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Stampings
Copper or aluminum sheets stamped into desired shapes Low cost solution to low density thermal problems
Casting
High density aluminum or copper/bronze pin fins are produced with sand, lost core, or die casting (May or may not be vacuum assisted) Allows for maximum performance with impingement cooling More expensive but can make odd shapes Al alloys used have lower conductivity than Al alloys used for extrusions
Extrusions
Allows for the formation of elaborate 2-D shapes capable of dissipating large heat loads Cross-cutting to produce rectangular pins may increase performance by 10-20% but the extrusion rate will be slower Design limits are usually set by
Fin height-to-gap aspect ratio Minimum fin thickness-to-height Maximum base to fin thickness
Bonded/Fabricated Fins
Thermally conductive aluminum filled epoxy is used to bond planar fins on a grooved extrusion plate
Greater fin height-to-gap aspect ratio is achieved with this method (~20-40)
Cooling capacity is increased without increasing volume requirements But epoxy has a much lower thermal conductivity, acting as an increased resistance.
Folded Fins
Aluminum or copper sheet metal is folded into fins and then attached to a base plate or directly to the heat surface via brazing or epoxying Due to the availability and fin efficiency folded fins are not suitable for high profile heat sinks Allows for the fabrication of high performance heat sinks when extrusion or bonded fins are unacceptable
Rectangular fins have better performance than square fins, whose back edges have poor air flow past them. Rectangular fins also have better performance than round fins; however, pressure drop is also higher for rectangular fins. Round fins are good if you dont know which direction your airflow will be from or if airflow may not be straight through the heat sink (its omni-directional). For natural convection/radiation, solid black anodized fins mounted in a vertical direction tend to work best.
Design Considerations
Design considerations
Flow Bypass
Flow bypass occurs when the flow duct is larger than the cross sectional dimensions of the heat sink Velocity of the approaching fluid may be much greater than the velocity through the channels Most commonly occurs with semi-active heat sinks
Flow Bypass
The amount of flow bypass will be greatly dependent on the cross sectional geometry and the pressure drop across the heat sink
Mounted to a heat source the same size of the heat sink At sea level Mounted with the fins in the direction of air flow The heat sink is painted or anodized black Zero Flow Bypass
Attachment Means
Clip to device Clip to PCB Snap-on stampings Double-sided tapes Solder or adhesives Thermal interface resistance minimized using grease or pad and by making surfaces as flat as possible
References
Sinks. IEEE Transactions on Components, Packaging, and Manufacturing. Part A, Vol. 18, No. 4. December
Lee, Serri. How to Select a Heat Sink. Aavid Thermal Technologies, Inc. Laconia, New Hampshire. Kraus, A. The Heat Sink Design Procedure.
Markstein, H., Optimizing Heat Sink Performance, Electronic Packaging and Production, v 35, n 10, Sept 1995, p. 38.