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(Maintenance of the basic version)
2010-07-21
Internal
Revision Record
Date
Revision Version
Revision Reason
Section Number
Change Description
2010-07-21
V1.0
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Contents
1 PRODUCT INTRODUCTION ................................................................................................................................. 5 1.1 1.2 2 PRODUCT VIEW ................................................................................................................................................... 5 PRODUCT FEATURES ........................................................................................................................................... 6
MAINTENANCE INSTRUCTIONS........................................................................................................................ 7 2.1 2.2 2.3 DOCUMENT APPLICATION .................................................................................................................................. 7 MAINTENANCE PRECAUTIONS............................................................................................................................ 7 OBTAINING MAINTENANCE INFORMATION ........................................................................................................ 7
3 4 5
EXPLODED VIEW OF THE WHOLE UNIT ........................................................................................................ 8 LOCATION OF COMPONENTS ON THE MAIN BOARD............................................................................... 10 SOFTWARE UPGRADE ........................................................................................................................................ 11 5.1 5.2 5.3 5.4 PREPARATIONS BEFORE UPGRADE ................................................................................................................... 11 HARDWARE CONNECTION ................................................................................................................................. 11 UPGRADE PROCEDURE ..................................................................................................................................... 11 EXCEPTION HANDLING ..................................................................................................................................... 23
6 7 8 9
MAINTENANCE TOOLS ...................................................................................................................................... 24 DISASSEMBLY PROCEDURE ............................................................................................................................. 25 ASSEMBLY PROCEDURE.................................................................................................................................... 28 TROUBLESHOOTING FOR COMMON FAULTS............................................................................................. 31 9.1 9.2 PRINCIPLE SUMMARY ....................................................................................................................................... 31 PHONE CAN NOT BE POWERED ON .................................................................................................................... 32 Phone can not be powered on-High Current ........................................................................................ 32
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9.2.1
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9.2.2
9.3 9.4 9.5 9.6 9.7 9.8 9.9 9.10 9.11 9.12 10
CHARGE FAILURE ............................................................................................................................................. 35 KEYPAD FAILURE .............................................................................................................................................. 36 DISPLAY FAILURE .............................................................................................................................................. 37 SPEAKER AND RECEIVER FAILURE ................................................................................................................... 38 VOICE TRANSMITTING FAILURE ....................................................................................................................... 40 VIBRATION FAILURE ......................................................................................................................................... 40 THE SIM CARD CANT BE IDENTIFIED ............................................................................................................ 41 FM FAILURE...................................................................................................................................................... 41 SIGNAL FAILURE ............................................................................................................................................... 43 RF TRANSMITTING FAILURE ............................................................................................................................ 45
FUNCTIONAL TEST.............................................................................................................................................. 46 10.1 10.2 10.3 INTRODUCTION TO THE KEY AND ICONS .......................................................................................................... 46 MMI TEST......................................................................................................................................................... 46 VOICE CALL TEST ............................................................................................................................................. 47
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1
1.1 Product View
Product Introduction
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External interfaces
USB interface: Micro USB/Headset interface SIM card interface: standard 6 PIN SIM card interface
Type: Li Battery Capacity : 3.7V700mAh Typical talk time: 240 minutes Typical standby time: 200hours LCD Function Feature Temperature Humidity Type: 1.47TFT Typical: 128160 65K Support : MP3/FM Operating: -10~+55 Storage: -40~+70 5%~ 95%
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2 Maintenance Instructions
2.1 Document Application
This document provides instructions for the maintenance of Huawei products for the maintenance personnel in senior authorized service sites. This manual is Huawei proprietary and is only permitted to be used by authorized service sites or companies. Mistakes may be found in the document. If you have found any mistake or have any suggestion, please contact our customer service personnel.
Electrostatic discharges are the major cause for the damage of sensitive electronic components. Each service site should attach great importance to the electrostatic discharges and strictly observe the antistatic measures described in this manual.
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No. 1 2 3 2010-7-26
Quantity 1 1 1
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No. 4 5 6 7 8 9 10 11 12 13 14
Name Description Top Cover Sponge Top Cover LCD Sponge Keypad LCD PCBA Speaker Motor Bottom Cover Sponge Bottom Cover Battery Cover
Quantity 1 1 1 1 1 1 1 1 1 1 1
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5 Software Upgrade
5.1 Preparations before Upgrade
Item Contents PC Upgrade environment Battery G2100 USB Data Cable Upgrade File HUAWEI G2100 V100R001ENGC01B117SEC.fls Mobile Studio-R GH0G2200ML01ULC2MLVer1004 USB drive Upgrade mode PL2303_Prolific_DriverInstaller_10311.exe Upgrade by USB date cable Install automatically Normal The version is only for your reference. Download or use the latest version. BOM: 02450712 Remark Windows 2000 /Windows XP system
PC
USB Cable
G2100
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303_Prolific_DriverInstaller_10311.exe.
5.3.2 Install Upgrade Software Tools 1 Double click to install Mobile Studio-R
MobileStudio-R.lnk
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5
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GHULC2MLVer1004.exe.lnk
Click Install
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Installation finish
5.3.4
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Click Download Type and Files Settings, select download type Batch Upgrade.
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Connect the phone to the PC by USB cable, click Start Download. Insert the battery according to prompt
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Upgrade finish
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6 Maintenance Tools
Tool Figure Description Name: constant-temperature gun Application: It is used to heat the components.
Name: Solder the iron Application: It is used for Solder the during maintenance.
Name: Solder the fixture Application: It is used to fix the main board.
Name: Tool kit Application: It is used to assembly and disassembly the PHONE.
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7 Disassembly Procedure
2Make sure the ESD antistatic wrist strap connect to the ground is normal.
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8 Assembly Procedure
1Make sure the ESD antistatic wrist strap connect to the ground is normal.
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Principle Diagram
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9.2 Phone can not be powered on 9.2.1 Phone can not be powered on-High Current
AnalysisThe current is above 1A as power supply by DC-power. Short circuit of the VBAT line
causes high current usually. (Reference Figure 1)
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VDD1V8/VRF1 Test Point L401 VRCORE Test Point C409 U401 CPU
Q500 U302 U302-VBAT Test Point C324 U501 FLASH VDDTRX Test Point C301
VRF2 Test Point C302 J501 Pin3 (VBAT) VDDTDC/VDDXO Test Point C303
Figure 1
9.2.2
AnalysisThe current is among 10mA-400mA scope as power supply by DC-power. The software or
FLASH damaged cause the failure usually. (Reference Figure 1)
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Charge Fault
Insert charger
No
Replace J500
Yes
No
Replace R500
Yes
No
Yes
Replace U401
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VBAT3.05V-5.5V VCHG5.0V
Q501
U401 CPU
R500 R=0
Figure 2
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R607 R4.6K
Figure 3
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9.7
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9.10
FM Failure
(Reference Figure 4)
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Q700 FM-LNA
Figure 4
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9.11
Signal Failure
Analysis Above all, check RF parameter whether is correct, the wrong RF parameter can cause
the failure usually. (Reference Figure 5)
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Z300 RX SAW Filter U302 Multi-function IC J300 U302-VBAT Test Point C324
Figure 5
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9.12
RF Transmitting Failure
AnalysisAbove all, check RF parameter whether is correct. The U302 cause the failure usually. (Reference Figure 5)
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10 Functional Test
10.1 Introduction to the Key and icons
Up Key Left Soft Key Left Key Right Soft Key Right Key End Key
Send Key
OK Key
Down Key
10.2
MMI Test
Insert the SIM card. Enter MMI test command *2846570+Down to access the MMI keypad binding combination test mode. No. Item Proced ure Contents Method and phenomenon (Take the new device as a standard. Press the Send key to enter the next procedure.) Enter the test command to access the SIM card test. If the SIM card is identified, the "SIM card test succeeded" is displayed. Otherwise, the "SIM card test failed" is displayed. Press the Send key and the LCD displays the white screen, and LCD Test display in middle.
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LCD Test
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No.
Item
Proced ure
Contents
Method and phenomenon (Take the new device as a standard. Press the Send key to enter the next procedure.) Press the Send key and the LCD displays the dark screen. Press the Send key and the LCD displays the color panel grids. Press the Send key and the LCD displays the black and white dots. Press the Send key and the LCD displays a black block overlapped with a white block. (Note: There is a white block amid the black block.) Press the Send key and the LCD displays a white block overlapped with a black block. (Note: There is a black block amid the white block.) Press the Send key. Then all the keypad LEDs are on and the motor vibrates. Press the Send key to display the keypad diagram. When you press any key except Send and End the keypad, a blue square grid appears on the key in the diagram. Press the Send key LCD displays Sound. then the speaker makes sound. When you use the headset,sound can be heard through the headset. Press the Send key and speak to the microphone, then you can hear your sound from the receiver; When you use the headset, your voice can be heard through the headset. Insert the headset first, Press the Send key to test FM function.
3 4 5
Black and white blocks Black and white blocks LED and motor Keypad
11
6 Call test 7 12
FM test
13
FM
Press the Send key display MMI Test Result, all the test Item and test result displays. If test pass, will display succeed after test Item, otherwise display failed after test Item. Completed MMI test, press End key to exit MMI Test Mode.
10.3
Insert a normally used SIM card and the battery into the phone to be tested. Press and hold the End key to power on the phone. Check whether the signal strength is changed normally in normal network environment. Dial the number of a fixed-line phone to test the voice quality during a call. If the preceding tests are normal, end the voice call test. Otherwise, perform the test again or send the phone to advanced maintenance center for repair.
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