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Experimental studies show that the root cause for more than 90 percent of the PoP assembly defects is package warpage. Minimizing package warpage is possible by
Controlling reflow time Temperature Packaging materials Selecting appropriate package design.
From the PCB assembly perspective, the first two parameters gain importance. Arriving at an acceptable reflow profile that falls within the specifications can control these parameters.
Solder on Pad PoP technology Solder on Pad (SOP) PoP assembly technology addresses several issues, like standoff height, solder joint collapse size and the ability to solder fine pitch components. In SOP technology, solder balls are present on the topside of the bottom package. These balls must be aligned with the balls of the top package during assembly. The ball-to-ball stacking (figure 3) provides a larger solder joint collapse compared to non-SOP based PoP. This large collapse helps to absorb package warpage. On the other hand, the ball-toball stacking presents new challenges, particularly in the reflow process. The most common challenge is the balls of the top package sliding off from the balls of bottom package and the inability to create a good solder joint from the twocontacting solder spheres.
Future challenges
The technology trend towards package miniaturization necessitates
thinner substrates, reduced standoff height, smaller die, thinner encapsulant materials etc.
While all these design parameters help achieve better assembly yield, they present additional challenges in the assembly, especially during the reflow process. Reworking PoP assemblies after the reflow process also requires a greater level of operator skill, therefore requiring the first pass assembly yield to be high.
Conclusion
The extent of PoP warpage during reflow dictates the final package stacking yield on the PCB. The main objective of a good reflow profile must be to control the package warpage throughout the process. Since the use of lead free solder demands a narrow process window in the reflow process, more emphasis should be placed on arriving at an acceptable reflow profile. For extended reliability, different lead free solder alloy combinations are also being considered for the top and bottom packages, making reflow soldering the most important process for achieving good yields.
Tools
Solder jet printing technology
PoP Topics
What is Package on Package (PoP)? Benefits of PoP Stack Packages Component Standards Component Types JEDEC Standards PCB Design Rules Pad Layout Via Hole Connection Lead-Free Assembly Engineering Interviews Stencil Printing POP Placement Tack Flux Dip Solder Paste Reflow Soldering Convection Vapour Phase Temperature Profiling Inspection Optical Inspection X-ray inspection Underfill Rework Package on Package Defects Optical inspection of joints X-ray inspection Component alignment Solder paste dipping Liquid flux application Paste & flux depth monitoring Open solder connections Solder balling Package warpage Excess paste Excess flux BGA voiding Package cracking Mask damage
PoP Assembly
Terminology
PSvfBGA
Package Stackable Very Thin Fine Pitch BGA
PSfcCSP
Package Stackable Flip Chip CSP
TMV PoP
Through Mold Via Package on Package
PoP (PACKAGE ON PACKAGE): AN EMS PERSPECTIVE ON ASSEMBLY, REWORK AND RELIABILITY Heather McCormick, et al.Celestica Inc. Price: $10 http://smta.org/knowledge/article_cart.cfm
Reflow Errors
floating QFNs excessive solder short and opens
Machine
MYDATA MY500
Solder Jet Printing 1.8 million dots per hour
BGA Variants
CBGA and PBGA denote the Ceramic or Plastic substrate material to which the array is attached. CABGA: Chip Array Ball Grid Array CTBGA: Thin Chip Array Ball Grid Array CVBGA: Very Thin Chip Array Ball Grid Array DSBGA: Die-Size Ball Grid Array FBGA or Fine Ball Grid Array based on ball grid array technology. It has thinner contacts and is mainly used in system-on-a-chip designs. Known as FineLine BGA by Altera FCmBGA: Flip Chip Molded Ball Grid Array LFBGA: Low-profile Fine-pitch Ball Grid Array UFBGA and UBGA and Ultra Fine Ball Grid Array based on pitch ball grid array. MBGA: Micro Ball Grid Array PBGA: Plastic Ball Grid Array MCM-PBGA: Multi-Chip Module Plastic Ball Grid Array TEPBGA: Thermally Enhanced Plastic Ball Grid Array SuperBGA (SBGA): Super Ball Grid Array TABGA / TBGA: Tape Array BGA TFBGA or Thin and Fine Ball Grid Array
Solder Balling
My Conclusion
Dip Paste is better for PoP Assembly