip
ECCH0009203
GRM033R60J333K 33nF 10% 6.3V X5R -55TO+85C
6
C111,
C4,
C471,
C639
Capacitor,
Ceramic, Chip
ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -
MECHANICS CO., LTD.
6 C3, C4
Capacitor,
Ceramic, Chip
ECCH0010501
GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATA
MANUFACTURING CO., LTD.
6
C434,
C749
Capacitor,
Ceramic, Chip
ECCH0017501
CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C
CO., LTD.
6
C205,
C212
Capacitor,
Ceramic, Chip
ECZH0003103
6 C311
Capacitor, TA,
Conformal
ECTH0001903
F980J226MMA 22 uF, 6.3V, M, L_ESR, 1608, R/TP
NICHICON CORPORATION, EAST JAPAN SALES
OFFICE
6 C110
Capacitor, TA,
Conformal
ECTH0005203
TCTP1A336M8R , [empty] , [empty] , , [empty] , , [empty] ,
[empty] , [empty] , [empty] ROHM.
6 C8544
Capacitor,
Ceramic, Chip
ECZH0000846
6
C708,
C709
Capacitor,
Ceramic, Chip
ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C
1005 BK-DUP - MURATA MANUFACTURING CO., LTD.
- 305 -
6 C206
Capacitor,
Ceramic, Chip
ECCH0017601
CO., LTD.
6 C1013, C1052
Capacitor,
Ceramic, Chip
ECZH0025916
GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603
6
C25,
C301,
C304,
C322
Capacitor,
Ceramic, Chip
ECZH0025917
GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C 0603
6
C30,
C31,
C312,
C314,
C32,
C33,
C34,
C429,
C437,
C741,
C742,
C753
Capacitor,
Ceramic, Chip
ECZH0025920
GRM033R71C102K 1nF 10% 16V X7R -55TO+125C
6
R2,
R335,
R4
PCB ASSY,
MAIN, PAD
SHORT
ROHM.
6 D701 Diode, Switching EDSY0011901
SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2
R/TP 2P 1 AUK CORP
6
D301,
D302,
D702
Diode, Switching EDSY0010501
KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESC
R/TP 2P 1 KEC CORPORAITION
6 ZD701 Diode, TVS EDTY0008610
PLW0501H-LF 800mV 6V 12.5V 16A 250W SOD523
R/TP 2P 1 PROTEK DEVICES INC.
6
D201,
D202,
D204
ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.
6 Q3 FET EQFP0011101
SiA431DJ PowerPAK SC-70-6L-Single, 3.5 W, -20 V, -12
A, R/TP, P-CHANNEL, MOSFET, -20 V, +- 8V, -12 A, 0.07
OHM, 3.5W, SC70, R/TP, 6P VISHAY
INTERTECHNOLOGY ASIA PTE LTD
6
L703,
L704
Inductor, Wire
Wound, Chip
ELCP0008004
MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ 0
SHIELD 2.0X1.6X1.0MM NONE R/TP FDK
CORPORATION.
6 L8055
Inductor, Wire
Wound, chip
ELCP0008001
MIP2520D4R7M 4.7UH 30% 0V 1.1A 0.11OHM 0HZ 0
SHIELD 2.5X2X1MM NONE R/TP FDK CORPORATION.
- 306 -
6 L803
Inductor, Wire
Wound, Chip
ELCP0008007
MIPS2520D3R3M 3.3UH 30% - 1A 0.12OHM - - SHIELD
2.5X2X1MM NONE R/TP FDK CORPORATION.
6
L701,
L702
Inductor, Wire
Wound, chip
ELCP0008012
VLS252012T-4R7MR81 VLS252012T-4R7MR81, 4.7 uH,
M, 2.5*2*1.2, R/TP, Coil TDK CORPORATION
6 L700
Inductor, Wire
Wound, Chip
ELCP0011901
CPI2012NHL2R2MT 2.2UH 20% - 800mA 0.25OHM - -
SHIELD 2X1.25X1MM NONE - SAMWHA CAPACITOR
CO, LTD.
6 CN700 connector, I/O ENRY0008701
HSMU-5SB-24DR2 5, mm, ETC HAN SHIN TERMINAL
CO., LTD.
6 Q1, Q2 TR, Bipolar EQBP0009901
QST4 PNP -6V -15V -12V -6A -0.1A 680 500mW TS6
R/TP 6P ROHM.
MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP -
ROHM.
ROHM.
ROHM.
RC1005F470CS 47OHM 1% 1/16W 1005 R/TP -
ROHM.
ROHM.
ROHM.
6
R306,
R315,
R316
MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -
ROHM.
6
R703,
R704
ROHM.
6
R1009,
R1010,
R1011,
R1012, R1020
ROHM.
ROHM.
6
R724,
R725
ROHM.
- 307 -
6
R104,
R105,
R402,
R403,
R623
ROHM.
ROHM.
ROHM.
6 R8522, R8523 Resistor, Chip ERHY0009586
MCR006YZPF2201 2.2KOHM 1% 1/20W 0603 R/TP -
ROHM.
ROHM.
RC1005F6041CS 6.04KOHM 1% 1/16W 1005 R/TP -
6 R8519, R8520 Resistor, Chip ERHY0024601
RC0603J151CS 150OHM 5% 1/20W 0603 R/TP -
6
R619,
R622
ROHM.
MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP -
ROHM.
ROHM.
MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP -
ROHM.
6
R301,
R600
ROHM.
6
R706,
R707
ROHM.
ROHM.
6
R101,
R102,
R203
ROHM.
MCR01MZP5J330 33OHM 5% 1/16W 1005 R/TP -
ROHM.
ROHM.
ROHM.
- 308 -
6
C706,
C707
Capacitor,
Ceramic, Chip
ECCH0009201
GRM033R60J473KE19D 47nF 10% 6.3V X5R -
55TO+85C 0603 R/TP - MURATA MANUFACTURING
CO., LTD.
ROHM.
RC2012FR100CS 0.1OHM 1% 1/8W 2012 R/TP -
RC1005F1213CS 121KOHM 1% 1/16W 1005 R/TP -
6 U301 IC, MCP, NOR EUSY0216301
NC7SV00P5X_NL SC70 , 5 PIN, R/TP , Single 2-Input
NAND Gate FAIRCHILD SEMICONDUCTOR
6 U1005 IC, Fuel Gauge EUSY0242303
MAX17040G DFN, 8, R/TP, Fuel gauge, IC, CMOSIC,
CMOS - - DFN R/TP 8P - MAXIM INTEGRATED
PRODUCTS INC.
6 U704 IC, PMIC EUSY0342201
PM7540 -0.5~18 N/A 0W CSP R/TP 137P - QUALCOMM
INCORPORATED.
6 IC1 IC, MUIC EUSY0372001
TS5USBA33402YZPR TS5USBA33402, MUIC WCSP
R/TP 20P TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.
6 U302
IC, Digital
Baseband
Processor, 3G
EUSY0392302
MSM7227 0VTO0V 0W 560P - BGA R/TP 560P
QUALCOMM INCORPORATED.
6 U701
IC, Audio Sub
System
EUSY0403901
WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -
WOLFSON MICROELECTRONICS PLC
6 U405
IC, LDO Voltage
Regulator
EUSY0407201
ROHM.
6 U801
IC, Acceleration
Sensor
EUSY0407801
KR3DM LGA16, 16, R/TP, 3-Axis G-Sensor, IC, A/D
ConverterIC, A/D Converter - LGA R/TP 16P - ST
MICROELECTRONICS
6 U300 IC, Flip Flop EUSY0408201
74LVC1G79GM 1.65~5.5V - D FLIP-FLOP SOT R/TP 6P -
STC CORP.
6 X300
Oscillator,
VCTCXO
EXSK0008901
KT3225L19200DCW28RA0 19.2MHZ 2PPM 2.8V
0.0x0.0x0.0MM NONE SMD R/TP KYOCERA CORP.
6 U400 MCP EUSY0430901
MT29C8G96MAZAPDJA-5 IT FBGA , 137 , ETC , 1.8V
8G(LB/512Mx16)NAND+4G(DDR400/16Mx4x32*2_2CS)D
RAM , ; , IC, MCP MICRON SEMICONDUCTOR ASIA
PTE LTD.
ROHM.
6 X800 Oscillator, TCXO EXST0001901
TG-5010LH-87N 26MHZ 2.5PPM 2.8V 32.0x25.0x10.0MM
- SMD R/TP EPSON TOYOCOM CORP
- 309 -
EVLC5S01033 EVLC5S01033, 5.5 V, , SMD , 0603
AMOTECH CO., LTD.
6 X700 Crystal EXXY0018701
FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM 12.5PF
32*15 SMD R/TP SEIKO EPSON CORP
6 R12, R4
PCB ASSY,
MAIN, PAD
OPEN
SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
6
VA300,
VA301,
VA302,
VA303,
VA304
ICVS0305500FR ICVS0305500FR, 5.6 V, M , SMD , 0603
SIZE INNOCHIPS TECHNOLOGY
BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6 ohm
LTD.
HH-1M1005-601JT_1 600 ohm 1.0X0.5X0.5 25% 0.6 ohm
0.5A SMD P/TP 2P 0 CERATECH CORPORATION
6 U800 Module, WLAN SMZY0024901
LBEH19UNBC-338 2.3VTO5.5V LGA 54P 9.0x7.8x1.3MM
- 310 -
2 SBPL00
Rechargeable
Battery, Lithium
Ion
SBPL0102103
LGIP-590F-TO-DCM 3.7 V, 1350 mAh, 1 CELL,
PRISMATIC, PRISMATIC, BLACK, TOCAD DONGHWA
2 MBM087201 Card, Warranty MBM63220002
COMPLEX L03C.ANTTBK ZZ:Without Color micro SD
Warranty
2 MBM087200 Card, Warranty MBM63220301 COMPLEX L04C.ANTTBK ZZ:Without Color -
2 AFN053800
Manual Assembly,
Operation
- AFN75293501 L04C.ANTTBK ZZ:Without Color -
3 MBM062602
Card, Quick
Reference
MCDD0031510
COMPLEX L-04B NTTBK ZZ:Without Color PRINTING,
(empty), , , , ,
3 MBM062604
Card, Quick
Reference
MBM63296001 COMPLEX L03C.ANTTBK ZZ:Without Color -
3 MBM062603
Card, Quick
Reference
MCDD0031511
COMPLEX L04C.ANTTBK ZZ:Without Color PRINTING,
(empty), , , , ,
3 MFL053802 Manual, Operation MFL66994405 COMPLEX L04C.ANTTBK ZZ:Without Color -
2 EBX000000
Accessory,
Gender
SGDG0002901 BRHA-1010C-05A - - BARONICS CO., LTD.
2 EAB010200 Earphone, Stereo SGEY0007603
HC-MYO-LG058 HC-MYO-LG058, 20mW, 16Ohm, 99dB,
1KHZ, 1mW, 65dB 10KHZ, 104dB 100KHZ3.5 L TYPE
STEREO 4POLE PLUG, Deco canal(white), Earphone, Ste
I-SOUND CO, LTD
2 EBX000001
Accessory, Data
Cable
SGDY0019301
KCA-ET-8-0210 , 0.5M, BLACK, Without LG Logo, Micro
USB Data Cable, N KSD CO., LTD
11.3 Accessory

Esm Android Smart Phone 53693009 LG L 04c SM

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